CN107835587B - High-frequency microwave multilayer printed circuit blind slot and manufacturing process thereof - Google Patents
High-frequency microwave multilayer printed circuit blind slot and manufacturing process thereof Download PDFInfo
- Publication number
- CN107835587B CN107835587B CN201710810845.0A CN201710810845A CN107835587B CN 107835587 B CN107835587 B CN 107835587B CN 201710810845 A CN201710810845 A CN 201710810845A CN 107835587 B CN107835587 B CN 107835587B
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- copper
- layer
- blind groove
- blind
- printed circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention provides a high-frequency multilayer printed circuit blind groove and a manufacturing process thereof, and the high-frequency multilayer printed circuit blind groove comprises a high-frequency multilayer printed circuit board, a blind groove, a full-plate electroplated copper layer, a pattern electroplated copper and a high-frequency signal circuit, wherein the high-frequency multilayer printed circuit board is formed by laminating outer-layer bottom copper, a medium, inner-layer circuit copper and outer-layer bottom copper, the blind groove is arranged on the high-frequency multilayer printed circuit board, the full-plate electroplated copper layer and the pattern electroplated copper are arranged on the blind groove wall of the blind groove, the blind groove bottom of the blind groove is the medium, and the high-frequency signal. The invention solves the manufacturing problems of copper on the wall of the blind groove and no copper at the bottom of the blind groove of the high-frequency multilayer printed circuit, the insulating groove can not be connected with current in the copper plating and tin plating processes, the tin layer protects the pattern copper electroplating during etching, the whole copper electroplating layer at the bottom of the blind groove is etched, and the medium is exposed, thereby realizing the signal shielding of the wall of the blind groove and the high-frequency multilayer printed circuit blind groove without interfering signals at the bottom of the blind groove.
Description
Technical Field
The invention relates to the technical field of high-frequency microwave multilayer printed circuit manufacturing, in particular to a high-frequency microwave multilayer printed circuit blind slot and a manufacturing process thereof.
Background
In the high-frequency microwave multilayer printed circuit, the wall of a blind slot is required to have copper for shielding inner layer signals, and the absence of copper at the slot bottom prevents outer layer signals opposite to the slot bottom from being shielded. In the prior art, the condition that the wall and the bottom of a blind slot of a printed circuit are both copper or copper-free can be realized, and the requirements that the wall and the bottom of the blind slot are both copper can not be realized. CN103079350B discloses a processing method of a pattern in a blind groove of a printed board, which is used for realizing the metallization of the side wall of the blind groove and the manufacture of a circuit pattern with a metalized through hole at the groove bottom, removing a gold nickel layer at an unnecessary isolation region by laser, and then corroding exposed copper in the isolation region by alkaline etching, thereby realizing the manufacture of the circuit pattern at the bottom of the blind groove, improving the problem of glue overflow of a prepreg by using a depth-controlled milling blind groove and a carbon dioxide laser milling blind groove mode.
Disclosure of Invention
The invention aims to solve the problems of the prior art, and provides a high-frequency microwave multilayer printed circuit blind slot and a manufacturing process thereof, which solves the manufacturing problem that the slot wall of the high-frequency microwave multilayer printed circuit blind slot has copper and the slot bottom has no copper.
Therefore, the technical solution adopted by the invention is as follows:
a manufacturing process of a high-frequency microwave multilayer printed circuit blind slot comprises the following steps:
(1) milling a blind groove on the high-frequency microwave multilayer printed circuit board, and metalizing a full-plate electroplated copper layer on the blind groove wall and the blind groove bottom of the blind groove and on the outer-layer bottom copper and the outer-layer bottom copper, wherein the thickness of the full-plate electroplated copper layer is 4-8 mu m;
(2) cutting and removing the whole copper electroplating layer on the bottom of part of the blind groove by using ultraviolet laser under the blind groove to form a square-shaped insulating groove, wherein the whole copper electroplating layer on the wall of the blind groove is separated from the whole copper electroplating layer on the bottom of the blind groove by the insulating groove, the width of the insulating groove is 0.1-0.5 mm, and the distance between the edge of the insulating groove and the wall of the blind groove is 0.15-0.3 mm;
(3) making an outer layer pattern on the whole board copper-plating layer, electroplating copper on the outer layer pattern to form pattern copper-plating and tin-plating to form a tin layer, wherein the thickness of the copper layer on the wall of the blind slot is 25-40 mu m, and the thickness of the tin layer is 10-15 mu m;
(4) etching the whole electroplated copper layer surrounded by the insulating groove by alkaline etching, exposing a medium at the bottom of the blind groove, and arranging a high-frequency microwave signal circuit on the outer-layer bottom copper below the bottom of the blind groove;
(5) and stripping tin from the high-frequency microwave multilayer printed circuit board to obtain the high-frequency microwave multilayer printed circuit blind slot with blind slot wall signal shielding and blind slot bottom interference-free signals.
