CN101720175A - Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board - Google Patents
Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board Download PDFInfo
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- CN101720175A CN101720175A CN200910189547A CN200910189547A CN101720175A CN 101720175 A CN101720175 A CN 101720175A CN 200910189547 A CN200910189547 A CN 200910189547A CN 200910189547 A CN200910189547 A CN 200910189547A CN 101720175 A CN101720175 A CN 101720175A
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Abstract
The invention relates to a manufacturing method of a multi-layer circuit board with high aspect ratio blind hole, comprising the following steps: sequentially detaching the circuit board for manufacturing the blind hole into at least two layers with similar thickness; carrying out the first lamination on an innermost layer core board and core boards which are not equipped with blind holes, and sequentially carrying out blind hole manufacturing, copper deposition, plating and polishing on the circuit board after the first lamination; carrying out lamination on each detached layer adjacent to the inner layer core board and the circuit board laminated last time, and sequentially carrying out blind hole manufacturing, copper deposition, plating and polishing on the circuit board laminated each time. In the invention, with the steps of sequentially detaching the circuit board for manufacturing the blind hole into at least two layers with similar thickness, carrying out the first compression on an innermost layer core board and core boards which are not equipped with blind holes, sequentially carrying out blind hole manufacturing, copper deposition, plating and polishing on the laminated circuit board, the circuit board with high aspect ratio blind hole 4 is conveniently manufactured, and has good effect of the blind hole 4 and high reliability of the circuit board.
Description
Technical field
The present invention relates to a kind of manufacturing method of multi-layer circuit board and multilayer circuit board, relate in particular to a kind of manufacturing method of multi-layer circuit board and multilayer circuit board with high aspect ratio blind hole with blind hole.
Background technology
In the manufacturing process of multilayer circuit board, often include blind hole.Traditional manufacturing method of multi-layer circuit board that contains blind hole adopts following steps successively: the interior layer pattern of etched circuit board, multilayer circuit board is carried out pressing, makes blind hole.This method is feasible for the height and the radical length of blind hole than making less than 1 multilayer circuit board, but height and radical length for blind hole are made than the multilayer circuit board greater than 1, because the height of blind hole is greater than the radical length of blind hole, when holing, the irregular problem of blind hole often appears.When wiring board was electroplated, the height of this blind hole was greater than the blind hole of the radical length of blind hole, often occurred that the aperture is stopped up in electro-coppering, electro-coppering is electroplated inhomogeneous in the hole and copper electroplating layer changes over blind hole irregularly shaped.Often cause thus in blind hole making and electroplating process, the bad problem of reliability can occurring.
Summary of the invention
The technical problem that the present invention solves is: a kind of manufacturing method of multi-layer circuit board with high aspect ratio blind hole is provided, overcome in the prior art and make when having the multilayer circuit board of high aspect ratio blind hole, often cause in blind hole making and electroplating process, the bad technical problem of reliability can occurring.
Technical scheme of the present invention is: a kind of manufacturing method of multi-layer circuit board with high aspect ratio blind hole is provided, comprises the steps:
Split pcb layer: the pcb layer that will make blind hole splits into close two-layer at least of thickness successively;
Pressing for the first time: the innermost layer central layer and other central layer of not making blind hole that split are carried out the pressing first time, the wiring board after the pressing first time is carried out blind hole successively make, sink copper, plating, polishing;
Pressing once more: will split with split near every layer of innermost layer central layer order layer respectively with last pressing after wiring board carry out pressing once more and to the wiring board after the pressing each time carry out successively that blind hole is made, heavy copper, plating, polishing.
Further technical scheme of the present invention is: the height of blind hole compares greater than 1 with the aperture length of blind hole on the described central layer.
Further technical scheme of the present invention is: first with described each layer of fractionation difference etched figure before the innermost layer central layer that will split and other central layer of not making blind hole carry out comprising pressing in the pressing first time step.
