CN114205996A - Double-sided aluminum-based printed circuit board and manufacturing method thereof - Google Patents
Double-sided aluminum-based printed circuit board and manufacturing method thereof Download PDFInfo
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- CN114205996A CN114205996A CN202111591576.6A CN202111591576A CN114205996A CN 114205996 A CN114205996 A CN 114205996A CN 202111591576 A CN202111591576 A CN 202111591576A CN 114205996 A CN114205996 A CN 114205996A
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- circuit board
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- printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a double-sided aluminum-based printed circuit board and a manufacturing method thereof. Through the aluminium base board of pressfitting after earlier inlayer etching, the preparation of outer copper circuit has been carried out again, has not only shortened the distance between two copper circuit layers, reduces the error rate to the hole in-process, has reduced manufacturing cost effectively, improves aluminium base double-sided board's output, has still introduced the aluminium base board that has high heat dissipating ability in double-sided printed circuit board for the operating temperature of whole printed circuit board product obtains effectual reduction, and then has improved the power density, the reliability of product, has prolonged the life of product.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a double-sided aluminum-based printed circuit board and a manufacturing method thereof.
Background
An aluminum-based printed circuit board is a circuit board which is manufactured by using a metal aluminum base as a base material and laminating the base material with a copper-clad foil. The aluminum substrate has excellent performances such as good thermal conductivity, electrical insulation, voltage resistance, dimensional stability, machining and the like, and is widely applied to extremely effective treatment on heat diffusion in a circuit design scheme, so that the operating temperature of a product is effectively reduced, the power density and reliability of the product are improved, and the service life of the product is prolonged. In addition, the aluminum substrate effectively reduces the product volume, reduces the hardware and assembly cost, and has excellent mechanical durability and the like which are not possessed by fragile ceramic substrates.
At present, most of aluminum substrates are single-sided, and double-sided boards are rarely used. However, with the continuous upgrade of electronic information products, the single-sided aluminum substrate cannot meet the requirements of medium-high end integrated multifunctional products which have unique dense circuits, have high power and need high heat dissipation performance. Further, a double-sided aluminum substrate appears. Because the double-sided aluminum substrate via hole needs to be insulated, the double-sided aluminum substrate is manufactured on the premise of ensuring the quality, and the manufacturing method is also very difficult. Nowadays, the double-sided aluminum substrate mainly adopts the following structure: line layer-insulating layer-aluminum base layer-insulating layer-line layer. For the structure, it is obvious that two circuit layers are arranged on the outermost layer, so that great difficulty is caused in the alignment process of the through holes, the waste board rate is greatly increased, and the production and manufacturing cost is undoubtedly greatly increased. In order to solve the problems caused by such a structure, we have developed a special multi-layer aluminum substrate structure: line layer-insulating layer-aluminium base layer. The structure enables the two circuit layers to be close to each other as much as possible, so that the error rate in the hole aligning process is reduced, the production cost can be reduced, and the yield of the aluminum-based double-sided board is improved. However, this structure has a significant reduction in heat dissipation performance compared to the former structure. In order to make up for the defect, a filling material with high thermal conductivity is added into an insulating layer between the aluminum substrate and the circuit board, so that the problem of relatively insufficient heat dissipation caused by the structure is solved.
Disclosure of Invention
The invention aims to provide a double-sided aluminum-based printed circuit board and a manufacturing method thereof, aiming at the problems in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a double-sided aluminum-based printed circuit board comprises a metal substrate 1 at the bottom, a first dielectric layer 2 above the metal substrate 1, a first line 3 above the inside of the first dielectric layer 2, a second dielectric layer 4 above the first line 3, and a second line 5 above the second dielectric layer 4;
the metal substrate is an aluminum substrate;
the first dielectric layer is a dielectric layer after resin curing, the resin is epoxy resin, or epoxy resin after phenolic aldehyde modification, or epoxy resin after polyimide modification, and fillers used in the curing process are silicon carbide and silicon nitride;
the first circuit and the second circuit are both copper circuits;
the second medium layer is an epoxy glass fiber cloth substrate.
