CN112165772A - Mixed-pressing PCB (printed Circuit Board) glue removing process - Google Patents
Mixed-pressing PCB (printed Circuit Board) glue removing process Download PDFInfo
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- CN112165772A CN112165772A CN202011056683.4A CN202011056683A CN112165772A CN 112165772 A CN112165772 A CN 112165772A CN 202011056683 A CN202011056683 A CN 202011056683A CN 112165772 A CN112165772 A CN 112165772A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Abstract
The invention provides a mixed-compression PCB (printed circuit board) glue removing process, which comprises the following steps: s1: mix the material of different grade type and press into PCB, PCB is including removing first material and the second material that the degree of difficulty is different that glue, and the relative first material' S of the degree of difficulty of removing of the glue of second material remove the glue degree of difficulty big, S2: drilling a through hole in the laminated PCB, wherein glue residues are respectively formed on the hole walls of the hole sections corresponding to the first material and the second material in the through hole; s3, plugging the through hole with resin after drilling; s4: drilling the plug hole, processing a first drill hole with a smaller diameter on the resin in the hole section corresponding to the first material, and processing a second drill hole with a larger diameter on the resin in the hole section corresponding to the second material; s5: and selecting a glue removing mode to simultaneously remove the glue residue and the resin on the hole section corresponding to the first material and the glue residue and the resin on the hole section corresponding to the second material. The mixed-compression PCB glue removing process can realize that the glue removal of the mixed-compression PCB can be completed at one time.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a mixed-compression PCB glue removing process.
Background
With the rapid development of 5G communication technology, the terminal customer has an increasing demand for materials, and the functional demand for materials is also increasing. Currently, the structure of co-pressing the high-speed material and the FR4 material, the high-speed material and the high-frequency material, and the high-speed material and the functional material is widely used in the PCB manufacture. Because the glue removing difficulty and the ease of different types of materials are obviously different, the control of the glue removing amount of the hole wall after the PCB of the plate mixed pressing structure is drilled is always a difficult point which is wanted to be broken through by process research. Specifically, when two materials with different glue removing amounts are mixed and pressed into a PCB, glue residues are formed on the hole walls after drilling, specifically, the PCB generates instantaneous high temperature during drilling, and a substrate (usually FR-4) or a resin material used for connecting copper layers is a poor conductor, so that heat is highly accumulated during drilling, the surface temperature of the hole walls exceeds the vitrification temperature of the resin and then the resin is melted, and consequently, the resin flows along the surface of the hole walls, so that a layer of thin glue residues is formed, the glue residues are not burrs or burrs drilled during mechanical drilling, the glue residues are mainly hydrocarbon, if the glue residues are not removed, the signal lines in the multilayer board cannot be connected or the connection is not reliable, so that glue removal is needed, plasma and chemical glue removal are generally adopted, and glue removing parameters (same glue removing agent and same glue removing concentration) are adopted during glue removing process, Parameters such as degel time) often do not match the effect of removing the scum well with both materials. When selecting the gluey parameter of removing that easily removes the mucilage binding material for use, cause the glue that removes of difficult gluey material pore wall to be incomplete easily, select with the gluey parameter of removing that removes of difficult gluey material that removes, cause easily removing gluey material remove gluey excessively easily.
The research for removing the glue residue on the hole wall of the material mixed pressing PCB mainly focuses on the optimization of the glue removing parameters in the industry, however, due to the mixed pressing characteristic of the material, the selection range of the glue removing parameters is very small or even none.
Disclosure of Invention
The invention provides a mixed-compression PCB (printed Circuit Board) glue removing process which can selectively remove glue from different types of materials, thereby realizing the purpose of removing glue from a mixed-compression PCB by using a time program once and improving the glue removing effect.