Further technical scheme of the present invention is: only carry out in the step of pressing for the first time fractionation core layer etched figure at the innermost layer central layer that will split and other central layer of not making blind hole to each described pressing, will split except that the central layer of innermost layer with the order of close innermost layer central layer with go up once pressing successively after wiring board carry out the fractionation core layer etched figure that also comprises before the pressing once more described pressing.
Further technical scheme of the present invention is: described boring is for adopting laser drill.
Further technical scheme of the present invention is: described internal layer circuit plate and outer-layer circuit plate are respectively arranged with dowel hole, and described dowel hole is used for determining the position of described two parts wiring board.
Further technical scheme of the present invention is: in the step that the electroplated metal layer around the blind hole is polished off, keep straight length and be 0.05 millimeter to 0.15 millimeter orifice ring electrodeposition of metals around blind hole.
Further technical scheme of the present invention is: in the step that the electroplated metal layer around the blind hole is polished off, keep straight length around the blind hole and be 0.1 millimeter orifice ring electrodeposition of metals, the straight length that keeps around described blind hole is to make the blind hole bit pattern on 0.1 millimeter the orifice ring electrodeposition of metals.
Further technical scheme of the present invention is: split in the close two-layer at least step of thickness the aperture length of blind hole on each core layer after the thickness of each core layer after the fractionation splits less than this successively at the pcb layer that will make blind hole.
Technical scheme of the present invention is: make up a kind of multilayer circuit board, described multilayer circuit board contains blind hole, and the height of described blind hole compares greater than 1 with the aperture length of blind hole.
Technique effect of the present invention is: it is immediate two-layer at least to be divided into thickness by the pcb layer that will make blind hole by the pressing order, carries out the making of pressing and blind hole, heavy copper, plating, polishing to splitting each layer respectively by layer then.The wiring board that contains high aspect ratio blind hole is so just made success, the multilayer circuit board of the high aspect ratio blind hole of Zhi Zuoing like this, and blind hole is effective, the reliability height that wiring board is made.
Description of drawings
Fig. 1 is a workflow diagram of the present invention.
Fig. 2 will make blind hole part wiring board structural representation divided into two parts for the present invention.
Fig. 3 is the structural representation of core material pressing of the present invention.
Fig. 4 makes the structural representation of blind hole for core material of the present invention.
Fig. 5 is the structural representation of the outer central layer pressing of the present invention.
Fig. 6 makes the structural representation of blind hole for the outer central layer of the present invention.
Embodiment
Below in conjunction with specific embodiment, technical solution of the present invention is further specified.
As shown in Figure 1, the specific embodiment of the present invention is: the invention provides a kind of manufacturing method of multi-layer circuit board with high aspect ratio blind hole, comprise the steps:
Step 100: split pcb layer, that is: the pcb layer that will make blind hole splits into close two-layer at least of thickness successively.For the multilayer circuit board that contains high aspect ratio blind hole, at first will make the wiring board core layer of blind hole and make dowel hole 3, it is immediate two-layer at least that the pcb layer that will make blind hole then is divided into thickness by the pressing order, according to the thickness of central layer and the radical length of blind hole, it is immediate two-layer that the pcb layer of making blind hole is divided into thickness by the pressing order, three layers and more multi-layered, split to require to be: the aperture length of blind hole on the thickness of each core layer after the fractionation each core layer after less than this fractionation, that is to say that the aspect ratio that splits each core layer blind hole of back is less than 1.In the present embodiment, as shown in Figure 2, it is immediate two-layer that the pcb layer of making blind hole is divided into thickness by the pressing order, that is: core material 2 and outer central layer 1, the blind hole of every like this part wiring board just no longer is a high aspect ratio, but blind hole is divided into highly near half blind hole.If split into multilayer, split structure with above-mentioned requirement.
