CN115551237A - Manufacturing method of PCB with Z-direction interconnection structure and PCB - Google Patents
Manufacturing method of PCB with Z-direction interconnection structure and PCB Download PDFInfo
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- CN115551237A CN115551237A CN202211336134.1A CN202211336134A CN115551237A CN 115551237 A CN115551237 A CN 115551237A CN 202211336134 A CN202211336134 A CN 202211336134A CN 115551237 A CN115551237 A CN 115551237A
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- hole
- daughter board
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- pcb
- prepreg
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the technical field of PCBs (printed circuit boards), and discloses a manufacturing method of a PCB with a Z-direction interconnection structure and the PCB. The manufacturing method comprises the following steps: providing at least one target daughter board which is provided with a metallized hole used for realizing Z-direction electrical conduction; firstly, filling resin into a metallized hole, then performing back drilling on a corresponding position of the metallized hole by taking a press-fit surface of a target sub-board and other sub-boards as a drilling surface to obtain a back-drilled blind hole, and then performing hole filling electroplating on the back-drilled blind hole; after hole filling electroplating is finished, laminating the target daughter board and other daughter boards through the prepregs with the conductive materials arranged at the positions corresponding to the metallization holes, and enabling the metallization holes in the target daughter board to be interconnected in the Z direction through the conductive materials and the metallization holes in the corresponding positions on the other daughter boards. According to the invention, the deformation resistance of the target daughter board is improved through the copper filling structure, so that the extrusion/pulling force of the conductive material in the deformation process of the daughter board is reduced, and the thermal reliability of the connection of the conductive paste is improved.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a manufacturing method of a PCB with a Z-direction interconnection structure and the PCB.
Background
With the rapid development of high-speed and high-density technologies of PCBs, the improvement of the density capacity of the PCBs is more and more important, and due to the limitation of electroplating liquid medicine, the thickness-diameter ratio cannot be infinitely increased, so that the Z-direction interconnection is adopted, the capability of realizing the high thickness-diameter ratio in a high-density aspect is realized, and meanwhile, the electrical performance and the thermal reliability are guaranteed.
Referring to fig. 1, the conventional Z-direction interconnect structure is processed by the following steps: selecting a proper prepreg → selecting a proper PET film (high temperature resistant polyester film) → pasting the PET film on the prepreg through a vacuum film pressing machine → drilling (laser drilling or mechanical drilling) the prepreg pasted with the PET film → binding the prepreg pasted with the PET film on the daughter board → pre-pasting the prepreg under heat and pressure → silk-screening conductive materials in holes of the prepreg pasted with the PET film → removing redundant conductive materials outside the holes → pre-baking (the silk-screening to pre-baking step can be repeated twice according to actual conditions) → removing the PET film → final baking → pre-discharging board → laminating → other normal procedures.
The conventional Z-direction interconnection technology process adopts a POFV structure, a conductive paste and a POFV structure for increasing the density and the capacity of the PCB, but the structural design and the process have the following defects: generally, the daughter board and the plug hole resin have a large CTE (coefficient of thermal expansion) difference, residual internal stress exists after lamination, the daughter board is prone to generate certain deformation due to the internal stress, and the conductive paste is extruded or pulled to cause cracks in the deformation process of the daughter board, as shown in fig. 2, so that the thermal reliability of the connection of the whole conductive paste is poor.
Disclosure of Invention
The invention aims to provide a manufacturing method of a PCB with a Z-direction interconnection structure and the PCB, so as to overcome the defect of poor thermal reliability of conductive paste connection in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of fabricating a PCB having a Z-direction interconnect structure, the method of fabricating comprising:
providing at least one target daughter board which is provided with a metallized hole used for realizing Z-direction electrical conduction;
firstly, filling resin into the metallized hole, then performing back drilling on the corresponding position of the metallized hole by taking the pressing surface of the target sub-board and other sub-boards as a drilling surface to obtain a back-drilled blind hole, and then performing hole filling electroplating on the back-drilled blind hole to obtain a copper filling structure;
after the hole filling electroplating is finished, laminating the target daughter board and other daughter boards through prepregs provided with conductive materials at corresponding positions of the metallization holes, so that the metallization holes in the target daughter board are interconnected in the Z direction through the conductive materials and the metallization holes at corresponding positions of the other daughter boards.
Optionally, the drilling depth range of the back-drilled blind hole is 4-6 mils.
Optionally, the aperture range of the back-drilled blind hole is D-2mil to D +2mil, and D is the aperture of the metalized hole.
Optionally, after the hole filling and electroplating, a recess is formed on the surface of the back-drilled blind hole, and the recess rate of the recess is smaller than a preset recess threshold value.
