CN107666774A - A kind of production method of circuit board of the edge with half bore - Google Patents
A kind of production method of circuit board of the edge with half bore Download PDFInfo
- Publication number
- CN107666774A CN107666774A CN201710919308.XA CN201710919308A CN107666774A CN 107666774 A CN107666774 A CN 107666774A CN 201710919308 A CN201710919308 A CN 201710919308A CN 107666774 A CN107666774 A CN 107666774A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit board
- half bore
- gong
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of production method of circuit board of edge with half bore, including step：1) edging, 2) baking sheet, 3) drilling, 4) heavy copper, a 5) copper facing, 6) outer-layer circuit, 7) secondary copper facing, 8) gong half bore, gong goes out the half bore of circuit board edge on milling machine；9) etch, 10) it is anti-welding, 11) word, 12) circuit board is surface-treated；13) it is molded.The present invention sets gong half bore process after secondary plating copper process, now the copper clad layers on circuit board substrate are not etched, copper clad layers in the copper clad layers and hole of circuit board surface are an entirety, so that the bond strength of the copper clad layers and substrate in hole is high, therefore during gong half bore, it is good to bear gong knife cutting force performance for layers of copper in hole, be not in hole layers of copper the problem of coming off and warpage occurs is gone out by gong knife-band；The subsequent etching gong half bore that can also go out produces burr, and so as to obtain, half bore layers of copper is complete, the effect of surface Glabrous thorn.
Description
Technical field
The present invention relates to circuit board production techniques field, the producer of more particularly to a kind of circuit board of the edge with half bore
Method.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed substrate, is important
Electronic unit, be electronic component supporter, be electronic component electrical connection carrier.In the prior art, printing electricity
The production technology of road plate is usually：An edging -- baking sheet -- drilling -- heavy copper -- copper facing -- outer-layer circuit -- secondary copper facing --
Etching -- anti-welding -- word -- surface treatment-edge shaping.
There are the printed circuit board of half bore (being called stamp hole), when being produced using existing process, circuit board for edge
Edge half bore is processed out in edge molding procedure.Because before edge molding procedure, circuit board passes through etching procedure,
The major part of the copper plate of circuit board surface has been removed, therefore the attachment of the at this moment layers of copper in circuit board edge hole and substrate is strong
Degree is very weak.When milling cutter is carrying out processing and forming to circuit board edge, the layers of copper in circuit board edge hole in the presence of milling cutter,
Easily deviate from from hole, cause circuit board to scrap.And even if copper plate is not taken out of by milling cutter in half bore, also easily processing
During produce warpage and Burr Problem so that half bore Forming Quality is poor.
The content of the invention
In view of this, it is existing to solve it is an object of the invention to provide a kind of production method of circuit board of edge with half bore
There is technology pcb board in the fabrication process, the copper plate in edge half bore is easily taken out of by milling cutter, copper plate easily produces warpage,
The technical problems such as burr.
The production method of circuit board of the edge of the present invention with half bore, comprises the following steps：
1) edging, it is on edge polisher that the edge ground smooth of circuit board substrate is smooth；
2) baking sheet, the substrate after edging is dried in an oven；
3) drill, the substrate after drying is placed on drilling machine, drills out institute's hole on circuit board；
4) heavy copper, deposits one layer of copper, using the substrate as a follow-up electro-coppering in the hole that step 3) processes；
5) a copper facing, the thickness of layers of copper in hole is thickeied by electro-coppering；
6) outer-layer circuit, circuitous pattern is made on substrate；
7) secondary copper facing, the copper layer thickness of circuitous pattern is thickeied by electroplating；
8) gong half bore, the half bore of circuit board edge is gone out by gong knife gong on milling machine；
9) etch, unnecessary on circuit board cover copper by etching to remove；
10) it is anti-welding, anti-solder ink is printed on circuit boards；
11) word, word is printed on circuit boards；
12) circuit board is surface-treated；
13) it is molded, passes through milling cutter reconditioning circuit plate shape on milling machine.
