CN110809376A - Process flow for replacing HDI plate back drill - Google Patents
Process flow for replacing HDI plate back drill Download PDFInfo
- Publication number
- CN110809376A CN110809376A CN201911003389.4A CN201911003389A CN110809376A CN 110809376 A CN110809376 A CN 110809376A CN 201911003389 A CN201911003389 A CN 201911003389A CN 110809376 A CN110809376 A CN 110809376A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a process flow for replacing a back drill of an HDI (high density interconnect) plate, in particular to a process flow for replacing a traditional HDI plate through hole and back drill by adopting a method of increasing butt joint of a blind hole by adopting a buried hole and a non-back drill surface. The method comprises the following steps: providing a multilayer board, wherein the multilayer board comprises 2 outer metal layers and 2m inner circuit layers, m buried holes penetrating the 2m layers are formed in the multilayer board, the 2m inner circuit layers are connected through one buried hole, and m is an integer greater than 1; CAP electroplating treatment is respectively carried out on the non-back drilling surfaces of the first buried hole and the second buried hole; and respectively manufacturing 1 metallized blind hole on the non-back drilling surface of the first buried hole and the non-back drilling surface of the second buried hole, wherein the first outer layer metallized blind hole of the first surface is used for connecting the first outer layer metal layer and the 1 st layer inner layer circuit layer, and the second outer layer metallized blind hole of the second surface is used for connecting the second outer layer metal layer and the 2m layer inner layer circuit layer. The method replaces the HDI plate back drilling process flow to solve the problems of deviation, over-depth and over-shallow of the traditional HDI plate back drilling hole.
Description
Technical Field
The invention relates to the technical field of HDI plate back drilling technology, in particular to a technological process for replacing HDI plate back drilling.
Background
With the development of the communication industry to the 5G era, communication signals are enhanced, the communication speed is increased, and the corresponding server PCB must meet the requirements of high frequency and high speed. In the manufacturing of the multilayer board, in order to reduce the interference of the register capacitor, a back drilling process is needed to remove the redundant bonding pads on the back of the impedance line. The traditional back drilling process is characterized in that when a drilling machine drills down by a drill point, micro-current generated when the drill point contacts a copper foil on the surface of a substrate senses the height position of the substrate surface, then the drilling is carried out according to the set drilling depth, and the drilling is stopped when the drilling depth is reached. The back drilling has high requirements on the precision and depth control of the drilling machine, the common drilling machine cannot meet the requirements of high-precision products, and the problems of open circuit or short circuit of a circuit board caused by drilling deviation, over-deep drilling or over-shallow drilling easily occur. Moreover, when the aperture is small and the dielectric layer is thin, the conventional back-drilling process cannot be performed, so a new manufacturing process needs to be developed to meet the market demand.
Disclosure of Invention
The invention provides a process flow for replacing HDI plate back drilling, which has no back drilling process and thoroughly solves the problems of drilling deviation, over-depth and over-shallow of the traditional back drilling hole.
In order to achieve the above purpose, the following technical solutions are provided.
A process flow for replacing a HDI plate back drill is a process flow for replacing a traditional HDI plate through hole and back drill by adopting a method of increasing butt joint of blind holes by adopting a buried hole and a non-back drill surface. The method for replacing the HDI board back drilling process flow adopts the method of increasing the blind hole butt joint by the buried hole and the non-back drilling surface without back drilling operation to manufacture the insulating layer and the conducting layer of the HDI board multilayer board, is used for replacing the HDI board back drilling process flow, greatly simplifies the process flow, improves the production efficiency, solves the problems of partial drilling, over-depth drilling and over-shallow drilling easily occurring in the traditional back drilling, and effectively ensures the stable quality of the circuit board.