Step 200: pressing for the first time, that is: innermost layer central layer and other central layer of not making blind hole that splits carried out the pressing first time, the wiring board after the pressing first time is carried out blind hole successively make, sink copper, plating, polishing.Below introduce step by step:
It at first is etched figure, promptly before carrying out pressing for the first time, also comprise the figure etching of central layer, the etched a kind of execution mode of figure to the core layer that splits is: earlier described each layer of fractionation is distinguished etched figure, and then innermost layer central layer and other central layer of not making blind hole that splits carried out pressing first time, the wiring board after the pressing first time is carried out the blind hole making successively, sinks copper, plating, polishing.Another execution mode is: only carry out in the step of pressing for the first time fractionation core layer etched figure at the innermost layer central layer that will split and other central layer of not making blind hole to each described pressing, and then will split except that the central layer of innermost layer with the order of close innermost layer central layer with go up once pressing successively after wiring board carry out the fractionation core layer etched figure that also comprises before the pressing once more described pressing.
Be pressing for the first time then, that is: innermost layer central layer and other central layer of not making blind hole that splits carried out the pressing first time.In the pressing process, also comprise pressing together to one or more layers layer of prepreg.In the present embodiment, as shown in Figure 3, be example to split two-layer, it is immediate two-layer that the pcb layer of making blind hole is divided into thickness by the pressing order, that is: core material 2 and outer central layer 1 carry out pressing with described core material 2 with other central layer of not making blind hole.Core material 1 and other central layer of not making blind hole are carried out pressing, as shown in Figure 3, in this practical example, only for example core material 2 and layer of prepreg 6 and the central layer 7 of not making blind hole are carried out pressing.If it is how two-layer excessively that the pcb layer that will make blind hole is divided into by the pressing order, promptly in the present embodiment, described core material 2 be fractionation inside core layer.
Be the wiring board after the pressing first time to be carried out blind hole successively make, sink copper, plating, polishing again.In the present embodiment, as shown in Figure 4, to split two-layer is example, it is immediate two-layer that the pcb layer of making blind hole is divided into thickness by the pressing order, that is: core material 2 and outer central layer 1 carry out blind hole to the core material after the pressing 2 and make, and adopt the mode of laser drill to make blind hole, in making the blind hole process, adopt alignment pin 32 to position so that the position that blind hole 42 is made can not departed from.After blind hole 42 is made, adopt metal material that described core material 2 and other central layer of pressing together are electroplated, in the present embodiment, adopt copper to electroplate.After the plating, the electroplated metal layer around the blind hole 42 is polished off.When the plated metal around the polishing blind hole 42, the orifice ring electrodeposition of metals 43 that keeps radical length and be 0.05 millimeter to 0.15 millimeter around blind hole is not polished, and when making blind hole in order to outer central layer 1, prevents blind hole stack dislocation.In the present embodiment, keep straight length around the blind hole and be 0.1 millimeter orifice ring electrodeposition of metals 43, the straight length that keeps around described blind hole is to make the blind hole bit pattern on 0.1 millimeter the orifice ring electrodeposition of metals.If it is how two-layer excessively that the pcb layer that will make blind hole is divided into by the pressing order, promptly in the present embodiment, described core material 2 be fractionation inside core layer.
Step 300: pressing once more, that is: will split with split near every layer of innermost layer central layer order layer respectively with last pressing after wiring board carry out pressing once more and to the wiring board after the pressing each time carry out successively that blind hole is made, heavy copper, plating, polishing.Before carrying out pressing once more, also comprise the figure etching that splits layer to described.Be to carry out pressing once more then, that is: will split with split near every layer of innermost layer central layer order layer respectively with last pressing after wiring board carry out pressing once more.In the present embodiment, as shown in Figure 5, be example to split two-layer, it is immediate two-layer that the pcb layer of making blind hole is divided into thickness by the pressing order, that is: core material 2 and outer central layer 1 carry out pressing once more to the wiring board after described outer central layer 1 and the pressing for the first time.As shown in Figure 6, the outer central layer after the pressing 2 is carried out blind hole make, adopt the mode of laser drill to make blind hole, in making the blind hole process, adopt dowel hole 3 to position so that the position that blind hole 4 is made can not departed from.After blind hole 4 is made, adopt metal material that described outer central layer 1 and other central layer of pressing together are electroplated, in the present embodiment, adopt copper to electroplate.After the plating, the electroplated metal layer around the blind hole 4 is polished off.
