JP2004111578A - Process for producing build-up printed wiring board with heat spreader and build-up printed wiring board with heat spreader - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process for producing an inexpensive build-up printed wiring board with a head spreader in which high density wiring can be formed. <P>SOLUTION: A first wiring layer is formed by electrolytic plating using a resist arranged on one side of a conductive substrate as a plating mask. Following to a series of circuit forming process comprising steps (a) for forming an insulating layer and a metal foil on the entire surface to cover the wiring part, (b) for forming the wiring part by photoetching the metal foil formed in layer, (c) for making a via hole connecting the wiring layers and then filling the via hole by carrying out electrolytic plating using the conductive substrate as a power supply layer, electrolytic plating is carried out in the region for forming an external connection terminal of a surface insulation layer covering the uppermost wiring layer using the conductive substrate as a power supply layer. An external connection terminal is then formed on the surface insulation layer and the conductive substrate used as the power supply layer is etched selectively. A heat spreader part is formed along with a frame part by the remaining part of the conductive substrate. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a build-up type wiring board, and more particularly to a build-up type wiring board with a heat spreader.
[0002]
[Prior art]
In recent years, in order to respond to increasingly smaller and lighter electronic devices, a multilayer printed circuit board (hereinafter, also referred to as a multilayer wiring board) requires a finer wiring pattern than a conventional bonded type printed circuit board. Various types of build-up boards (also referred to as build-up wiring boards), which are build-up type printed boards in which an insulating layer and a wiring layer are sequentially laminated on a core material, have been developed as those that can be accommodated at a high density. There are various production methods.
For the formation of the wiring portion, there are a sub-trackive method in which the wiring portion is formed by etching, an additive method in which the wiring portion is formed by plating, a semi-additive method in between these methods, and the like. There are a photo via process method in which an insulating resin is formed by making holes by a photo process, and a laser via process method in which an insulating resin is formed by making holes.
According to such a build-up substrate, the wiring of the conventional bonded type substrate can be miniaturized to about 25/25 μm, whereas the wiring / gap is usually about 50/50 μm. Was.
In addition, the build-up substrate enables not only a fine wiring but also a penetrating T / H-less operation that does not require a penetrating through hole (T / H) used in a conventional bonded type substrate.
Although the thickness per layer has been reduced due to the progress of technology, the number of layers may be several tens in some cases, and the total thickness may be several cm or more.
[0003]
Here, as an example, an example of manufacturing a build-up substrate by forming a wiring portion by a subtracking method and forming a via portion by a laser via process will be briefly described with reference to FIG.
First, on both sides of a core substrate 510 on which inner layer patterns (also referred to as inner layer wiring patterns) 512 and 513 formed by photoetching a copper foil laminated on the core material are provided on both surfaces of the core material 511, respectively. Copper foils 525 and 526 are laminated via insulating layers 520 and 521 made of a thermosetting resin, and the via forming portions of the copper foils 525 and 526 are formed by photoetching. (FIG. 5 (a))
Next, a laser beam 540 having a larger diameter than the holes 525a and 526a of the perforated copper foils 525 and 526 is irradiated to perforate the insulating layers 520 and 521. (FIG. 5 (b))
By adjusting the irradiation energy of the laser beam 540, only the insulating layers 520 and 521 are removed and penetrated. (FIG. 5 (c))
As a result, holes 550 and 555 reaching the inner layer patterns 512 and 513 are formed.
Next, a copper plating layer 560 is formed by electroless and electroless. (FIG. 5 (d))
Next, a predetermined region is etched away by a photoetching method. (FIG. 5 (e))
Thereby, desired via portions 570 and 571 and wiring portions 580 and 581 are formed.
Similarly, by repeating the formation of the wiring portions 580 and 581 and the formation of the via portions 570 and 571, a wiring layer can be formed in a further multilayer.
[0004]
In recent years, as ICs have become faster and more highly integrated, finer wiring and higher definition have been demanded. For example, a build-up wiring board manufactured as described above may be used as an interposer. When used as a printed wiring board for a semiconductor package, since a copper foil is etched to form a wiring pattern, there has been a limit to miniaturization and high definition of wiring, which has been a problem.
Further, a complicated process of forming a power supply layer by performing electroless plating and forming a via portion by electrolytic plating is required, and there is a problem in work efficiency due to this.
