CN102740582A - Multilayer printed wiring board and producing method thereof - Google Patents
Multilayer printed wiring board and producing method thereof Download PDFInfo
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- CN102740582A CN102740582A CN2011103896563A CN201110389656A CN102740582A CN 102740582 A CN102740582 A CN 102740582A CN 2011103896563 A CN2011103896563 A CN 2011103896563A CN 201110389656 A CN201110389656 A CN 201110389656A CN 102740582 A CN102740582 A CN 102740582A
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Abstract
The invention relates to a multilayer printed wiring board and a producing method thereof, especially relates to a multilayer printed wiring board which is filled by plated metals and has through holes, and a producing method of the multilayer printed wiring board. The multilayer printed wiring board (90) comprises inner layer circuit substrate (10), outer layer circuit substrate (40) which stack on the surface of the inner layer circuit substrate (10) with an insulation layer disposed in between, outer layer circuit substrate (50) which stack on the rear side of the inner layer circuit substrate (10) with an insulation layer disposed in between, and a filling through path (71) which fills plated metals (68) in the through hole (61) of the inner layer circuit substrate (10) and the outer layer circuit substrate (40, 50). The through hole (61) is composed in a manner of communicating a path hole (67) communicating with the outer layer circuit substrate (40), an inner layer through hole (5) communicating with the inner layer circuit substrate (10), and a path hole (66) communicating with the outer layer circuit substrate (50). The path holes (67, 66) have a minimum opening diameter which is larger than the maximum opening diameter of the inner layer through hole (5).
Description
Technical field
The present invention relates to multilayer printed-wiring board and manufacturing approach thereof, particularly have filling vias (filled via) structure multilayer printed wiring board and manufacturing approach thereof.
Background technology
In recent years, the miniaturization and the high performance thereof of electronic equipment are growing, follow in this, and be also constantly surging to the requirement of the densification of printed wiring board.Therefore, be center and popularizing widely with the fit multilayer printed-wiring board of seeking densification of a plurality of printed wiring boards with the miniaturized electronics of portable phone, digital video camera etc.As densification an example of printed wiring board, disclose the multilayer printed-wiring board that flexible printing wiring board is range upon range of (for example, with reference to patent documentation 1).
In addition, in patent documentation 2 and 3, disclose through the vertical section that makes through hole and be shaped as drum type or be the top that the makes cone-shaped shape to getting up each other, thus form the through hole of filling with plated metal (below, be called " fill and connect path ".) method.
The prior art document
Patent documentation 1: TOHKEMY 2004-200260 communique;
Patent documentation 2: TOHKEMY 2004-311919 communique;
Patent documentation 3: TOHKEMY 2003-046248 communique.
The problem that invention will solve
To the manufacturing approach of the multilayer flexible printed wiring plate of comparative example, use Fig. 5 A and Fig. 5 B to describe here.
(1) at first, prepare to be formed with the two sides copper-surfaced plywood of Copper Foil on the two sides of the flexual insulating basement membrane that constitutes by polyimides etc.Then, this two sides copper-surfaced plywood is carried out the composition etc. of formation, copper plating treatment and the Copper Foil of through hole, make internal circuit base material 100.Can know that from Fig. 5 A (1) internal layer circuit base material 100 has: wiring pattern that forms on the two sides of insulating basement membrane and the electroplating ventilating hole that the wiring pattern on two sides is electrically connected.
(2) then; Can know from Fig. 5 A (1); In order to carry out insulation protection in the two sides to internal layer circuit base material 100, use vacuum laminator etc., lamination has the cover layer (coverlay) 110 of dielectric film 130 and bond layer 120 on the two sides of internal layer circuit base material 100.Thus, make core substrate 200.
(3) then, making increases the outer circuit base material 300 of usefulness layer by layer.This outer circuit base material 300 is with the base material after the Copper Foil pattern processing according to the rules on the two sides of two sides copper-surfaced plywood.The wiring pattern of outer circuit base material 300 forms the position at blind via hole (blind via hole) and has peristome 310.This peristome 310 in the laser processing operation of back level as conformal mask (conformal mask) and the performance function.
(4) then, on the two sides of core substrate 200 across lamination adhesive layer 210 range upon range of outer circuit base material 300, thus, the multilayer circuit base material 400 shown in the construction drawing 5 (1).
(5) then shown in Fig. 5 A (2), at multilayer circuit base material 400 blind via hole of formation and through holes (through hole).More specifically; Peristome 310 irradiating lasers to outer circuit base material 300 carry out laser processing, are formed on blind via hole 410 and the blind via hole 420 of wiring pattern that exposes the back side of outer circuit base material 300 in the bottom surface that the wiring pattern of internal layer circuit base material 100 is exposed in the bottom surface.In addition, through the processing of being holed in the formation position of through hole, thereby form the through hole 430 that connects multilayer circuit base material 400.
(6) follow shown in Fig. 5 A (3), the multilayer circuit base material 400 that is formed with blind via hole 410,420 and through hole 430 is applied electroplating processes, form and electroplate epithelium 450.Form plating epithelium 450 through side, thereby bring into play function, form and electroplate blind via hole 460,470,480 and electroplating ventilating hole 490 as the interlayer access path at blind via hole 410,420 and through hole 430.
(7) then, shown in Fig. 5 B (4), through using photoetching process the conducting film on the surface of outer circuit base material 300 is processed as the pattern of regulation, thereby forms outer circuit wiring pattern 500.
(8) then as Fig. 5 B (5) shown in, form solder resist 510, the outer circuit layout card case of 510 pairs of this solder resists 500, the blind via hole 460,470,480 of plating and electroplating ventilating hole 490 carry out insulation protection.This solder resist 510 forms with the mode that the formation predetermined position that the terminal of usefulness and the terminal that is connected usefulness are installed at parts has peristome 510a.Have again,, also can replace solder resist and use cover layer as the insulation protection material.
