CN112235952A - Manufacturing method for controlling dimensional stability of multilayer flexible circuit board - Google Patents
Manufacturing method for controlling dimensional stability of multilayer flexible circuit board Download PDFInfo
- Publication number
- CN112235952A CN112235952A CN202011125443.5A CN202011125443A CN112235952A CN 112235952 A CN112235952 A CN 112235952A CN 202011125443 A CN202011125443 A CN 202011125443A CN 112235952 A CN112235952 A CN 112235952A
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- circuit board
- holes
- outer layer
- layer circuit
- multilayer flexible
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method for controlling the dimensional stability of a multilayer flexible circuit board, which comprises the following steps: laminating the second outer layer circuit board to the inner layer circuit board; manufacturing a plurality of first through holes on the secondary outer layer circuit board and the inner layer circuit board; copper plating is carried out on the first through holes; the outer layer circuit board is laminated to the next outer layer circuit board. Through increasing a plurality of through-holes in the non-product region in multilayer flexible line way board, utilize the copper-plating with the through-hole copper-plating, play rivet fixed effect to the back processing procedure at the hot pressing can effectively stabilize the product size, reduces product deformation, has reduced the risk of interlayer blind hole fracturing.
Description
Technical Field
The invention relates to the technical field of flexible circuit board manufacturing, in particular to a manufacturing method for controlling the dimensional stability of a multilayer flexible circuit board.
Background
As a world wide consumer electronics product manufacturing country, a Flexible Printed Circuit Board (Flexible Printed Circuit Board) has a great demand in China, and in recent years, a domestic Flexible Circuit Board enterprise is rapidly developed.
At present, the technical requirements of the market on the FPC are higher and higher, for example, the number of layers is higher and higher, and the product size precision is higher and higher, so for manufacturing enterprises, how to better control the size stability of a multilayer board layer, reduce the size deformation in the product manufacturing process, and the problem to be solved is urgently needed.
Disclosure of Invention
In view of this, embodiments of the present invention provide a manufacturing method for controlling the dimensional stability of a multi-layer flexible printed circuit board, so as to solve the problem in the prior art how to better control the dimensional stability of a multi-layer board layer and reduce dimensional deformation in the product manufacturing process.
The embodiment of the invention provides a manufacturing method for controlling the dimensional stability of a multilayer flexible circuit board, which comprises the following steps:
laminating the second outer layer circuit board to the inner layer circuit board;
manufacturing a plurality of first through holes on the secondary outer layer circuit board and the inner layer circuit board;
copper plating is carried out on the first through holes;
the outer layer circuit board is laminated to the next outer layer circuit board.
Optionally, fabricating a plurality of first vias on the sub-outer layer circuit board and the inner layer circuit board includes:
and manufacturing through holes with the thickness of 0.3-2 mm in non-finished product areas on the secondary outer layer circuit board and the inner layer circuit board, wherein the density of the through holes is 500-700/square decimeter.
Optionally, after laminating the outer layer circuit board to the second outer layer circuit board, further comprising:
and manufacturing a plurality of second through holes corresponding to the first through holes one by one on the outer layer circuit board.
Optionally, after laminating the outer layer circuit board to the second outer layer circuit board, further comprising:
manufacturing a plurality of third through holes on the multilayer flexible circuit board;
and plating copper on the third through hole.
Optionally, after laminating the outer layer circuit board to the second outer layer circuit board, further comprising:
and copper plating is performed on the plurality of first through holes and the plurality of second through holes.
Optionally, the thickness of the copper plating is 12 μm or more.
Optionally, the second outer layer circuit board comprises a first circuit board and a second circuit board; wherein the first circuit board is laminated on one side of the inner layer circuit board; the second wiring board is laminated on the other side of the inner wiring board.
Optionally, the outer layer circuit board comprises a third circuit board and a fourth circuit board; the third circuit board is laminated on one side of the first circuit board, which is far away from the inner-layer circuit board; the fourth wiring board is laminated on a side of the second wiring board remote from the inner wiring board.