Further, the process flow for replacing the HDI plate back drilling specifically comprises the following steps,
s1: providing a multilayer board, wherein the multilayer board comprises 2 outer metal layers and 2m inner circuit layers, m buried holes penetrating the 2m layers are formed in the multilayer board, the 2m inner circuit layers are connected through one buried hole, and m is an integer greater than 1;
s2: respectively carrying out CAP electroplating treatment on the non-back drilling surfaces of the first buried hole and the second buried hole, wherein the CAP electroplating is cover plate electroplating;
s3: and respectively manufacturing 1 metallized blind hole on the non-back drilling surface of the first buried hole and the non-back drilling surface of the second buried hole, wherein the first outer layer metallized blind hole of the first surface is used for connecting the first outer layer metal layer and the 1 st layer inner layer circuit layer, and the second outer layer metallized blind hole of the second surface is used for connecting the second outer layer metal layer and the 2m layer inner layer circuit layer.
Further, the method for manufacturing a multilayer board according to the above step S1 includes,
s1.1: the manufacturing method of the 2m inner layer circuit layer comprises the steps of stacking the 2m inner layer circuit layers in sequence, then carrying out first pressing, manufacturing m through holes on the pressed inner layer circuit board, and forming m buried holes in the multilayer board by the m through holes;
s1.2: and respectively placing the first outer metal layer and the second outer metal layer on two sides of the 2m inner circuit layer, and performing second pressing to form the multilayer board.
Further, the manufacturing of the 2m inner layer circuit layer in the step S1.1 further includes manufacturing of inner layer metalized blind holes, wherein 1 metalized blind hole is respectively manufactured on two sides of the laminated inner layer circuit layer, the first inner layer metalized blind hole on the first surface is used for the 1 st inner layer circuit layer and the 2 nd inner layer circuit layer of the inner layer circuit layer, and the second inner layer metalized blind hole on the second surface is used for connecting the 2m inner layer circuit layer and the 2m-1 th inner layer circuit layer.
Further, m through holes in the 2m inner layer circuit layer in the step S1.1 are manufactured by a mechanical drilling method, and after drilling is completed, the through holes are sequentially subjected to hole filling electroplating and resin hole plugging by a conventional manufacturing method.
Further, the method for manufacturing a multilayer board in the step S1 further includes manufacturing a third outer layer plated-through hole and a fourth outer layer plated-through hole on two sides of the outer layer board, where the third outer layer plated-through hole and the fourth outer layer plated-through hole are respectively communicated with the first inner layer plated-through hole and the second inner layer plated-through hole.
Further, the method for manufacturing a multilayer board in step S1 further includes manufacturing a through hole on the multilayer board by using a mechanical drilling method, and performing hole filling electroplating and resin hole plugging on the through hole in sequence by using a conventional manufacturing method after the drilling is completed.
Furthermore, after the through hole is subjected to hole filling electroplating and resin hole plugging, CAP electroplating treatment is respectively carried out on two ends of the through hole.
Furthermore, the metallized blind holes are metallized after laser drilling.
Further, the process flow of replacing the HDI plate back drilling comprises the steps of material cutting to pressing → laser drilling → mechanical drilling → hole filling electroplating → resin plug hole → CAP electroplating → outer layer → external inspection → pressing → laser drilling → mechanical drilling → hole filling electroplating → resin plug hole → CAP electroplating → outer layer circuit → external inspection → solder mask → post process.
Compared with the prior art, the process flow for replacing the HDI plate back drill has the following beneficial effects:
compared with the conventional HDI board back drilling process, the process flow has the advantages that the back drilling process is reduced, the process is greatly simplified, and the production efficiency is improved;
secondly, the quality is high, the insulating layer and the conducting layer of the HDI board multilayer board can be manufactured by adopting a method of increasing blind hole butt joint by adopting a buried hole and a non-back drilling surface without back drilling operation in the process flow of replacing HDI board back drilling, the problems of easy drilling deviation, excessive depth and excessive shallow of the traditional back drilling are solved, and the stable quality of the circuit board is effectively ensured;
thirdly, the process flow of the HDI board back drilling replaced by the method disclosed by the invention does not need a back drilling process, the problems of inclined drilling, over-depth and over-shallow of the traditional back drilling are solved, the stable quality of the circuit board is effectively ensured, the product yield is improved, the production cost is reduced, and the product market competitiveness is improved.
