JP3205998U - Metal heat sink structure - Google Patents

Abstract

Provided is a metal heat sink structure in which a metal heat sink has a high thermal conductivity and is applied to various electronic products to obtain a high heat dissipation effect. A metal heat dissipation plate structure includes a metal substrate 1 having upper and lower surfaces 11, two metal coating layers 2 respectively formed on the upper and lower surfaces 11 of the metal substrate 1, and a high-purity natural graphite layer 3. In addition, two natural graphite layers 3 respectively formed on the upper and lower surfaces 11 of the metal coating layer 2 are included. The metal substrate 1 is made of copper, aluminum, stainless steel or cold rolled steel and has a thickness of 10 μm to 1.6 mm. The metal coating layer 2 is made of nickel, cadmium, a nickel cadmium alloy, silver, or titanium. [Selection] Figure 1

Description

  The present invention relates to a metal heat radiating plate structure, and more particularly, to a metal heat radiating plate structure that has a high thermal conductivity and can be applied to various electronic products to obtain a high heat radiating effect.

  With the rapid development of the electronic industry, for example, electronic products such as personal computers, mobile phones, office automation equipment, and global positioning systems are gradually spreading. Modern electronic components and electronic devices are developing toward thin and light weight, and are multifunctional and high performance.

  As the degree of integration of electronic products increases, the number of electronic components per unit area also increases geometrically, and heat dissipation is an important issue. If the heat is not released quickly, the operating temperature of the components will rise, and in the worst case, the electronic components may fail, directly affecting the life and reliability of various precision instruments. It was. For this reason, the problem of heat dissipation has become a bottleneck in the miniaturization and integration of electronic products.

Thermally conductive silicone is employed in conventional heat dissipation technology. The advantage of thermally conductive silicone is that it is compressible, it has a slower thermal conductivity than metals such as copper, and it must be combined with a fan, which quickly lowers the temperature and limits the space. In that case, the performance could not be fully exhibited. For this reason, some manufacturers have increased the heat dissipation by bonding a carbon-containing layer to the copper bottom (for example, “Copper-carbon composite heat dissipation piece and manufacturing method thereof” in Patent Document 1).
The copper-carbon composite heat dissipation piece is formed by applying a carbon heat conductive layer on both sides of a copper foil. The thickness of the copper foil is 0.02 to 0.25 mm, the thickness of the carbon heat conduction layer is 0.015 to 0.03 mm, and the thickness of the copper carbon composite heat dissipation piece is 0. 0.08 to 0.3 mm. The carbon thermal conductive layer described above is composed of 100 parts of graphene or single-walled carbon nanotubes, 1 to 50 parts of adhesive, and a specific surface area of the graphene of 500 to 1000 m ² / g. The specific surface area of the carbon nanotube is 500 to 1000 m ² / g, and the particle size of the single-walled carbon nanotube is 5 nm. The aforementioned adhesive contains one or more selected from the group consisting of polyvinylidene fluoride, polyvinyl pyrrolidone, polyethylene glycol, and polyvinyl alcohol.
The production method comprises dissolving an adhesive in an organic solvent to obtain an organic solvent for the adhesive (1), mixing a graphene or carbon nanotube and an organic solvent for the adhesive to obtain a mixture (2), The mixture is ultrasonically dispersed for 0.5 to 1 hour, stirred and dispersed at a rotational speed of 1500 to 3000 RPM for 1 to 5 hours, and uniformly mixed to obtain a mixture (3), and the uniformly mixed mixture is copper Apply to both sides of the foil, protect and solidify with inert gas, obtain the above-mentioned copper-carbon composite copper foil heat dissipation piece, set the solidification temperature to 50-200 ° C, set the solidification time to 10-100 minutes Step (4).

  In the above-mentioned Patent Document 1 “Copper / Carbon Composite Heat Dissipating Piece and Method for Producing the Same”, the attachment method of attaching the carbon-containing material to the bottom surface of the copper foil is that the carbon-containing material generates an organic solution using an adhesive and a solvent. It is applied by coating with an inert gas and solidified to form a copper-carbon composite copper foil heat dissipating piece, which is simply a method of adhering an adhesive or a solvent. For this reason, the carbon-containing material itself constituting the carbon layer is likely to come off, the bond with the foreign copper foil becomes unstable, the carbon layer is easily peeled off from the copper foil surface, and the carbon-containing material is separated by an adhesive or a solvent. There is a possibility that the conductivity between the carbon-containing materials is lowered by this method, and the heat conduction effect is greatly lowered.

  Since the structure of the carbon layer is bonded onto the conventional copper foil described above and the bonding method with the carbon layer and the aluminum material is still not preferable, the heat conduction effect is lowered, the cost is too high, and the economic efficiency Therefore, there has been a demand for a metal heat sink structure that improves the problems of the prior art.

Chinese Patent No. 10476227A

  An object of the present invention is to provide a metal heat radiating plate structure that has a high heat conductivity of a metal heat radiating plate and obtains a high heat radiating effect when applied to various electronic products.