If will make the pcb layer of blind hole is divided into how two-layer excessively by the pressing order, described outer central layer 1 is the inferior nexine central layer that splits the close innermost layer central layer in the layer, be ground floor central layer, to carrying out pressing once more near the ground floor central layer of innermost layer central layer and the wiring board after the described pressing first time near the innermost layer central layer.After the pressing, carry out blind hole successively and make, sink copper, plating, polishing carry out wiring board after the pressing once more near the ground floor central layer of innermost layer central layer and the wiring board after the described pressing first time.Other each fractionation layer is followed successively by the second layer central layer near the innermost layer central layer, to carry out pressing once more with last near the wiring board after the ground floor central layer pressing of innermost layer central layer near the second layer central layer of innermost layer central layer again, after the pressing, to near the second layer central layer of innermost layer central layer with last near the wiring board after the ground floor central layer pressing of innermost layer central layer carry out that wiring board after the pressing once more carries out successively that blind hole is made, heavy copper, plating, polishing.Be the 3rd layer of central layer then near the innermost layer central layer, and the like, repeat previous action and carry out blind hole making, heavy copper, plating, polishing successively up to the equal pressing of described fractionation layer and to the wiring board after the pressing.Then making the multilayer circuit board high aspect ratio blind hole finishes.
In the embodiment of the present invention, it is immediate two-layer at least to be divided into thickness by the pcb layer that will make blind hole by the pressing order, carries out the making of pressing and blind hole, heavy copper, plating, polishing to splitting each layer respectively by layer then.The wiring board that contains high aspect ratio blind hole 4 is so just made success, the multilayer circuit board of the high aspect ratio blind hole 4 of Zhi Zuoing like this, and blind hole 4 is effective, the reliability height that wiring board is made.
As shown in Figure 6, the specific embodiment of the present invention is: the height H of described blind hole compares greater than 1 with the aperture length L of blind hole.In blind hole manufacturing process, wiring board is thinner usually, and the aperture of blind hole is also bigger, therefore, the blind hole height H of common line plate is all less than the radical length L of blind hole, and the making once-forming of this blind hole also is fine, and adopts secondary to make after all and uses the manufacture craft of blind hole more complicated.Along with the height H of the blind hole of wiring board is increasing with the ratio of aperture length L, the making reliability of wiring board blind hole is also more and more littler, especially for the aperture length L of the height H of wiring board blind hole and blind hole than making greater than 1 blind hole, adopt once-forming, then the reliability of wiring board blind hole making is lower.Therefore, this method aperture length L of preferably being applicable to the height H of stating blind hole and blind hole is than the making greater than 1 wiring board blind hole.
As shown in Figure 6, the specific embodiment of the invention is: make up a kind of multilayer circuit board, described multilayer circuit board contains blind hole 4, and the height H of described blind hole 4 compares greater than 1 with the aperture length L of blind hole.