Drawings
FIG. 1 is a superposed view of an HDI plate in the process flow of replacing the HDI plate back drilling.
Detailed Description
The process flow of the present invention for replacing the HDI board back drilling will be described in further detail with reference to the following embodiments and the accompanying drawings.
Referring to fig. 1, a process flow for replacing the HDI board back drilling includes the steps of material cutting to pressing → laser drilling → mechanical drilling → hole filling electroplating → resin hole filling → CAP electroplating → outer layer → external inspection → pressing → laser drilling → mechanical drilling → hole filling electroplating → resin hole filling → CAP electroplating → outer layer circuit → external inspection → anti-soldering → post process.
The process flow for replacing the HDI plate back drilling specifically comprises the following steps,
s1: providing a multilayer board, wherein the multilayer board comprises 2 outer metal layers and 2m inner circuit layers, m buried holes penetrating the 2m layers are formed in the multilayer board, the 2m inner circuit layers are connected through one buried hole, m is an integer larger than 1,
the manufacturing method of the multilayer board comprises the following steps,
s1.1: 2m inner layer circuit layer, including, 2m inner layer circuit layer is stacked in turn and then is pressed for the first time, m through holes 1,2, … …, m are made on the inner layer circuit board after being pressed, mechanical drilling mode is adopted for making, after drilling is finished, conventional making mode is adopted for filling hole and electroplating and resin hole plugging to the through holes in turn, the m through holes form m buried holes in the multilayer board, a copper-free PAD is added on the back drilling surface of the buried holes to insulate the back drilling surface of the buried holes and ensure the insulation effect of the back drilling layer, also includes,
manufacturing inner-layer metallized blind holes, namely manufacturing 1 metallized blind hole on each of two sides of the pressed inner-layer circuit layer, wherein a first inner-layer metallized blind hole 7 on the first side is used for the 1 st inner-layer circuit layer and the 2 nd inner-layer circuit layer of the inner-layer circuit layer, and a second inner-layer metallized blind hole 8 on the second side is used for connecting the 2m inner-layer circuit layer and the 2m-1 st inner-layer circuit layer;
s1.2: and respectively placing the first outer metal layer and the second outer metal layer on two sides of the 2m inner circuit layer, and performing second pressing to form the multilayer board.
The manufacturing method of the multilayer board also comprises the following steps,
and respectively manufacturing a third outer-layer metallized blind hole 9 and a fourth outer-layer metallized blind hole 10 on two sides of the outer layer plate, wherein the third outer-layer metallized blind hole 9 and the fourth outer-layer metallized blind hole 10 are respectively communicated with the first inner-layer metallized blind hole 7 and the second inner-layer metallized blind hole 8.
The manufacturing method of the multilayer board also comprises the following steps,
and (2) manufacturing a through hole 4 on the multilayer board by adopting a mechanical drilling mode, sequentially carrying out hole filling electroplating and resin hole plugging on the through hole by adopting a conventional manufacturing mode after the drilling is finished, and respectively carrying out CAP (CAP electroplating) treatment on two ends of the through hole after the hole filling electroplating and the resin hole plugging are carried out on the through hole so as to ensure that the circuit from the L1 layer to the L (2 m + 2) layer is communicated.
S2: respectively carrying out CAP electroplating treatment on non-back drilling surfaces of the first buried hole 1 and the second buried hole 2, wherein the CAP electroplating is cover plate electroplating;
s3: respectively manufacturing 1 metallized blind hole on the non-back drilling surface of the first buried hole 1 and the non-back drilling surface of the second buried hole 2, wherein a first outer layer metallized blind hole 5 on the first surface is used for connecting a first outer layer metal layer and a 1 st layer inner layer circuit layer, and a second outer layer metallized blind hole 6 on the second surface is used for connecting a second outer layer metal layer and a 2m layer inner layer circuit layer;
the metallized blind holes in the steps S1 to S3 are all formed by laser drilling and then metallization processing.