A mixed-compression PCB (printed Circuit Board) glue removing process comprises the following steps:
s1: the PCB is manufactured by mixing and pressing different types of materials, the PCB comprises a first material and a second material which are different in glue removing difficulty, and the glue removing difficulty of the second material is larger than that of the first material;
s2: drilling a through hole in the laminated PCB, wherein glue residues are respectively formed on the hole walls of the hole sections corresponding to the first material and the second material in the through hole;
s3, plugging the through hole with resin;
s4: drilling is carried out on the resin in the filled through hole, a first drilling hole is processed on the resin in the hole section corresponding to the first material, a second drilling hole is processed on the resin in the hole section corresponding to the second material, the diameter of the first drilling hole is smaller than that of the second drilling hole, so that the thickness of the resin attached to the inner hole wall of the hole section corresponding to the first material is larger than that of the resin attached to the inner hole wall of the hole section corresponding to the second material, and the size of the drilling hole is required to be ensured: when the same degumming mode is used, the biting time required for removing the resin attached in the corresponding hole section of the first material and the degumming time required for removing the skim in the corresponding hole section of the first material are equal to the biting time required for removing the resin attached in the corresponding hole section of the second material and the degumming time required for removing the skim in the corresponding hole section of the second material;
s5: and selecting a glue removing mode to simultaneously remove the glue residue and the resin on the hole section corresponding to the first material and the glue residue and the resin on the hole section corresponding to the second material.
Further, in S3, a water-soluble resin or a polyimide resin is used as the resin.
Further, in S4, when drilling the first and second drill holes, the first drill hole is drilled by using a small-diameter drill or a milling cutter, and then the second drill hole with a larger diameter is drilled by replacing the large-diameter drill or the milling cutter on the resin in the hole section corresponding to the second material through the depth-controlling drill, the second drill hole has the same axis as the first drill hole, the diameter of the second drill hole is larger than that of the first drill hole, and the depth of the second drill hole corresponds to the thickness of the second material.
Further, in S4, the relation condition of the sizes of the drill holes during drilling the first drill hole and the second drill hole is ensured, and the glue removing method adopted in the early stage of the glue removing process is obtained by testing the glue removing amount of the first material and the second material in unit thickness and the resin in unit thickness.
Further, in S4 or S5, the removing method includes removing the glue by plasma or using a glue removing agent, or a combination of removing the glue by plasma or removing the glue by the plasma.
Further, in S4 or S5, when the glue is removed by the glue removing agent, the glue removing agent adopts a potassium permanganate system to remove the glue.
Further, in step S1, the co-pressing of the different types of materials includes co-pressing of the high-speed material and the FR4 material, co-pressing of the high-speed material and the high-frequency material, or co-pressing of the high-speed material and the functional material.
Further, the high speed material comprises: epoxy system resin, modified epoxy resin, PPO/PPE resin; the high-frequency material includes: hydrocarbon resin, PTFE material.
Compared with the prior art, the mixed-compression PCB degumming process has the advantages that the thickness of the resin in the hole section corresponding to the material easy to remove is larger than that of the resin in the hole section corresponding to the material difficult to remove, so that the degumming time required by the material difficult to remove, the biting time of the printing ink in the material section difficult to remove, the degumming time required by the material easy to remove and the biting time of the printing ink in the material section easy to remove are guaranteed, the degumming of the mixed-compression PCB can be completed by one time program at one time, and the degumming effect is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings, there is shown in the drawings,
FIG. 1: the invention relates to a flow chart of the steps of a mixed-compression PCB degumming process;
FIG. 2: the invention discloses a flow diagram of a mixed-compression PCB degumming process;
FIG. 3: the invention discloses a glue residue schematic diagram of a through hole of a PCB in a mixed-pressing PCB glue removing process.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As shown in fig. 1 and 2, the mixed-compression PCB glue removing process of the present invention comprises the following steps:
s1: mixing and pressing different types of materials to synthesize a PCB; the different types of materials comprise a first material and a second material which are different in glue removing difficulty, wherein the different glue removing difficulties refer to the fact that the different materials adopt the same glue removing agent; such as: the high-speed material is mixed and pressed with FR4 material, the high-speed material is mixed and pressed with high-frequency material, and the high-speed material is mixed and pressed with functional material. Referring to fig. 2, in the first embodiment, the mixed-compression PCB is stacked as the first material 11+ the second material 12, and the difficulty of removing the glue of the second material 12 is greater than that of removing the glue of the first material 11. In the present embodiment, the first material 11, the outer surface of the second material 12, and the interlayer 13 between the first material 11 and the second material 12 are copper layers.