(9) then, the outer circuit wiring pattern 500 that exposes in the bottom surface of peristome 510a is applied gold-plated, zinc-plated etc. surface treatment, form terminal 520.
Through above-mentioned operation, accomplish multilayer flexible printed wiring plate 600 with the blind via hole 460,470,480 of plating and electroplating ventilating hole 490.
Can know from Fig. 5 B, terminal 520 be not arranged on electroplate blind via hole 460,470,480 and electroplating ventilating hole 490 directly over.This is for electronic unit, the nude film that is typically chip size package (CSP:Chip Size Package) etc. are installed with respect to multilayer flexible printed wiring plate abreast.That is,, be difficult to electronic unit is installed with respect to printed wiring board abreast electronic unit being installed under the situation of electroplating directly over blind via hole 460,470,480 and the electroplating ventilating hole 490.In order to make this reason clearer, describe to the installation procedure of CSP.
At first, to lay respectively at the mode of electroplating directly over blind via hole 460,470,480 and the electroplating ventilating hole 490 at a plurality of solder balls that are provided with on the terminal of CSP, CSP is carried put on printed wiring board.Afterwards, in the Reflow Soldering operation, make the solder ball fusion, CSP is fixed in printed wiring board., shown in Fig. 5 B (5), the degree of depth of electroplating blind via hole 460,470,480 and electroplating ventilating hole 490 is miscellaneous, and the amount that therefore is inhaled into the fusion welding in these holes is difference by each hole.As a result, can not CSP be installed abreast with respect to printed wiring board.
Therefore; Can not with terminal be arranged on electroplate blind via hole 460,470,480 and electroplating ventilating hole 490 directly over; Terminal 520 that kind shown in Fig. 5 B (5), must with terminal be arranged on from electroplate blind via hole 460,470,480 and electroplating ventilating hole 490 directly over the position of departing to the left and right.
Miniaturization/multifunction the alarming development of the electronic equipment of digital video camera in recent years etc., the solder pad space length of CSP be thin spaceization all the more also.Specifically, the solder pad space length about 0.8mm became below the 0.5mm originally, cooperated to change, and printed wiring board is also required further densification.
, owing to as above-mentioned, in the configuration of terminal, restriction is arranged, so always, extremely be difficult to install the chip of thin space and multitube pin, for example netful lattice dispose the CSP of the pad more than 10 * 10 (full grid).
Therefore, consider to construct thereby form filling vias through carrying out blind via hole, through hole are filled the filling electroplating processes of metal.As stated, in patent documentation 2 and 3, proposed to be shaped as drum type, thereby formed the method that connects path of filling through the vertical section that makes through hole.
, the single layer substrate that all will be made up of single material in these documents can not be used multilayer printed-wiring board as object.For example under the situation of the multilayer printed-wiring board shown in Fig. 5 (B), the layer of the various materials that machined layer is range upon range of processing characteristics such as dielectric film, bonding agent and Copper Foil are different.Therefore,, also extremely be difficult to machined layer is processed, make that the vertical section is a drum type even use laser processing etc.
And then, under the situation of multilayer printed-wiring board, also there is other problem.That is, the terminal of electronic unit not only need be arranged on the through hole, also need be arranged on the blind via hole, but because mobile different at textural plating soup of through hole and blind via hole, so existence is difficult to handle with identical filling electroplating work procedure.More specifically, filling electroplating processes, to have under the lower situation of the flowability of electroplating soup be characteristic efficient and that carry out easily.Under the situation of the blind via hole that the end is arranged, owing to electroplate the mobile low of soup, so can obtain good filling vias structure.With respect to this, under the situation of through hole, owing to electroplate the mobile high of soup, so can not be expeditiously to filling plated metal in the through hole.
Summary of the invention
Be used to solve the scheme of problem
According to a mode of the present invention, a kind of multilayer printed-wiring board is provided, it is characterized in that possessing: the internal layer circuit base material; The 1st outer circuit base material is layered in the surface of said internal layer circuit base material across insulating barrier; The 2nd outer circuit base material is layered in the back side of said internal layer circuit base material across insulating barrier; And fill the perforation path, in the through hole that connects said the 1st outer circuit base material, said internal layer circuit base material and said the 2nd outer circuit base material, be filled with plated metal,
Said through hole with the 1st via hole that connects said the 1st outer circuit base material, connect the internal layer through hole of said internal layer circuit base material and connect the mode that the 2nd via hole of said the 2nd outer circuit base material is communicated with and constitute, the said the 1st and the 2nd via hole has the minimal openings diameter bigger than the maximum open diameter of said internal layer through hole.
