CN202514172U - Molding mould with high and low punch pins - Google Patents

Molding mould with high and low punch pins Download PDF

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Publication number
CN202514172U
CN202514172U CN2012200870078U CN201220087007U CN202514172U CN 202514172 U CN202514172 U CN 202514172U CN 2012200870078 U CN2012200870078 U CN 2012200870078U CN 201220087007 U CN201220087007 U CN 201220087007U CN 202514172 U CN202514172 U CN 202514172U
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CN
China
Prior art keywords
pins
pin
mould
molding mould
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2012200870078U
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Chinese (zh)
Inventor
陈定红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU HAIHONG ELECTRONICS CO LTD
Original Assignee
CHANGZHOU HAIHONG ELECTRONICS CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU HAIHONG ELECTRONICS CO LTD filed Critical CHANGZHOU HAIHONG ELECTRONICS CO LTD
Priority to CN2012200870078U priority Critical patent/CN202514172U/en
Application granted granted Critical
Publication of CN202514172U publication Critical patent/CN202514172U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a molding mould with high and low punch pins. The molding mould is provided with a mold body. The high and low punch pins are staggered on the mold body. The molding mould of the utility model is advantaged in simple processing, adaptation of an engineering bearing-stress subtraction principle as well as technology of the high and low punch pins, ensured quality of a PCB substrate, prolonged service life of an electric appliance, reduced stress born by equipment, prolonged service life of the equipment. Pin batching technology is adopted for round pins and abnormal pins such that crack phenomena which occur at integrated holes, insertion and arrangement holes and access holes of the PCB substrate can be avoided; in addition, after the pin batching of the mould, the high pins contact with a board surface before the low pins contact with the board surface such that the batched punching can reduce a punching blanking force, and therefore, punching quality can be ensured, stress born by a punch machine can be reduced, the service life of the punch machine can be prolonged.

Description

Have the mould of height towards pin
Technical field
The utility model relates to pcb board commonly used on the electronic equipment, relates in particular to a kind of mould with height towards pin.
Background technology
Along with the develop rapidly of electron trade, the trend of electronic product microminiaturization is obvious day by day, and a pcb board is except fixing various little electronic components, and its major function provides being electrically connected each other of various electronic components in addition.Along with the development of information technology, electronic equipment also becomes increasingly complex, and the part that needs is more and more, and circuit and part on the pcb board are also more and more intensive.In the pcb board manufacturing; Pcb board is heat insulation by insulation, also unbending material constitutes substrate, and the tiny line material that can see on the surface is a Copper Foil, and Copper Foil is to cover on the whole plate originally; Part is etched and disposes in manufacture process; The part that stays has just become netted tiny circuit, and these circuits are known as lead, and is used to provide the circuit of part on the pcb board to connect.
In the PCB Production process.Utilize the pin punching out contact plate on the pcb board mould,, increase the stamping-out pressure of contact plate, cause the integrated hole, insert row hole of pcb board, near seminesses such as holes owing to all be that highly consistent pin is exerted pressure to contact plate simultaneously.Also increase simultaneously the holding capacity of punch press, shortened the useful life of punch press.
The utility model content
The purpose of the utility model is the problem that solves above-mentioned existence, provides simple in structure, reduces the blanking pressure that connects thick version, reduces a kind of mould with height towards pin of the seminess in hole simultaneously.
The purpose of the utility model realizes as follows: a kind of mould with height towards pin, have die ontology, and said die ontology is provided with the Gao Chongzhen that is interspersed and hangs down towards pin.
Saying further, said height is a plurality of towards pin with hanging down towards pin.
Saying further: said is column structure towards pin.
The advantage of the utility model: the processing of the technology of the utility model is simple, utilizes the stressed branch of engineering to subtract principle, adopts height pin technology, guarantees the quality of PCB substrate, prolongs electrical equipment useful life, reduces the holding capacity of equipment, the useful life of improving equipment.Round needle and special-shaped pin are adopted the minute hand technology, can stop the integrated hole of pcb board, insert row hole, near seminesses such as holes; After passing through the mould minute hand in addition, contact plate face behind the low pin of principle of readjustment, restructuring, consolidation and improvement elder generation contact plate face during punching out, punching out can reduce blanking pressure so in batches, guarantees punching quality, reduces the holding capacity of punch press simultaneously, prolongs the useful life of punch press.
Description of drawings
For the content that makes the utility model is expressly understood more easily,, the utility model is done further detailed explanation, wherein below according to specific embodiment and combine accompanying drawing
Fig. 1 is the structural representation of the utility model;
Reference numeral: 1, die ontology, 2, Gao Chongzhen, 3, low towards pin.
Embodiment:
See shown in Figure 1ly, a kind of have height towards the mould of pin, has die ontology 1, said die ontology 1 be provided with the height that is interspersed towards pin 2 with low towards pin 3; Said height is a plurality of towards pin 2 with hanging down towards pin 3; Said is column structure towards pin; Its operation principle is: have on the die ontology 1 high towards pin 2 with low towards pin 3, during punching out height towards pin 2 first contact plate faces, secondly low towards pin 3 contact plate face again; Punching out can reduce blanking pressure so in batches; Guarantee punching quality, reduce the holding capacity of punch press simultaneously, prolong the useful life of punch press.
Above-described specific embodiment; Purpose, technical scheme and beneficial effect to the utility model have carried out further explain, it should be understood that the above is merely the specific embodiment of the utility model; Be not limited to the utility model; All within the spirit and principle of the utility model, any modification of being made, be equal to replacement, improvement etc., all should be included within the protection range of the utility model.