The invention also provides a manufacturing method of the double-sided aluminum-based printed circuit board, which comprises the following steps:
(1) taking a resin substrate, drilling holes at the positions of positioning holes on the resin substrate, and removing the glue residues left by the drilling holes to obtain a first substrate;
(2) carrying out chemical copper plating on the first substrate to deposit a seed conducting layer on the surface of the substrate, and then carrying out full-board electroplating on the seed conducting layer to obtain a copper layer so as to obtain a first circuit board;
(3) plugging the first circuit board with resin to obtain a second circuit board;
(4) exposing and developing the second circuit board, then etching the inner layer to obtain an inner layer copper circuit, and carrying out etching inspection to obtain a third circuit board;
(5) taking an aluminum substrate, carrying out brown oxidation treatment on the surface of the aluminum substrate, and then pressing the aluminum substrate, an epoxy resin prepreg and a third circuit board together, wherein the epoxy resin prepreg is positioned between the aluminum substrate and the third circuit board during pressing, and the inner layer copper circuit part of the third circuit board faces one end of the epoxy resin prepreg, so that a fourth circuit board is obtained;
(6) milling the fourth circuit board by adopting an aluminum substrate milling cutter, attaching a protective film after milling, and drilling a positioning hole in the milled circuit board to obtain a fifth circuit board;
(7) exposing and developing the fifth circuit board, then etching the outer layer to obtain an outer layer copper circuit, and carrying out etching inspection to obtain a sixth circuit board;
(8) and (3) sequentially carrying out solder mask, character printing, nickel gold immersion, drilling, plate milling, testing, hole inspection, appearance inspection FQC and engineering measurement FQA on the sixth circuit board, and further obtaining a final seventh circuit board, namely the aluminum-based printed circuit board.
Preferably, the resin substrate is an epoxy glass fiber cloth substrate FR-4, the thickness of the substrate is 0.4mm, and the substrate does not contain copper.
As a preferred mode, the reagent used in the process of removing the glue residue is alkaline potassium permanganate solution; the formula of the degumming solution is 140 kg of potassium permanganate and 88 kg of sodium hydroxide, the volume of the reaction vessel is 2000L, and the degumming speed is 0.2-0.4g/cm2。
Preferably, the thickness of the seed conductive layer in step (2) is 2 μm, and the thickness of the copper layer after the full-sheet plating is 30 μm.
Preferably, the resin for plugging in step (3) is an epoxy resin or a modified epoxy resin.
Preferably, the exposure and development in the step (4) adopt negative film exposure, the exposure mode is LED light source automatic exposure, the developing solution is 0.8-1.2% sodium carbonate solution, the working temperature is 28-32 ℃, and only the inner layer is subjected to circuit manufacturing, the outer layer is protected by a protective film, the protective film is a common dry film, and only one copper layer which is not protected by the protective film is etched during etching.
Preferably, the exposure and development in step (7) is carried out by negative film exposure, the exposure is carried out automatically by an LED light source, the developer is 0.8-1.2% sodium carbonate solution, and the working temperature is 28-32 ℃.
Preferably, the aluminum substrate has a thickness of 1.5 mm.
Preferably, the surface of the protective film adhered in the step (6) is an aluminum surface, the used protective film is a high-temperature-resistant PE protective film, and the circuit board faces upwards when the positioning hole is drilled.
The invention has the beneficial effects that: according to the double-sided aluminum-based printed circuit board, the steps of chemical copper plating and the like are firstly carried out on a substrate to obtain an inner-layer copper circuit, then the inner-layer copper circuit is pressed with an epoxy resin prepreg and an aluminum substrate, then the copper layer which is not etched on the other surface of the substrate is etched to obtain an outer-layer copper circuit, and finally the steps of drilling and the like are carried out to obtain the final aluminum-based printed circuit board. Through the aluminium base board of pressfitting after earlier inlayer etching, the preparation of outer copper circuit has been carried out again, has not only shortened the distance between two copper circuit layers, reduces the error rate to the hole in-process, has reduced manufacturing cost effectively, improves aluminium base double-sided board's output, has still introduced the aluminium base board that has high heat dissipating ability in double-sided printed circuit board for the operating temperature of whole printed circuit board product obtains effectual reduction, and then has improved the power density, the reliability of product, has prolonged the life of product.
Drawings
Fig. 1 is a schematic structural diagram of a double-sided aluminum-based printed circuit board according to an embodiment of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. the circuit comprises a metal substrate, 2, a first dielectric layer, 3, a first circuit, 4, a second dielectric layer, 5 and a second circuit.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1, the embodiment provides a double-sided aluminum-based printed circuit board, which includes a metal substrate 1 at the bottom, a first dielectric layer 2 above the metal substrate 1, a first line 3 above the inside of the first dielectric layer 2, a second dielectric layer 4 above the first line 3, and a second line 5 above the second dielectric layer 4;
the metal substrate is an aluminum substrate;
the first dielectric layer is a dielectric layer after resin curing, the resin is epoxy resin, or epoxy resin after phenolic aldehyde modification, or epoxy resin after polyimide modification, and fillers used in the curing process are silicon carbide and silicon nitride;
the first circuit and the second circuit are both copper circuits;
the second medium layer is an epoxy glass fiber cloth substrate.