According to another mode of the present invention; A kind of manufacturing approach of multilayer printed-wiring board is provided, it is characterized in that, prepare the two sides genus plywood of gilding; Gild and belong to the metal forming that plywood has flexual insulating basement membrane and forms on the two sides of this insulating basement membrane in this two sides; Be formed on thickness direction and connect said two sides and gild and belong to the internal layer through hole of plywood, the said two sides metal forming that belongs to plywood of gilding is carried out composition, form the internal layer wiring pattern; Make the internal layer circuit base material thus; Prepare the 1st and the 2nd genus plywood of gilding, the 1st and the 2nd gilds belongs to the metal forming that plywood has flexual insulating basement membrane and forms at least one face of this insulating basement membrane, and the said the 1st metal forming that belongs to plywood of gilding is carried out composition; Form the 1st outer wiring pattern; Make the 1st outer circuit base material thus, the said the 2nd metal forming that belongs to plywood of gilding is carried out composition, form the 2nd outer wiring pattern; Make the 2nd outer circuit base material thus; Be positioned at the mode in the outside with the said the 1st outer wiring pattern, said the 1st outer circuit base material be layered in the surface of said internal layer circuit base material across insulating barrier, and be positioned at the mode in the outside with the said the 2nd outer wiring pattern; Said the 2nd outer circuit base material is layered in the back side of said internal layer circuit base material across insulating barrier; Make the multilayer circuit base material thus, through carrying out laser processing operation, thereby form the through hole that connects said multilayer circuit base material the area illumination laser of the regulation of said multilayer circuit base material; Said through hole constitutes; Connect said the 1st outer circuit base material and have the 1st via hole, the said internal layer through hole of the minimal openings diameter bigger and the 2nd via hole that connects said the 2nd outer circuit base material and have a minimal openings diameter bigger than the maximum open diameter of said internal layer through hole is communicated with, carry out said through hole is filled the filling electroplating processes of plated metal, form the filling that said internal layer wiring pattern, the said the 1st outer wiring pattern and the said the 2nd outer wiring pattern are electrically connected and connect path than the maximum open diameter of said internal layer through hole.
The effect of invention
The through hole of execution mode of the present invention with the 1st via hole that connects the 1st outer circuit base material, connect the internal layer through hole of internal layer circuit base material and connect the mode that the 2nd via hole of the 2nd outer circuit base material is communicated with and constitute.In addition, the 1st and the 2nd via hole has the minimal openings diameter bigger than the maximum open diameter of internal layer through hole.In through hole with such structure; Form the bight in the coupling part of the 1st via hole and internal layer through hole and the coupling part of the 2nd via hole and internal layer through hole; When in to through hole, filling plated metal; Because exist the bight to cause to electroplate the flowability of soup to reduce, plated metal becomes and separates out easily.And then the 1st and the 2nd via hole constitutes has the minimal openings diameter bigger than the maximum open diameter of internal layer through hole, so the more past inside diameter of through hole is more little.Therefore, when filling electroplating processes, pass through plated metal and blocked at initial internal layer through hole, formation is the recess of 2 V-shapes up and down.Thus, can suppress the generation in space etc. and form high-quality filling and connect path, and, improve, can shorten and fill the formation time that connects path so fill the efficient of electroplating processes owing to electroplate the mobile of soup and further reduce.
Description of drawings
Figure 1A is the process profile of manufacturing approach of the multilayer flexible printed wiring plate of expression execution mode of the present invention.
Figure 1B is the process profile of manufacturing approach of the multilayer flexible printed wiring plate of expression execution mode of the present invention.
Fig. 2 A is the process profile of manufacturing approach of the multilayer flexible printed wiring plate of expression execution mode of the present invention.
Fig. 2 B is then Fig. 2 A, representes the process profile of manufacturing approach of the multilayer flexible printed wiring plate of execution mode of the present invention.
Fig. 3 is the profile that the A portion of Fig. 2 A (3) has been amplified and the plane graph of through hole.
Fig. 4 A is illustrated in the profile of filling the appearance of plated metal in the through hole.
Fig. 4 B follows Fig. 4 A, is illustrated in the profile of filling the appearance of plated metal in the through hole.
Fig. 5 A is the process profile of manufacturing approach of the multilayer flexible printed wiring plate of expression comparative example.
Fig. 5 B follows Fig. 5 A, the process profile of the manufacturing approach of the multilayer flexible printed wiring plate of expression comparative example.
Fig. 6 (A) is the profile that the outer circuit substrate layer of being made by single face copper-surfaced plywood is stacked in the multilayer flexible printed wiring plate of core substrate, (B) is the profile that the outer circuit substrate layer of being made by single face copper-surfaced plywood is laminated to the multilayer flexible printed wiring plate of internal layer circuit base material.
Embodiment
Below, with reference to accompanying drawing execution mode of the present invention is described.
Have again, in each figure, give prosign, do not repeat the detailed description of the structural element of prosign structural element with same function.In addition, accompanying drawing is to be the figure that the center is represented with the characteristic, and ratio of the relation of thickness and planar dimension, the thickness of each layer etc. is different with reality.
Use Figure 1A, Figure 1B, Fig. 2 A, Fig. 2 B, Fig. 3 and Fig. 4 A and Fig. 4 B, the manufacturing approach of the multilayer printed-wiring board of this execution mode is described.
At first, use Figure 1A, describe to the manufacturing approach of core substrate.
(1) prepares to have the flexual insulating basement membrane 1 that constitutes by polyimides etc. and the two sides copper-surfaced plywood 4 of Copper Foil 2 that forms on the two sides of this insulating basement membrane 1 and Copper Foil 3.
(2) then, as can knowing,, form the internal layer through hole 5 that connects two sides copper-surfaced plywood 4 through NC boring processing (or laser processing method) to this two sides copper-surfaced plywood 4 from Figure 1A (1).
(3) then, can know, in to internal layer through hole 5, remove and bore after dirty processing and the conductionization processing, the whole face of the two sides copper-surfaced plywood 4 that is formed with internal layer through hole 5 is applied electroplating processes (for example electrolytic copper plating processing) from Figure 1A (1).Thus, on Copper Foil 2,3 and the inwall of internal layer through hole 5 form to electroplate epithelium 6, and form the electroplating ventilating hole 7 that Copper Foil 2 and Copper Foil 3 are electrically connected.
(4) then, through subtracting into the pattern that worker's method is processed into the conducting film (electroplating epithelium 6 and Copper Foil 2,3) on the two sides of insulating basement membrane 1 regulation.In more detail, to cover the mode of electroplating epithelium 6 and electroplating ventilating hole 7, the resist layer (not shown) of formation dry film photoresist etc. afterwards, makes public/develops resist layer through photoetching process, resist layer is processed into the pattern of regulation.Afterwards, with composition resist layer as mask, carry out etching to electroplating epithelium 6 with Copper Foil 2,3, form internal layer wiring pattern 8A, 8B thus.Afterwards, peel off resist layer.