Optionally, the preset recess threshold is 35 μm.
Optionally, the conductive material is a conductive paste.
Optionally, the step of laminating the target daughter board and another daughter board by using the prepreg provided with the conductive material at the position corresponding to the metallization hole includes:
providing a prepreg, and attaching a PET film on the surface layer of one side of the prepreg;
performing laser drilling on the prepreg pasted with the PET film at the corresponding position of the metallized hole;
after laser drilling, pre-sticking the prepreg stuck with the PET film to the pressing surface of the target daughter board or the other daughter boards;
silk-screening the conductive material in the hole prepared by the laser drilling, and baking;
then, removing the PET film to obtain a prepreg provided with a conductive material at the position corresponding to the metallized hole;
and pressing the target daughter board, the prepreg and the other daughter boards at a high temperature.
A PCB manufactured according to the method for manufacturing the PCB with the Z-direction interconnection structure.
Compared with the prior art, the invention has the beneficial effects that:
compared with the conventional Z-direction interconnection structure composed of a POFV structure, a conductive material and a POFV structure, the Z-direction interconnection structure composed of the back-drilled blind hole copper plating structure, the conductive material and the back-drilled blind hole copper plating structure or the Z-direction interconnection structure composed of the back-drilled blind hole copper plating structure, the conductive material and the POFV structure manufactured by the embodiment of the invention has the advantages that the copper filling structure in the back-drilled blind hole copper plating structure is insensitive to CTE difference among materials, so that the deformation resistance of the target daughter board can be effectively improved, the deformation degree of the target daughter board generated when the target daughter board has larger CTE difference with resin can be reduced, the extrusion force or the pulling force applied to the conductive material in the deformation process can be further reduced, and the thermal reliability of connection of the conductive paste can be effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic diagram of a conventional manufacturing process of a PCB with a Z-direction interconnect structure in the prior art.
FIG. 2 is an exemplary diagram of a blind hole crack defect in the prior art.
Fig. 3 is a flowchart of a method for manufacturing a PCB having a Z-direction interconnect structure according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a target daughter board provided with a metallization hole for implementing Z-direction electrical conduction according to an embodiment of the present invention.
Fig. 5 is a schematic view of the target daughter board after resin is plugged into the metallized hole shown in fig. 4.
Fig. 6 is a schematic structural diagram of the target daughter board shown in fig. 5 after back drilling.
Fig. 7 is a schematic structural diagram of the target daughter board shown in fig. 6 after hole filling electroplating.
Fig. 8 is a schematic structural view of a PCB manufactured by laminating the target sub-board and another target sub-board shown in fig. 7.
Fig. 9 is another schematic structural diagram of a PCB according to an embodiment of the present invention.
Illustration of the drawings:
the daughter board comprises a target daughter board 1, a metallized hole 11, resin 12, a back-drilled blind hole 13, a copper filling structure 14, a prepreg 2, a conductive material 21 and other daughter boards 3.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to overcome the problem of poor connection reliability of the conductive paste caused by the large CTE difference between the board and the hole plugging resin in the prior art, an embodiment of the present invention provides a method for manufacturing a PCB having a Z-direction interconnection structure, and referring to fig. 3, the method includes the steps of:
In this step, the target daughter board 1 having the metallization holes 11 may be manufactured according to a conventional manufacturing process, and the metallization holes 11 may be through holes or blind holes metallized in the holes, and the number of the metallization holes may be multiple. The plate thickness of the target daughter board 1 is not particularly limited.
The resin 12 does not need to be fixed with a resin model with excellent processing performance, and the processing performance can be more general to save cost. In the step of plugging the resin 12 into the metallized hole 11, it is necessary to perform baking and curing using curing parameters corresponding to the resin 12.
For ease of description, the hole produced after the initial metallized hole 11 is processed as described in step 102 will be referred to hereinafter as a backdrilled blind via copper plated structure.
It should be noted that the other daughter board 3 pressed with the target daughter board 1 may be specifically another target daughter board 1, or may be a common daughter board manufactured according to a conventional process. The conductive material 21 may be specifically a conductive paste.
In the structure shown in fig. 8, two target daughter boards 1 processed according to the same special process (i.e., a way of back drilling the metallized hole 11 after being plugged by the resin 12 first and then performing hole filling electroplating on the prepared back-drilled blind hole 13) are pressed together to form a Z-direction interconnection structure composed of a back-drilled blind hole copper plating structure on the upper layer, a conductive material 21 in the middle and a back-drilled blind hole copper plating structure on the lower layer.