Optionally, the method further comprises:
when the thickness of the multilayer flexible circuit board is 1.2mm-1.4mm and the copper coating amount of the inner layer is 1OZ-1.2OZ, through holes with the density of 650/square decimeter-700/square decimeter and the inner diameter of more than or equal to 300 mu m are manufactured in a non-finished product area of the multilayer flexible circuit board;
when the thickness of the multilayer flexible circuit board is 1.4mm-1.6mm and the copper coating amount of the inner layer is 1.2OZ-1.5OZ, through holes with the density of 600/square decimeter-650/square decimeter and the inner diameter of more than or equal to 350 mu m are manufactured in the unfinished product area of the multilayer flexible circuit board;
when the thickness of the multilayer flexible circuit board is 1.6mm-1.8mm and the copper coating amount of the inner layer is 1.5OZ-2OZ, through holes with the density of 500/square decimeter-600/square decimeter and the inner diameter of more than or equal to 400 mu m are manufactured in the non-finished product area of the multilayer flexible circuit board.
The embodiment of the invention has the following beneficial effects:
through increasing a plurality of through-holes in the non-product region in multilayer flexible line way board, utilize the copper-plating with the through-hole copper-plating, play rivet fixed effect to the back processing procedure at the hot pressing can effectively stabilize the product size, reduces product deformation, has reduced the risk of interlayer blind hole fracturing.
Drawings
The features and advantages of the present invention will be more clearly understood by reference to the accompanying drawings, which are illustrative and not to be construed as limiting the invention in any way, and in which:
FIG. 1 is a flow chart of a manufacturing method for controlling dimensional stability of a multi-layer flexible circuit board according to an embodiment of the present invention;
FIG. 2 is a view showing a structure of a multilayer wiring board fixed by rivets;
fig. 3 shows a structure diagram of a multilayer flexible wiring board in an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a manufacturing method for controlling the dimensional stability of a multilayer flexible circuit board, as shown in fig. 1, comprising the following steps:
step S10, the sub-outer layer wiring board is laminated on the inner layer wiring board.
In step S20, a plurality of first through holes are formed in the sub-outer layer circuit board and the inner layer circuit board.
In step S30, copper plating is performed on the plurality of first through holes.
In step S40, the outer layer wiring board is laminated on the next outer layer wiring board.
In this embodiment, taking a six-layer board as an example, the inner layer circuit board is L3/4 layer, the sub outer layer circuit board is L2/5 layer, and the outer layer circuit board is L1/6 layer. After the inner layer circuit board L3/4 layer is manufactured, the outer layer circuit board L2/5 layer is laminated, the L2-L5 circuit board is laminated, a plurality of first through holes are manufactured on the L2-L5 circuit board and plated with copper, the L2-L5 circuit board is fixed in a through hole copper plating mode, then the laminated board lamination of the L1/6 layer is carried out, the first through holes also play a positioning role in the laminated board lamination process of the L1/6 layer, and the first through holes plated with copper play a role in fixing the inner layer circuit board and the outer layer circuit board, so that the product size can be effectively stabilized in the subsequent preparation process of hot pressing, the product deformation is reduced, the stability of the product size is improved, the risk of interlayer blind hole fracturing is reduced, and the yield of the product is improved.
In a specific embodiment, the multilayer circuit board is an eight-layer board and comprises an L1-L8 layer circuit board, an inner layer circuit board is an L4/5 layer, a secondary outer layer circuit board is an L2/3/6/7 layer, a first intermediate circuit board of L3-L6 is prepared through steps S10-S30, a second intermediate circuit board of L2-L7 is prepared through steps S10-S30, and finally step S40 is executed to obtain a finished product circuit board.
As an alternative embodiment, step S20 includes:
and manufacturing through holes with the thickness of 0.3-2 mm in non-finished product areas on the secondary outer layer circuit board and the inner layer circuit board, wherein the density of the through holes is 500-700/square decimeter.
As shown in fig. 2, the multilayer circuit board is fixed by rivets 101, and usually, holes are punched only at four corners of the circuit board for fixing, and the rivets have a large size, and the manufacturing process comprises: the inner layer is made of L3/L4; laminate L2/5; punching and fixing by rivets; laminating L2-5; stack L1/6; punching and fixing by rivets; laminate L1-6.
The flexible circuit board adopting the riveting process is easy to deform when the product is hot-pressed, and the interlayer blind hole fracturing risk is higher. In the embodiment, through manufacturing the through holes with the density of 500-700/square decimeter and the diameter of 0.3-2 mm, the diameter of the through holes is smaller, the risk of deformation and blind hole fracturing of a product is smaller during manufacturing, and then the multi-layer flexible circuit board is fixed by plating copper on the through holes, so that a rivet process is replaced.
