CN104053305A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN104053305A CN104053305A CN201310080032.2A CN201310080032A CN104053305A CN 104053305 A CN104053305 A CN 104053305A CN 201310080032 A CN201310080032 A CN 201310080032A CN 104053305 A CN104053305 A CN 104053305A
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- Prior art keywords
- copper
- thickness
- layer
- hole
- metal
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 164
- 229910052802 copper Inorganic materials 0.000 claims abstract description 161
- 239000010949 copper Substances 0.000 claims abstract description 161
- 239000000463 material Substances 0.000 claims abstract description 35
- 238000009713 electroplating Methods 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims description 54
- 229910052751 metal Inorganic materials 0.000 claims description 54
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 35
- 230000000181 anti-adherent effect Effects 0.000 claims description 30
- 238000007747 plating Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 21
- 239000011889 copper foil Substances 0.000 claims description 12
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 abstract description 7
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 120
- 238000010586 diagram Methods 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 3
- 239000003814 drug Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000021186 dishes Nutrition 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a printed circuit board and a manufacturing method thereof. The thickness L of a surface copper meets the relation expressing by the formula: L=L1+L2; and the thickness H of a hole copper meets the relation expressing by the formula: H=H1+H2. The copper layer L2 and the copper layer H2 are obtained by simultaneous electroplating; and the copper layer L1 and the copper layer H1 can be manufactured and controlled separately. During the manufacturing process, the difference between the surface copper thickness and the hole copper thickness can be realized by controlling the thicknesses of the copper layer L1 and the copper layer H2; and the surface copper and the hole copper can meet the thickness requirement simultaneously. In addition, a tin-lead layer is plated in advance to form a corrosion-resistant layer (3), so that the surface copper layer can be protected from being damaged; and the thickness of the electroplated surface copper is minimized and the thickness uniformity of the surface copper is ensured. Besides, an anti-adhesion material (4) is also used for protecting the hole copper layer, thereby ensuring that the finished hole copper layer thickness meets the requirement.
Description
Technical field
The present invention relates to printed wiring board technical field, especially a kind of high thickness to diameter ratio printed wiring board and preparation method thereof.
Background technology
Along with the high speed development of electronic product, the wiring density of pcb board improves constantly, and circuit is more and more thinner, through hole radius-thickness ratio is increasing.In high thickness to diameter ratio, fine-line PCB manufacturing process, the making of fine rule road, little spacing pcb board, requires table copper thickness to be limited in certain thickness, and face copper thickness is thinner, and fine-line is more easily made; Copper layer thickness is too high, and the making of fine-line will encounter difficulties; But through hole connects and welding position as the interlayer of circuit, and hole copper thickness is had to strict requirement, and its copper layer thickness need to reach certain requirement conventionally.Therefore, cause showing the requirement of copper thickness and contradiction has appearred in the requirement of hole copper thickness.
In conventional pcb board manufacturing process, general dull and stereotyped plating and the figure of adopting once shifts, and according to customer requirement, on PCB substrate, once property is electroplated table copper thickness and the hole copper thickness of customer requirement, and on PCB substrate, once property is carried out figure transfer.But in the manufacturing process of high thickness to diameter ratio, fine-line PCB, when electroplating when meeting hole copper thickness, face copper also can reach larger thickness; Thereby when the making of fine-line, there will be etching difficulty, owing to showing the requirement of copper thickness and the requirement of hole copper thickness, have contradiction, must adopt additive method to make.
Application number is 200880005349.7 Chinese patent, has announced multiple preventing of using and adhere to or anti-adhesive material in printed wiring board manufacturing process, comprises its preparation, using method, and can adopt wet chemistry or mechanical polish-brush to remove.Such material is in use not bonding with dielectric layer and the copper layer of printed circuit board.
The technical scheme that application number is 201010159324.1, name is called the patent of " manufacture method of a kind of high thickness to diameter ratio, fine-line PCB " is: after carrying out basic electric plating of whole board, adopt the mode of graphic plating to thicken hole copper, and the copper post that adopts polish-brush mode to remove to eat dishes without rice or wine outstanding, reach when not increasing face copper thickness thickening hole copper thickness.