In other embodiments, a special process treatment may be performed on only one target daughter board 1 (i.e., a back drilling is performed on the metallized hole 11 plugged with the resin 12 first, and then the obtained back-drilled blind hole 13 is subjected to a hole filling electroplating treatment), a conventional process treatment is performed on the other Zhang Ziban (i.e., only the surface of the metallized hole 11 plugged with the resin 12 is electroplated to obtain a POFV structure), and after the target daughter board 1 and the conventional daughter board are pressed together, a Z-direction interconnection structure composed of a back-drilled blind hole copper plating structure, a conductive material 21 and a POFV structure can be formed.
Compared with the conventional Z-direction interconnection structure composed of the POFV structure, the conductive material 21 and the POFV structure, the Z-direction interconnection structure composed of the back-drilled blind hole copper plating structure, the conductive material 21 and the back-drilled blind hole copper plating structure or the Z-direction interconnection structure composed of the back-drilled blind hole copper plating structure, the conductive material 21 and the POFV structure manufactured by the embodiment of the invention has the advantages that the copper filling structure 14 in the back-drilled blind hole copper plating structure is insensitive to CTE difference among materials, so that the deformation resistance of the target daughter board 1 can be effectively improved, the deformation degree of the target daughter board generated when the target daughter board has larger CTE difference with the resin 14 can be reduced, the extrusion force or the pulling force applied to the conductive material 21 in the deformation process can be further reduced, and the thermal reliability of connection of the conductive paste can be effectively improved.
Further, in the back drilling process in step 102, preferably, the aperture of the back-drilled blind hole 13 ranges from D-2mil to D +2mil, where D is the aperture of the metalized hole 11, for example, the aperture of the back-drilled blind hole 13 in fig. 8 is D +2mil, and the aperture of the back-drilled blind hole 13 in fig. 9 is D-2mil; the drilling depth range of the back-drilled blind hole 13 is 4-6 mil; meanwhile, the back drilling tool can be a tool with a large sharp angle (such as 150 degrees and 165 degrees), so that the minimum gradient (smaller as much as possible) of inclination is ensured, the hole plugging resin 12 at the position of the inner layer corresponding to the connecting conductive material 21 can be drilled, a good hole plugging electroplating effect can be obtained in the subsequent hole plugging electroplating process, and the situation that the hole bottom of the back drilling blind hole 13 is too small to be completely electroplated is avoided.
In addition, in the process of performing hole filling electroplating on the back-drilled blind hole 13, the back-drilled blind hole 13 can be filled and leveled, and a certain degree of recess can also be allowed to exist, that is, the surface recess rate of the back-drilled blind hole 13 is controlled to be smaller than a preset recess threshold value. Illustratively, the preset dishing threshold is 35 μm. Under the condition that the surface of the copper filling structure 14 is sunken, in the process that the target daughter board 1 is laminated with other daughter boards 3 through the prepreg 2, the conductive material 21 on the prepreg 1 partially enters the sunken position on the surface of the copper filling structure 14, so that the contact area between the conductive material 21 and the copper filling structure 14 is increased, and the firmness of connection between the conductive material 21 and the target daughter board 1 is further improved.
In the step 103, the step of laminating the target daughter board 1 and the other daughter boards 3 by the prepreg 2 having the conductive material 21 provided at the corresponding position of the metallization hole 11 further includes:
providing a prepreg 2, and attaching a PET film on the surface layer of one side of the prepreg 2;
performing laser drilling on the prepreg 2 pasted with the PET film at the corresponding position of the metallized hole 11;
after laser drilling, pre-sticking the prepreg 2 coated with the PET film to the laminating surface of the target daughter board 1 or other daughter boards 3;
silk-screen printing a conductive material 21 in the hole obtained by laser drilling, and baking;
then, removing the PET film to obtain a prepreg 2 provided with a conductive material 21 at a position corresponding to the metallized hole 11;
and pressing the target daughter board 1, the prepreg 2 and the other daughter boards 3 at a high temperature.
Based on the same inventive concept, the embodiment of the invention also provides a PCB which is manufactured according to the above-mentioned manufacturing method of the PCB with the Z-direction interconnection structure. Because the PCB has an unconventional Z-direction interconnection structure (namely, the Z-direction interconnection structure consisting of the back-drilled blind hole copper plating structure, the conductive material 21 and the back-drilled blind hole copper plating structure, or the Z-direction interconnection structure consisting of the back-drilled blind hole copper plating structure, the conductive material 21 and the POFV structure), the Z-direction interconnection structure can effectively improve the thermal reliability of the connection of the conductive paste, and thus the product quality of the PCB can be effectively improved.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A method for manufacturing a PCB with a Z-direction interconnection structure is characterized by comprising the following steps:
providing at least one target daughter board which is provided with a metallized hole used for realizing Z-direction electrical conduction;
firstly, filling resin into the metallized hole, then performing back drilling on the corresponding position of the metallized hole by taking the pressing surface of the target sub-board and other sub-boards as a drilling surface to obtain a back-drilled blind hole, and then performing hole filling electroplating on the back-drilled blind hole to obtain a copper filling structure;
after the hole filling electroplating is finished, laminating the target daughter board and other daughter boards through prepregs provided with conductive materials at corresponding positions of the metallization holes, so that the metallization holes in the target daughter board are interconnected in the Z direction through the conductive materials and the metallization holes at corresponding positions of the other daughter boards.