The present invention contains the multilayer circuit board of high aspect ratio blind hole, and the height H of described blind hole compares greater than 1 with the aperture length L of blind hole.In blind hole manufacturing process, wiring board is thinner usually, and the aperture of blind hole is also bigger, therefore, the blind hole height H of common line plate is all less than the radical length L of blind hole, and the making once-forming of this blind hole also is fine, and adopts secondary to make after all and uses the manufacture craft of blind hole more complicated.Along with the height H of the blind hole of wiring board is increasing with the ratio of aperture length L, the making reliability of wiring board blind hole is also more and more littler, especially for the aperture length L of the height H of wiring board blind hole and blind hole than making greater than 1 blind hole, adopt once-forming, then the reliability of wiring board blind hole making is lower.Therefore, this method aperture length L of preferably being applicable to the height H of stating blind hole and blind hole is than the making greater than 1 wiring board blind hole.Be divided into immediate core material of thickness and outer central layer by the pcb layer that will make blind hole by the pressing order, then to described core material and the pressing at twice of described outer central layer.The wiring board that contains high aspect ratio blind hole 4 is so just made success, the multilayer circuit board of the high aspect ratio blind hole 4 of Zhi Zuoing like this, and blind hole 4 is effective, the reliability height that wiring board is made.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. the manufacturing method of multi-layer circuit board with high aspect ratio blind hole comprises the steps:
Split pcb layer: the pcb layer that will make blind hole splits into close two-layer at least of thickness successively;
Pressing for the first time: the innermost layer central layer and other central layer of not making blind hole that split are carried out the pressing first time, the wiring board after the pressing first time is carried out blind hole successively make, sink copper, plating, polishing;
Pressing once more: will split with split near every layer of innermost layer central layer order layer respectively with last pressing after wiring board carry out pressing once more and to the wiring board after the pressing each time carry out successively that blind hole is made, heavy copper, plating, polishing.
2. the manufacturing method of multi-layer circuit board with high aspect ratio blind hole according to claim 1 is characterized in that, the height of blind hole compares greater than 1 with the aperture length of blind hole on the described central layer.
3. the manufacturing method of multi-layer circuit board with high aspect ratio blind hole according to claim 1, it is characterized in that, first with described each layer of fractionation difference etched figure before the innermost layer central layer that will split and other central layer of not making blind hole carry out comprising pressing in the pressing first time step.
4. the manufacturing method of multi-layer circuit board with high aspect ratio blind hole according to claim 1, it is characterized in that, only carry out in the step of pressing for the first time fractionation core layer etched figure at the innermost layer central layer that will split and other central layer of not making blind hole to each described pressing, will split except that the central layer of innermost layer with the order of close innermost layer central layer with go up once pressing successively after wiring board carry out the fractionation core layer etched figure that also comprises before the pressing once more described pressing.
5. the manufacturing method of multi-layer circuit board with high aspect ratio blind hole according to claim 1 is characterized in that, described boring is for adopting laser drill.
6. the manufacturing method of multi-layer circuit board with high aspect ratio blind hole according to claim 1 is characterized in that, described internal layer circuit plate and outer-layer circuit plate are respectively arranged with dowel hole, and described dowel hole is used for determining the position of described two parts wiring board.
7. the manufacturing method of multi-layer circuit board with high aspect ratio blind hole according to claim 1, it is characterized in that, in the step that the electroplated metal layer around the blind hole is polished off, around blind hole, keep straight length and be 0.05 millimeter to 0.15 millimeter orifice ring electrodeposition of metals.
8. the manufacturing method of multi-layer circuit board with high aspect ratio blind hole according to claim 7, it is characterized in that, in the step that the electroplated metal layer around the blind hole is polished off, keep straight length around the blind hole and be 0.1 millimeter orifice ring electrodeposition of metals, the straight length that keeps around described blind hole is to make the blind hole bit pattern on 0.1 millimeter the orifice ring electrodeposition of metals.
9. the multilayer line utmost point manufacture method with high aspect ratio blind hole according to claim 1, it is characterized in that, split in the close two-layer at least step of thickness the aperture length of blind hole on each core layer after the thickness of each core layer after the fractionation splits less than this successively at the pcb layer that will make blind hole.