Through operation so far, shown in Figure 1A (1), be produced on the internal layer circuit base material 10 that the surface and the back side form internal layer wiring pattern 8A, 8B respectively, have electroplating ventilating hole 7.
Have again, in above-mentioned process, after forming internal layer through hole 5, carry out electroplating processes, but do not carry out this electroplating processes and the composition that carries out Copper Foil 2,3 also can.
(5) then, prepare to have the dielectric film 12 that constitutes by polyimide film etc. and the cover layer 13 of the bond layer 11 that forms at the single face of this dielectric film 12.Bond layer 11 for example is made up of the bonding agent of acrylic resin, epoxy resin etc.And, for internal layer wiring pattern 8A, 8B are carried out insulation protection, use vacuum laminator etc., to the two sides difference lamination cover layer 13 of internal layer circuit base material 10.Through this operation, obtain the core substrate 20 shown in Fig. 1 (2).Have, shown in Fig. 1 (2), internal layer wiring pattern 8A, 8B and electroplating ventilating hole 7 are filled through bond layer 11 again.
Then, to the manufacturing approach that increases outer circuit base material 40,50 layer by layer in core substrate 20 range upon range of becoming, use Figure 1B to describe.
(1) at first, prepare two sides copper-surfaced plywood 34 and two sides copper-surfaced plywood 44.This two sides copper-surfaced plywood 34 (44) has flexual insulating basement membrane 31 (41) and Copper Foil 32 (42) that forms on its two sides and the Copper Foil 33 (43) that is made up of polyimides etc.
(2) then, through subtracting into worker's method, the Copper Foil 32,33 of two sides copper-surfaced plywood 34 is processed into the pattern of regulation, makes the outer circuit base material 40 shown in Figure 1B (a) thus.Copper Foil 32 has peristome 35,37 and 38, and Copper Foil 33 has the outer wiring pattern 39 that comprises peristome 36.
Likewise, through the Copper Foil 42,43 of two sides copper-surfaced plywood 44 being processed into the pattern of regulation, make the outer circuit base material 50 shown in Figure 1B (b) thus.Copper Foil 42 has the outer wiring pattern 49 that comprises peristome 47, and Copper Foil 43 has peristome 45,46 and 48.Peristome 35 ~ 38 and peristome 45 ~ 48 are arranged on the formation presumptive area of through hole, blind via hole, in the laser processing operation of back level, bring into play function as the conformal mask.
In addition, at Figure 1B (a) and (b) from figure the peristome 36 and peristome 45 during beneath.Like this; Peristome 36 and 45 is with the minimal openings diameter during as benchmark; Have the starriness of a plurality of recesses and form as accordion ground, when with the maximum open diameter during, as having and form towards the shape of a plurality of juts of inboard as benchmark.
Then, core substrate 20, outer circuit base material 40 and the outer circuit base material of in above-mentioned operation, making 50, the method for making the multilayer flexible printed wiring plate of this execution mode used is described.
(1) such shown in Fig. 2 A (1), outer circuit base material 40 is regional via the regulation at the range upon range of respectively surface that is bonded in core substrate 20 of bonding agent 51 and the back side with 50.Thus, the multilayer circuit base material 60 shown in the construction drawing 2A (2).There is not the zone of range upon range of outer circuit base material to become the flexible cable portion that is used for lead-out wiring.
Have, as the bonding agent that in bond layer 51, uses, preferably the prepreg of low flow model, adhesive sheet etc. flow out few material again.
(2) then, such shown in Fig. 2 A (2) and (3), to peristome 35,37,38,45,46,48 irradiating laser (for example, the CO of multilayer circuit base material 60
2Laser), carry out the conformal laser processing.Thus, form through hole 61 and blind via hole 62 ~ 65.Afterwards, bore dirty processing etc., carry out the cleaning in through hole 61 and the blind via hole 62 ~ 65 through removing.
Shown in Fig. 2 A (3); Via hole 61 is the holes that connect multilayer circuit base material 60 at thickness direction; More specifically, upside connects insulating basement membrane 31, bond layer 51 (upside), dielectric film 12 (upside), bond layer 11 (upside), bond layer 11 (downside), dielectric film 12 (downside), bond layer 51 (downside) and insulating basement membrane 41 towards downside from figure.
Blind via hole 62 connects insulating basement membrane 31, bond layer 51, dielectric film 12 and bond layer 11, exposes in its bottom surface and electroplates epithelium 6.This blind via hole 62 is leap via holes (skip via) that the outer wiring pattern 39 at the back side that is arranged on outer circuit base material 40 is crossed over.
Blind via hole 63 connects insulating basement membrane 41, bond layer 51, dielectric film 12 and bond layer 11, exposes in its bottom surface and electroplates epithelium 6.This blind via hole 63 is the ladder via holes that expose Copper Foil 42 at the middle part.
Blind via hole 64 is the blind via holes that connect insulating basement membrane 31, expose Copper Foil 33 in its bottom surface.In addition, blind via hole 65 is the blind via holes that connect insulating basement membrane 41, expose Copper Foil 42 in its bottom surface.
To the structure of through hole 61, use Fig. 3 to describe in further detail here.The amplification profile of the part of Fig. 3 presentation graphs 2A (3) (A portion) with dotted line.Through hole 61 constitutes the hole that internal layer through hole 5, via hole 67 and via hole 66 are communicated with.