In this embodiment, as shown in fig. 3, the through holes 201 formed in the non-finished product areas of the secondary outer layer circuit board and the inner layer circuit board are plated with copper to fix the secondary outer layer circuit board and the inner layer circuit board, so that a rivet process is replaced, the problem that the products are easily deformed during hot pressing is solved, and the interlayer blind hole fracturing risk is reduced. In addition, the size of the through holes is far smaller than the inner diameter of the opening of the rivet, and the number of the through holes is large, so that the effect of fixing the multilayer circuit board by the copper plating of the through holes can meet the process requirement.
As an optional implementation manner, after step S40, the method further includes:
step S41, second through holes corresponding to the first through holes are formed on the outer layer circuit board.
In this embodiment, the positions of the second through holes on the outer layer circuit board are in one-to-one correspondence with the positions of the first through holes, and through holes of L1-L6 layers are formed. In a specific embodiment, if the subsequent process does not require hot pressing, rivet fastening may be employed. Specifically, when the second through hole is manufactured on the outer-layer circuit board, only the L1 layer and the L6 layer are drilled through, and the through holes of the L2-L5 layer at the corresponding positions are not punched.
As an optional implementation manner, after step S40, the method further includes:
step S42, a plurality of third through holes are manufactured on the multilayer flexible circuit board;
and step S43, copper plating is carried out on the third through hole.
In this embodiment, the multilayer flexible printed circuit is a multilayer printed circuit board composed of an inner layer printed circuit board, a sub-outer layer printed circuit board and an outer layer printed circuit board. The position of the third through hole is selected according to actual needs, and the third through hole can be manufactured in a non-finished product area different from the position of the first through hole and can also be manufactured in a position corresponding to the first through hole. When the third through hole is formed at a position corresponding to the first through hole, the process of step S41 may be employed to drill only the L1/6, or the first through holes on L2-L5 may be drilled again. And fixing the L1-L6 layer circuit board by plating copper on the third through holes.
As an optional implementation manner, after step S40, the method further includes:
step S44, copper plating is performed on the plurality of first through holes and the plurality of second through holes.
In this embodiment, the fixation between L1/L6 and L2-5 is achieved by through-hole copper plating, replacing the riveting process.
In an alternative embodiment, the thickness of the copper plating is 12 μm or more.
In the embodiment, the copper plating strength of 12 μm can stabilize the structure of the multilayer board, prevent deformation which may occur in a subsequent hot pressing process, and eliminate the risk of interlayer blind hole fracture by not providing interlayer blind holes and providing rivets in the blind holes.
As an alternative embodiment, the second outer layer circuit board includes a first circuit board and a second circuit board; wherein the first circuit board is laminated on one side of the inner layer circuit board; the second wiring board is laminated on the other side of the inner wiring board.
In this embodiment, the second outer layer circuit board is an upper layer and a lower layer, i.e., a first circuit board and a second circuit board.
As an optional embodiment, the outer layer circuit board comprises a third circuit board and a fourth circuit board; the third circuit board is laminated on one side of the first circuit board, which is far away from the inner-layer circuit board; the fourth wiring board is laminated on a side of the second wiring board remote from the inner wiring board.
In this embodiment, the outer layer circuit boards are two upper and lower layers, i.e., the third circuit board and the fourth circuit board.
In a specific embodiment, the structure of the multilayer flexible circuit board is as follows: the third circuit board-the first circuit board-the inner layer circuit board-the second circuit board-the fourth circuit board.
As an optional implementation, further comprising:
when the thickness of the multilayer flexible circuit board is 1.2mm-1.4mm and the copper coating amount of the inner layer is 1OZ-1.2OZ, through holes with the density of 650/square decimeter-700/square decimeter and the inner diameter of more than or equal to 300 mu m are manufactured in a non-finished product area of the multilayer flexible circuit board;
when the thickness of the multilayer flexible circuit board is 1.4mm-1.6mm and the copper coating amount of the inner layer is 1.2OZ-1.5OZ, through holes with the density of 600/square decimeter-650/square decimeter and the inner diameter of more than or equal to 350 mu m are manufactured in the unfinished product area of the multilayer flexible circuit board;
when the thickness of the multilayer flexible circuit board is 1.6mm-1.8mm and the copper coating amount of the inner layer is 1.5OZ-2OZ, through holes with the density of 500/square decimeter-600/square decimeter and the inner diameter of more than or equal to 400 mu m are manufactured in the non-finished product area of the multilayer flexible circuit board.
