CN114173495A - Method for manufacturing multilayer flexible circuit board - Google Patents
Method for manufacturing multilayer flexible circuit board Download PDFInfo
- Publication number
- CN114173495A CN114173495A CN202111477632.3A CN202111477632A CN114173495A CN 114173495 A CN114173495 A CN 114173495A CN 202111477632 A CN202111477632 A CN 202111477632A CN 114173495 A CN114173495 A CN 114173495A
- Authority
- CN
- China
- Prior art keywords
- layer flexible
- board
- semi
- finished product
- flexible board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title abstract description 5
- 239000010410 layer Substances 0.000 claims abstract description 72
- 239000011265 semifinished product Substances 0.000 claims abstract description 26
- 238000005452 bending Methods 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 238000005553 drilling Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 238000001465 metallisation Methods 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 4
- 239000011241 protective layer Substances 0.000 claims abstract description 4
- 230000008719 thickening Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000047 product Substances 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention provides a method for manufacturing a multilayer flexible circuit board, which comprises the following steps: step 1: manufacturing an inner-layer flexible board, and attaching covering films to the upper surface and the lower surface of the inner-layer flexible board; step 2: manufacturing a first outer-layer flexible plate and a second outer-layer flexible plate, and carrying out depth control UV laser on the bending areas of the first outer-layer flexible plate and the second outer-layer flexible plate; and step 3: pressing and curing the first outer-layer flexible board, the inner-layer flexible board and the second outer-layer flexible board to obtain a semi-finished product of the multilayer flexible circuit board; and 4, step 4: drilling the semi-finished product; and 5: carrying out hole and surface metallization and thickening copper plating on the semi-finished product; step 6: manufacturing an outer layer circuit aiming at the semi-finished product and removing a protective layer of the bending area; and 7: and (4) sticking and pressing covering films on the upper surface and the lower surface of the semi-finished product to obtain the multilayer flexible circuit board with the bending requirement. The invention has the beneficial effects that the product design capacity, the production and manufacturing efficiency and the product quality yield can be effectively improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a manufacturing method of a multilayer flexible circuit board.
Background
The existing manufacturing process for the area of the multilayer flexible board needing to be bent in the industry generally adopts a mode of sticking an adhesive tape to protect the area needing to be bent, and along with the design of electronic products, the area needing to be bent is smaller, more and irregular, and the manufacturing process can not meet the requirements of product design, production efficiency and quality yield.
Disclosure of Invention
The invention provides a method for manufacturing a multilayer flexible circuit board, which comprises the following steps:
step 1: manufacturing an inner-layer flexible board, and attaching covering films to the upper surface and the lower surface of the inner-layer flexible board;
step 2: manufacturing a first outer-layer flexible plate and a second outer-layer flexible plate which are matched with the designed areas needing to be bent, and carrying out depth-controlled UV laser on the areas needing to be bent of the first outer-layer flexible plate and the second outer-layer flexible plate;
and step 3: placing the inner-layer flexible board between the first outer-layer flexible board and the second outer-layer flexible board, and pressing and curing the first outer-layer flexible board, the inner-layer flexible board and the second outer-layer flexible board to obtain a semi-finished product of the multilayer flexible circuit board;
and 4, step 4: drilling the semi-finished product;
and 5: carrying out hole and surface metallization and thickening copper plating on the semi-finished product;
step 6: manufacturing an outer layer circuit aiming at the semi-finished product and removing a protective layer of the bending area;
and 7: and (4) sticking and pressing covering films on the upper surface and the lower surface of the semi-finished product to obtain the multilayer flexible circuit board with the bending requirement.
As a further improvement of the present invention, in the step 3, the first outer layer flexible board, the inner layer flexible board and the second outer layer flexible board are bonded by using an adhesive, and the first outer layer flexible board, the inner layer flexible board and the second outer layer flexible board are pressed and cured to obtain a semi-finished product of the multilayer flexible circuit board.
As a further improvement of the present invention, in the step 4, the semi-finished product is subjected to numerical control drilling.
The invention has the beneficial effects that: the invention can effectively improve the product design capability, the production and manufacturing efficiency and the product quality yield.
Drawings
Fig. 1 is a schematic structural view of a multilayer flexible wiring board of the present invention.
Detailed Description
As shown in fig. 1, the multilayer flexible wiring board of the present invention includes an inner layer flexible board including a first inner layer flexible board S2 and a second inner layer flexible board S3, a first outer layer flexible board S1, a second outer layer flexible board S4, and a cover film COV.