Via hole 67 is to have last hole that the peristome 35 with Copper Foil 32 forms as mask and the ladder via hole in following hole that the peristome 36 of Copper Foil 33 is formed as mask.As shown in Figure 3, diameter becomes big with the order in the last hole of the following hole of internal layer through hole 5, via hole 67, via hole 67.That is, the diameter of the through hole of perforation multilayer circuit base material is accompanied by entering internal layer side and diminishes interimly.
Via hole 66 is via holes that the peristome 45 with Copper Foil 43 forms as mask.As shown in Figure 3, the diameter of via hole 66 is bigger than the diameter of internal layer through hole 5.The maximum open diameter of the internal layer through hole 5 that more generally, is provided with at internal layer circuit base material 10 is littler than the minimal openings diameter of the via hole 66,67 that is provided with at outer circuit base material 40,50.Here, the maximum open diameter means the maximum of opening diameter.If the cross section shape of internal layer through hole 5 is circles shown in Figure 3, the maximum open diameter is that (length among Fig. 3 a) for this diameter of a circle.In addition, the minimal openings diameter means the minimum value of opening diameter.If the cross section shape in the following hole of via hole 66, via hole 67 is the stars towards the jut of inboard that have of that kind shown in Figure 3, the minimal openings diameter is the distance (the length b among Fig. 3) between 2 juts in opposite directions of this star.
The plane graph of representing the through hole 61 when upside and downside are observed through hole 61 in the above and below of the amplification profile of Fig. 3 respectively.
The cross section in the following hole of via hole 67 is identical with the shape of peristome 36.Therefore, the sidewall in the following hole of via hole 67, the starriness of reflection peristome 36 and form concavo-convex.Likewise, the cross section of via hole 66 is identical with the shape of peristome 45.Therefore, at the sidewall of via hole 66, the reflection peristome 45 starriness and form concavo-convex.
(3) then, shown in Fig. 2 B (4), to through hole 61 and 62 ~ 65 conduction processing of blind via hole.Afterwards, fill plating soup (the copper sulphate electroplating additive that electroplating processes is used through having utilized.The Toplucina THF of wild pharmaceuticals industry for example difficult to understand society system) filling electroplating processes (metallide processing) is filled plated metal 68 in through hole 61 and blind via hole 62 ~ 65, form to fill to connect path 71, filling vias 72 ~ 75.
Thus, shown in Fig. 2 B (4), obtain to have filled the multilayer circuit base material 70 of through hole 61 and blind via hole 62 ~ 65 with plated metal 68.
To the appearance of in through hole 61, filling plated metal 68, use Fig. 4 A and Fig. 4 B at length to describe here.
Shown in Fig. 4 A (1), at the initial stage of filling electroplating processes, be the center to fill the mobile smaller bight C that electroplates soup, separate out plated metal 68.Afterwards, along with the electroplating processes progress, shown in Fig. 4 A (2), the plated metal of in through hole 61, separating out becomes the drum type of the region D that diameter in the through hole 61 is minimum as the top.
When electroplating processes was further carried out, shown in Fig. 4 A (2) and (3), through hole 61 was stopped up by plated metal 68 in region D.The result forms the recess 69 of 2 mortar shapes up and down shown in Fig. 4 A (3).Through forming recess 69, electroplate the mobile of soup and further reduce, therefore promote to electroplate and fill.
Afterwards, along with filling the electroplating processes progress, shown in Fig. 4 B (4) and (5), recess 69 shoals, and finally becomes below the degree of depth of regulation, accomplishes and fills electroplating processes.
Like this, through hole 61 constitutes has the bight, and diameter diminishes along with getting into the inboard, therefore can be rapidly and ground such as space does not take place with plated metal 68 filling vias 61.
Pass through the filling electroplating processes of through hole 61 in addition, thereby blind via hole 62,63,64,65 can be filled also with plated metal 68.Thus, the plating filling work procedure that can unify through hole 61 and blind via hole 62,63,64,65.
And then, as using Fig. 3 explanation, the sidewall corrugated of the following hole of via hole 67 and via hole 66 be provided with a plurality of recesses.Therefore the flowability of electroplating soup when filling electroplating processes, promotes separating out of plated metal also owing to this recess reduces in this recess.As a result, can more promptly carry out the filling of metal.
(4) then, shown in Fig. 2 B (5), for example through the above-mentioned worker's method that subtracts into, pattern according to the rules carries out etching to the conducting film on the top layer of multilayer circuit base material 70, forms outer wiring pattern 80A and 80B.
(5) then, shown in Fig. 2 B (6), form the solder resist 91 of the outer wiring pattern 80A of protection, 80B.This solder resist 91 has peristome 91a at the terminal of parts installation usefulness and the formation predetermined position of the terminal that is connected usefulness.Have, replace solder resist (solder resist), the diaphragm that uses cover layer to form outer wiring pattern 80A, 80B also can.
(6) then, shown in Fig. 2 B (6), the plated metal 68 that exposes in the bottom surface of peristome 91a is applied needed surface treatments such as gold-plated, zinc-plated, form terminal 92.
Through above operation, accomplish the multilayer flexible printed wiring plate 90 of execution mode of the present invention.
Then, the structure to the multilayer flexible printed wiring plate 90 of this execution mode describes.
Shown in Fig. 2 B (6), multilayer flexible printed wiring plate 90 constitutes range upon range ofly respectively at the surface of internal layer circuit base material 10 and the back side has outer circuit base material 40 and 50.Multilayer circuit base material 40 is layered in the surface of internal layer circuit base material 10 across insulating barrier (bond layer 11, dielectric film 12, bond layer 51).Multilayer circuit base material 50 is layered in the back side of internal layer circuit base material 10 across insulating barrier (bond layer 11, dielectric film 12, bond layer 51).
In addition, multilayer flexible printed wiring plate 90 possesses the filling that is filled with plated metal and connects path 71 in the through hole 61 that connects outer circuit base material 40, internal layer circuit base material 10 and outer circuit base material 50.
Through hole 61 constitutes with the mode of via hole 66 connections of the via hole 67 that connects outer circuit base material 40, the internal layer through hole 5 that connects internal layer circuit base material 10 and perforation outer circuit base material 50.In addition, via hole 66,67 has the minimal openings diameter bigger than the maximum open diameter of internal layer through hole 5.
The amounting to 6 layers and be electrically connected of the wiring pattern that fill to connect 71 pairs of wiring patterns that are provided with on the two sides of outer circuit base material 40 of path, the wiring pattern that is provided with on the two sides of internal layer circuit base material 10 and be provided with on the two sides of outer circuit base material 50.Have again, be provided with through sidewall and electroplate epithelium 6, thereby the reliability of filling the interlayer connection that connects path 71 is further improved at through hole 5.
In addition, in multilayer flexible printed wiring plate 90, in blind via hole, also possesses the filling vias 72 ~ 75 of having filled plated metal.74,75 pairs of filling vias (surperficial path) are electrically connected at 2 layers of wiring pattern that are provided with as the two sides that increases outer circuit base material 40,50 layer by layer.72 pairs of 2 layers of wiring patterns in outer circuit base material 40 and 10 settings of internal layer circuit base material of filling vias (leap path) are electrically connected.In addition, 3 layers of the wiring patterns that are provided with on the two sides of outer circuit base material 50 of 73 pairs of filling vias (ladder path) and the wiring pattern that is provided with at internal layer circuit base material 10 are electrically connected.
As stated, in multilayer flexible printed wiring plate 90, the interlayer conductive path uses the filling vias structure and constitutes.Thus, shown in Fig. 2 B (6), can directly over filling perforation path 71, filling vias 72 ~ 75, terminal 92 be set.Therefore, the arrangement freedom of terminal increases, and can the electronic unit of the CSP of thin space etc. be installed with respect to multilayer flexible printed wiring plate 90 abreast.
That kind as described above according to the present invention, but can obtain the multilayer printed-wiring board of electronic unit of the CSP etc. of integrated level high carrying narrow space length.
In addition, multilayer flexible printed wiring plate 90 possesses as drawing the high flexible cable portion of the degree of freedom and also can.This flexible cable portion is to have the mode of the parts installation portion extension of outer circuit base material 40,50 to be provided with from range upon range of.
In the explanation of above-mentioned execution mode, outer circuit base material 40,50 use two sides copper-surfaced plywoods 34,44 and making, but be not limited thereto, use single face copper-surfaced plywood to make and also can.Fig. 6 (A) expression will be used the outer circuit base material 40A of single face copper-surfaced plywood making, the profile of multilayer printed-wiring board 90A that 50A is laminated to core substrate 20.
Shown in Fig. 6 (A); Outer circuit base material 40A and 50A have the Copper Foil of single face copper-surfaced plywood are processed and the outer wiring pattern that forms; With this skin wiring pattern be positioned at the outside mode, outer circuit base material 40A and 50A are layered in the surface and the back side of core substrate 20 respectively via bond layer 51A.
In addition; In the explanation of above-mentioned execution mode, make core substrate 20 at internal layer circuit base material 10 lamination cover layers 13, afterwards the outer circuit substrate layer is stacked in core substrate 20; But be not limited thereto, also can at internal layer circuit base material 10 direct range upon range of outer circuit base materials.Fig. 6 (B) expression will be used the outer circuit base material 40B of single face copper-surfaced plywood making, the profile of multilayer printed-wiring board 90B that 50B is laminated to internal layer circuit base material 10.
Shown in Fig. 6 (B); Outer circuit base material 40B and 50B have the Copper Foil of single face copper-surfaced plywood are processed and the outer wiring pattern that forms; With this skin wiring pattern be positioned at the outside mode, outer circuit base material 40B and 50B are layered in the surface and the back side of internal layer circuit base material 10 respectively via bond layer 51B.Can know that from Fig. 6 (B) for the internal layer wiring pattern to internal layer circuit base material 10 carries out insulation protection, outer circuit base material 40B, 50B also are layered in flexible cable portion.
Have, the method that outer circuit base material 40B, 50B is layered in internal layer circuit base material 10 roughly is divided into 2 kinds of methods again.
The 1st method is that the mode with internal layer wiring pattern 8A, 8B and the electroplating ventilating hole 7 of filling internal layer circuit base material 10 forms bond layer 51B, in the method for this bond layer 51B laminated outer circuit base material 40B, 50B.
The 2nd method is to use the method that single face copper-surfaced plywood bond layer, the band bond layer is arranged at the mask that does not form Copper Foil.In the method, the Copper Foil of single face copper-surfaced plywood is processed and formed outer circuit base material 40B, 50B, this outer circuit base material 40B, 50B are laminated to internal layer circuit base material 10.Have again, after will being laminated to internal layer circuit base material 10, the Copper Foil on surface processed forming outer wiring pattern and also can with the single face copper-surfaced plywood of bond layer.
In addition, at the folded outer circuit base material of making by two sides copper-surfaced plywood of a surface layer of core substrate 20 (or internal layer circuit base material 10), also can at the folded outer circuit base material of making by single face copper-surfaced plywood of another surface layer.
More than, be illustrated to multilayer printed-wiring board of the present invention and manufacturing approach thereof.
In the explanation of above-mentioned execution mode, carry out the method that composition is provided with wiring pattern and peristome as conducting film to Copper Foil etc., adopt to subtract into worker's method, but be not limited thereto, use false add to become other worker's method such as worker's method also can.