In addition, since the core material 411 is used, there is a limit in reducing the size and weight, and this has been a problem.
[0005]
As an interposer for a semiconductor package, one having a high-density wiring is required. However, an LSI requiring a high-density wiring has a relatively large number of I / Os and a large amount of heat generated during operation. Therefore, it is necessary to cope with heat radiation, and it is necessary to add a heat spreader. Conventionally, however, a heat spreader has been disclosed in Japanese Unexamined Patent Application Publication No. 11-74417 and Japanese Unexamined Patent Application Publication No. 2001-185563. It is manufactured separately from the substrate, and requires steps such as sticking to a substrate or a chip at the time of packaging, which is troublesome and causes a problem in terms of work efficiency.
Further, the addition of the attaching tape and the attaching step has caused a problem in terms of manufacturing cost.
[0006]
[Patent Document 1]
JP-A-11-74417 (FIGS. 1 and 4)
[Patent Document 2]
JP 2001-185653 A (FIG. 6)
[0007]
[Problems to be solved by the invention]
As described above, in recent years, there has been a demand for a high-density wiring board as an interposer for a semiconductor package in order to cope with high speed and high integration of ICs. There has been a demand for a method of manufacturing a wiring board that can perform operations efficiently and has a low manufacturing cost.
The present invention corresponds to this, specifically, with a heat sledder capable of high-density wiring and efficiently and inexpensively manufacturing a build-up type wiring board with a heat sledder. It is an object of the present invention to provide a method of manufacturing a build-up type wiring board.
At the same time, an object of the present invention is to provide a build-up type wiring board with a heat spreader manufactured by such a manufacturing method.
[0008]
[Means for Solving the Problems]
According to the method of manufacturing a build-up type wiring board with a heat spreader of the present invention, a first wiring layer is formed by plating on one surface of a conductive substrate used as a power supply layer, and a wiring is further formed on the first wiring layer. Build-up in which one or more layers are formed via interlayer insulating layers (interlayer insulating layers), via connections are made between wiring layers, and heat spreaders are formed by etching the conductive substrate. A method for manufacturing a wiring board of a mold, a method for manufacturing a wiring board, provided on one surface of a conductive substrate used as a power supply layer, a plating-resistant resist having an opening in a wiring formation portion, as a plating mask, The first wiring layer is selectively formed by electrolytic plating, and after removing the resist, (a) an insulating layer for an interlayer insulating layer and a metal foil are laminated in this order on the entire surface so as to cover the wiring portion. Lamination process (B) a wiring portion forming step of forming a wiring portion by etching the laminated metal foil by a photo-etching method, and (c) a via hole for interlayer (wiring interlayer) connection by a laser if necessary. And forming a via hole portion in the formed via hole portion, performing electroplating using the conductive substrate as a power supply layer, and filling the electrolytic plating layer, in order. After performing according to the number of layers, a surface insulating layer is provided on the entire surface so as to cover the outermost wiring layer, and further, an external connection terminal formation region of the surface insulating layer is opened, and the conductive substrate is removed. Electroplating is performed as a power supply layer, an external connection terminal portion is formed in the opening of the surface insulating layer, and thereafter, the conductive substrate used as the power supply layer is selectively etched to form a remaining portion of the conductive substrate. With the frame It is characterized in that to form the heat spreader portion.
In the above, the first wiring layer has a four-layer structure in which a nickel layer, a copper layer, a nickel layer, and a gold layer are stacked in this order from the conductive substrate side, or a copper layer, a nickel layer, and a gold layer in this order. It has a laminated three-layer structure, and the conductive substrate is a copper substrate.
Further, in the above, the laminating step uses a metal foil provided with an insulating layer for an interlayer insulating layer on one surface, so that the insulating layer for the interlayer insulating layer covers the wiring layer,
An insulating layer for an interlayer insulating layer and a metal foil are laminated at a time.
Further, in the above, the metal foil used in the laminating step is a copper foil.
In the above, the laser is a YAG laser.
Further, in the above, the formation of the interlayer (interlayer wiring) via hole in the filling via forming step is characterized in that the via hole is formed by cover-coating with a DFR (drain film resist) or the like and is formed by a laser from above. is there.