Beneficial effects of the present invention：
The production method of circuit board of the edge of the present invention with half bore, it sets gong half bore process after secondary plating copper process,
The half bore of circuit board edge is processed, the gong half bore after secondary copper facing, now the copper clad layers on circuit board substrate are not carved
Lose, the copper clad layers in the copper clad layers and hole of circuit board surface are an entirety so that the combination of copper clad layers and substrate in hole is strong
Degree is high, therefore during gong half bore, and it is good to bear gong knife cutting force performance for layers of copper in hole, be not in hole layers of copper by gong knife-band
Go out the problem of coming off and warpage occurs.And after etching procedure is arranged on gong half bore process, by etching energy by half bore during gong half bore
The burr of middle layers of copper edge is etched away, and so as to obtain, half bore layers of copper is complete, the effect of surface Glabrous thorn.
Embodiment
With reference to embodiment, the invention will be further described.
The production method of circuit board of the present embodiment edge with half bore, comprises the following steps：
1) edging, on edge polisher that the edge ground smooth of circuit board substrate is smooth, edging can prevent that substrate edge is sharp
Angle, burr etc. stab finger and other plates are spent in wiping；
2) baking sheet, the substrate after edging is dried in an oven；Baking sheet can drive vapor and organic volatile in substrate away
Thing, discharge internal stress, increase board size stability, chemical stability and mechanical strength；
3) drill, the substrate after drying is placed on drilling machine, drills out institute's hole on circuit board；
4) heavy copper, deposits one layer of copper, using the substrate as a follow-up electro-coppering in the hole that step 3) processes；
5) a copper facing, the thickness of layers of copper in hole is thickeied by electro-coppering；
6) outer-layer circuit, circuitous pattern is made on substrate；
7) secondary copper facing, the copper layer thickness of circuitous pattern is thickeied by electroplating；
8) gong half bore, the half bore of circuit board edge is gone out by gong knife gong on milling machine；
9) etch, unnecessary on circuit board cover copper by etching to remove；
10) it is anti-welding, anti-solder ink is printed on circuit boards, and anti-solder ink can be protected to circuit board, avoid circuit
The problems such as oxidized, scratching causes to open a way or be short-circuit；
11) word, word is printed on circuit boards；
12) circuit board is surface-treated, surface treatment includes circuit board and carries out gold-plated, silver-plated and spray tin etc., to carry
The electric conductivity of high circuit layer and the welding performance of weld part etc.；
13) it is molded, passes through milling cutter reconditioning circuit plate shape on milling machine.
The production method of circuit board of the present embodiment edge with half bore, it sets gong half bore work after secondary plating copper process
Sequence, the half bore of circuit board edge is processed, the gong half bore after secondary copper facing, now the copper clad layers on circuit board substrate not by
Etch, the copper clad layers in the copper clad layers and hole of circuit board surface are an entirety so that the combination of copper clad layers and substrate in hole
Intensity is high, therefore during gong half bore, and it is good to bear gong knife cutting force performance for layers of copper in hole, be not in hole layers of copper by gong knife
Take the problem of coming off and warpage occurs out of.And after etching procedure is arranged on gong half bore process, by etching energy by during gong half bore half
The burr of layers of copper edge is etched away in hole, and so as to obtain, half bore layers of copper is complete, the effect of surface Glabrous thorn.
Finally illustrate, the above embodiments are merely illustrative of the technical solutions of the present invention and it is unrestricted, although with reference to compared with
The present invention is described in detail good embodiment, it will be understood by those within the art that, can be to the skill of the present invention
Art scheme is modified or equivalent substitution, and without departing from the objective and scope of technical solution of the present invention, it all should cover at this
Among the right of invention.