S2: the bonded PCB is subjected to a via drilling 14. After the through hole 14 is drilled, the glue residues 16 (as shown in fig. 3) are formed on the hole walls corresponding to the first material 11 and the second material 12, and because the materials of the first material 11 and the second material 12 are different, the thickness of the glue residues 16 formed on the hole walls is different, the difficulty of removing the glue residues formed on the hole walls in the same glue removing mode is different, and the time for removing the glue residues is also different.
S3: the through hole 14 is plugged with resin 15, and the through hole 14 is filled with the resin. The resin 15 is generally polyacrylamide, polyacrylic acid, polyethylene oxide, polyvinyl alcohol, or the like.
S4: drilling the resin of the filled through hole 14, firstly drilling a first drill hole 17 with a smaller diameter, wherein the first drill hole 17 is a through hole, then drilling a second drill hole 18 with a larger diameter on the resin in the hole section corresponding to the second material 12 through depth control, wherein the second drill hole 18 and the first drill hole 17 have the same axial lead, and the diameter of the second drill hole 18 is larger than that of the first drill hole17, and the depth of the second bore hole 18 corresponds to the thickness of the second material 12, such that the first bore hole 17 with a smaller diameter is machined in the resin in the bore section corresponding to the first material 11, and the second bore hole 18 is machined in the resin in the bore section corresponding to the second material 12, such that the thickness of the resin 15 attached to the bore wall of the bore section corresponding to the first material 11 is greater than the thickness of the resin attached to the bore wall of the bore section corresponding to the second material 12, and the relationship between the bore hole sizes when drilling the first bore hole 17 and the second bore hole 18 is required to ensure that: when the same degumming mode is used, the biting time required for removing the resin attached in the hole section corresponding to the first material 11+ the degumming time required for removing the gum slag in the hole section corresponding to the first material 11 is equal to the biting time required for removing the resin attached in the hole section corresponding to the second material 12 + the degumming time required for removing the gum slag in the hole section corresponding to the second material 12; the glue removing mode adopts a resin biting mode or/and a plasma glue removing mode to remove resin attached to the hole wall due to filling and glue residues to be removed from the hole wall. Wherein, the mode of biting and biting the resin generally adopts the horizontal line mode of removing glue (adopt potassium permanganate system to remove glue solution to remove glue promptly), and its degumming principle is: under high temperature sensitive conditions, KMnO is used4The strong oxidizing property of the copper-based composite material oxidizes and decomposes resin carbon chains on the surface of the hole wall, removes the bulked and softened resin and the glue residue, exposes the hole wall and forms a honeycomb-shaped coarse structure, and improves the binding force between the hole wall and the chemical copper. In this patent, the resin (also referred to as ink) to be packed is a resin system, and is not required to be soluble in a solution, and the ink cannot be removed by solution dissolution, but is removed by bite or plasma degumming. If plasma glue removal is adopted, the plasma method is also called as a plasma method, and is a method for removing glue residues by placing a circuit board in a high-frequency electric energy environment with the vacuum degree of 200mbar and 2000W through generated plasma, is mainly used for removing the glue residues of through holes and blind holes with high aspect ratio and is also used for a polytetrafluoroethylene substrate plate, hydrocarbon in the glue residues and ions or free radicals in the plasma react to form volatile hydrocarbon, and the volatile hydrocarbon is removed through a vacuum pumping system.
The relationship between the sizes of the first and second drilled holes 17 and 18 is obtained by testing the removal amount of the first and second materials 11 and 12 per unit area and unit thickness and the resin pack in the removal manner before the removal of the glue. If the plasma glue removing method is adopted, the glue removing amount of the first material 11 and the second material 12 per unit area unit thickness and the glue removing amount of the filled resin are respectively tested by plasma, and when the glue removing agent is adopted, the glue removing agent is used for respectively testing the glue removing amount of the first material 11 and the second material 12 per unit area unit thickness and the glue removing amount of the filled resin. The test mode is conventional and will not be described here. The glue removing method can also be a combination of plasma glue removing and glue removing of the glue removing agent. The resin 15 filled in the resin is easily removed by using polyimide resin or the like, which is advantageous for removing the glue by the above-mentioned glue removing method.
S5: and selecting a glue removing mode to simultaneously remove the glue residues and the resin on the hole section corresponding to the first material 11 and the glue residues and the resin on the hole section corresponding to the second material 12. And selecting a proper glue removing mode, a glue removing time parameter and the like according to the test result of the glue removing amount of the material at the early stage to selectively remove the glue from the mixed pressing material, and finishing the glue removing. If the degumming agent adopts potassium permanganate solution, the degumming parameters comprise concentration, dosage, degumming time and the like. Although the difficulty of removing the glue of the second material 12 is high, the thickness of the resin on the hole wall of the hole section corresponding to the second material 12 is smaller than that of the resin on the hole wall of the hole section corresponding to the first material 11, the time spent on removing the resin on the hole wall of the hole section corresponding to the second material 12 is relatively less, and the time spent on removing the glue residues is relatively more, so that the same glue removing agent can be put into the whole through hole 14, the glue removing agent and the glue residues on the hole sections corresponding to the first material and the second material can be simultaneously removed, and the purpose of uniformly removing the glue residues is achieved.
Because the required degumming time of first material hole section and second material hole section is different, in order to accomplish the degumming of the first material \ second material hole section of the mixed pressure material by using a time program once, the scheme provides that the resin printing ink with a certain thickness is attached to the hole wall, the hole wall printing ink thickness of the first material hole section and the hole wall printing ink thickness of the second material hole section are different, even if the degumming time of the glue residue is different, the difference control of the resin printing ink thickness is adopted, and the degumming time required by the glue residue of the first material section and the biting time of the resin printing ink of the first material section are achieved, namely the degumming time required by the glue residue of the second material section and the biting time of the printing ink of the second material resin section.
In the scheme of the invention, basic research on the aspect of the glue removing amount of each material is carried out before the material is manufactured, so that the index of the difficulty degree of glue removing of different materials is obtained; secondly, the purpose of drilling big and small holes after plugging the holes with resin is to attach a layer of protective resin with different thicknesses to the hole walls of different materials, the protective resin attached to the material difficult to remove glue is relatively easy to remove the glue material, and the effective glue removing time of the different materials is different after the protective resin is removed by controlling the glue removing time, so that the purpose of removing glue on the hole walls of the through holes simultaneously is achieved.
In conclusion, according to the mixed-compression PCB degumming process, the small holes are formed in the hole sections corresponding to the materials easy to remove, and the large holes are formed in the hole sections corresponding to the materials difficult to remove, so that the thickness of the resin in the hole sections corresponding to the materials easy to remove is larger than that of the resin in the hole sections corresponding to the materials difficult to remove, and the degumming time required by the materials difficult to remove plus the biting time of the resin ink in the resin sections easy to remove are ensured, so that the degumming of the mixed-compression PCB can be completed by one time program at one time, and the degumming effect is improved.
Any combination of the various embodiments of the present invention should be considered as disclosed in the present invention, unless the inventive concept is contrary to the present invention; within the scope of the technical idea of the invention, any combination of various simple modifications and different embodiments of the technical solution without departing from the inventive idea of the present invention shall fall within the protection scope of the present invention.
Claims (8)
1. The mixed-compression PCB glue removing process is characterized by comprising the following steps of:
s1: the PCB is manufactured by mixing and pressing different types of materials, the PCB comprises a first material and a second material which are different in glue removing difficulty, and the glue removing difficulty of the second material is larger than that of the first material;
s2: drilling a through hole in the laminated PCB, wherein glue residues are respectively formed on the hole walls of the hole sections corresponding to the first material and the second material in the through hole;
s3, plugging the through hole with resin;
s4: drilling is carried out on the resin in the filled through hole, a first drilling hole is processed on the resin in the hole section corresponding to the first material, a second drilling hole is processed on the resin in the hole section corresponding to the second material, the diameter of the first drilling hole is smaller than that of the second drilling hole, so that the thickness of the resin attached to the inner hole wall of the hole section corresponding to the first material is larger than that of the resin attached to the inner hole wall of the hole section corresponding to the second material, and the size of the drilling hole is required to be ensured: when the same degumming mode is used, the biting time required for removing the resin attached in the corresponding hole section of the first material and the degumming time required for removing the skim in the corresponding hole section of the first material are equal to the biting time required for removing the resin attached in the corresponding hole section of the second material and the degumming time required for removing the skim in the corresponding hole section of the second material;
s5: and selecting a glue removing mode to simultaneously remove the glue residue and the resin on the hole section corresponding to the first material and the glue residue and the resin on the hole section corresponding to the second material.
2. The hybrid PCB degumming process of claim 1, wherein: in S3, a water-soluble resin or a polyimide resin is used as the resin.
3. The hybrid PCB degumming process of claim 1, wherein: in S4, when the first drill hole and the second drill hole are drilled, the first through drill hole is machined by the small-diameter drill tool or the milling cutter, then the large-diameter drill tool or the milling cutter is replaced to drill the second drill hole with a larger diameter on the resin in the hole section corresponding to the second material through the depth control drill, the second drill hole and the first drill hole have the same axial line, the diameter of the second drill hole is larger than that of the first drill hole, and the depth of the second drill hole corresponds to the thickness of the second material.
4. The hybrid PCB degumming process of claim 1, wherein: in S4, the relation condition of the sizes of the drill holes when the first drill hole and the second drill hole are drilled is ensured, and the glue removing method adopted in the earlier stage of the glue removing process is obtained by the results of the glue removing amount test on the first material, the second material and the resin.
5. The hybrid PCB degumming process of claim 1, wherein: in S4 or S5, the removing method includes removing the glue by plasma or by using a glue removing agent, or by combining the removing methods.
6. The hybrid PCB degumming process of claim 5, wherein: in S4 or S5, when the glue is removed by the glue removing agent, the glue removing agent adopts a potassium permanganate system to remove the glue solution.
7. The method for removing glue from a hybrid PCB according to claim 1, wherein: in step S1, the mixing and pressing of different types of materials includes mixing and pressing of the high-speed material and the FR4 material, mixing and pressing of the high-speed material and the high-frequency material, or mixing and pressing of the high-speed material and the functional material.
8. The method for removing glue from a hybrid PCB according to claim 7, wherein: the high-speed material comprises: epoxy system resin, modified epoxy resin, PPO/PPE resin; the high-frequency material includes: hydrocarbon resin, PTFE material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011056683.4A CN112165772B (en) | 2020-09-30 | 2020-09-30 | Mixed-pressing PCB (printed Circuit Board) glue removing process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011056683.4A CN112165772B (en) | 2020-09-30 | 2020-09-30 | Mixed-pressing PCB (printed Circuit Board) glue removing process |
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| CN112165772A true CN112165772A (en) | 2021-01-01 |
| CN112165772B CN112165772B (en) | 2021-10-01 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03229482A (en) * | 1990-02-05 | 1991-10-11 | Fujitsu Ltd | Printed wiring board with metal plate incorporated |
| CN101909409A (en) * | 2010-07-16 | 2010-12-08 | 统赢软性电路(珠海)有限公司 | Manufacturing process for high-frequency multilayer mixed compression signal plate |
| CN102523693A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures |
| CN105682382A (en) * | 2016-03-30 | 2016-06-15 | 高德（无锡）电子有限公司 | High-glass temperature rigid-flex board containing copper-free substrate layer and glue removing process of rigid-flex board |
-
2020
- 2020-09-30 CN CN202011056683.4A patent/CN112165772B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03229482A (en) * | 1990-02-05 | 1991-10-11 | Fujitsu Ltd | Printed wiring board with metal plate incorporated |
| CN101909409A (en) * | 2010-07-16 | 2010-12-08 | 统赢软性电路(珠海)有限公司 | Manufacturing process for high-frequency multilayer mixed compression signal plate |
| CN102523693A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures |
| CN105682382A (en) * | 2016-03-30 | 2016-06-15 | 高德（无锡）电子有限公司 | High-glass temperature rigid-flex board containing copper-free substrate layer and glue removing process of rigid-flex board |
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| CN112165772B (en) | 2021-10-01 |
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