In the above, the interlayer insulating layer is a polyimide resin.
In the above, the wiring board to be manufactured is a printed wiring board for a semiconductor package used as an interposer.
[0009]
Here, a wiring board formed by sequentially laminating wiring layers is referred to as a build-up type wiring board, and does not have a material equivalent to the core material 511 of the wiring board shown in FIG. Including.
[0010]
The build-up type wiring board with a heat spreader according to the present invention is configured such that a first wiring layer is formed by plating on one surface of a conductive substrate used as a power supply layer, and further a wiring layer is formed on the first wiring layer. Build-up type wiring in which at least one layer is formed via an interlayer insulating layer (wiring interlayer insulating layer), via connections are made between wiring layers, and a heat spreader portion is formed by etching the conductive substrate. A substrate, which is manufactured by the above-described method of manufacturing a build-up type wiring board with a heat spreader according to the present invention.
And in the above, it is a wiring board for a semiconductor package used as an interposer.
[0011]
[Action]
The method of manufacturing a build-up type wiring board with a heat spreader according to the present invention can achieve high-density wiring by adopting such a configuration, and efficiently and inexpensively a build-up type wiring board with a heat spreader. And a method of manufacturing a build-up type wiring board with a heat sledder capable of manufacturing the same.
As a result, it is possible to provide a build-up type wiring board with an inexpensive heat spreader that can be efficiently manufactured with high-density wiring.
In particular, this is more effective when the manufactured wiring board is a wiring board for a semiconductor package used as an interposer.
More specifically, by selectively forming the first wiring layer by electrolytic plating using a plating-resistant resist as a plating mask, it is possible to form wiring finely and with high precision. By forming wiring in multiple layers on the wiring layer and connecting vias between wiring layers, it is possible to realize a high-density wiring and to increase the degree of freedom in wiring layout.
A wiring layer formed on the first wiring layer is formed by laminating an insulating layer for an interlayer insulating layer and a metal foil and forming the via hole by a photo-etching method. This is to perform electroplating using a conductive substrate as a power supply layer to fill the openings and electrically connect the wiring layers, and it is easy to multi-layer wiring and the connection work between wiring layers, and high in reliability in terms of quality And make that work possible.
In addition, the conductive substrate used as the power supply layer is finally etched to form a heat sledder, whereby the heat sledder adding operation can be performed efficiently and the manufacturing cost can be reduced. .
[0012]
In addition, from the viewpoint of heat dissipation of the heat spreader, the conductive substrate is preferably a copper substrate. As the first wiring layer, the first wiring layer is formed of a nickel layer, a copper layer, and a nickel layer from the conductive substrate side. , A four-layer structure laminated in the order of a gold layer, or a three-layer structure laminated in the order of a copper layer, a nickel layer, and a gold layer. In addition, a structure capable of preventing diffusion between the gold layer and the copper layer can be obtained.
In the laminating step, a metal foil provided with an insulating layer for an interlayer insulating layer on one surface is used, so that the insulating layer for the interlayer insulating layer covers the wiring layer, an insulating layer for the interlayer insulating layer, When the metal foil is laminated at a time, the lamination itself can be a simple operation.
As a laser, a YAG laser is generally used, but a carbon dioxide laser or the like is also used.
Note that a via hole can be formed at once by a laser so as to penetrate a plurality of layers, so that it is not always necessary to form a via hole each time the wiring layer is configured.
In addition, the formation of an interlayer (interlayer wiring) via hole is usually performed by coating a cover with a DFR (drain film resist) or the like, and then forming a laser from above.
A stacked via structure can also be formed by penetrating a plurality of wiring layers with a laser.
In addition, as the interlayer insulating layer, a polyimide resin is preferable in terms of insulation, strength, chemical resistance, workability, and the like, but is not limited thereto.
For example, an epoxy resin or the like may be used.
[0013]
By adopting such a configuration, the build-up type wiring board with a heat spreader of the present invention can be manufactured efficiently and can provide an inexpensive build-up type wiring board with a heat spreader.
A stacked via structure can also be taken.