Summary of the invention
For existing deficiency in prior art, the invention provides a kind of high thickness to diameter ratio printed wiring board manufacturing method, by adjusting the composition structure of the face copper of printed wiring board, can on the basis that meets hole copper requirement, reduce face copper thickness, and make hole copper and face copper thickness precisely controlled.
The present invention solves the problems of the technologies described above adopted technical scheme as described below:
A printed wiring board manufacturing method, comprises the following steps:
(S1) adopt the face copper Copper Foil that thickness is L1 to be compressed on making sheet, and holing in making sheet, L1 is less than the requirement of circuit copper layer thickness;
(S2) zinc-plated plumbous resist layer on the face copper Copper Foil in making sheet;
(S3) the internal layer hole copper thickness of electroplating described hole is to set point H1;
(S4) in described hole, clog anti-adhesive material;
(S5) remove unnecessary the copper being electroplated onto on the plumbous resist layer of tin, make the plumbous resist layer of tin exposed;
(S6) remove the anti-adhesive material in described hole, divest the plumbous resist layer (3) of tin on face copper Copper Foil;
(S7) carry out electric plating of whole board, copper electroplating layer thickness L2, electroplates outer hole copper thickness H2;
(S8) carry out figure transfer, make fine-line.
Further, the thickness range of the plumbous resist layer of the tin described in step (S2) is 3-5 micron.
Further, in step (S4), remove the unnecessary anti-adhesive material in through hole aperture.
Further, in step (S4), adopt mechanical polish-brush or chemical method to remove the unnecessary anti-adhesive material in through hole aperture.
Further, described chemical method is for adopting ammoniacal liquor, ethyoxyl propyl alcohol that unnecessary anti-adhesive material is dissolved and removed.
Further, in step (S5), adopt engraving method to remove and be electroplated onto unnecessary copper on the plumbous resist layer of tin.
Further again, in step (S7), use graphic plating mode to carry out electric plating of whole board.
A printed wiring board, comprises metal aperture and metallic circuit layer, wherein,
Described metallic circuit layer comprises the outer layer metal that inner layer metal that thickness is L1 and thickness are L2;
Metal comprises the outer layer metal that inner layer metal and thickness are H2 in described metal aperture, and the inner layer metal of described metal aperture is H1 at the thickness at middle part, hole;
The inner layer metal of the inner layer metal of described metal aperture and described metallic circuit layer, joins by the plumbous resist layer of tin;
The outer layer metal of described metallic circuit layer and the outer layer metal of described metal aperture are same plating step gained.
Beneficial effect of the present invention is as follows: of the present invention copper thickness L=L1+L2, hole copper thickness H=H1+H2, wherein, copper layer L2 and copper layer H2 are for electroplate and obtain simultaneously, copper layer L1 and copper layer H1 can separately make control, in manufacturing process, can realize the difference between face copper thickness and hole copper thickness by controlling the thickness of copper layer L1 and copper layer H1, and make it to meet thickness requirement simultaneously.In addition, the present invention adopts plating tin lead layer in advance as resist layer, can not to be damaged by protective surface copper layer, and to reduce the thickness of electroplating surface copper as far as possible, guarantees the thickness evenness of face copper; The present invention also adopts anti-adhesive material protection hole copper layer, can guarantee that final hole copper layer thickness meets the demands.
Accompanying drawing explanation
The general structure schematic diagram that Fig. 1 is the pcb board that adopts the method for the invention and make;
Fig. 2 is for to be compressed on making sheet with Copper Foil, and at the schematic diagram getting out in making sheet after through hole;
Fig. 3 is the schematic diagram after zinc-plated plumbous resist layer in making sheet;
Fig. 4 is electroplating hole copper thickness H to the schematic diagram after set point H1;
Fig. 5 is for to clog anti-adhesive material in through hole, and removes the schematic diagram after the unnecessary anti-adhesive material in through hole aperture;
Fig. 6 is for removing the schematic diagram after unnecessary the copper being electroplated onto on the plumbous resist layer of tin;
Fig. 7, for removing the anti-adhesive material in through hole, divests the schematic diagram after the plumbous resist layer of tin on face copper;
Fig. 8, for carrying out electric plating of whole board, is electroplated to L2 by copper layer thickness, and hole copper thickness is electroplated to the schematic diagram after H2.
