CN110996509B - A kind of step groove manufacturing method and PCB - Google Patents
A kind of step groove manufacturing method and PCB Download PDFInfo
- Publication number
- CN110996509B CN110996509B CN201911421508.8A CN201911421508A CN110996509B CN 110996509 B CN110996509 B CN 110996509B CN 201911421508 A CN201911421508 A CN 201911421508A CN 110996509 B CN110996509 B CN 110996509B
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- groove
- stepped groove
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- 239000000853 adhesive Substances 0.000 claims abstract description 61
- 230000001070 adhesive effect Effects 0.000 claims abstract description 61
- 238000003825 pressing Methods 0.000 claims abstract description 35
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 239000011800 void material Substances 0.000 claims 2
- 238000003475 lamination Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 4
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the technical field of PCBs, and discloses a stepped groove manufacturing method and a PCB. The method comprises the following steps: manufacturing a step groove with non-metalized side wall and groove bottom areas; coating conductive adhesive on the groove bottom area; obtaining a pressing die which comprises a male die, wherein the male die comprises a pressing surface, the pressing surface comprises a first convex surface and a first concave surface, the first convex surface and the first concave surface are arranged in a concave-convex mode, the first concave surface is of a first designated graph, and the first designated graph is consistent with a preset groove bottom line graph; when the male die is placed in the stepped groove and the first convex surface is abutted to the groove bottom area of the stepped groove, a first gap is formed between the first concave surface and the groove bottom area; and pressing the male die and the stepped groove at a high temperature, so that the conductive adhesive flows into the first gap and is solidified to form a groove bottom circuit pattern. According to the embodiment of the invention, the required groove bottom circuit pattern can be prepared by coating the conductive adhesive with the specified thickness at the groove bottom and then placing the conductive adhesive into the groove by adopting the special pressing die for pressing, so that the preparation process can be greatly simplified, the preparation difficulty is reduced, and the production efficiency is effectively improved.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a stepped groove manufacturing method and a PCB.
Background
The stepped groove has special structure and electric performance, and is widely applied to three-dimensional assembly, reduction of the assembly volume of electric equipment, special electric performance and the like.
At present, the manufacturing process of the printed circuit board is various, but for the step groove with the non-metallized side wall, the general manufacturing method is as follows: firstly, making a groove bottom pattern on a core plate/daughter plate positioned at the groove bottom, and then making a stepped groove. The manufacturing method has the following defects: because the mode of firstly manufacturing the groove bottom graph is adopted, the groove bottom graph needs to be protected before the subsequent step groove manufacturing, the whole process flow is long and complicated, the requirements on each process precision are high, the manufacturing difficulty is high, and the popularization and the application of the step groove graph plate are restricted.
Disclosure of Invention
The invention aims to provide a stepped groove manufacturing method and a PCB (printed Circuit Board), which overcome the defects of complex manufacturing process and high manufacturing difficulty in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method of a stepped groove comprises the following steps:
manufacturing a step groove with non-metalized side wall and groove bottom areas;
coating conductive adhesive on the bottom area of the stepped groove;
obtaining a pressing mold, wherein the pressing mold comprises a male mold, the male mold comprises a pressing surface, the pressing surface comprises a first convex surface and a first concave surface, the first convex surface and the first concave surface are arranged in a concave-convex mode, the first convex surface and the first concave surface are in a first appointed graph, and the first appointed graph is consistent with a preset groove bottom line graph; when the male die is placed in the stepped groove and the first convex surface is abutted against the groove bottom area of the stepped groove, a first gap is formed between the first concave surface and the groove bottom area;
and pressing the male die and the stepped groove at a high temperature to press the pressing surface of the male die from the upper position of the conductive adhesive until the first convex surface is abutted against the groove bottom area, so that the conductive adhesive flows into the first gap and is cured to form the groove bottom line pattern.
Optionally, the size of the male die is consistent with the inner size of the stepped groove, and when the male die is placed in the stepped groove, the side wall of the male die is attached to the side wall of the stepped groove.
Optionally, a height difference between the first convex surface and the first concave surface is consistent with a preset height of the groove bottom line pattern; the coating amount of the conductive adhesive is consistent with the theoretical value of the adhesive amount required for preparing the groove bottom line pattern.