The invention discloses a method for manufacturing a multilayer flexible circuit board, which comprises the following steps:
step 1: manufacturing an inner-layer flexible board, and attaching and pressing covering films COV to the upper surface and the lower surface of the inner-layer flexible board;
step 2: manufacturing a first outer-layer flexible plate S1 and a second outer-layer flexible plate S4 which are matched with the designed areas needing to be bent, and carrying out depth-controlled UV laser on the areas needing to be bent of the first outer-layer flexible plate S1 and the second outer-layer flexible plate S4;
and step 3: placing the inner-layer flexible board between the first outer-layer flexible board S1 and the second outer-layer flexible board S4, and pressing and curing the first outer-layer flexible board S1, the inner-layer flexible board and the second outer-layer flexible board S4 to obtain a semi-finished product of the multilayer flexible circuit board;
and 4, step 4: drilling the semi-finished product;
and 5: carrying out hole and surface metallization and thickening copper plating on the semi-finished product;
step 6: manufacturing an outer layer circuit aiming at the semi-finished product and removing a protective layer of the bending area;
and 7: and (4) sticking and pressing covering films COV on the upper surface and the lower surface of the semi-finished product to obtain the multilayer flexible circuit board with the bending requirement.
In the step 3, the first outer layer flexible board material S1, the inner layer flexible board material and the second outer layer flexible board material S4 are bonded by using adhesive glue, and the first outer layer flexible board material S1, the inner layer flexible board material and the second outer layer flexible board material S4 are pressed and cured to obtain a semi-finished product of the multilayer flexible circuit board.
In the step 4, the semi-finished product is subjected to numerical control drilling.
The invention can effectively improve the product design capability, the production and manufacturing efficiency and the product quality yield.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (3)
1. A manufacturing method of a multilayer flexible circuit board is characterized by comprising the following steps:
step 1: manufacturing an inner-layer flexible board, and attaching covering films to the upper surface and the lower surface of the inner-layer flexible board;
step 2: manufacturing a first outer-layer flexible plate and a second outer-layer flexible plate which are matched with the designed areas needing to be bent, and carrying out depth-controlled UV laser on the areas needing to be bent of the first outer-layer flexible plate and the second outer-layer flexible plate;
and step 3: placing the inner-layer flexible board between the first outer-layer flexible board and the second outer-layer flexible board, and pressing and curing the first outer-layer flexible board, the inner-layer flexible board and the second outer-layer flexible board to obtain a semi-finished product of the multilayer flexible circuit board;
and 4, step 4: drilling the semi-finished product;
and 5: carrying out hole and surface metallization and thickening copper plating on the semi-finished product;
step 6: manufacturing an outer layer circuit aiming at the semi-finished product and removing a protective layer of the bending area;
and 7: and (4) sticking and pressing covering films on the upper surface and the lower surface of the semi-finished product to obtain the multilayer flexible circuit board with the bending requirement.
2. The manufacturing method according to claim 1, wherein in the step 3, the first outer layer flexible board, the inner layer flexible board and the second outer layer flexible board are bonded by using an adhesive, and the first outer layer flexible board, the inner layer flexible board and the second outer layer flexible board are pressed and cured to obtain a semi-finished product of the multilayer flexible circuit board.