In addition, the peristome of bringing into play function as the conformal mask forms after the outer circuit substrate layer is stacked in core substrate also can.In addition,, use the method do not utilize the conformal mask, promptly use direct irradiation laser on the conducting film, the direct laser processing method of removing the insulating barrier of conducting film and below thereof also can as laser processing method.
In addition, the shape in the cross section of via hole 66,67 is not limited to star shown in Figure 3.In filling electroplating processes, as long as the structure that the flowability of electroplating soup reduces (concavo-convex etc.) is set.In addition, also can be not only in the following hole of via hole 67, also the sidewall in last hole is provided with recess.
In addition, be illustrated to multilayer flexible printed wiring plate in the above-described embodiment, but be not limited thereto, also can use the present invention other multilayer printed-wiring board such as hard and soft property printed wiring board, multilayer rigid printed wiring board.
In addition, wiring pattern, plated metal are not limited to copper.That is, in the explanation of above-mentioned execution mode, the metal that constitutes wiring pattern is a copper with the plated metal that is filled into via hole etc., but the present invention is not limited thereto, for example is that other metal such as aluminium, silver also can.
In addition, the multilayer flexible printed wiring plate of above-mentioned execution mode has 6 layers wiring pattern, but is not limited thereto.There is the multilayer printed-wiring board of outer circuit base material also can use the present invention to also range upon range of on outer circuit base material 40,50.
Based on above-mentioned record, so long as those skilled in the art, though possibly can expect effect of appending of the present invention, various distortion, mode of the present invention is not limited to above-mentioned execution mode.In the scope of the thought of the notion of the present invention that interior perhaps its coordinate that does not break away from the scope defined that is required by the present technique scheme is derived and purport, can carry out variously appending, changing and deletion partly.
Description of reference numerals
1 insulating basement membrane;
2,3 Copper Foils;
4 two sides copper-surfaced plywoods;
5 internal layer through holes;
6 electroplate epithelium;
7 electroplating ventilating holes;
8A, 8B internal layer wiring pattern;
10 internal layer circuit base materials;
11 bond layers;
12 dielectric films;
13 cover layers;
20 core substrates;
31,41 insulating basement membranes;
32,33,42,43 Copper Foils;
34,44 two sides copper-surfaced plywoods;
35,36,37,38,45,46,47,48 peristomes;
39,49 outer wiring patterns;
40,40A, 40B, 50,50A, 50B outer circuit base material;
51,51A, 51B bond layer;
60 multilayer circuit base materials;
61 through holes;
62,63,64,65 blind via holes;
66,67 via holes;
68 plated metals;
69 recesses
70 multilayer circuit base materials;
71 fill the perforation path;
72,73,74,75 filling vias;
80A, the outer wiring pattern of 80B;
90,90A, 90B multilayer printed-wiring board;
91 solder resists;
The 91a peristome;
92 terminals;
100 internal layer circuit base materials;
110 cover layers;
120 bond layers;
130 dielectric films;
200 core substrates;
210 lamination adhesive layers;
300 outer circuit base materials;
310 peristomes;
400 multilayer circuit base materials;
410,420 blind via holes;
430 through holes;
450 electroplate epithelium;
460,470,480 electroplate blind via hole;
490 electroplating ventilating holes;
500 outer circuit wiring patterns;
510 solder resists;
The 510a peristome;
520 terminals;
600 multilayer printed-wiring boards;
The C bight;
The D middle section.
Claims (10)
1. multilayer printed-wiring board is characterized in that possessing:
The internal layer circuit base material;
The 1st outer circuit base material is layered in the surface of said internal layer circuit base material across insulating barrier;
The 2nd outer circuit base material is layered in the back side of said internal layer circuit base material across insulating barrier; And
Fill and connect path, in the through hole that connects said the 1st outer circuit base material, said internal layer circuit base material and said the 2nd outer circuit base material, be filled with plated metal,
Said through hole with the 1st via hole that connects said the 1st outer circuit base material, connect the internal layer through hole of said internal layer circuit base material and connect the mode that the 2nd via hole of said the 2nd outer circuit base material is communicated with and constitute, the said the 1st and the 2nd via hole has the minimal openings diameter bigger than the maximum open diameter of said internal layer through hole.
2. multilayer printed-wiring board according to claim 1 is characterized in that, said the 1st via hole and/or said the 2nd via hole have concavo-convex at its sidewall.
3. multilayer printed-wiring board according to claim 1 is characterized in that, the cross section of said the 1st via hole and/or said the 2nd via hole has a plurality of juts towards the inboard.
4. multilayer printed-wiring board according to claim 1 is characterized in that also possessing: filling vias is filled with plated metal in the blind via hole that connects said the 1st outer circuit base material and/or said the 2nd outer circuit base material.
5. multilayer printed-wiring board according to claim 1 is characterized in that also possessing: flexible cable portion, and to have the mode of the parts installation portion extension of the said the 1st and the 2nd outer circuit base material to be provided with from range upon range of.
6. multilayer printed-wiring board according to claim 1 is characterized in that,
Said internal layer circuit base material has: flexual the 1st insulating basement membrane and the 1st and the 2nd internal layer wiring pattern that is provided with respectively on the two sides of said the 1st insulating basement membrane,
Said the 1st outer circuit base material has: flexual the 2nd insulating basement membrane and the 1st and the 2nd outer wiring pattern that is provided with respectively at the surface and the back side of said the 2nd insulating basement membrane,
Said the 2nd outer circuit base material has: flexual the 3rd insulating basement membrane and the 3rd and the 4th outer wiring pattern that is provided with respectively at the surface and the back side of said the 3rd insulating basement membrane,
Said filling connects path the said the 1st and the 2nd internal layer wiring pattern and said the 1st to the 4th outer wiring pattern is electrically connected.