The embodiment also provides a manufacturing method of the double-sided aluminum-based printed circuit board, which comprises the following steps:
(1) taking a resin substrate, wherein the resin substrate is an epoxy glass fiber fabric substrate FR-4, the thickness of the substrate is 0.4mm, the substrate does not contain copper, drilling holes at the positions of positioning holes on the resin substrate, and then removing glue residues remained due to drilling holes to obtain a first substrate; the reagent used in the process of removing the glue residue is alkaline potassium permanganate solution; the formula of the degumming solution is 140 kg of potassium permanganate and 88 kg of sodium hydroxide, the volume of the reaction vessel is 2000L, and the degumming speed is 0.2-0.4g/cm2；
(2) Carrying out chemical copper plating on the first substrate to deposit a seed conducting layer on the surface of the substrate, and then carrying out full-board electroplating on the seed conducting layer to obtain a copper layer so as to obtain a first circuit board; the thickness of the seed conducting layer is 2 mu m, and the thickness of the copper layer after the whole board is electroplated is 30 mu m;
(3) plugging the first circuit board with resin to obtain a second circuit board; the resin for plugging the holes is epoxy resin and modified epoxy resin;
(4) exposing and developing the second circuit board by adopting a negative film during exposure and development, wherein the exposure mode is automatic exposure of an LED light source, the developing solution is 0.8-1.2% sodium carbonate solution, the working temperature is 28-32 ℃, only one surface of the second circuit board is subjected to circuit manufacturing, the other surface of the second circuit board is protected by a protective film, the protective film is a common dry film, and only one copper layer which is not protected by the protective film is etched during etching; then, etching the inner layer to obtain an inner layer copper circuit, and carrying out etching inspection to finally obtain a third circuit board;
(5) an aluminum substrate is taken, and the thickness of the aluminum substrate is 1.5 mm. Performing brown oxidation treatment on the surface of the third circuit board, and then pressing the third circuit board together with an epoxy resin prepreg, wherein the epoxy resin prepreg is positioned between the aluminum substrate and the third circuit board during pressing, and the inner layer copper circuit part of the third circuit board faces one end of the epoxy resin prepreg, so that a fourth circuit board is obtained;
(6) milling the fourth circuit board by adopting an aluminum substrate milling cutter, attaching a protective film after milling, and drilling a positioning hole in the milled circuit board to obtain a fifth circuit board; one surface of the protective film is an aluminum surface, the used protective film is a high-temperature-resistant PE protective film, and the circuit board is upward in aluminum surface when the positioning hole is drilled;
(7) exposing and developing the fifth circuit board by adopting a negative film during exposure and development, wherein the exposure mode is automatic exposure of an LED light source, the developing solution is 0.8-1.2% of sodium carbonate solution, and the working temperature is 28-32 ℃; then, etching the outer layer to obtain an outer layer copper circuit, and carrying out etching inspection to finally obtain a sixth circuit board;
(8) and (3) sequentially carrying out solder mask, character printing, nickel gold immersion, drilling, plate milling, testing, hole inspection, appearance inspection FQC and engineering measurement FQA on the sixth circuit board, and further obtaining a final seventh circuit board, namely the aluminum-based printed circuit board.
After testing and using, the finally obtained aluminum substrate printed circuit board shows that the double-sided aluminum substrate in the embodiment really has excellent heat dissipation performance, and the volume of the circuit board can be reduced to a greater extent.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A double-sided aluminum-based printed circuit board is characterized in that: the circuit comprises a metal substrate (1) at the bottom, a first dielectric layer (2) above the metal substrate (1), a first circuit (3) above the inner part of the first dielectric layer (2), a second dielectric layer (4) above the first circuit (3), and a second circuit (5) above the second dielectric layer (4);
the metal substrate is an aluminum substrate;
the first dielectric layer is a dielectric layer after resin curing, the resin is epoxy resin, or epoxy resin after phenolic aldehyde modification, or epoxy resin after polyimide modification, and fillers used in the curing process are silicon carbide and silicon nitride;
the first circuit and the second circuit are both copper circuits;
the second medium layer is an epoxy glass fiber cloth substrate.
2. A manufacturing method of a double-sided aluminum-based printed circuit board is characterized by comprising the following steps:
(1) taking a resin substrate, drilling holes at the positions of positioning holes on the resin substrate, and removing the glue residues left by the drilling holes to obtain a first substrate;
(2) carrying out chemical copper plating on the first substrate to deposit a seed conducting layer on the surface of the substrate, and then carrying out full-board electroplating on the seed conducting layer to obtain a copper layer so as to obtain a first circuit board;
(3) plugging the first circuit board with resin to obtain a second circuit board;
(4) exposing and developing the second circuit board, then etching the inner layer to obtain an inner layer copper circuit, and carrying out etching inspection to obtain a third circuit board;
(5) taking an aluminum substrate, carrying out brown oxidation treatment on the surface of the aluminum substrate, and then pressing the aluminum substrate, an epoxy resin prepreg and a third circuit board together, wherein the epoxy resin prepreg is positioned between the aluminum substrate and the third circuit board during pressing, and the inner layer copper circuit part of the third circuit board faces one end of the epoxy resin prepreg, so that a fourth circuit board is obtained;
(6) milling the fourth circuit board by adopting an aluminum substrate milling cutter, attaching a protective film after milling, and drilling a positioning hole in the milled circuit board to obtain a fifth circuit board;
(7) exposing and developing the fifth circuit board, then etching the outer layer to obtain an outer layer copper circuit, and carrying out etching inspection to obtain a sixth circuit board;
(8) and (3) sequentially carrying out solder mask, character printing, nickel gold immersion, drilling, plate milling, testing, hole inspection, appearance inspection FQC and engineering measurement FQA on the sixth circuit board, and further obtaining a final seventh circuit board, namely the aluminum-based printed circuit board.