Embodiment
Below in conjunction with the drawings and specific embodiments, describe the present invention.
In the present invention, by adjusting the face copper of printed wiring board, form structure, on the basis that meets hole copper requirement, reduce face copper thickness, make hole copper thickness and face copper thickness precisely controlled.Technical scheme of the present invention comprises: installation surface copper copper thickness L1, electroplating surface copper thickness L2, electroplating hole copper thickness H1, H2; Face copper thickness L=L1+L2, hole copper thickness H=H1+H2, wherein, copper layer thickness L2 and H2 are for electroplate and obtain simultaneously, and copper layer thickness L1 and H1, can separately make control; In manufacturing process, can make up by controlling copper layer thickness L1 and H1 the difference of copper layer thickness L2 and H2 in plating, and make it to meet thickness requirement simultaneously.
The printed wiring board that the present invention makes, comprises metal aperture and metallic circuit layer, and wherein, described metallic circuit layer comprises the outer layer metal that inner layer metal that thickness is L1 and thickness are L2; Metal comprises the outer layer metal that inner layer metal that thickness is H1 and thickness are H2 in described metal aperture; The inner layer metal of the inner layer metal of described metal aperture and described metallic circuit layer, joins by the plumbous resist layer of tin; The outer layer metal of described metallic circuit layer and the outer layer metal of described metal aperture are same plating step gained.
Further, the height of the plumbous resist layer of described tin is the thickness L1 of metallic circuit layer inner layer metal.
Further, the bed thickness of the plumbous resist layer of described tin is less than the inner layer metal of described metal aperture at the thickness H1 at middle part, hole.
Particularly, a kind of printed wiring board manufacturing method, as shown in Fig. 1-8, comprises the following steps:
(S1) adopt the face copper Copper Foil that thickness is L1 to be compressed on making sheet 1, and in making sheet 1, getting out through hole 2, L1 is less than the requirement of circuit copper layer thickness;
(S2) zinc-plated plumbous resist layer 3 on the face copper Copper Foil in making sheet 1, the thickness suggestion of the described plumbous resist layer 3 of tin is greater than 3 microns, and preferred range is 3-5 micron;
(S3) electroplate internal layer hole copper thickness to set point H1; Indication internal layer thickness herein, refers to and approaches the copper layer thickness at metal aperture middle part the thick existence because of plumbous resist layer 3 bed thickness of tin of copper at position, aperture, and be slightly less than H1.
(S4) in through hole 2, clog anti-adhesive material 4, described anti-adhesive material refers to that the organic substance of chemical reaction does not occur for existing and copper or other metals, adopt mechanical polish-brush or chemical method to remove the unnecessary anti-adhesive material in through hole 2 apertures, described chemical method is for adopting ammoniacal liquor, ethyoxyl propyl alcohol equal solvent that unnecessary anti-adhesive material is dissolved and removed again;
(S5) remove unnecessary the copper being electroplated onto on the plumbous resist layer 3 of tin, make the plumbous resist layer 3 of tin completely out exposed, owing to will clog anti-adhesive material 4 in through hole 2 in step (S4), the hole copper thickness H1 in through hole 2 can be affected in this step;
(S6) remove the anti-adhesive material 4 in through hole 2, divest the plumbous resist layer 3 of tin on face copper Copper Foil;
(S7) adopt graphic plating mode to carry out electric plating of whole board, copper electroplating layer thickness L2, electroplates outer hole copper thickness H2; Copper layer L2 and copper layer H2 are for electroplate and obtain simultaneously, and copper layer L1 and copper layer H1 are for separately making.
(S8) carry out figure transfer, make fine-line.
For L1 of the present invention and L2, H1 and H2, the value of face copper thickness L be L1 and L2 and, the value of hole copper thickness H be H1 and H2 with.