Optionally, the size of the male die is smaller than the internal size of the stepped groove, the male die further comprises a side wall, and the side wall is of a planar structure;
when the male die is placed in the stepped groove and the first convex surface abuts against the groove bottom region of the stepped groove, a second gap is formed between the side wall of the male die and the side wall of the stepped groove;
and the coating amount of the conductive adhesive is larger than the theoretical value of the adhesive amount required for preparing the groove bottom line graph, so that the conductive adhesive can partially flow into the second gap and be solidified in the high-temperature pressing process to form a conductive layer attached to the side wall of the stepped groove.
Optionally, the size of the male die is consistent with the inner size of the stepped groove; the side wall of the male die comprises a second convex surface and a second concave surface in a second specified pattern, wherein the second convex surface is arranged in a concave-convex manner;
when the male die is placed in the stepped groove and the first convex surface abuts against the groove bottom region of the stepped groove, the second convex surface of the side wall of the male die abuts against the side wall of the stepped groove, and a second gap is formed between the second concave surface and the side wall of the stepped groove;
and the coating amount of the conductive adhesive is larger than the theoretical value of the adhesive amount required for preparing the groove bottom line graph, so that the conductive adhesive can partially flow into the second gap and be solidified to form a conductive layer attached to the side wall of the stepped groove.
Optionally, before the convex die is placed in the stepped groove, the method further includes: and coating the conductive adhesive on the side wall of the stepped groove.
Optionally, a height difference between the first convex surface and the first concave surface is consistent with a preset height of the groove bottom line pattern; the width of the second gap is consistent with the preset thickness of the conductive layer attached to the side wall of the stepped groove;
the coating amount of the conductive adhesive is consistent with the sum of theoretical glue amount values required by manufacturing the groove bottom line pattern and the conductive layer with the preset thickness attached to the whole side wall of the stepped groove.
Optionally, the step groove manufacturing method further includes: and after the conductive adhesive is coated, preheating and solidifying the conductive adhesive.
A PCB comprises a stepped groove, wherein the stepped groove is manufactured according to any one of the above stepped groove manufacturing methods.
Compared with the prior art, the invention has the beneficial effects that:
according to the embodiment of the invention, the required groove bottom circuit pattern can be prepared by coating the conductive adhesive with the specified thickness at the groove bottom and then placing the conductive adhesive into the groove by adopting the special pressing die for pressing, so that the preparation process can be greatly simplified, the preparation difficulty is reduced, and the production efficiency is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a flowchart of a method for manufacturing a stepped trench according to an embodiment of the present invention;
fig. 2 is a schematic view of a step groove manufacturing process provided in the first embodiment of the present invention;
fig. 3 is a flowchart of a method for manufacturing a stepped trench according to a second embodiment of the present invention;
fig. 4 is a schematic view of a step groove manufacturing process provided in the second embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing a stepped trench according to a third embodiment of the present invention;
fig. 6 is a schematic view of a step groove manufacturing process provided by a third embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1 and 2, the method for manufacturing a stepped trench provided in this embodiment is suitable for manufacturing a stepped trench with a non-metalized sidewall, and specifically includes the following steps:
In the subsequent step of pressing to form the pattern of the groove bottom line, the male mold 10 is used to extend into the stepped groove and contact the surface of the groove bottom to generate pressure. Based on this, the press-fit surface specifically means: after the punch 10 has been inserted into the stepped groove, the surface of the punch 10 facing the groove bottom region.
The size of the male die 10 is substantially consistent with the inner size of the stepped groove, so that after the male die 10 is placed in the stepped groove, the side wall of the male die 10 is tightly attached to the side wall of the stepped groove, the first convex surface 12 of the pressing surface of the male die 10 is abutted to the groove bottom area, and a first gap is formed between the first concave surface 11 and the groove bottom area.
The first designated pattern is substantially consistent with the shape and size of the preset groove bottom line pattern.
And 102, manufacturing the integral non-metalized stepped groove 20.