10. an application rights requires 1 described multilayer circuit board with manufacturing method of multi-layer circuit board of high aspect ratio blind hole, it is characterized in that described multilayer circuit board contains blind hole, and the height of described blind hole compares greater than 1 with the aperture length of blind hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910189547A CN101720175A (en) | 2009-11-24 | 2009-11-24 | Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board |
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| CN200910189547A CN101720175A (en) | 2009-11-24 | 2009-11-24 | Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101909409A (en) * | 2010-07-16 | 2010-12-08 | 统赢软性电路(珠海)有限公司 | Manufacturing process for high-frequency multilayer mixed compression signal plate |
| CN102045965A (en) * | 2010-11-17 | 2011-05-04 | 深圳统信电路电子有限公司 | Lamination manufacturing method for imbedded inductance magnet ring |
| CN104378929A (en) * | 2014-11-28 | 2015-02-25 | 广州杰赛科技股份有限公司 | Circuit board production method |
| CN104378931A (en) * | 2014-11-21 | 2015-02-25 | 江门崇达电路技术有限公司 | Method for manufacturing metallized counterbore in PCB |
| CN104902697A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | A manufacturing method for metalized blind holes and a circuit board having the metalized blind holes |
| CN107911957A (en) * | 2017-12-15 | 2018-04-13 | 珠海杰赛科技有限公司 | A kind of compression method for the printed circuit board (PCB) for preventing core plate warpage |
| CN109451683A (en) * | 2018-12-11 | 2019-03-08 | 深圳市景旺电子股份有限公司 | A kind of asymmetric multi-layer board pressing back plate that solves sticks up undesirable method and compression method |
| CN110708888A (en) * | 2019-09-18 | 2020-01-17 | 九江明阳电路科技有限公司 | Method and system for manufacturing multilayer printing plate |
| CN113375540A (en) * | 2021-05-17 | 2021-09-10 | 深圳市景旺电子股份有限公司 | Circuit board, circuit board blind hole testing module and testing method thereof |
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- 2009-11-24 CN CN200910189547A patent/CN101720175A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101909409A (en) * | 2010-07-16 | 2010-12-08 | 统赢软性电路(珠海)有限公司 | Manufacturing process for high-frequency multilayer mixed compression signal plate |
| CN102045965A (en) * | 2010-11-17 | 2011-05-04 | 深圳统信电路电子有限公司 | Lamination manufacturing method for imbedded inductance magnet ring |
| CN102045965B (en) * | 2010-11-17 | 2013-01-23 | 深圳统信电路电子有限公司 | Lamination manufacturing method for imbedded inductance magnet ring |
| CN104902697A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | A manufacturing method for metalized blind holes and a circuit board having the metalized blind holes |
| CN104378931B (en) * | 2014-11-21 | 2017-11-28 | 江门崇达电路技术有限公司 | The preparation method of metallization counterbore in a kind of PCB |
| CN104378931A (en) * | 2014-11-21 | 2015-02-25 | 江门崇达电路技术有限公司 | Method for manufacturing metallized counterbore in PCB |
| CN104378929B (en) * | 2014-11-28 | 2017-05-24 | 广州杰赛科技股份有限公司 | Circuit board production method |
| CN104378929A (en) * | 2014-11-28 | 2015-02-25 | 广州杰赛科技股份有限公司 | Circuit board production method |
| CN107911957A (en) * | 2017-12-15 | 2018-04-13 | 珠海杰赛科技有限公司 | A kind of compression method for the printed circuit board (PCB) for preventing core plate warpage |
| CN109451683A (en) * | 2018-12-11 | 2019-03-08 | 深圳市景旺电子股份有限公司 | A kind of asymmetric multi-layer board pressing back plate that solves sticks up undesirable method and compression method |
| CN110708888A (en) * | 2019-09-18 | 2020-01-17 | 九江明阳电路科技有限公司 | Method and system for manufacturing multilayer printing plate |
| CN113375540A (en) * | 2021-05-17 | 2021-09-10 | 深圳市景旺电子股份有限公司 | Circuit board, circuit board blind hole testing module and testing method thereof |
| CN113375540B (en) * | 2021-05-17 | 2023-03-03 | 深圳市景旺电子股份有限公司 | Circuit board, circuit board blind hole testing module and testing method thereof |
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Application publication date: 20100602 |