In this embodiment, taking a multilayer flexible circuit board with a glass transition temperature of 165-180 ℃ as an example, the roughness of the wall of the through hole is affected by the number of layers of the multilayer circuit board, the thickness of copper in the inner layer, the thickness of the dielectric layer, and the width of the inner layer ring: the larger the inner layer copper thickness is, the larger the layer number is, the larger the copper content in the drill cuttings is; the smaller the inner ring width is, the hole is easily damaged by pulling during drilling, and the roughness of the hole wall exceeds the standard and the interconnection defect is caused. Therefore, the through holes with different densities and inner diameters are arranged according to the parameters of the multilayer flexible circuit board such as different thicknesses, inner copper coating amount, glass transition temperature and the like, so that the stability of the multilayer flexible circuit board with different parameters is adapted.
Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope defined by the appended claims.
Claims (9)
1. A manufacturing method for controlling the dimensional stability of a multilayer flexible circuit board is characterized by comprising the following steps:
laminating the second outer layer circuit board to the inner layer circuit board;
manufacturing a plurality of first through holes on the secondary outer layer circuit board and the inner layer circuit board;
copper plating a plurality of the first through holes;
laminating an outer layer circuit board to the next outer layer circuit board.
2. The method of claim 1, wherein forming a plurality of first vias in the outer layer circuit board and the inner layer circuit board comprises:
and manufacturing through holes of 0.3-2 mm in the non-finished product areas on the secondary outer layer circuit board and the inner layer circuit board, wherein the density of the through holes is 500-700/square decimeter.
3. The method of claim 1, further comprising, after laminating an outer layer circuit board to the second outer layer circuit board:
and manufacturing a plurality of second through holes corresponding to the first through holes one by one on the outer layer circuit board.
4. The method of claim 1, further comprising, after laminating an outer layer circuit board to the second outer layer circuit board:
manufacturing a plurality of third through holes on the multilayer flexible circuit board;
and plating copper on the third through hole.
5. The method of claim 3, further comprising, after laminating the outer layer circuit board to the second outer layer circuit board:
and carrying out copper plating on the plurality of first through holes and the plurality of second through holes.
6. The method of claim 1, wherein the thickness of the copper plating is 12 μm or more.
7. The manufacturing method for controlling the dimensional stability of a multilayer flexible circuit board according to claim 1, wherein the sub-outer layer circuit board comprises a first circuit board and a second circuit board; wherein the first wiring board is laminated on one side of the inner-layer wiring board; the second wiring board is laminated on the other side of the inner-layer wiring board.
8. The manufacturing method for controlling the dimensional stability of a multilayer flexible wiring board according to claim 7, wherein the outer layer wiring board comprises a third wiring board and a fourth wiring board; wherein the third circuit board is laminated on the side of the first circuit board away from the inner layer circuit board; the fourth circuit board is laminated on a side of the second circuit board remote from the inner circuit board.
9. The manufacturing method for controlling the dimensional stability of the multilayer flexible circuit board according to claim 1, further comprising:
when the thickness of the multilayer flexible circuit board is 1.2mm-1.4mm and the copper coating amount of the inner layer is 1OZ-1.2OZ, through holes with the density of 650/square decimeter-700/square decimeter and the inner diameter of more than or equal to 300 mu m are manufactured in the unfinished product area of the multilayer flexible circuit board;
when the thickness of the multilayer flexible circuit board is 1.4mm-1.6mm and the copper coating amount of the inner layer is 1.2OZ-1.5OZ, through holes with the density of 600/square decimeter-650/square decimeter and the inner diameter of more than or equal to 350 mu m are manufactured in the unfinished product area of the multilayer flexible circuit board;
when the thickness of the multilayer flexible circuit board is 1.6mm-1.8mm and the copper coating amount of the inner layer is 1.5OZ-2OZ, through holes with the density of 500/square decimeter-600/square decimeter and the inner diameter of more than or equal to 400 mu m are manufactured in the unfinished product area of the multilayer flexible circuit board.
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| CN202011125443.5A CN112235952B (en) | 2020-10-20 | 2020-10-20 | Manufacturing method for controlling dimensional stability of multilayer flexible circuit board |
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| CN202011125443.5A CN112235952B (en) | 2020-10-20 | 2020-10-20 | Manufacturing method for controlling dimensional stability of multilayer flexible circuit board |
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