In particular, this is more effective when the manufactured wiring board is a wiring board for a semiconductor package used as an interposer.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a process diagram showing a part of the process of one example of an embodiment of a method of manufacturing a build-up type wiring board with a heat spreader according to the present invention, and FIG. 2 is a process diagram showing a process following FIG. FIG. 3 (a) (corresponding to FIG. 2 (j)) is a cross-sectional view of an example of an embodiment of a build-up type wiring board with a heat spreader according to the present invention, and FIG. FIG. 4 shows an example of a manufacturing process of a semiconductor package using a build-up type wiring board with a heat spreader according to the present invention.
FIGS. 1 and 2 show cross-sectional shapes of respective steps at positions corresponding to A2-A3 in FIG. 3B.
1 to 4, 110 is a conductive substrate, 115 is a heat spreader, 116 is a frame, 117 is a suspension lead, 120 is a first wiring layer (also simply called wiring), and 130 is an insulating layer (also called an interlayer insulating layer). 135, an insulating layer (also referred to as a surface insulating layer), 136, an opening, 140A a metal foil, 140, a second wiring layer (also simply referred to as wiring), 150, a cover coat layer, 155, a via hole, and 160, a via hole. A filled via, 170 is an external connection terminal, 180 is a semiconductor chip, 181 is a terminal, 185 is a bonding wire, and 190 is a sealing resin (potting resin).
[0015]
Hereinafter, an example of an embodiment of a method of manufacturing a build-up type wiring board with a heat spreader according to the present invention will be described with reference to FIG.
In the method of manufacturing a build-up type wiring board with a heat spreader of the present example, a first wiring layer is formed by plating on one surface of a conductive substrate 110 used as a power supply layer, and further, on the first wiring layer, One wiring layer is formed via an interlayer insulating layer (interlayer insulating layer) to form two wiring layers, via connections are made between wiring layers, and a heat spreader portion is formed by etching the conductive substrate. This is a method for manufacturing a wiring board for manufacturing a build-up type wiring board for a semiconductor package as an interposer, which is formed by using the above method.
First, the first wiring layer 120 is selectively formed using a plating-resistant resist (not shown) provided on one surface of the conductive substrate 110 used as a power supply layer and having an opening in a wiring formation portion as a plating mask. Is formed by electroplating, and the resist is removed. (FIG. 1 (a))
As the conductive substrate 110, a copper substrate is preferable from the viewpoint of heat dissipation.
Since the first wiring layer is formed by selective electrolytic plating using a resist pattern formed by a photolithography method as a mask, finer wiring and higher definition can be provided for the first wiring layer.
As the first wiring layer, a four-layer structure in which a nickel layer, a copper layer, a nickel layer, and a gold layer are stacked in this order from the conductive substrate side, or a three-layer structure in which a copper layer, a nickel layer, and a gold layer are stacked in that order Those having a layer structure are mentioned as preferable structures that can prevent diffusion between the gold layer and the copper layer.
Next, an insulating layer 130 for an interlayer insulating layer and a metal foil 140A are laminated in this order on the entire surface so as to cover the first wiring layer 120. (FIG. 1 (b))
The insulating layer 130 and the metal foil 140A may be laminated in this order, but a metal foil having an insulating layer 130 for an interlayer insulating layer on one surface is used, and the insulating layer 130 for the interlayer insulating layer is formed of a first wiring. Laminating the insulating layer 130 for the interlayer insulating layer and the metal foil 120 at one time so as to cover the layer 120 and laminating at one time simplifies the work of the laminating step.
Examples of the lamination method include vacuum lamination and hot pressing.
As the metal foil 140A, a single-layer rolled copper foil is generally used, but an electrolytic copper foil may also be used, and a foil having a thickness of 3 to 18 μm is generally used.
As the insulating layer 130 for the wiring interlayer insulating layer, a polyimide resin is preferable in terms of insulating properties, strength, chemical resistance, workability, and the like, but is not limited thereto.
[0016]
Next, the laminated metal foil 140A is etched by a photoetching method to form the second wiring layer 140. (Fig. 1 (c))
Using a dry film resist or a liquid resist, predetermined pattern exposure and development are performed to form a resist pattern (not shown) on the metal foil 140A, and etching is performed using the resist pattern as an etching resistant mask.
The etchant to be used is appropriately selected and determined according to the material of the metal foil.
For example, it is performed by spray etching or the like using an iron chloride solution, a copper chloride solution, copper selective etching or the like.