Claims (3)

1. the mould with height towards pin has die ontology (1); It is characterized in that: said die ontology (1) is provided with the Gao Chongzhen (2) that is interspersed and hangs down towards pin (3).
2. according to claim 1 have height towards the mould of pin, it is characterized in that: said Gao Chongzhen (2) with low be a plurality of towards pin (3).
3. the mould with height towards pin according to claim 2, it is characterized in that: said is column structure towards pin.
CN2012200870078U 2012-03-09 2012-03-09 Molding mould with high and low punch pins Expired - Lifetime CN202514172U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012200870078U CN202514172U (en) 2012-03-09 2012-03-09 Molding mould with high and low punch pins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012200870078U CN202514172U (en) 2012-03-09 2012-03-09 Molding mould with high and low punch pins

Publications (1)

Publication Number Publication Date
CN202514172U true CN202514172U (en) 2012-10-31

Family

ID=47066621

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012200870078U Expired - Lifetime CN202514172U (en) 2012-03-09 2012-03-09 Molding mould with high and low punch pins

Country Status (1)

Country Link
CN (1) CN202514172U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104308891A (en) * 2014-10-16 2015-01-28 马鞍山市力涛数控机床有限公司 Long rectangular table hydraulic punching machine
CN105149422A (en) * 2015-07-15 2015-12-16 苏州赛弗尔机械有限公司 Progressive die of unequal-height puncher pins
CN105964768A (en) * 2016-06-30 2016-09-28 中精集团有限公司 Automobile partition plate punching device
CN109262745A (en) * 2018-11-21 2019-01-25 奥士康精密电路(惠州)有限公司 A kind of pcb board connection position stamping die and its process for stamping

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104308891A (en) * 2014-10-16 2015-01-28 马鞍山市力涛数控机床有限公司 Long rectangular table hydraulic punching machine
CN105149422A (en) * 2015-07-15 2015-12-16 苏州赛弗尔机械有限公司 Progressive die of unequal-height puncher pins
CN105964768A (en) * 2016-06-30 2016-09-28 中精集团有限公司 Automobile partition plate punching device
CN109262745A (en) * 2018-11-21 2019-01-25 奥士康精密电路(惠州)有限公司 A kind of pcb board connection position stamping die and its process for stamping

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CX01 Expiry of patent term
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Granted publication date: 20121031