Claims (1)
- A kind of 1. production method of circuit board of edge with half bore, it is characterised in that：Comprise the following steps：1) edging, it is on edge polisher that the edge ground smooth of circuit board substrate is smooth；2) baking sheet, the substrate after edging is dried in an oven；3) drill, the substrate after drying is placed on drilling machine, drills out institute's hole on circuit board；4) heavy copper, deposits one layer of copper, using the substrate as a follow-up electro-coppering in the hole that step 3) processes；5) a copper facing, the thickness of layers of copper in hole is thickeied by electro-coppering；6) outer-layer circuit, circuitous pattern is made on substrate；7) secondary copper facing, the copper layer thickness of circuitous pattern is thickeied by electroplating；8) gong half bore, the half bore of circuit board edge is gone out by gong knife gong on milling machine；9) etch, unnecessary on circuit board cover copper by etching to remove；10) it is anti-welding, anti-solder ink is printed on circuit boards；11) word, word is printed on circuit boards；12) circuit board is surface-treated；13) it is molded, passes through milling cutter reconditioning circuit plate shape on milling machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710919308.XA CN107666774A (en) | 2017-09-30 | 2017-09-30 | A kind of production method of circuit board of the edge with half bore |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710919308.XA CN107666774A (en) | 2017-09-30 | 2017-09-30 | A kind of production method of circuit board of the edge with half bore |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107666774A true CN107666774A (en) | 2018-02-06 |
Family
ID=61098609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710919308.XA Pending CN107666774A (en) | 2017-09-30 | 2017-09-30 | A kind of production method of circuit board of the edge with half bore |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107666774A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698843A (en) * | 2020-05-27 | 2020-09-22 | 西安金百泽电路科技有限公司 | Reworking method for milled slot plate with etched leakage half-edge hole |
| CN112235952A (en) * | 2020-10-20 | 2021-01-15 | 盐城维信电子有限公司 | Manufacturing method for controlling dimensional stability of multilayer flexible circuit board |
| CN112672508A (en) * | 2020-11-30 | 2021-04-16 | 重庆凯歌电子股份有限公司 | Resin hole plugging method for PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168525A (en) * | 1999-12-14 | 2001-06-22 | Fuji Kiko Denshi Kk | Manufacturing method of printed wiring board with end- surface through hole |
| CN104768338A (en) * | 2015-04-28 | 2015-07-08 | 清远市富盈电子有限公司 | PCB edge semi-hole metallization manufacturing process |
| CN104918422A (en) * | 2015-05-21 | 2015-09-16 | 东莞市五株电子科技有限公司 | Method for manufacturing semi-metallized hole of printed circuit board |
-
2017
- 2017-09-30 CN CN201710919308.XA patent/CN107666774A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168525A (en) * | 1999-12-14 | 2001-06-22 | Fuji Kiko Denshi Kk | Manufacturing method of printed wiring board with end- surface through hole |
| CN104768338A (en) * | 2015-04-28 | 2015-07-08 | 清远市富盈电子有限公司 | PCB edge semi-hole metallization manufacturing process |
| CN104918422A (en) * | 2015-05-21 | 2015-09-16 | 东莞市五株电子科技有限公司 | Method for manufacturing semi-metallized hole of printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 谢平: "《PCB设计与加工》", 28 February 2017 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698843A (en) * | 2020-05-27 | 2020-09-22 | 西安金百泽电路科技有限公司 | Reworking method for milled slot plate with etched leakage half-edge hole |
| CN112235952A (en) * | 2020-10-20 | 2021-01-15 | 盐城维信电子有限公司 | Manufacturing method for controlling dimensional stability of multilayer flexible circuit board |
| CN112235952B (en) * | 2020-10-20 | 2021-08-17 | 盐城维信电子有限公司 | Manufacturing method for controlling dimensional stability of multilayer flexible circuit board |
| CN112672508A (en) * | 2020-11-30 | 2021-04-16 | 重庆凯歌电子股份有限公司 | Resin hole plugging method for PCB |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180206 |