The high-frequency microwave multilayer printed circuit blind groove is obtained by applying a manufacturing process of the high-frequency microwave multilayer printed circuit blind groove, and comprises a high-frequency microwave multilayer printed circuit board, a blind groove, a full-plate copper electroplating layer, a pattern copper electroplating layer and a high-frequency microwave signal circuit, wherein the high-frequency microwave multilayer printed circuit board is formed by laminating outer-layer bottom copper, a medium and inner-layer circuit copper, the blind groove is arranged on the high-frequency microwave multilayer printed circuit board, the full-plate copper electroplating layer and the pattern copper electroplating layer are arranged on the wall of the blind groove, the blind groove bottom of the blind groove is the medium, and the high-frequency microwave signal circuit is arranged on the.
The beneficial effects of the above technical scheme are that:
the invention carries out full-plate copper plating on the high-frequency microwave multilayer printed circuit board after milling the blind slot, utilizes ultraviolet laser to cut and eliminate partial full-plate copper plating layer under the blind slot to form an insulating slot, the width of the insulating slot is 0.1 mm-0.5 mm, the distance between the edge of the insulating slot and the wall of the blind slot is 0.15 mm-0.3 mm, when the outer layer pattern is electroplated with copper and tin after the outer layer pattern is made on the whole board electroplated copper layer, because the insulating groove is not connected with current in the electroplating process, the whole electroplated copper layer surrounded by the insulating groove can not be electroplated with copper and electroplated with tin, and the whole electroplated copper layer surrounded by the insulating groove is etched in the alkaline etching process to completely expose the medium, the high-frequency microwave signal circuit is arranged below the blind slot bottom, so that the high-frequency microwave multilayer printed circuit blind slot can realize blind slot wall signal shielding and non-interference signal at the blind slot bottom, namely the blind slot wall of the blind slot has copper and the blind slot bottom has no copper.
Drawings
Fig. 1 is a schematic structural diagram of the blind groove of the present invention.
FIG. 2 is a schematic diagram of the structure of the whole plate after electroplating.
Fig. 3 is a schematic structural diagram of the ultraviolet laser cutting structure of the invention.
FIG. 4 is a schematic view of the structure of the present invention after UV laser cutting.
FIG. 5 is a schematic diagram of the structure after alkaline etching according to the present invention.
In the figure: 1. a high-frequency microwave multilayer printed circuit board; 2. a blind groove; 3. electroplating a copper layer on the whole board; 4. an insulating groove; 5. electroplating copper on the pattern; 6. a high-frequency microwave multilayer circuit; 101. outer bottom copper layer; 102. a medium; 103. inner layer circuit copper; 104. outer bottom copper layer; 201. a blind slot wall; 202. the bottom of the blind groove.
Detailed Description
To make the features and advantages of the present invention more apparent, the following description is given with reference to specific embodiments.
