CN112105163A - Manufacturing method for realizing rapid compression joint of blind hole circuit board - Google Patents

Manufacturing method for realizing rapid compression joint of blind hole circuit board Download PDF

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Publication number
CN112105163A
CN112105163A CN202011117408.9A CN202011117408A CN112105163A CN 112105163 A CN112105163 A CN 112105163A CN 202011117408 A CN202011117408 A CN 202011117408A CN 112105163 A CN112105163 A CN 112105163A
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CN
China
Prior art keywords
holes
compression joint
blind hole
manufacturing
hole
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Pending
Application number
CN202011117408.9A
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Chinese (zh)
Inventor
刘慧民
东国秀
蔡原琼
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Dongguan Somacis Graphic PCB Co Ltd
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Dongguan Somacis Graphic PCB Co Ltd
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Application filed by Dongguan Somacis Graphic PCB Co Ltd filed Critical Dongguan Somacis Graphic PCB Co Ltd
Priority to CN202011117408.9A priority Critical patent/CN112105163A/en
Publication of CN112105163A publication Critical patent/CN112105163A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The invention relates to a manufacturing method for realizing rapid compression joint of a blind hole circuit board, which only needs to carry out one-time compression joint on a back plate, and carries out the following operations at the position of the back plate needing double-side compression joint to form a blind hole: firstly, making small holes; respectively controlling the depth from the small hole to the knife entering face and the knife exiting face to manufacture large holes, wherein the depth is controlled to be between 2/5 and 1/2 of the thickness of the back plate, two large holes are formed on the upper surface and the lower surface of the back plate, and the bottoms of the two large holes are communicated through the small hole; electroplating, namely plating copper with the thickness of 10-15um on the big holes and the small holes; the CCD optical image alignment holes are manufactured in a target-seeing and targeting mode, the middle holes are manufactured in a CCD optical image alignment mode, and the bottoms of the two big holes are communicated through the middle holes. The manufacturing method for realizing the rapid compression joint of the blind hole circuit board has the advantages of only needing one-time compression, low cost, high product yield, high yield, accurate control of compression joint alignment and controllable flowing glue inflow.