Generally first make H1, the thick little 5-10 micron of its Thickness Ratio target copper is advisable; H2 scope is 5-15 micron; The thickness of L2 is to generate while making H2, according to different electroplating devices and liquid medicine ability, determines.In general, in situation about setting with target thickness L1+L2, the thickness of L1 is determined by L2.In actual production process, can test by experiment to control data.Due to distinct device, liquid medicine and electroplating parameter, the thick difference of copper generating afterwards in plating, and widely different, therefore the thickness proportion of the thickness proportion of L1 and L2 and H1 and H2 is not specifically limited.With the reasonable plating level of industry, H1:H2 can be designed as 4:1 left and right, and the L1:L2 of generation is probably 3:1 left and right.
Preferably, in step (S4), clog anti-adhesive material 4 in through hole 2 after, adopt mechanical polish-brush or chemical method to remove the unnecessary anti-adhesive material in through hole 2 apertures, described chemical method is for adopting ammoniacal liquor, ethyoxyl propyl alcohol equal solvent that unnecessary anti-adhesive material is dissolved and removed.
In the technical scheme of the method for the invention, adopt in advance plating tin lead layer as resist layer, it is that the face copper layer of L1 is not damaged that the plumbous resist layer of tin can be protected thickness, and can reduce as far as possible and need the thickness of electroplating surface copper L2, guarantees the uniformity of the thickness of face copper; In addition, in technical scheme, adopt anti-adhesive material protection hole copper layer, guarantee that final hole copper layer thickness H meets the demands.
In one embodiment, technical scheme of the present invention comprises:
1, adopt the thickness that is slightly less than the requirement of circuit copper layer thickness, the Copper Foil of thickness L1 is compressed on making sheet 1, as shown in Figure 2;
2, after having bored through hole 2, plate the thin tin lead layer of one deck as resist layer in making sheet 1, the plumbous resist layer 3 of described tin can, as the protective layer of original copper layer, be avoided subtracting copper and be caused face copper thickness inhomogeneous, as shown in Figure 3 while subtracting copper follow-up;
3, sink copper and process, electroplate internal layer hole copper thickness to set point H1, this set point is approximately less than or equal to the requirement of the thick H of target copper, as shown in Figure 4;
4, in through hole 2, clog anti-adhesive material 4, adopt the method for mechanical polish-brush or chemistry to remove the unnecessary anti-adhesive material in through hole 2 apertures, as shown in Figure 5, this anti-adhesive material can protect through hole copper layer not to be damaged when subtracting copper, and can after subtracting copper, remove;
5, adopt engraving method to remove the face copper in plating, completely out exposed to the plumbous resist layer 3 of tin, as shown in Figure 6;
6, remove the anti-adhesive material 4 in through hole 2, divest the plumbous resist layer 3 of tin on face copper, as shown in Figure 7;
7, carry out electric plating of whole board, increase face copper thickness L2 and hole copper thickness H2, as shown in Figure 8, to reach final copper layer thickness requirement, in face copper, copper electroplating layer thickness L2 is less, can avoid electroplating and cause the thick difference of Local Copper, improves the quality that fine-line is made.
The optimal technical scheme of the present embodiment further comprises:
1, select the modes such as electrotinning layer, chemical plating stannum to make the plumbous resist layer of tin;
2,, after forming the plumbous resist layer of tin, the mode of graphic plating of take is made the internal layer hole copper layer that thickness is H1;
3, after completing, compacting in making sheet, plates the thin tin lead layer of one deck as resist layer, then the making of holing;
4, be compressed on the copper thickness L1 of making sheet, copper electroplating layer thickness L2, hole copper thickness H1, H2; As shown in Figure 1, face copper thickness L=L1+L2, hole copper thickness H=H1+H2, wherein, copper layer thickness L2 and H2 are for electroplate and obtain simultaneously, and copper layer thickness L1 and H1, can separately make control; In manufacturing process, can make up by controlling the value of L1 and H1 the difference in thickness of L2 and H2 in plating, and make it to meet thickness requirement simultaneously;
5, use graphic plating mode to thicken face copper thickness to L2 and hole copper thickness to H2, and carry out fine-line making.