As shown in fig. 1 to 5, a process for manufacturing a blind slot of a high-frequency microwave multilayer printed circuit comprises the following steps:
(5) milling a blind groove 2 on the high-frequency microwave multilayer printed circuit board 1, and metalizing a full-plate electroplated copper layer 3 on a blind groove wall 201 and a blind groove bottom 202 of the blind groove 2 and on an outer-layer bottom copper 101 and an outer-layer bottom copper 104, wherein the thickness of the full-plate electroplated copper layer 3 is 4-8 mu m;
(6) cutting and removing the full-plate electroplated copper layer 3 on part of the blind groove bottom 202 by using ultraviolet laser at the blind groove bottom 202 to form a square-shaped insulating groove 4, wherein the full-plate electroplated copper layer 3 of the blind groove wall 201 is separated from the full-plate electroplated copper layer 3 of the blind groove bottom 202 by the insulating groove 4, the width of the insulating groove 4 is 0.1 mm-0.5 mm, and the distance between the edge of the insulating groove 4 and the blind groove wall is 0.15 mm-0.3 mm;
(7) making an outer layer pattern on the whole board copper electroplating layer 3, electroplating copper on the outer layer pattern to form a pattern copper electroplating 5 and electroplating tin to form a tin layer, wherein the thickness of the copper layer of the blind groove wall 201 is 25-40 μm, and the thickness of the tin layer is 10-15 μm;
(8) etching the whole electroplated copper layer 3 surrounded by the insulating groove 4 by alkaline etching, wherein the medium 102 is exposed at the bottom 102 of the blind groove, and the high-frequency microwave multilayer circuit 6 is arranged on the outer-layer bottom copper 104 below the bottom 102 of the blind groove;
(9) and (3) stripping tin from the high-frequency microwave multilayer printed circuit board 1 to obtain the high-frequency microwave multilayer printed circuit blind slot with the blind slot wall 201 for signal shielding and the blind slot bottom 202 for interference-free signals.
As shown in fig. 1 to 5, a high-frequency microwave multilayer printed circuit blind slot comprises a high-frequency microwave multilayer printed circuit board 1, a blind slot 2, a full-plate copper electroplating layer 3, a pattern copper electroplating layer 5 and a high-frequency microwave multilayer circuit 6, wherein the high-frequency microwave multilayer printed circuit board 1 is formed by laminating outer-layer bottom copper 101, a medium 102, inner-layer circuit copper 103 and outer-layer bottom copper 104, the blind slot 2 is arranged on the high-frequency microwave multilayer printed circuit board 1, the full-plate copper electroplating layer 3 and the pattern copper electroplating layer 5 are arranged on a blind slot wall 201 of the blind slot 2, a blind slot bottom 202 of the blind slot 2 is the medium 102, and the high-frequency microwave multilayer circuit 6 is arranged on the outer-layer bottom copper 104 below.
The production process flow comprises the following steps: the method comprises the steps of forming a high-frequency microwave multilayer printed circuit board 1 through automatic optical scanning and pressing, milling a blind groove 2 on the high-frequency microwave multilayer printed circuit board 1, carrying out full-board electroplating on the high-frequency microwave multilayer printed circuit board 1 to form a full-board electroplated copper layer 3, forming an insulating groove 4 through ultraviolet laser, forming an outer-layer pattern on the full-board electroplated copper layer 3, carrying out electroplated copper and electroplated tin on the outer-layer pattern, and then carrying out alkaline etching to ensure that the full-board electroplated copper layer 3 surrounded by the insulating groove 4 at the bottom of the blind groove 202 cannot be electrified and cannot be plated with copper and tin without tin layer protection, wherein the full-board electroplated copper layer 3 at the bottom of the blind groove 202 is etched during alkaline etching, so that the high-frequency microwave multilayer printed circuit with signal shielding of the blind groove wall 201 and interference.
In addition to the above embodiments, the present invention may have other embodiments. All the technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope of the present invention.