[0017]
Next, the entire upper surface of the wiring layer is covered with the cover coat layer 150, and an interlayer via hole 155 for electrically connecting the first wiring layer and the second wiring layer is formed thereon by using a laser. . (Fig. 1 (d))
Examples of the cover coat layer 150 include DFR (dray film resist).
Next, the formed via hole 155 is subjected to electrolytic plating using the conductive substrate 140A as a power supply layer, and is filled with the electrolytic plated layer to form a filled via 160. (Fig. 1 (e))
Further, the cover coat layer 150 is removed. (Fig. 1 (f))
[0018]
Next, a surface insulating layer 135 is provided on the entire surface so as to cover the second wiring layer 140 (FIG. 2G). Further, an external connection terminal forming region of the surface insulating layer 135 is opened (FIG. h)), electrolytic plating is performed using the conductive substrate 110 as a power supply layer, and an external connection terminal portion 170 is formed in the opening 136 of the surface insulating layer 135. (FIG. 2 (i))
The external connection terminal portion 1 includes a main layer having a copper plating layer and two layers of nickel and copper or three layers of gold, nickel and copper from the front side.
[0019]
Next, the conductive substrate 110 used as the power supply layer is selectively etched to form a heat spreader portion 115 together with the frame portion 116 on the remaining portion of the conductive substrate 110.
The conductive substrate 110 is formed by a photoetching method using an iron chloride solution or the like as an etching solution, and after etching, a resist used as an etching resistant mask is removed. (FIG. 2 (i))
Thus, a build-up type wiring board with a heat spreader can be manufactured.
[0020]
As another embodiment of the method of manufacturing a build-up type wiring board with a heat spreader according to the present invention, a series of steps for forming the second wiring layer 140 and forming the filling via 160 in the above-described embodiment is described. Is performed one or more times, and three or more wiring layers are provided.
In this embodiment, it is not necessary to form a via every time the second and subsequent wiring layers are formed.
In some cases, they can be performed collectively.
[0021]
Next, an embodiment of a build-up type wiring board with a heat spreader according to the present invention will be briefly described with reference to FIG.
This example corresponds to FIG. 2 (j) manufactured by the manufacturing method of the embodiment of the steps shown in FIGS. 1 and 2. In this example, a wiring layer is formed on an interlayer insulating layer on a first wiring layer. One layer is formed via a (wiring interlayer insulating layer), and via layers are connected between the wiring layers. The wiring layer is a two-layer build-up type wiring board for a semiconductor package as an interposer (FIG. 3A). This is a wiring substrate formed by etching a conductive substrate (corresponding to 110 in FIGS. 1 and 2) used as a power supply layer when the heat spreader portion 115 is manufactured.
Since the material of each part has been described above, the description is omitted here.
The heat spreader 115 is integrally connected to the frame 116 by suspension leads 117 as shown in FIG.
In the build-up type wiring board with a heat spreader of this example, for example, as shown in FIG. 4A, the insulating layers 130 and 135 on the side other than the heat spreader portion 115 side are formed in a region for mounting a semiconductor chip. After mounting the semiconductor chip 180 on the wiring portion 120b formed on the heat spreader portion 115 of the first wiring layer 120 with the side of the terminal 181 facing up (FIG. 4B), Both sides are resin-sealed by potting or the like. (FIG. 4 (c))
An epoxy resin or the like is used as the sealing resin.
There are various shapes of the wiring portion, and examples thereof include those having a linear shape and the same shape as a heat spreader.
[0022]
The embodiment shown in FIG. 4A is also an embodiment of the build-up type wiring board with a heat spreader of the present invention.
Of course, as a modified example, a wiring board shown in FIGS. 3A and 4A with three or more wiring layers may be used.
[0023]
【Example】
In the embodiment, the method of manufacturing the build-up type wiring board with the heat sledder of the embodiment shown in FIGS. 1 and 2 is carried out, and is shown in FIG. 3 (a) (corresponding to FIG. 2 (j)). This is a fabrication of a build-up type wiring board with a heat sledder.
A description will be given based on FIGS.