In another embodiment, method of the present invention comprises the following steps:
1, the Copper Foil of selecting to be slightly less than the requirement of circuit copper layer thickness is compressed on making sheet 1, and in making sheet, is getting out through hole 2, as shown in Figure 2;
2, in making sheet 1, plating the thin tin lead layer of one deck as resist layer 3 as shown in Figure 3;
3, according to the heavy process for copper of routine, to sink copper in making sheet 1, process, electroplating hole copper thickness reaches set point H1, as shown in Figure 4;
4, adopt silk-screen mode, in the through hole 2 in making sheet 1, fill in non-cohesive material, and the unnecessary non-cohesive material in worn through hole 2 apertures, as shown in Figure 5;
5, to carry out etching in making sheet 1, subtract copper processing, eliminate unnecessary face copper on the plumbous resist layer 3 of tin, completely out exposed to the plumbous resist layer of tin, as shown in Figure 6;
6, remove the non-cohesive material in through hole 2, divest the plumbous resist layer 3 of tin on face copper, as shown in Figure 7;
7, carry out electric plating of whole board, make face copper thickness and hole copper thickness reach final copper layer thickness requirement; And make to form a complete copper layer with surface in through hole 2, as shown in Figure 8;
8, carry out figure transfer, make fine-line.
The present invention forms structure by adjusting the face copper of printed wiring board; can on the basis that meets hole copper requirement, reduce face copper thickness; and make hole copper and face copper thickness precisely controlled; by adopting in advance plating tin lead layer as resist layer; protective surface copper layer is not damaged, and reduces electroplating surface copper thickness as far as possible, can guarantee the thickness evenness of face copper; by adopting anti-adhesive material protection hole copper layer, can guarantee that final hole copper layer thickness meets the demands.In addition, above-described embodiment is all usingd copper (face copper, hole copper) as the underlying metal of line layer and metal aperture, and the actual copper that is not limited to, can also be the conductive materials such as other metal or alloy.
It should be noted that; above-mentioned specific embodiment is only exemplary; under above-mentioned instruction of the present invention, those skilled in the art can carry out various improvement and distortion on the basis of above-described embodiment, and these improvement or distortion all drop in protection scope of the present invention.It will be understood by those skilled in the art that specific descriptions are above in order to explain object of the present invention, not for limiting the present invention.Protection scope of the present invention is limited by claim and equivalent thereof.
Claims (10)
1. a printed wiring board manufacturing method, comprises the following steps:
(S1) adopt the face copper Copper Foil that thickness is L1 to be compressed on making sheet (1), and above holing (2) in making sheet (1), L1 is less than the requirement of circuit copper layer thickness;
(S2) zinc-plated plumbous resist layer (3) on the face copper Copper Foil in making sheet (1);
(S3) the internal layer hole copper thickness of electroplating described hole (2) is to set point H1;
(S4) filling anti-adhesive material (4) in described hole (2);
(S5) remove unnecessary the copper being electroplated onto on the plumbous resist layer of tin (3), make the plumbous resist layer of tin (3) exposed;
(S6) remove the anti-adhesive material (4) in described hole (2), divest the plumbous resist layer (3) of tin on face copper Copper Foil;
(S7) carry out electric plating of whole board, copper electroplating layer thickness L2, electroplates outer hole copper thickness H2;
(S8) carry out figure transfer, make fine-line.
2. printed wiring board manufacturing method as claimed in claim 1, is characterized in that: the thickness range of the plumbous resist layer of the tin described in step (S2) (3) is 3-5 micron.
3. printed wiring board manufacturing method as claimed in claim 1, is characterized in that: in step (S4), remove the unnecessary anti-adhesive material in through hole (2) aperture.
4. printed wiring board manufacturing method as claimed in claim 3, is characterized in that: in step (S4), adopt mechanical polish-brush or chemical method to remove the unnecessary anti-adhesive material in through hole (2) aperture.