Claims (2)
1. A manufacturing process of a high-frequency multilayer printed circuit blind slot is characterized by comprising the following steps: the method comprises the following steps:
(1) milling a blind groove on the high-frequency multilayer printed circuit board, and metalizing a full-plate electroplated copper layer on the blind groove wall and the blind groove bottom of the blind groove and on the outer-layer bottom copper and the outer-layer bottom copper, wherein the thickness of the full-plate electroplated copper layer is 4-8 mu m;
(2) cutting and removing the whole copper electroplating layer on the bottom of part of the blind groove by using ultraviolet laser under the blind groove to form a square-shaped insulating groove, wherein the whole copper electroplating layer on the wall of the blind groove is separated from the whole copper electroplating layer on the bottom of the blind groove by the insulating groove, the width of the insulating groove is 0.1-0.5 mm, and the distance between the edge of the insulating groove and the wall of the blind groove is 0.15-0.3 mm;
(3) making an outer layer pattern on the whole board copper-plating layer, electroplating copper on the outer layer pattern to form pattern copper-plating and tin-plating to form a tin layer, wherein the thickness of the copper layer on the wall of the blind slot is 25-40 mu m, and the thickness of the tin layer is 10-15 mu m;
(4) etching the whole electroplated copper layer surrounded by the insulating groove by alkaline etching, exposing a medium at the bottom of the blind groove, and arranging a high-frequency signal circuit on the outer-layer bottom copper below the bottom of the blind groove;
(5) and stripping tin from the high-frequency multilayer printed circuit board to obtain the blind groove of the high-frequency multilayer printed circuit board with blind groove wall signal shielding and blind groove bottom interference-free signals.
2. A high frequency multilayer printed circuit blind slot, comprising the application of the manufacturing process of the high frequency multilayer printed circuit blind slot of claim 1, wherein: the high-frequency multilayer printed circuit board is formed by pressing outer bottom copper, a medium, inner layer circuit copper and outer bottom copper, the blind groove is formed in the high-frequency multilayer printed circuit board, the blind groove wall of the blind groove is provided with the full-plate copper electroplating layer and the pattern copper electroplating layer, the blind groove bottom of the blind groove is the medium, and the outer bottom copper below the blind groove bottom is provided with the high-frequency signal circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710810845.0A CN107835587B (en) | 2017-09-11 | 2017-09-11 | High-frequency microwave multilayer printed circuit blind slot and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710810845.0A CN107835587B (en) | 2017-09-11 | 2017-09-11 | High-frequency microwave multilayer printed circuit blind slot and manufacturing process thereof |
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| Publication Number | Publication Date |
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| CN107835587A CN107835587A (en) | 2018-03-23 |
| CN107835587B true CN107835587B (en) | 2019-12-31 |
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| CN201710810845.0A Active CN107835587B (en) | 2017-09-11 | 2017-09-11 | High-frequency microwave multilayer printed circuit blind slot and manufacturing process thereof |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219255A (en) * | 2018-11-14 | 2019-01-15 | 生益电子股份有限公司 | A kind of production method and PCB of non-metallic stepped groove |
| CN112867235B (en) * | 2021-01-19 | 2022-05-17 | 中国电子科技集团公司第二十九研究所 | High-frequency microwave circuit board blind slot structure and implementation method and device |
| CN112822871A (en) * | 2021-01-20 | 2021-05-18 | 珠海杰赛科技有限公司 | Processing method for blind slot of circuit board |
| CN112969279A (en) * | 2021-02-05 | 2021-06-15 | 成都中科四点零科技有限公司 | Printed circuit board integrated with ceramic thin film circuit and manufacturing method thereof |
| CN113411977B (en) * | 2021-06-30 | 2022-07-12 | 生益电子股份有限公司 | Manufacturing method of stepped groove and circuit board |
| CN113600886B (en) * | 2021-08-04 | 2022-06-03 | 湖南省方正达电子科技有限公司 | Multi-axis collaborative blind milling method and device for printed circuit board |
| CN114040565A (en) * | 2021-11-15 | 2022-02-11 | 广东世运电路科技股份有限公司 | PCB processing method, PCB processing equipment and computer readable storage medium |
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| CN102548225A (en) * | 2012-02-13 | 2012-07-04 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method for printed circuit board (PCB) |
| CN103079350A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100784497B1 (en) * | 2004-10-06 | 2007-12-11 | 삼성전자주식회사 | Film substrate of semiconductor package and manufacturing method thereof |
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- 2017-09-11 CN CN201710810845.0A patent/CN107835587B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548225A (en) * | 2012-02-13 | 2012-07-04 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method for printed circuit board (PCB) |
| CN103079350A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
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| CN107835587A (en) | 2018-03-23 |
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