Referring to fig. 1, in this embodiment, m is taken as 3, an HDI multilayer board is taken as 2m +2, and an 8-layer HDI board is taken as an example, the conventional back drilling process has back drilling levels of L1-L3 (the back drilling depth is required to be: drilling through an L2 layer of copper and not damaging an L3 layer of copper), L8-L6 (the back drilling depth is required to be: drilling through an L7 layer of copper and not damaging an L6 layer of copper), buried via levels are L2-L7, and a set of copper-free PADs (L2 layer and L7 layer) are added at positions corresponding to the back drilling surfaces of a set of superimposed laser vias (L1-L2 and L8-L7).
The manufacturing process of the 8-layer HDI board in this embodiment:
manufacturing an inner layer circuit layer, namely sequentially stacking 6 inner layer circuit layers after cutting and cleaning, and then performing first pressing to form the 6 inner layer circuit layers into a whole;
laser drilling is respectively carried out on the L2-L3 layer and the L7-L6 layer, and metallization processing is carried out after drilling to form a first inner-layer metallized blind hole 7 and a second inner-layer metallized blind hole 8;
3 inner-layer line through holes are drilled in an L2-7 layer in a mechanical drilling mode, hole filling electroplating and resin hole plugging are sequentially carried out after the drilling is finished so as to ensure the communication among lines of each layer of the inner layer, the 3 inner-layer line through holes are respectively a first buried hole 1, a second buried hole 2 and a third buried hole 3, wherein the bottom surface of the first buried hole 1 and the top surface of the second buried hole 2 are back drilling surfaces,
adding a copper-free PAD on the back drilling surfaces of the first buried hole 1 and the second buried hole 2 respectively to enable the back drilling surfaces of the first buried hole 1 and the second buried hole 2 to form insulation arrangement, so that the insulation effect of an insulation layer is ensured;
CAP electroplating treatment is respectively carried out on the non-back drilling surfaces of the first buried via 1 and the second buried via 2.
Manufacturing a multilayer board, namely respectively placing an outer metal layer on the top surface and the bottom surface of the manufactured 6 inner circuit layers, and performing second pressing to enable the outer metal layer and the inner circuit layers to be laminated together to form the integral multilayer board;
respectively drilling blind holes on the non-back drilling surface of the first buried hole and the non-back drilling surface of the second buried hole in a laser drilling mode, and then carrying out metallization treatment to form a first outer-layer metallized blind hole 5 and a second outer-layer metallized blind hole 6, wherein the first outer-layer metallized blind hole 5 is used for connecting an L1 outer metal layer and an L2 inner-layer circuit layer, and the second outer-layer metallized blind hole 6 is used for connecting an L8 outer metal layer and an L7 inner-layer circuit layer
And respectively manufacturing a third outer-layer metallized blind hole 9 and a fourth outer-layer metallized blind hole 10 on two sides of the outer layer plate by adopting a laser drilling mode, wherein the third outer-layer metallized blind hole 9 and the fourth outer-layer metallized blind hole 10 are respectively communicated with the first inner-layer metallized blind hole 7 and the second inner-layer metallized blind hole 8.
The invention relates to a process flow for replacing the traditional HDI board through hole and back drilling by adopting a method of increasing blind hole butt joint by adopting a buried hole and non-back drilling surface. The method for replacing the HDI board back drilling process flow adopts the method of increasing the blind hole butt joint by the buried hole and the non-back drilling surface without back drilling operation to manufacture the insulating layer and the conducting layer of the HDI board multilayer board, is used for replacing the HDI board back drilling process flow, greatly simplifies the process flow, improves the production efficiency, solves the problems of partial drilling, over-depth drilling and over-shallow drilling easily occurring in the traditional back drilling, and effectively ensures the stable quality of the circuit board.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (10)
1. The utility model provides a replace HDI board back drilling's process flow which characterized in that: the method adopts the buried hole and non-back drilling surface to increase the butt joint of the blind holes to replace the traditional HDI board through hole and back drilling process flow.