The steps may specifically include:
according to the size and the position of the step groove to be manufactured, grooving treatment is carried out on a first appointed core plate and an appointed prepreg of the groove body to be formed, and copper layer removing treatment is carried out on the groove bottom area of a second appointed core plate positioned at the groove bottom;
stacking the core plates and the prepregs in sequence, wherein after the core plates and the prepregs are stacked, the slotting regions of the first appointed core plate and the appointed prepregs form a groove body of the step groove to be manufactured;
and (5) high-temperature pressing.
It is to be understood that, since the operation objects and the operation processes of step 101 and step 102 are not related to each other, the operation order between the two steps may be interchanged, and may also be performed synchronously, which is not limited in particular.
And 103, coating the conductive adhesive 30 on the bottom area of the stepped groove 20.
The coating amount of the conductive paste 30 is substantially identical to the theoretical amount of paste required for manufacturing a predetermined pattern of the groove bottom line.
It should be noted that the height difference between the first convex surface 12 and the first concave surface 11 can be set according to the height manufacturing requirement of the groove bottom line pattern. On the basis, under the condition that the conductive adhesive 30 can be ensured to fill the first gap, the coating thickness of the conductive adhesive 30 is calculated and set so as to effectively control the manufacturing precision of the groove bottom circuit pattern.
And 104, pressing the male die 10 and the stepped groove 20 at a high temperature to press the pressing surface of the male die 10 from the upper position of the conductive adhesive 30 until the first convex surface 12 abuts against the groove bottom area, so that the conductive adhesive 30 completely flows into the first gap and is cured, and thus a preset groove bottom line pattern is obtained.
After the male die 10 is placed in the stepped groove 20, in the process that the first convex surface 12 of the press-fit surface is pressed down from the surface of the conductive adhesive 30 until the first convex surface abuts against the groove bottom region, the conductive adhesive 30 flows to the corresponding position of the first concave surface 11 under the action of the first convex surface 12, and finally the conductive adhesive 30 can completely flow into and fill a first gap formed between the first concave surface 11 and the groove bottom region, so that a first specified pattern is formed through conversion, and a groove bottom circuit pattern is formed.
In this embodiment, since the conductive adhesive 30 is only coated on the bottom of the trench, the coating amount just meets the requirement for manufacturing the trench bottom line pattern, and the sidewall of the convex mold 10 inserted into the stepped trench 20 is tightly attached to the sidewall of the stepped trench 20, so that all the conductive adhesive 30 on the bottom of the trench can be smoothly formed into the trench bottom line pattern, and no conductive adhesive 30 flows into the sidewall of the stepped trench 20, thereby obtaining the stepped trench 20 with non-metallized sidewall and trench bottom line pattern.
Compared with the conventional manufacturing mode, the required line pattern at the bottom of the groove can be manufactured by coating the conductive adhesive 30 with the specified thickness at the bottom of the groove and then placing the conductive adhesive into the groove by adopting the special pressing die for pressing, so that the manufacturing process can be greatly simplified, the manufacturing difficulty is reduced, and the production efficiency is effectively improved.
Example two
Referring to fig. 3 and 4, the second embodiment provides another method for manufacturing a step trench with a metalized sidewall, which includes the following steps:
The overall size of the male die 10 is slightly smaller than the internal size of the stepped groove to be manufactured, so that when the male die 10 is placed in the stepped groove 20 and the first convex surface 12 of the pressing surface of the male die 10 abuts against the groove bottom area, a first gap is formed between the first concave surface 11 and the groove bottom area, and a second gap is formed between the side wall of the male die 10 and the side wall of the stepped groove 20.
And step 203, coating the conductive adhesive 30 on the bottom area of the stepped groove 20.
The coating amount of the conductive adhesive 30 is larger than the theoretical value of the adhesive amount required for preparing the preset groove bottom line pattern.
And 204, pressing the male die 10 and the stepped groove 20 at a high temperature to press the pressing surface of the male die 10 from the upper position of the conductive adhesive 30 until the first convex surface 12 abuts against the groove bottom area, so that the conductive adhesive 30 flows into the first gap and the second gap and is cured, and thus a preset groove bottom circuit pattern and a conductive layer attached to the side wall of the stepped groove 20 are obtained.