  In order to solve the above problems, according to the first aspect of the present invention, a metal substrate having upper and lower surfaces, two metal coating layers respectively formed on the upper and lower surfaces of the metal substrate, and high-purity natural There is provided a metal heat dissipating plate structure comprising a graphite layer and two natural graphite layers respectively formed on upper and lower surfaces of the metal coating layer.

  The metal substrate is made of copper, aluminum, stainless steel, or cold rolled steel, and preferably has a thickness of 10 μm to 1.6 mm.

  The metal coating layer is preferably made of nickel, cadmium, a nickel cadmium alloy, silver or titanium.

  The metal heat sink structure of the present invention can form a metal coating layer and a natural graphite layer on an unprocessed metal substrate under the condition of a vacuum magnetron sputtering space.

It is sectional drawing which shows the metal heat sink structure which concerns on one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited thereby.

  Please refer to FIG. FIG. 1 is a cross-sectional view showing a metal heat sink structure according to an embodiment of the present invention. As shown in FIG. 1, the metal heat sink structure according to an embodiment of the present invention includes at least a metal substrate 1, two metal coating layers 2, and two natural graphite layers 3.

  The metal substrate 1 has upper and lower surfaces 11.

  The two metal coating layers 2 are respectively formed on the upper and lower surfaces 11 of the metal substrate 1.

  The two natural graphite layers 3 are made of high-purity natural graphite and are respectively formed on the surface of the metal coating layer 2.

  When actually manufacturing a metal heat sink, the following method is used.

  First, the metal substrate 1 is prepared. The metal substrate 1 is made of a metal material such as copper, aluminum, stainless steel, cold rolled steel, and has a thickness of 10 μm to 1.6 mm. The upper and lower surfaces 11 of the metal substrate 1 have a smooth or rough surface depending on the selected metal material. For example, when the copper material is not processed, the surface 11 is formed as a smooth surface, and when stainless steel, cold-rolled steel or the like is not processed, the surface 11 is formed as a rough surface having irregularities. Subsequently, the metal substrate 1 is placed in a vacuum chamber, and the vacuum chamber performs sputtering on the metal substrate 1 under the conditions of the vacuum magnetron sputtering space to form the metal coating layer 2.

  Here, the metal coating layer 2 may be made of nickel, cadmium, a nickel cadmium alloy, silver, or titanium when sputtering. Thereafter, the metal coating layer 2 is formed on the upper and lower surfaces 11 of the metal substrate 1 through a vacuum chamber. Next, similarly, high-purity natural graphite is formed on the surface of the metal coating layer 2 under the conditions of the vacuum magnetron sputtering space, thereby completing the manufacture of the metal heat sink.

As described above, the metal heat radiation plate is formed by firmly bonding the natural graphite layer 3 and the metal substrate 1 and forming the natural graphite by the bonding of carbon atoms, so that the graphite itself has high adhesion. Further, the natural graphite layer 3 made of high-purity graphite has high conductivity and conductivity.
As described above, the metal heat sink of the present embodiment can greatly increase the mechanical strength of the heat sink and has a high thermal conductivity. Life can be extended.

As can be seen from the above, the metal heat sink structure of the present invention has the following advantages (1) to (4).
(1) Consisting of a metal substrate, the surface is formed into a smooth or rough surface, natural graphite is bonded to the substrate surface via the metal coating layer, and high purity is formed in the surfaces of the metal substrate and the metal coating layer. Since natural graphite is inserted and firmly bonded to the base material, the surface is prevented from peeling off and the mechanical strength of the heat sink is increased.
(2) The metal heat sink structure uses high-purity natural graphite, which can greatly increase the mechanical strength of the metal substrate due to the good adhesion and conductivity of graphite, and is combined because of its high thermal conductivity. It is possible to extend the service life by enhancing the heat dissipation effect of electrical products or electronic components.
(3) To form a layered structure of an adherent metal coating layer and natural graphite on both surfaces of the metal substrate to double the efficiency of use of the heat sink and increase the throughput and industrial competitiveness of the metal heat sink it can.
(4) Since the surface of the metal substrate can be formed into a smooth surface or a rough surface depending on the selected metal material, the application range is wide and the adhesion of the structure can be enhanced.

DESCRIPTION OF SYMBOLS 1 Metal base material 2 Metal coating layer 3 Natural graphite layer 11 Surface

Claims (3)

A metal substrate having upper and lower surfaces;
Two metal coating layers respectively formed on the upper and lower surfaces of the metal substrate;
It is composed of a high-purity natural graphite layer, and includes two natural graphite layers respectively formed on the upper and lower surfaces of the metal coating layer,
Metal heat sink structure.   The metal heat sink structure according to claim 1, wherein the metal substrate is made of copper, aluminum, stainless steel, or cold rolled steel and has a thickness of 10 μm to 1.6 mm.   The metal heat sink structure according to claim 2, wherein the metal coating layer is made of nickel, cadmium, nickel cadmium alloy, silver, or titanium.

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