3. The manufacturing method according to claim 1, wherein in the step 4, the semi-finished product is subjected to numerical control drilling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111477632.3A CN114173495A (en) | 2021-12-06 | 2021-12-06 | Method for manufacturing multilayer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111477632.3A CN114173495A (en) | 2021-12-06 | 2021-12-06 | Method for manufacturing multilayer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114173495A true CN114173495A (en) | 2022-03-11 |
Family
ID=80483371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111477632.3A Pending CN114173495A (en) | 2021-12-06 | 2021-12-06 | Method for manufacturing multilayer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114173495A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040084447A (en) * | 2003-03-28 | 2004-10-06 | 영풍전자 주식회사 | Method for making inner-layer window-open part of multi-layer flexible printed circuit board |
| CN101193503A (en) * | 2006-11-30 | 2008-06-04 | 比亚迪股份有限公司 | A making method for multi-layer flexible circuit board |
| CN102740582A (en) * | 2011-04-06 | 2012-10-17 | 日本梅克特隆株式会社 | Multilayer printed wiring board and producing method thereof |
| CN103281859A (en) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | Rigid-flex combined circuit board and manufacturing method therefore |
| KR20140040971A (en) * | 2012-09-27 | 2014-04-04 | 삼성전기주식회사 | Manufacturing method of rigid flexible printed circuit board |
| CN105578704A (en) * | 2014-10-13 | 2016-05-11 | 富葵精密组件(深圳)有限公司 | Multilayer flexible circuit board and manufacturing method thereof |
| CN106031309A (en) * | 2015-01-16 | 2016-10-12 | 日本梅克特隆株式会社 | Flexible printed circuit board and method for manufacturing flexible printed circuit board |
| CN111182715A (en) * | 2020-02-12 | 2020-05-19 | 福建世卓电子科技有限公司 | Multilayer flexible circuit board with partially exposed inner layer and production process |
-
2021
- 2021-12-06 CN CN202111477632.3A patent/CN114173495A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040084447A (en) * | 2003-03-28 | 2004-10-06 | 영풍전자 주식회사 | Method for making inner-layer window-open part of multi-layer flexible printed circuit board |
| CN101193503A (en) * | 2006-11-30 | 2008-06-04 | 比亚迪股份有限公司 | A making method for multi-layer flexible circuit board |
| CN102740582A (en) * | 2011-04-06 | 2012-10-17 | 日本梅克特隆株式会社 | Multilayer printed wiring board and producing method thereof |
| KR20140040971A (en) * | 2012-09-27 | 2014-04-04 | 삼성전기주식회사 | Manufacturing method of rigid flexible printed circuit board |
| CN103281859A (en) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | Rigid-flex combined circuit board and manufacturing method therefore |
| CN105578704A (en) * | 2014-10-13 | 2016-05-11 | 富葵精密组件(深圳)有限公司 | Multilayer flexible circuit board and manufacturing method thereof |
| CN106031309A (en) * | 2015-01-16 | 2016-10-12 | 日本梅克特隆株式会社 | Flexible printed circuit board and method for manufacturing flexible printed circuit board |
| CN111182715A (en) * | 2020-02-12 | 2020-05-19 | 福建世卓电子科技有限公司 | Multilayer flexible circuit board with partially exposed inner layer and production process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104519682B (en) | Semi-flexible wiring board and preparation method thereof | |
| CN101695217B (en) | Method for producing printed board combining rigidness and flexibleness | |
| TWI407865B (en) | Method for manufacturing rigid-flexible printed circuit board | |
| US9210811B2 (en) | Compact rigid-flexible printed circuit board and method for manufacturing same | |
| CN110769598B (en) | Embedded circuit board and manufacturing method thereof | |
| WO2020093400A1 (en) | Rigid-flex circuit board and manufacturing method therefor | |
| CN102340933B (en) | Manufacturing method of circuit board | |
| CN110049632B (en) | Embedded flexible circuit board and manufacturing method thereof | |
| CN110662342B (en) | Rigid-flex board and manufacturing method thereof | |
| CN114340156A (en) | Manufacturing method of PET material die cutting process flexible single panel | |
| CN107835561B (en) | Circuit board containing electromagnetic wave shielding film and manufacturing method thereof | |
| CN101399248A (en) | Wiring substrate and method of manufacturing the same | |
| CN114173495A (en) | Method for manufacturing multilayer flexible circuit board | |
| CN110753447A (en) | Embedded circuit board and manufacturing method thereof | |
| CN110740564B (en) | Processing method of dense network multilayer printed circuit board | |
| CN109890132B (en) | Multilayer flexible circuit board for shielding signal line and manufacturing method thereof | |
| CN109152223B (en) | Manufacturing method of rigid-flex board | |
| CN101547573B (en) | Method for manufacturing circuit board with offset structure | |
| CN114173494A (en) | Method for manufacturing multilayer flexible circuit board with inner layer needing to be pasted | |
| CN110972413A (en) | Composite circuit board and manufacturing method thereof | |
| TWI393494B (en) | Substrate strip with wiring and method for fabricating the same | |
| KR20050031288A (en) | Structure for joining and manufacturing method of flexible printed circuit board | |
| CN109688734B (en) | Processing technology for preventing soft and hard combined plate from being bent and torn | |
| CN105848418B (en) | A kind of flexible circuit board for carrying Type-C interfaces and preparation method thereof | |
| JPH0936499A (en) | Epoxy based flexible printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |