CN101909409A - Manufacturing process for high-frequency multilayer mixed compression signal plate - Google Patents
Manufacturing process for high-frequency multilayer mixed compression signal plate Download PDFInfo
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- CN101909409A CN101909409A CN 201010231738 CN201010231738A CN101909409A CN 101909409 A CN101909409 A CN 101909409A CN 201010231738 CN201010231738 CN 201010231738 CN 201010231738 A CN201010231738 A CN 201010231738A CN 101909409 A CN101909409 A CN 101909409A
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Abstract
The invention relates to a manufacturing process for a high-frequency multilayer mixed compression signal plate. The existing multilayer mixed compression signal plate manufacturing process has complicated procedure, high production cost, low efficiency and energy wastage. The invention changes the compression process and the plated through hole (PTH) pretreatment process, wherein the compression process is changed as follows: typesetting is finished by two high-frequency plates and a common PP film and requires that the high-frequency plates finish compression after finishing etching; lamination is characterized in that typeset production plates are laminated into certain layers according to the production capacity of a press, and kraft paper comprises 10 pieces of old kraft paper and 10 pieces of new kraft paper; and compression is characterized by completing the finished structure of the product under high temperature and high pressure. The PTH pretreatment process is changed as follows: changing the polarity of teflon resin, inflating for 8min, desmearing for 15min, neutralizing for 5min, grinding the plates once, soaking in sodium naphthaline stock solution for 20min, and putting into a cylinder after carrying out secondary neutralizing. The invention realizes the mixed compression process of the high-frequency plate and the common PP, realizes the mass production of the mixed compression plate and reduces the production cost.
Description
Technical field
The present invention relates to the electronic circuit production field, be specifically related to a kind of manufacture craft of high-frequency multilayer mixed compression signal plate.
Background technology
The manufacture craft of existing multilayer mixed pressure signal plate comprises the heavy copper pre-treatment manufacture craft and the heavy copper pre-treatment manufacture craft of high frequency plate of common four layer signal plate pressings and manufacture craft, common four laminates.
Common four layer signal plate pressings and manufacture craft are:
I: set type (by a core material, two films and two blocks of Copper Foils are finished)
After the common central layer etching to basic no requirement (NR) standing time.
II: lamination (output according to press is superimposed as certain number of plies with typesetted production plate)
Brown paper quantity is that 15 old+5 are new
III: pressing (under HTHP, finishing the finished product structure of product)
IV: the concrete parameter of pressing is as follows:
The heavy copper pre-treatment manufacture craft of common four laminates is:
Expansion (8min) → de-smear (15min) → neutralization (5min)
The heavy copper pre-treatment manufacture craft of high frequency plate is:
Mainly be the polarity that changes the Teflon resin, sodium naphthalene stoste is soaked (20min), from the back cylinder down that neutralizes.
Above-mentioned traditional handicraft exists that program complexity, production cost height, efficient are low, shortcoming such as waste energy.
Summary of the invention
The object of the present invention is to provide a kind of manufacture craft of high-frequency multilayer mixed compression signal plate, reduce operation, promote quality, raise the efficiency energy savings, reduce production costs, can make conventional high frequency plate into 4 layers of designing requirement by two-sided according to the client,, realize the batch process of high-frequency multilayer mixed compression signal plate by the change of part of production, make double sided board into four laminates, therefore solved the long-pending excessive problem of existing high frequency board assembly.
The present invention has changed process for pressing and heavy copper pre-treating technology on the basis of traditional processing technology, thereby guarantees production quality and volume production condition.
A: the change of process for pressing:
I: set type (central layer+1 common PP sheet by two high frequency plates is finished) requires high frequency plate central layer to finish after the etching and finished pressing at 8 hours
II: superimposed (output according to press is superimposed as certain number of plies with typesetted production plate) brown paper quantity is that 10 old+10 are new
III: pressing (under HTHP, finishing the finished product structure of product)
B: the change of heavy copper pre-treating technology:
Mainly be the polarity that changes the Teflon resin, concrete parameter is as follows:
(8min) → de-smear (15min) → neutralization (5min) → nog plate (the once) → sodium naphthalene stoste that expands is soaked (20min), from the back cylinder down that neutralizes.
The invention has the advantages that: A: by having changed process for pressing and heavy copper pre-treating technology, realized the mixed pressure technology of high frequency plate and common PP, finally realized the volume production of mixed pressure plate; B: the high-frequency signal of high-frequency multilayer mixed pressing plate can satisfy client's demanding terminal; C: energy savings, reduce production costs, be beneficial to popularization.
Embodiment
With most preferred embodiment the present invention is described in further details below:
The present invention has changed process for pressing and heavy copper pre-treating technology on the basis of traditional processing technology, thereby guarantees production quality and volume production condition.