Description

Manufacturing method for realizing rapid compression joint of blind hole circuit board
Technical Field
The invention relates to a circuit board, in particular to a manufacturing method for realizing rapid compression joint of a blind hole circuit board.
Background
With the development of electronic products towards high density and high precision, the same requirements are correspondingly put forward on circuit boards. The most effective method for improving the density of the PCB is to reduce the number of through holes, accurately arrange blind holes and bury the blind holes.
The blind hole is a through hole which connects the surface layer and the inner layer without penetrating through the whole plate. Blind vias are located on the top and bottom surfaces of the printed wiring board and have a depth for connection of the surface layer circuitry to the underlying inner layer circuitry, the depth of the vias generally not exceeding a certain ratio. Blind vias are formed by a via-forming process prior to lamination of the circuit board, and several internal layers may be formed in an overlapping manner during the via formation process. The existing blind hole manufacturing mode has the advantages of laser drilling and blind/buried hole drilling by mechanical equipment.
As shown in fig. 1, a schematic structural diagram of a conventional blind via circuit board manufacturing is that, in order to simultaneously implement compression bonding and insulation, a conventional technical scheme is a technical scheme of applying two-time compression bonding of a double-sided compression bonding blind via, which has extremely high requirements on process control in aspects of compression alignment control, gummosis control, and the like, and also limits yield, cost, and yield of products. Meanwhile, the problem that PP flowing glue enters the compression joint blind hole is difficult to control.
Disclosure of Invention
Aiming at the problems, the invention provides the manufacturing method for realizing the rapid compression joint of the blind hole circuit board, which only needs one-time compression, has low cost, high product yield, high yield, accurate control of compression joint alignment and flowing glue inflow control.
The invention is realized by the following technical scheme: a manufacturing method for realizing rapid compression joint of a blind hole circuit board is characterized in that only one-time compression joint is needed to be carried out on a back plate, and the following operations are carried out at the position of the back plate needing double-side compression joint to form a blind hole:
A. firstly, making small holes;
B. respectively controlling the depth from the small hole to the knife entering face and the knife exiting face to manufacture large holes, wherein the depth is controlled to be between 2/5 and 1/2 of the thickness of the back plate, two large holes are formed on the upper surface and the lower surface of the back plate, and the bottoms of the two large holes are communicated through the small hole;
C. electroplating, namely plating copper with the thickness of 10-15um on the big holes and the small holes;
D. the CCD optical image alignment holes are manufactured in a target-seeing and targeting mode, the middle holes are manufactured in a CCD optical image alignment mode, and the bottoms of the two big holes are communicated through the middle holes.
Further, the large hole is the normal size of the required blind hole; the pore diameter of the small pore is 1/3-1/2 of the large pore; the mesopore size is 1/2 to 3/4 of macropores.
Preferably, a small hole of 0.30mm is made firstly; respectively entering a cutter face and a cutter face from a small hole of 0.30mm, controlling the depth to manufacture a large hole of 0.55mm, and controlling the depth to be between 1.05 and 1.35 mm; electroplating, namely plating copper with the thickness of 10-15um on the big holes and the small holes; manufacturing a CCD optical image alignment hole in a target-seeing and targeting mode, and manufacturing a 0.45mm middle hole in a CCD optical image alignment mode; electroplating, namely plating 0.55mm large holes on two sides until the copper thickness is finished under the condition of whole plate electroplating.
Further, the method also comprises the following steps: E. electroplating, namely plating 0.55mm large holes on two sides until the copper thickness is finished under the condition of whole plate electroplating;
F. pattern electroplating, wherein a tinning reduction method is applied, only tinning is carried out, and copper is not plated;
G. back drilling, namely replacing a blind hole designed by secondary pressing by using a back drilling scheme;
H. and alkaline etching is carried out, and a circuit pattern on the outer layer of the double-sided compression joint backboard is manufactured.
The manufacturing method for realizing the rapid compression joint of the blind hole circuit board applies a one-time compression joint double-sided compression joint blind hole technology, and can simultaneously solve the problems of large-scale backboard compression alignment control, gummosis control and the like through the manufacture of small holes, large holes on two sides, electroplating and middle holes, thereby improving the product yield and providing a solution for the mass production of double-sided compression joint blind hole technology products.
Drawings
FIG. 1 is a schematic diagram of a double-sided circuit board of the prior art;
FIG. 2 is a schematic structural diagram of a blind via hole after being perforated in the manufacturing method for realizing rapid compression joint of the blind via circuit board according to the invention;
FIG. 3 is a schematic view of the structure of FIG. 2 with a large hole opened in one side;
FIG. 4 is a schematic view of the structure of FIG. 2 after large holes are opened on the upper and lower surfaces;
FIG. 5 is a schematic diagram of the electroplated structure of FIG. 4;
fig. 6 is a schematic view of the structure of fig. 5 after the opening of the hole.
Detailed Description
The present invention will be described in further detail below with reference to specific examples for facilitating understanding of those skilled in the art.
As shown in fig. 1, a schematic diagram of a double-sided compression-bonding circuit board in the prior art is shown, in the diagram, a paint layer 1, an electroplated layer 2, a low-flow prepreg glue layer 5, and a surface treatment layer 3 are shown, after blind hole treatment is respectively performed on the circuit board in the prior art, then the two circuit boards are compressed and bonded together, in the compression-bonding process, the two circuit boards are required to be aligned, then the low-flow prepreg glue layer 5 is subjected to compression curing, and then a communicating part is opened.
As shown in fig. 2 to 6, in a manufacturing method for realizing a quick compression joint of a blind hole circuit board, a back plate is pressed only once, and the following operations are performed at a position of the back plate where a blind hole needs to be formed by double-sided compression joint:
A. firstly, making a small hole 10;
B. respectively entering a cutter face and a cutter face from the small hole 10, controlling the depth to manufacture a large hole 11, controlling the depth to be between 2/5 and 1/2 of the thickness of the back plate, forming two large holes 11 on the upper surface and the lower surface of the back plate, and communicating the bottoms of the two large holes 11 through the small hole 10;
C. electroplating, namely plating copper with the thickness of 10-15um on the large holes 11 and the small holes 10;
D. manufacturing CCD optical image alignment holes in a target-seeing and targeting mode, manufacturing a middle hole 12 in the CCD optical image alignment mode, and communicating the bottoms of the two big holes 11 through the middle hole;
E. and electroplating, namely plating the macropores 11 on the two sides until the copper thickness is finished under the condition of whole-plate electroplating.
F. And (4) pattern electroplating, wherein a tinning reduction method is applied, and only tinning is performed without copper plating.
G. And back drilling, namely replacing the blind hole designed by secondary pressing by using a back drilling scheme.
H. And alkaline etching is carried out, and a circuit pattern on the outer layer of the double-sided compression joint backboard is manufactured.
The invention realizes the manufacturing method of the circuit board with the quickly pressed blind hole, and the large hole 11 is the normal size of the required blind hole; the pore diameter of the small pore 10 is 1/3-1/2 of the large pore; the mesopores 12 have a pore size of 1/2 to 3/4 of macropores.
Example one
Firstly, making small holes of 0.30 mm; respectively entering a cutter face and a cutter face from a small hole of 0.30mm, controlling the depth to manufacture a large hole of 0.55mm, and controlling the depth to be between 1.05 and 1.35 mm; electroplating, namely plating copper with the thickness of 10-15um on the big holes and the small holes; manufacturing a CCD optical image alignment hole in a target-seeing and targeting mode, and manufacturing a 0.45mm middle hole in a CCD optical image alignment mode; electroplating, namely plating 0.55mm large holes on two sides until the copper thickness is finished under the condition of whole plate electroplating; electroplating, namely plating 0.55mm large holes on two sides until the copper thickness is finished under the condition of whole plate electroplating; pattern electroplating, wherein a tinning reduction method is applied, only tinning is carried out, and copper is not plated; back drilling, namely replacing a blind hole designed by secondary pressing by using a back drilling scheme; and alkaline etching is carried out, and a circuit pattern on the outer layer of the double-sided compression joint backboard is manufactured.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in the embodiments and modifications thereof may be made, and equivalents may be substituted for elements thereof; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (4)