5. printed wiring board manufacturing method as claimed in claim 4, is characterized in that: described chemical method is for adopting ammoniacal liquor, ethyoxyl propyl alcohol that unnecessary anti-adhesive material is dissolved and removed.
6. the printed wiring board manufacturing method as described in one of claim 1-5, is characterized in that: in step (S5), adopt engraving method to remove unnecessary the copper being electroplated onto on the plumbous resist layer of tin (3).
7. printed wiring board manufacturing method as claimed in claim 6, is characterized in that: in step (S7), use graphic plating mode to carry out electric plating of whole board.
8. a printed wiring board, comprises metal aperture and metallic circuit layer, it is characterized in that:
Described metallic circuit layer comprises the outer layer metal that inner layer metal that thickness is L1 and thickness are L2;
Metal comprises the outer layer metal that inner layer metal and thickness are H2 in described metal aperture, and the inner layer metal of described metal aperture is H1 at the thickness at middle part, hole;
The inner layer metal of the inner layer metal of described metal aperture and described metallic circuit layer, joins by the plumbous resist layer of tin;
Wherein, the outer layer metal of described metallic circuit layer and the outer layer metal of described metal aperture are same plating step gained.
9. printed wiring board as claimed in claim 8, is characterized in that, the height of the plumbous resist layer of described tin is the thickness L1 of metallic circuit layer inner layer metal.
10. printed wiring board as claimed in claim 8 or 9, is characterized in that, the bed thickness of the plumbous resist layer of described tin is less than the inner layer metal of described metal aperture at the thickness H1 at middle part, hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310080032.2A CN104053305B (en) | 2013-03-13 | 2013-03-13 | A kind of printed wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310080032.2A CN104053305B (en) | 2013-03-13 | 2013-03-13 | A kind of printed wiring board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104053305A true CN104053305A (en) | 2014-09-17 |
| CN104053305B CN104053305B (en) | 2017-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310080032.2A Expired - Fee Related CN104053305B (en) | 2013-03-13 | 2013-03-13 | A kind of printed wiring board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104053305B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105392299A (en) * | 2015-11-27 | 2016-03-09 | 北大方正集团有限公司 | Method for improving uniformity of PCB copper reduction |
| CN112969297A (en) * | 2019-12-12 | 2021-06-15 | 欣兴电子股份有限公司 | Circuit board and method for manufacturing the same |
| US11289413B2 (en) | 2019-12-10 | 2022-03-29 | Unimicron Technology Corp. | Wiring board and manufacture method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3322881A (en) * | 1964-08-19 | 1967-05-30 | Jr Frederick W Schneble | Multilayer printed circuit assemblies |
| US4211603A (en) * | 1978-05-01 | 1980-07-08 | Tektronix, Inc. | Multilayer circuit board construction and method |
| US5707893A (en) * | 1995-12-01 | 1998-01-13 | International Business Machines Corporation | Method of making a circuitized substrate using two different metallization processes |
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
-
2013
- 2013-03-13 CN CN201310080032.2A patent/CN104053305B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3322881A (en) * | 1964-08-19 | 1967-05-30 | Jr Frederick W Schneble | Multilayer printed circuit assemblies |
| US4211603A (en) * | 1978-05-01 | 1980-07-08 | Tektronix, Inc. | Multilayer circuit board construction and method |
| US5707893A (en) * | 1995-12-01 | 1998-01-13 | International Business Machines Corporation | Method of making a circuitized substrate using two different metallization processes |
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105392299A (en) * | 2015-11-27 | 2016-03-09 | 北大方正集团有限公司 | Method for improving uniformity of PCB copper reduction |
| CN105392299B (en) * | 2015-11-27 | 2018-08-03 | 北大方正集团有限公司 | A method of improving PCB and subtracts copper uniformity |
| US11289413B2 (en) | 2019-12-10 | 2022-03-29 | Unimicron Technology Corp. | Wiring board and manufacture method thereof |
| CN112969297A (en) * | 2019-12-12 | 2021-06-15 | 欣兴电子股份有限公司 | Circuit board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104053305B (en) | 2017-06-16 |
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