A: the change of process for pressing:
I: set type (central layer+1 common PP sheet by two high frequency plates is finished) requires high frequency plate central layer to finish after the etching and finished pressing at 8 hours, characteristics according to high frequency sheet material, surface activity can fade away after 8 hours, so the long residence time to pressing after the etching was controlled within 8 hours.To guarantee the reliability of pressing.
II: superimposed (output according to press is superimposed as certain number of plies with typesetted production plate) brown paper quantity is that 10 old+10 are new, increases by 5 new brown paper, has played compensator or trimmer pressure to a certain extent, increases the effect of film flowability.
III: pressing (under HTHP, finishing the finished product structure of product)
The maximum difference of this program change is, the film flowability preferably the 3rd step of time period increased the time, make film obtain better filling.Increase the time at gel section 3-4 between step simultaneously, reduced certain heating rate, prolonged the gel time of film.
These two kinds of settings combine, and make our pressing stability and reliability obtain good guarantee.
Claims (1)
1. the manufacture craft of high-frequency multilayer mixed compression signal plate is characterized in that it is to have changed process for pressing and heavy copper pre-treating technology on the basis of traditional processing technology, thereby guarantees production quality and volume production condition,
A: the change of process for pressing:
I: set type (central layer+1 common PP sheet by two high frequency plates is finished) requires high frequency plate central layer to finish after the etching and finished pressing at 8 hours
II: superimposed (output according to press is superimposed as certain number of plies with typesetted production plate) brown paper quantity is that 10 old+10 are new
III: pressing (under HTHP, finishing the finished product structure of product)
B: the change of heavy copper pre-treating technology:
Mainly be the polarity that changes the Teflon resin, concrete parameter is as follows:
(8min) → de-smear (15min) → neutralization (5min) → nog plate (the once) → sodium naphthalene stoste that expands is soaked (20min), from the back cylinder down that neutralizes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102317380A CN101909409B (en) | 2010-07-16 | 2010-07-16 | Manufacturing process for high-frequency multilayer mixed compression signal plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102317380A CN101909409B (en) | 2010-07-16 | 2010-07-16 | Manufacturing process for high-frequency multilayer mixed compression signal plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101909409A true CN101909409A (en) | 2010-12-08 |
| CN101909409B CN101909409B (en) | 2012-06-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102317380A Expired - Fee Related CN101909409B (en) | 2010-07-16 | 2010-07-16 | Manufacturing process for high-frequency multilayer mixed compression signal plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN101909409B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906379A (en) * | 2014-02-28 | 2014-07-02 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
| CN108323011A (en) * | 2018-01-25 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of multilayer Teflon wiring board |
| CN112165772A (en) * | 2020-09-30 | 2021-01-01 | 生益电子股份有限公司 | Mixed-pressing PCB (printed Circuit Board) glue removing process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01243602A (en) * | 1988-03-24 | 1989-09-28 | Nitto Denko Corp | High frequency circuit substrate and planar antenna using substrate concerned |
| JPH08293650A (en) * | 1995-04-24 | 1996-11-05 | Unitika Ltd | High-frequency circuit board |
| CN101400212A (en) * | 2008-08-13 | 2009-04-01 | 东莞生益电子有限公司 | Method for producing printed circuit board for local region high frequency circuit by half-addition method |
| CN101699939A (en) * | 2009-11-05 | 2010-04-28 | 深南电路有限公司 | Method for rolling PCB |
| CN101720175A (en) * | 2009-11-24 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board |
-
2010
- 2010-07-16 CN CN2010102317380A patent/CN101909409B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01243602A (en) * | 1988-03-24 | 1989-09-28 | Nitto Denko Corp | High frequency circuit substrate and planar antenna using substrate concerned |
| JPH08293650A (en) * | 1995-04-24 | 1996-11-05 | Unitika Ltd | High-frequency circuit board |
| CN101400212A (en) * | 2008-08-13 | 2009-04-01 | 东莞生益电子有限公司 | Method for producing printed circuit board for local region high frequency circuit by half-addition method |
| CN101699939A (en) * | 2009-11-05 | 2010-04-28 | 深南电路有限公司 | Method for rolling PCB |
| CN101720175A (en) * | 2009-11-24 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906379A (en) * | 2014-02-28 | 2014-07-02 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
| CN103906379B (en) * | 2014-02-28 | 2017-01-25 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
| CN108323011A (en) * | 2018-01-25 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of multilayer Teflon wiring board |
| CN108323011B (en) * | 2018-01-25 | 2020-04-14 | 深圳崇达多层线路板有限公司 | Manufacturing method of multilayer teflon circuit board |
| CN112165772A (en) * | 2020-09-30 | 2021-01-01 | 生益电子股份有限公司 | Mixed-pressing PCB (printed Circuit Board) glue removing process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101909409B (en) | 2012-06-06 |
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