3. The method for manufacturing a double-sided aluminum-based printed circuit board according to claim 2, wherein: the resin substrate is an epoxy glass fiber cloth substrate FR-4, the thickness of the substrate is 0.4mm, and the substrate does not contain copper.
4. The method for manufacturing a double-sided aluminum-based printed circuit board according to claim 2, wherein: the reagent used in the process of removing the glue residue is alkaline potassium permanganate solution; the formula of the degumming solution is 140 kg of potassium permanganate and 88 kg of sodium hydroxide, the volume of the reaction vessel is 2000L, and the degumming speed is 0.2-0.4g/cm2。
5. The method for manufacturing a double-sided aluminum-based printed circuit board according to claim 2, wherein: the thickness of the seed conducting layer in the step (2) is 2 microns, and the thickness of the copper layer after the whole board is electroplated is 30 microns.
6. The method for manufacturing a double-sided aluminum-based printed circuit board according to claim 2, wherein: the resin for plugging the holes in the step (3) is epoxy resin and modified epoxy resin.
7. The method for manufacturing a double-sided aluminum-based printed circuit board according to claim 2, wherein: in the step (4), negative film exposure is adopted during exposure and development, the exposure mode is LED light source automatic exposure, the developing solution is 0.8-1.2% sodium carbonate solution, the working temperature is 28-32 ℃, only the inner layer is subjected to circuit manufacturing, the outer layer is protected by a protective film, the protective film is a common dry film, and only one copper layer which is not protected by the protective film is etched during etching.
8. The method for manufacturing a double-sided aluminum-based printed circuit board according to claim 2, wherein: in the step (7), negative film exposure is adopted during exposure and development, the exposure mode is LED light source automatic exposure, the developing solution is 0.8-1.2% sodium carbonate solution, and the working temperature is 28-32 ℃.
9. The method for manufacturing a double-sided aluminum-based printed circuit board according to claim 2, wherein: the thickness of the aluminum substrate is 1.5 mm.
10. The method for manufacturing a double-sided aluminum-based printed circuit board according to claim 2, wherein: and (6) one side of the protective film is an aluminum surface, the used protective film is a high-temperature-resistant PE protective film, and the aluminum surface of the circuit board faces upwards when the positioning hole is drilled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111591576.6A CN114205996A (en) | 2021-12-23 | 2021-12-23 | Double-sided aluminum-based printed circuit board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111591576.6A CN114205996A (en) | 2021-12-23 | 2021-12-23 | Double-sided aluminum-based printed circuit board and manufacturing method thereof |
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| CN114205996A true CN114205996A (en) | 2022-03-18 |
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| CN202111591576.6A Pending CN114205996A (en) | 2021-12-23 | 2021-12-23 | Double-sided aluminum-based printed circuit board and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114900969A (en) * | 2022-06-01 | 2022-08-12 | 深圳市深联电路有限公司 | Printed circuit board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102264191A (en) * | 2011-06-30 | 2011-11-30 | 中山市达进电子有限公司 | Method for manufacturing high-density interconnected aluminum base circuit board |
| CN106572609A (en) * | 2016-11-04 | 2017-04-19 | 深圳市深联电路有限公司 | Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate |
| CN109413867A (en) * | 2018-12-11 | 2019-03-01 | 奥士康科技股份有限公司 | High thermal conductivity double-face aluminium substrate and preparation method thereof |
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2021
- 2021-12-23 CN CN202111591576.6A patent/CN114205996A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102264191A (en) * | 2011-06-30 | 2011-11-30 | 中山市达进电子有限公司 | Method for manufacturing high-density interconnected aluminum base circuit board |
| CN106572609A (en) * | 2016-11-04 | 2017-04-19 | 深圳市深联电路有限公司 | Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate |
| CN109413867A (en) * | 2018-12-11 | 2019-03-01 | 奥士康科技股份有限公司 | High thermal conductivity double-face aluminium substrate and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114900969A (en) * | 2022-06-01 | 2022-08-12 | 深圳市深联电路有限公司 | Printed circuit board and manufacturing method thereof |
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