CN206380174U - Wiring board with radiating explosion-proof side structure - Google Patents
Wiring board with radiating explosion-proof side structure Download PDFInfo
- Publication number
- CN206380174U CN206380174U CN201720105972.6U CN201720105972U CN206380174U CN 206380174 U CN206380174 U CN 206380174U CN 201720105972 U CN201720105972 U CN 201720105972U CN 206380174 U CN206380174 U CN 206380174U
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- wiring board
- radiating
- hole
- side structure
- proof side
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Abstract
The utility model discloses a kind of wiring board with radiating explosion-proof side structure, several radiating reinforced holes that the distribution of circumferential groove hole peripheral is provided with grooved hole, the wiring board are set on the wiring board.By several radiating reinforced holes on slotted eye periphery, the contact stress at slotted eye edge with the stress in enhancement line board slot hole, can be lowered；Secondly it can effectively prevent occurring chip problem during lead-free tin spray with the heat-sinking capability of enhancement line plate, reduce the scrappage of slotted eye chip, improve the yield of lead-free tin spray.
Description
Technical field
The utility model is related to a kind of wiring board with radiating explosion-proof side structure.
Background technology
At present in the production process of electronic circuit board, assist side surface cover one layer of solder mask, next step need into
Enter to spray tin process and carry out spray tin operation.Wherein lead-free tin spray is than there is the processing temperature of lead spray tin high 30 DEG C, and temperature is up to 260 DEG C.
And the lead-free tin spray environment of high temperature can have a significant impact to the slotted eye of wiring board.If there is certain water in former circuit inner cord
Point, in the case of a high temperature, moisture seriously gasifies, and plate bursting phenomenon just occurs（I.e. adjacent layers of copper separation）, cause wiring board to be scrapped,
This is that many electronic circuit boards manufacture the unfavorable condition that enterprise is least ready to receive.
Utility model content
To solve the problems, such as plate bursting that the slotted eye under lead-free tin spray high-temperature condition occurs, the purpose of this utility model is to provide
A kind of wiring board with radiating explosion-proof side structure.
The utility model is that the technical scheme for solving the use of its technical problem is：
Set and set on grooved hole, the wiring board on a kind of wiring board with radiating explosion-proof side structure, the wiring board
It is equipped with several radiating reinforced holes of circumferential groove hole peripheral distribution.
Further, the hole wall deposition of the radiating reinforced hole has layers of copper.
Further, the upper and lower end face periphery deposition of the radiating reinforced hole has layers of copper.
Further, insertion is free heart rivet in the radiating reinforced hole.
The beneficial effects of the utility model are：, can be with enhancement line plate by several radiating reinforced holes on slotted eye periphery
The stress of slotted eye, lowers the contact stress at slotted eye edge；Secondly unleaded spray can effectively be prevented with the heat-sinking capability of enhancement line plate
Occur chip problem during tin, reduce the scrappage of slotted eye chip, improve the yield of lead-free tin spray.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 be in Fig. 1 A-A to schematic cross-section.
Embodiment
The utility model is described further below in conjunction with accompanying drawing and example.
As depicted in figs. 1 and 2, a kind of wiring board with radiating explosion-proof side structure of the present utility model, the wiring board
Several radiating reinforced holes 2 around the distribution of the periphery of slotted eye 1 are provided with upper setting grooved hole 1, the wiring board, slotted eye 1 is utilized
The radiating reinforced hole 2 on periphery prevents heat from gathering, the heat-sinking capability of enhancement line plate, effectively prevents appearance during lead-free tin spray
Chip problem.
There is layers of copper the hole wall of the radiating reinforced hole 2 and upper and lower end face by heavy copper process deposition, and layers of copper can promote heat
Transmission.
Insertion is free heart rivet in the radiating reinforced hole 2, radiating reinforced hole is had rivet hole structure, structural strength
Height, contributes to the stress in enhancement line board slot hole 1, lowers the contact stress at the edge of slotted eye 1.
Described above, simply preferred embodiment of the present utility model, the utility model is not limited to above-mentioned implementation
Mode, as long as it reaches technique effect of the present utility model with identical means, should all belong to protection domain of the present utility model.
Claims (4)
1. grooved hole is set on the wiring board with radiating explosion-proof side structure, the wiring board, it is characterised in that：The wiring board
On be provided with circumferential groove hole peripheral distribution several radiating reinforced holes.
2. the wiring board according to claim 1 with radiating explosion-proof side structure, it is characterised in that：The radiating reinforced hole
Hole wall deposition have layers of copper.
3. the wiring board according to claim 1 or 2 with radiating explosion-proof side structure, it is characterised in that：The radiating adds
The upper and lower end face periphery deposition of solid hole has layers of copper.
4. the wiring board according to claim 1 with radiating explosion-proof side structure, it is characterised in that：The radiating reinforced hole
Interior insertion is free heart rivet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720105972.6U CN206380174U (en) | 2017-01-23 | 2017-01-23 | Wiring board with radiating explosion-proof side structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720105972.6U CN206380174U (en) | 2017-01-23 | 2017-01-23 | Wiring board with radiating explosion-proof side structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206380174U true CN206380174U (en) | 2017-08-04 |
Family
ID=59401087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720105972.6U Active CN206380174U (en) | 2017-01-23 | 2017-01-23 | Wiring board with radiating explosion-proof side structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206380174U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600907A (en) * | 2017-09-30 | 2019-04-09 | 惠州威健电路板实业有限公司 | Explosion-proof spray sheet tin and preparation method thereof |
| CN111405744A (en) * | 2020-03-12 | 2020-07-10 | 万安裕维电子有限公司 | Explosion-proof type PCB board |
-
2017
- 2017-01-23 CN CN201720105972.6U patent/CN206380174U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600907A (en) * | 2017-09-30 | 2019-04-09 | 惠州威健电路板实业有限公司 | Explosion-proof spray sheet tin and preparation method thereof |
| CN111405744A (en) * | 2020-03-12 | 2020-07-10 | 万安裕维电子有限公司 | Explosion-proof type PCB board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190329 Address after: 529000 No. 76 Longxi Road, Jianghai District, Jiangmen City, Guangdong Province Patentee after: Jiangmen Benlida Printed Circuit Co., Ltd. Address before: 529000 Factory No. 7 and No. 8, No. 21, Coastal Southeast Industrial Zone, Jianghai District, Jiangmen City, Guangdong Province Patentee before: Jiangmen Kai Yu circuit Co., Ltd. |
|
| TR01 | Transfer of patent right |