7. the manufacturing approach of a multilayer printed-wiring board is characterized in that,
Preparing the two sides genus plywood of gilding, gilds and belongs to the metal forming that plywood has flexual insulating basement membrane and forms on the two sides of this insulating basement membrane in this two sides,
Be formed on thickness direction and connect said two sides and gild and belong to the internal layer through hole of plywood,
The said two sides metal forming that belongs to plywood of gilding is carried out composition, forms the internal layer wiring pattern, make the internal layer circuit base material thus,
Prepare the 1st and the 2nd genus plywood of gilding, the 1st and the 2nd gilds belongs to plywood and has: flexual insulating basement membrane and the metal forming that forms at least one face of this insulating basement membrane,
The said the 1st metal forming that belongs to plywood of gilding is carried out composition, forms the 1st outer wiring pattern, make the 1st outer circuit base material thus,
The said the 2nd metal forming that belongs to plywood of gilding is carried out composition, forms the 2nd outer wiring pattern, make the 2nd outer circuit base material thus,
Be positioned at the mode in the outside with the said the 1st outer wiring pattern; Said the 1st outer circuit base material is layered in the surface of said internal layer circuit base material across insulating barrier; And be positioned at the mode in the outside with the said the 2nd outer wiring pattern; Said the 2nd outer circuit base material is layered in the back side of said internal layer circuit base material across insulating barrier, makes the multilayer circuit base material thus
Through carrying out laser processing operation to the area illumination laser of the regulation of said multilayer circuit base material; Thereby form the through hole that connects said multilayer circuit base material; Said through hole constitutes; Connect said the 1st outer circuit base material and have the 1st via hole of the minimal openings diameter bigger than the maximum open diameter of said internal layer through hole; Said internal layer through hole; And the 2nd via hole that connects said the 2nd outer circuit base material and have a minimal openings diameter bigger than the maximum open diameter of said internal layer through hole is communicated with
Carry out said through hole is filled the filling electroplating processes of plated metal, form the filling that said internal layer wiring pattern, the said the 1st outer wiring pattern and the said the 2nd outer wiring pattern are electrically connected and connect path.
8. the manufacturing approach of multilayer printed-wiring board according to claim 7 is characterized in that,
Before said laser processing operation, gilding the said the 1st belongs to the gild metal forming that belongs to plywood of plywood and/or the said the 2nd and forms the through hole that has towards a plurality of juts of inboard and form and use peristome,
In said laser processing operation, carry out said through hole is formed the conformal mask processing with the peristome irradiating laser, forming the formation of cross section and said through hole is identical shaped said the 1st via hole with peristome.
9. the manufacturing approach of multilayer printed-wiring board according to claim 7; It is characterized in that; After forming said internal layer through hole and before forming said internal layer wiring pattern; Said the 1st two sides that is formed with said internal layer through hole gilded to be belonged to plywood and applies electroplating processes, forms the electroplating ventilating hole that metal forming that the two sides that belongs to plywood to gilding on said the 1st two sides is provided with is electrically connected thus.
10. the manufacturing approach of multilayer printed-wiring board according to claim 7 is characterized in that,
Gilding the said the 1st belongs to plywood and/or the said the 2nd and gilds and belong to plywood and form blind via hole and form and use peristome,
Carry out said blind via hole is formed the conformal mask processing with the peristome irradiating laser, form blind via hole,
In said filling electroplating processes, said blind via hole is filled said plated metal, form filling vias.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-084616 | 2011-04-06 | ||
| JP2011084616A JP5693339B2 (en) | 2011-04-06 | 2011-04-06 | Multilayer printed wiring board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102740582A true CN102740582A (en) | 2012-10-17 |
| CN102740582B CN102740582B (en) | 2016-12-14 |
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| CN105323950A (en) * | 2014-07-29 | 2016-02-10 | 三星电机株式会社 | Flexible printed circuit board and manufacturing method thereof |
| CN106658959A (en) * | 2015-10-28 | 2017-05-10 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN112235952A (en) * | 2020-10-20 | 2021-01-15 | 盐城维信电子有限公司 | Manufacturing method for controlling dimensional stability of multilayer flexible circuit board |
| CN114173495A (en) * | 2021-12-06 | 2022-03-11 | 博罗县精汇电子科技有限公司 | Method for manufacturing multilayer flexible circuit board |
| CN114286540A (en) * | 2020-09-28 | 2022-04-05 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board manufacturing method and circuit board |
| CN114651369A (en) * | 2019-11-13 | 2022-06-21 | 株式会社自动网络技术研究所 | Battery wiring module |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105323950A (en) * | 2014-07-29 | 2016-02-10 | 三星电机株式会社 | Flexible printed circuit board and manufacturing method thereof |
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| CN114651369A (en) * | 2019-11-13 | 2022-06-21 | 株式会社自动网络技术研究所 | Battery wiring module |
| CN114286540A (en) * | 2020-09-28 | 2022-04-05 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board manufacturing method and circuit board |
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| CN112235952A (en) * | 2020-10-20 | 2021-01-15 | 盐城维信电子有限公司 | Manufacturing method for controlling dimensional stability of multilayer flexible circuit board |
| CN112235952B (en) * | 2020-10-20 | 2021-08-17 | 盐城维信电子有限公司 | Manufacturing method for controlling dimensional stability of multilayer flexible circuit board |
| CN114173495A (en) * | 2021-12-06 | 2022-03-11 | 博罗县精汇电子科技有限公司 | Method for manufacturing multilayer flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201247055A (en) | 2012-11-16 |
| JP5693339B2 (en) | 2015-04-01 |
| JP2012222078A (en) | 2012-11-12 |
| TWI500366B (en) | 2015-09-11 |
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