1. A manufacturing method for realizing rapid compression joint of a blind hole circuit board is characterized by comprising the following steps: only need carry out once pressfitting to the backplate, in the position of the backplate that needs two-sided crimping to form the blind hole, carry out the following operation:
A. firstly, making small holes;
B. respectively controlling the depth from the small hole to the knife entering face and the knife exiting face to manufacture large holes, wherein the depth is controlled to be between 2/5 and 1/2 of the thickness of the back plate, two large holes are formed on the upper surface and the lower surface of the back plate, and the bottoms of the two large holes are communicated through the small hole;
C. electroplating, namely plating copper with the thickness of 10-15um on the big holes and the small holes;
D. the CCD optical image alignment holes are manufactured in a target-seeing and targeting mode, the middle holes are manufactured in a CCD optical image alignment mode, and the bottoms of the two big holes are communicated through the middle holes.
2. The manufacturing method for realizing the rapid compression joint of the blind hole circuit board according to claim 1, is characterized in that: the big hole is the normal size of the required blind hole; the pore diameter of the small pore is 1/3-1/2 of the large pore; the mesopore size is 1/2 to 3/4 of macropores.
3. The manufacturing method for realizing the rapid compression joint of the blind hole circuit board according to claim 2 is characterized in that: firstly, making small holes of 0.30 mm; respectively entering a cutter face and a cutter face from a small hole of 0.30mm, controlling the depth to manufacture a large hole of 0.55mm, and controlling the depth to be between 1.05 and 1.35 mm; electroplating, namely plating copper with the thickness of 10-15um on the big holes and the small holes; manufacturing a CCD optical image alignment hole in a target-seeing and targeting mode, and manufacturing a 0.45mm middle hole in a CCD optical image alignment mode; electroplating, namely plating 0.55mm large holes on two sides until the copper thickness is finished under the condition of whole plate electroplating.
4. The manufacturing method for realizing the rapid compression joint of the blind hole circuit board according to claim 3, is characterized in that: the method also comprises the following steps of,
E. electroplating, namely plating 0.55mm large holes on two sides until the copper thickness is finished under the condition of whole plate electroplating;
F. pattern electroplating, wherein a tinning reduction method is applied, only tinning is carried out, and copper is not plated;
G. back drilling, namely replacing a blind hole designed by secondary pressing by using a back drilling scheme;
H. and alkaline etching is carried out, and a circuit pattern on the outer layer of the double-sided compression joint backboard is manufactured.
CN202011117408.9A 2020-10-19 2020-10-19 Manufacturing method for realizing rapid compression joint of blind hole circuit board Pending CN112105163A (en)

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Application Number Priority Date Filing Date Title
CN202011117408.9A CN112105163A (en) 2020-10-19 2020-10-19 Manufacturing method for realizing rapid compression joint of blind hole circuit board

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112638044A (en) * 2021-02-19 2021-04-09 四川英创力电子科技股份有限公司 Drilling positioning method for multilayer printed circuit board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120300395A1 (en) * 2011-05-25 2012-11-29 Evercase Technology Inc. Table pc bracket
CN103298259A (en) * 2012-02-22 2013-09-11 深南电路有限公司 Drilling technology eliminating high-speed backboard noise
CN103458627A (en) * 2013-09-07 2013-12-18 汕头超声印制板(二厂)有限公司 Double-surface pressing connecting through hole structure of printed-circuit board and machining method thereof
CN108040416A (en) * 2017-11-22 2018-05-15 江门崇达电路技术有限公司 A kind of production method of double-face aluminium substrate
CN110430668A (en) * 2019-07-24 2019-11-08 珠海崇达电路技术有限公司 Crimping hole, wiring board and production method on a kind of wiring board
US20200100366A1 (en) * 2017-05-25 2020-03-26 Saralon Gmbh Method of producing an electrical through connection between opposite surfaces of a flexible substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120300395A1 (en) * 2011-05-25 2012-11-29 Evercase Technology Inc. Table pc bracket
CN103298259A (en) * 2012-02-22 2013-09-11 深南电路有限公司 Drilling technology eliminating high-speed backboard noise
CN103458627A (en) * 2013-09-07 2013-12-18 汕头超声印制板(二厂)有限公司 Double-surface pressing connecting through hole structure of printed-circuit board and machining method thereof
US20200100366A1 (en) * 2017-05-25 2020-03-26 Saralon Gmbh Method of producing an electrical through connection between opposite surfaces of a flexible substrate
CN108040416A (en) * 2017-11-22 2018-05-15 江门崇达电路技术有限公司 A kind of production method of double-face aluminium substrate
CN110430668A (en) * 2019-07-24 2019-11-08 珠海崇达电路技术有限公司 Crimping hole, wiring board and production method on a kind of wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112638044A (en) * 2021-02-19 2021-04-09 四川英创力电子科技股份有限公司 Drilling positioning method for multilayer printed circuit board

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