As the conductive substrate 110, 0. Using a 25 mm-thick rolled copper plate (EFTEC64T manufactured by Furukawa Electric Co., Ltd.), a plating resist (THB-120N manufactured by JSR) is patterned on one surface of the conductive substrate 110 according to the wiring shape of the first wiring layer. After that, a first wiring layer in which a copper layer, a nickel layer, and a gold layer are sequentially formed to a thickness of 7 μm, 2 μm, and 1 μm, respectively, is selectively plated by electrolytic plating, and then the resist is removed. did. (FIG. 1 (a))
Next, a laminated material obtained by laminating a 25 μm-thick insulating layer and a 3 μm-thick electrolytic copper foil for wiring interlayer insulation made of a polyimide resin, covering the first wiring layer 120 with the insulating layer as the conductive substrate side. The substrate was treated at 180 ° C. for 60 minutes with a hot press, and laminated on the entire surface. (FIG. 1 (b))
Next, an etching-resistant resist pattern is formed according to the wiring shape to be formed on the laminated copper foil 140A, and the copper foil 140A is spray-etched with a ferric chloride solution using the resist pattern as a mask to form a wiring. Formed.
As the resist, DFR (dry film resist, NIT-225 manufactured by Nichigo Moton Co., Ltd.) having a thickness of 25 μm was used.
Next, after the resist was removed (FIG. 1C), DFR (dry film resist, NIT-225 manufactured by Nichigo Moton Co., Ltd.) was used as the cover coat layer 150, and the UV-YAG laser was applied thereon. Was irradiated to form a via hole 155. (Fig. 1 (d))
The via diameter was 70 μm.
Next, electrolytic copper plating was performed using the conductive substrate 110 as a power supply layer to fill a via hole, thereby forming a filled via. (Fig. 1 (e))
Next, after removing the cover coat layer 150 (FIG. 1F), a solder resist (AUS402 manufactured by Taiyo Ink Mfg. Co., Ltd.) was applied to a thickness of 30 μm (FIG. 2G) to form external connection terminals. The region was opened with a diameter of 150 μm. (FIG. 2 (h))
Next, using the conductive substrate 110 as a power supply layer, electrolytic copper plating was performed to form main portions of external connection terminals, and further, nickel plating and gold plating were performed on the surface layer. (FIG. 2 (i)) Thereafter, the conductive substrate 110 used as the power supply layer was selectively etched to form a heat spreader portion 115 together with the frame portion 116 on the remaining portion of the conductive substrate. (FIG. 2 (j))
Using a resist pattern in which DFR (dry film resist, NIT-225 manufactured by Nichigo Moton Co., Ltd.) having a thickness of 40 μm was formed in a predetermined shape as an etching resistant mask, spray etching was performed using a ferric chloride solution.
[0024]
After a build-up type wiring board with a heat threader shown in FIG. 3A (corresponding to FIG. 2J) was manufactured in this manner, the semiconductor chip was further irradiated with a UV-YAG laser. The mounting-side insulating layer (solder resist 135, polyimide resin 130) is removed until the first wiring layer 120 is reached (FIG. 4A), and a semiconductor chip 180 is mounted on that portion, and wire bonding is performed. This was performed (FIG. 4 (b)), sealed with a resin (FIG. 4 (c)), and mounted on a motherboard, but there was no particular problem, and a good heat radiation effect was exhibited.
[0025]
【The invention's effect】
As described above, the present invention provides a build-up type wiring board with a heat sledder capable of producing a high-density wiring and efficiently and inexpensively manufacturing a build-up type wiring board with a heat sledder. It has become possible to provide a manufacturing method for
As a result, it has become possible to provide a build-up type wiring board with a high-density wiring, which can be efficiently manufactured, and has an inexpensive heat spreader.
[Brief description of the drawings]
FIG. 1 is a process diagram showing a part of a process of an example of an embodiment of a method of manufacturing a build-up type wiring board with a heat spreader according to the present invention.
FIG. 2 is a process chart showing a step following FIG. 1;
FIG. 3A is a cross-sectional view of an embodiment of a build-up type wiring board with a heat spreader according to the present invention, and FIG. 3B is a frame and a heat spreader as viewed from the direction A1 thereof. It is the figure which showed one example of the shape of the part.
FIG. 4 is an example of a manufacturing process of a semiconductor package using a build-up type wiring board with a heat spreader of the present invention.
FIG. 5 is a process sectional view illustrating one example of a method for manufacturing a build-up wiring board.
