CN214757074U - Metallized edge semi-finished plate - Google Patents

Metallized edge semi-finished plate Download PDF

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Publication number
CN214757074U
CN214757074U CN202120903051.0U CN202120903051U CN214757074U CN 214757074 U CN214757074 U CN 214757074U CN 202120903051 U CN202120903051 U CN 202120903051U CN 214757074 U CN214757074 U CN 214757074U
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China
Prior art keywords
hole
pth
npth
holes
metallized
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CN202120903051.0U
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王健康
胡克
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Kunshan Hongyuntong Multilayer Circuit Board Co ltd
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Kunshan Hongyuntong Multilayer Circuit Board Co ltd
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Abstract

The utility model provides a metallization limit semi-manufactured goods board, including PTH hole and NPTH hole, the PTH hole with the coincidence of NPTH hole portion, the PTH hole with the crossing two points in NPTH hole are in the edge of waiting to make the metallization limit finished goods board. The utility model discloses can improve the quality of the metallization limit production board that next process made.

Description

Metallized edge semi-finished plate
Technical Field
The utility model relates to a printed circuit board technical field, concretely relates to metallized edge semi-finished product board.
Background
At present, a PCB (Printed Circuit Board) edge covering design has two types of metallization and non-metallization, and the PCB edge covering design is mature for PCB industry manufacturers with non-metallization edges, but more and more customers have demands for the metallization edges, and the demands for the metallization edges include but are not limited to the following two types: connect different PCBs behind the tin feeding to play the effect of similar draw-in groove, or be used for connecting the IC pin behind the tin feeding, and then play the effect of transmission signal. The quality of the metallized edge of the PCB becomes a concern to customers and manufacturers, as the quality of the metallization directly affects the customer's installation and use.
One way of manufacturing a metallized edge in the related art is to manufacture a PTH (plated Through Hole) Hole on a semi-finished board, and then mill the PTH Hole by a milling machine, so that the cut finished board is a circuit board with a metallized edge. As shown in fig. 1, the PTH holes are designed at the edge of the finished PCB, two points A, B are the intersection points of the PTH holes and the edge of the finished PCB, the dotted line represents the cutting line, the arrow direction represents the cutting direction, and the area below the dotted line is the finished PCB area. When the copper sheet is cut to the point A, namely the cutting force acts on the point A, the cutting force can well cut the copper at the point A due to the support of the base material on the left side of the point A, and when the copper sheet is cut to the point B, the copper sheet is difficult to cut smoothly due to the lack of the support on the left side of the point B, insufficient rotation speed of a milling cutter and abrasion, so that the copper sheet is warped or separated, namely, a burr or a hole is damaged. The damage of the burrs or the holes can influence the production of the post process, and the phenomena of insufficient solder, short circuit of tin bridge connection and the like can be generated when the solder paste is used by customers.
SUMMERY OF THE UTILITY MODEL
The utility model provides a solve above-mentioned technical problem, provide a metallized limit semifinished product board, can improve the quality of the metallized limit finished product board that next process made.
The utility model adopts the technical scheme as follows:
a metallized side semi-finished plate is characterized by comprising PTH holes and NPTH (Non-plated Through Hole) holes, wherein the PTH holes are overlapped with the NPTH holes, and two points of intersection of the PTH holes and the NPTH holes are positioned on the edge of the metallized side semi-finished plate to be manufactured.
The PTH hole has the same hole diameter as the NPTH hole.
The PTH hole and the NPTH hole have different hole diameters.
The utility model has the advantages that:
the utility model discloses a set up the NPTH hole on the basis in PTH hole, can get rid of the PTH hole copper skin that needs mill in cutting out metallization limit finished plate technology with the mode of drilling in advance, from this, can effectively avoid appearing criticizing cutting edge of a knife or a hole and decrease to can improve the quality of the metallization limit finished plate that next process made.
Drawings
FIG. 1 is a schematic view showing a structure and a cutting example of a metallized side semi-finished plate in the related art;
fig. 2 is a schematic structural diagram of a metallized side semi-finished board according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1, the utility model discloses metallized limit semifinished product board of embodiment, including PTH hole 1 and NPTH hole 2, PTH hole 1 with NPTH hole 2 partially coincides, PTH hole 1 with two crossing a, b in NPTH hole 2 are in the edge of the metallized limit finished product board of waiting to make.
Among them, the NPTH hole 2 may be formed at the time of secondary drilling. It will be appreciated that in the new hole formed by partial registration of the PTH hole 1 with the NPTH hole 2, the PTH hole side, i.e. the portion containing the copper skin, is in the finished board area of the metallized edge to be formed.
The utility model discloses an in the embodiment, PTH hole 1 can be the same with NPTH hole 2's aperture, also can be different to PTH hole 1 can intersect in PTH hole 1 and two nodical points of the metallization limit finished board edge of waiting to make with NPTH hole 2, and PTH hole 1 and NPTH hole 2 can intersect in foretell a, b two points for setting up the foundation promptly.
Because the copper sheet in the PTH hole 1 can not bear the force vertical to the hole wall attached to the PTH hole when the NPTH hole 2 is drilled, and the cutting of the copper sheet can be avoided at the passing cutting points, namely the points a and b, when the cutting is carried out along the edge of the finished board with the metalized edge to be manufactured, namely the cutting line, the situation that the copper sheet is warped or separated can be effectively avoided, and the occurrence of burr or hole damage is avoided.
According to the utility model discloses metallized limit semi-finished plate through seting up the NPTH hole on the basis in PTH hole, can get rid of the PTH hole copper skin that needs mill in cutting out metallized limit finished plate technology in advance with the mode of drilling, from this, can effectively avoid appearing criticizing cutting edge of a knife or a hole loss to can improve the quality of the metallized limit finished plate that next process made.
In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. The meaning of "plurality" is two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and the scope of the preferred embodiments of the present invention includes other implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present invention.
The logic and/or steps represented in the flowcharts or otherwise described herein, e.g., an ordered listing of executable instructions that can be considered to implement logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium could even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via for instance optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.
It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.
In addition, each functional unit in the embodiments of the present invention may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims (3)

1. A metallized edge semifinished sheet comprising PTH holes and NPTH holes, said PTH holes and said NPTH holes being in partial registration, the two points where said PTH holes intersect said NPTH holes being at the edge of the finished metallized edge sheet to be formed.
2. The metallized edge semifinished plate according to claim 1, wherein the PTH holes and the NPTH holes have the same hole diameter.
3. The metallized edge semifinished plate according to claim 1, wherein said PTH holes and said NPTH holes have different hole diameters.
CN202120903051.0U 2021-04-28 2021-04-28 Metallized edge semi-finished plate Active CN214757074U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120903051.0U CN214757074U (en) 2021-04-28 2021-04-28 Metallized edge semi-finished plate

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Application Number Priority Date Filing Date Title
CN202120903051.0U CN214757074U (en) 2021-04-28 2021-04-28 Metallized edge semi-finished plate

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CN214757074U true CN214757074U (en) 2021-11-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116916563A (en) * 2023-08-10 2023-10-20 清远市富盈电子有限公司 Manufacturing method of PCB with PTH holes connected with NPTH holes, and PCB

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116916563A (en) * 2023-08-10 2023-10-20 清远市富盈电子有限公司 Manufacturing method of PCB with PTH holes connected with NPTH holes, and PCB

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