2. The method as claimed in claim 1, wherein the back-drilled blind via has a depth of 4-6 mil.
3. The method as claimed in claim 1, wherein the diameter of the via hole is in the range of D-2mil to D +2mil, and D is the diameter of the metallization hole.
4. The method as claimed in claim 1, wherein after the hole-filling electroplating, a recess is formed on the surface of the backdrilled blind via, and a recess rate of the recess is less than a predetermined recess threshold.
5. The method as claimed in claim 4, wherein the predetermined recess threshold is 35 μm.
6. The method as claimed in claim 1, wherein the conductive material is conductive paste.
7. The method for manufacturing a PCB having a Z-directional interconnect structure according to claim 1, wherein the step of laminating the target daughter board with other daughter boards by providing a prepreg of conductive material at a position corresponding to the metallization hole comprises:
providing a prepreg, and attaching a PET film on the surface layer of one side of the prepreg;
performing laser drilling on the prepreg pasted with the PET film at the corresponding position of the metallized hole;
after laser drilling, pre-sticking the prepreg stuck with the PET film to the pressing surface of the target daughter board or the other daughter boards;
silk-printing the conductive material in the holes prepared by the laser drilling, and baking;
then, removing the PET film to obtain a prepreg provided with a conductive material at the position corresponding to the metallized hole;
and pressing the target daughter board, the prepreg and the other daughter boards at a high temperature.
8. A PCB manufactured according to the method of manufacturing a PCB having a Z-directional interconnect structure of any one of claims 1 to 7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211336134.1A CN115551237A (en) | 2022-10-28 | 2022-10-28 | Manufacturing method of PCB with Z-direction interconnection structure and PCB |
| PCT/CN2023/127346 WO2024088416A1 (en) | 2022-10-28 | 2023-10-27 | Fabrication method for pcb having z-direction interconnection structure, and pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211336134.1A CN115551237A (en) | 2022-10-28 | 2022-10-28 | Manufacturing method of PCB with Z-direction interconnection structure and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115551237A true CN115551237A (en) | 2022-12-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211336134.1A Pending CN115551237A (en) | 2022-10-28 | 2022-10-28 | Manufacturing method of PCB with Z-direction interconnection structure and PCB |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115551237A (en) |
| WO (1) | WO2024088416A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024088416A1 (en) * | 2022-10-28 | 2024-05-02 | 生益电子股份有限公司 | Fabrication method for pcb having z-direction interconnection structure, and pcb |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2937933B2 (en) * | 1997-03-24 | 1999-08-23 | 富山日本電気株式会社 | Manufacturing method of multilayer printed wiring board |
| CN102523702B (en) * | 2011-12-19 | 2014-11-26 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing process of circuit board with back-drilled blind hole |
| CN103813655A (en) * | 2012-11-09 | 2014-05-21 | 镇江华扬信息科技有限公司 | Manufacturing method for improving reliability of printed circuit board (PCB) including bonding pad structure |
| CN105636347A (en) * | 2014-10-28 | 2016-06-01 | 镇江华扬信息科技有限公司 | Structure design method for improving reliability of printed circuit board |
| CN107155266B (en) * | 2017-06-20 | 2020-10-23 | 广州兴森快捷电路科技有限公司 | Z-direction interconnection circuit board and manufacturing method thereof |
| CN109195363B (en) * | 2018-11-13 | 2021-04-02 | 生益电子股份有限公司 | Manufacturing method of PCB (printed Circuit Board) interconnected in Z direction and PCB |
| CN115551237A (en) * | 2022-10-28 | 2022-12-30 | 生益电子股份有限公司 | Manufacturing method of PCB with Z-direction interconnection structure and PCB |
-
2022
- 2022-10-28 CN CN202211336134.1A patent/CN115551237A/en active Pending
-
2023
- 2023-10-27 WO PCT/CN2023/127346 patent/WO2024088416A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024088416A1 (en) * | 2022-10-28 | 2024-05-02 | 生益电子股份有限公司 | Fabrication method for pcb having z-direction interconnection structure, and pcb |
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| Publication number | Publication date |
|---|---|
| WO2024088416A1 (en) | 2024-05-02 |
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