2. The process flow for back drilling instead of HDI plate according to claim 1, characterized by comprising the following steps,
s1: providing a multilayer board, wherein the multilayer board comprises 2 outer metal layers and 2m inner circuit layers, m buried holes penetrating the 2m layers are formed in the multilayer board, the 2m inner circuit layers are connected through one buried hole, and m is an integer greater than 1;
s2: CAP electroplating treatment is respectively carried out on the non-back drilling surfaces of the first buried hole and the second buried hole;
s3: and respectively manufacturing 1 metallized blind hole on the non-back drilling surface of the first buried hole and the non-back drilling surface of the second buried hole, wherein the first outer layer metallized blind hole of the first surface is used for connecting the first outer layer metal layer and the 1 st layer inner layer circuit layer, and the second outer layer metallized blind hole of the second surface is used for connecting the second outer layer metal layer and the 2m layer inner layer circuit layer.
3. The process flow of back drilling for replacing HDI board according to claim 2, wherein the method for manufacturing the multi-layer board in the step S1 comprises,
s1.1: the manufacturing method of the 2m inner layer circuit layer comprises the steps of stacking the 2m inner layer circuit layers in sequence, then carrying out first pressing, manufacturing m through holes on the pressed inner layer circuit board, and forming m buried holes in the multilayer board by the m through holes;
s1.2: and respectively placing the first outer metal layer and the second outer metal layer on two sides of the 2m inner circuit layer, and performing second pressing to form the multilayer board.
4. A process flow instead of the HDI board back drilling according to claim 3, wherein the manufacturing of the 2m inner layer circuit layer in step S1.1 further includes manufacturing of inner layer metallized blind holes, wherein 1 metallized blind hole is respectively manufactured on two sides of the laminated inner layer circuit layer, a first inner layer metallized blind hole on the first side is used for the 1 st inner layer circuit layer and the 2 nd inner layer circuit layer of the inner layer circuit layer, and a second inner layer metallized blind hole on the second side is used for connecting the 2m inner layer circuit layer and the 2m-1 st inner layer circuit layer.
5. The process flow of replacing HDI board back drilling in claim 4, wherein m through holes in the 2m inner layer circuit layer in the step S1.1 are made by mechanical drilling, and after the drilling is completed, the through holes are sequentially subjected to hole filling electroplating and resin hole filling by using a conventional manufacturing method.
6. The process of claim 5, wherein said multilayer board manufacturing method in S1 further comprises respectively manufacturing a third outer layer metallized blind via and a fourth outer layer metallized blind via on both sides of the outer layer board, said third outer layer metallized blind via and fourth outer layer metallized blind via being respectively communicated with the first inner layer metallized blind via and the second inner layer metallized blind via.
7. The process flow of claim 5 instead of HDI board back drilling, wherein the method for manufacturing the multilayer board in step S1 further comprises the steps of manufacturing a through hole on the multilayer board by mechanical drilling, and after the drilling is completed, filling the through hole with hole and plating with resin and plugging the through hole in sequence by conventional manufacturing methods.
8. A process flow for replacing HDI plate back drilling as claimed in claim 6, wherein CAP electroplating treatment is performed on both ends of the through hole after the through hole is filled with hole electroplating and resin hole plugging.
9. The process flow of claim 8 instead of an HDI back drill, wherein said metallized blind via is metallized after laser drilling.
10. The process flow of replacing HDI board back drilling as claimed in claim 9, wherein the process flow includes material cutting to press fit → laser drilling → mechanical drilling → hole filling plating → resin hole filling → CAP plating → outer layer → external inspection → press fit → laser drilling → mechanical drilling → hole filling plating → resin hole filling → CAP plating → outer layer circuit → external inspection → solder mask → post process.
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| CN201911003389.4A CN110809376A (en) | 2019-10-22 | 2019-10-22 | Process flow for replacing HDI plate back drill |
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| CN201911003389.4A CN110809376A (en) | 2019-10-22 | 2019-10-22 | Process flow for replacing HDI plate back drill |
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Application publication date: 20200218 |
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