[Explanation of symbols]
110 Conductive substrate 115 Heat spreader 116 Frame 117 Suspended lead 120 First wiring layer (also referred to simply as wiring)
130 Insulating layer (also called interlayer insulating layer)
135 Insulating layer (also called surface insulating layer)
136 Opening 140A Metal foil 140 Second wiring layer (also simply referred to as wiring)
150 Cover coat layer 155 Via hole 160 Filled via 170 External connection terminal section 180 Semiconductor chip 181 Terminal 185 Bonding wire 190 Sealing resin (potting resin)

Claims (10)

A first wiring layer is formed by plating on one surface of a conductive substrate used as a power supply layer, and a wiring layer is further formed on the first wiring layer via an interlayer insulating layer (wiring interlayer insulating layer). A method of manufacturing a wiring board for forming a build-up type wiring board formed as above, connecting vias between wiring layers, and further forming a heat spreader portion by etching the conductive substrate. The first wiring layer is selectively formed by electroplating using a plating-resistant resist provided on one surface of a conductive substrate used as a power supply layer and having an opening in a wiring formation portion as a plating mask, After removing the resist, (a) a laminating step of laminating an insulating layer for an interlayer insulating layer and a metal foil in this order on the entire surface so as to cover the wiring portion, and (b) a photo-etching method of the laminated metal foil. Etching by A wiring forming step of forming a line portion,
(C) If necessary, a via hole for interlayer (interlayer wiring) connection is formed by a laser, and the formed via hole portion is subjected to electrolytic plating using the conductive substrate as a power supply layer to fill the electrolytic plated layer. Filling via forming step and, in order, after performing a series of circuit forming processing according to the number of wiring layers to be formed, a surface insulating layer is provided on the entire surface so as to cover the outermost wiring layer, Further, an external connection terminal forming region of the surface insulating layer is opened, electrolytic plating is performed using the conductive substrate as a power supply layer, and an external connection terminal portion is formed in the opening of the surface insulating layer. Manufacturing a build-up type wiring board with a heat spreader, characterized in that the conductive substrate used as a substrate is selectively etched to form a heat spreader part together with a frame part in the remaining part of the conductive substrate. . The first wiring layer according to claim 1, wherein the first wiring layer has a four-layer structure in which a nickel layer, a copper layer, a nickel layer, and a gold layer are stacked in this order from the conductive substrate side, or a copper layer, a nickel layer, and a gold layer in that order. A method of manufacturing a build-up type wiring board with a heat spreader, wherein the wiring board has a three-layer structure and the conductive substrate is a copper substrate. 3. The laminating step according to claim 1, wherein the laminating step uses a metal foil provided with an insulating layer for an interlayer insulating layer on one surface, and the insulating layer for the interlayer insulating layer covers a wiring layer. A method of manufacturing a build-up type wiring board with a heat spreader, wherein an insulating layer for use and a metal foil are laminated at one time. 4. The method for manufacturing a build-up type wiring board with a heat spreader according to claim 1, wherein the metal foil used in the laminating step is a copper foil. 5. The method according to claim 1, wherein the laser is a YAG laser. In the first to fifth aspects, the formation of the interlayer (interlayer wiring) via hole in the filling via forming step is performed by covering with a DFR (drain film resist) or the like, and forming the via hole with a laser. A method for manufacturing a build-up type wiring board with a heat spreader. 7. The method for manufacturing a build-up type wiring board with a heat spreader according to claim 1, wherein the interlayer insulating layer is a polyimide resin. 8. The method for manufacturing a build-up type wiring board with a heat spreader according to claim 1, wherein the wiring board to be manufactured is a printed wiring board for a semiconductor package used as an interposer. A first wiring layer is formed by plating on one surface of a conductive substrate used as a power supply layer, and one wiring layer is further formed on the first wiring layer via an interlayer insulating layer (interlayer insulating layer). 8. A build-up type wiring board formed as described above, connecting via layers between wiring layers, and further forming a heat spreader portion by etching the conductive substrate. A build-up type wiring board with a heat spreader, which is manufactured by the manufacturing method of (1). The build-up type wiring board with a heat spreader according to claim 9, wherein the wiring board is a wiring board for a semiconductor package used as an interposer.

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