In the pressing process, the conductive adhesive 30 coated on the groove bottom area flows into and fills the first gap to form a groove bottom circuit pattern, and the redundant part flows upwards into the second gap to form a conductive layer attached to the side wall of the stepped groove 20, so that the stepped groove 20 with the side wall metalized and the groove bottom circuit pattern is finally obtained.
It should be noted that the sidewall of the stepped trench 20 can be metalized or fully metalized by adjusting the coating amount of the conductive adhesive 30 on the bottom region of the trench. A certain amount of conductive paste 30 may be additionally coated on the sidewall of the stepped trench 20 and pre-heated for solidification, so as to enlarge the sidewall metallization region and improve the sidewall metallization effect (e.g., uniformity).
In order to fully metalize the sidewalls, the total coating amount of the conductive adhesive 30 needs to be not less than the sum of theoretical amounts of adhesive required to manufacture the predetermined bottom line pattern and the conductive layer of the sidewall of the stepped trench.
EXAMPLE III
Referring to fig. 5 and 6, the third embodiment provides another method for manufacturing a step trench with a metalized sidewall, which includes the following steps:
The size of the male die 10 is substantially consistent with the internal size of the stepped groove to be manufactured, so that when the male die 10 is placed in the stepped groove 20 and the first convex surface 12 of the pressing surface of the male die 10 abuts against the groove bottom region, the first concave surface 11 forms a first gap with the groove bottom region, the second convex surface 14 of the side wall of the male die 10 abuts against the side wall of the stepped groove 20, and the second concave surface 13 forms a second gap with the side wall of the stepped groove 20.
The coating amount of the conductive adhesive 30 is larger than the theoretical value of the adhesive amount required for preparing the preset groove bottom line pattern.
304, pressing the male die 10 and the stepped groove 20 at a high temperature to press the pressing surface of the male die 10 from the upper position of the conductive adhesive 30 until the first convex surface 12 abuts against the groove bottom area, so that the conductive adhesive 30 flows into the first gap and the second gap and is cured, and thus a preset groove bottom circuit pattern and a conductive pattern formed on the side wall of the stepped groove 20 are obtained;
in the pressing process, the conductive adhesive 30 coated on the groove bottom area flows into and fills the first gap to form a groove bottom line pattern; the excess portion then flows upward into the second gap to form a conductive layer in a second designated pattern attached to the sidewall of the stepped trench 20, finally obtaining the stepped trench 20 with sidewall metallization and a trench bottom line pattern. A certain amount of conductive paste 30 may be additionally coated on the sidewall of the step trench to enlarge the sidewall metallization region and improve the sidewall metallization effect (e.g., uniformity).
In addition, the second designated pattern can be optionally set according to the manufacturing requirement, and is not limited specifically. On the premise that the coating amount of the conductive adhesive 30 is sufficient, a step groove with a side wall conductive layer in any specified pattern can be manufactured.
Example four
The fourth embodiment provides a PCB, which includes a stepped groove, and the stepped groove is manufactured according to any one of the stepped groove manufacturing methods provided in the first to third embodiments.
Different from the conventional PCB product, the pattern of the bottom line of the stepped slot of the PCB of this embodiment is made of the conductive adhesive 30, and when the partial or all side walls of the stepped slot are metallized, the conductive adhesive 30 layer attached to the side walls may be in any second designated shape.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911421508.8A CN110996509B (en) | 2019-12-31 | 2019-12-31 | A kind of step groove manufacturing method and PCB |
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| CN201911421508.8A CN110996509B (en) | 2019-12-31 | 2019-12-31 | A kind of step groove manufacturing method and PCB |
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| CN110996509B true CN110996509B (en) | 2021-04-09 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114080121B (en) * | 2020-08-20 | 2024-04-12 | 庆鼎精密电子（淮安）有限公司 | Method for manufacturing embedded element circuit board and embedded element circuit board |
| CN113207236A (en) * | 2021-04-19 | 2021-08-03 | 珠海杰赛科技有限公司 | Method for manufacturing printed circuit board |
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|---|---|---|---|---|
| EP0138673A2 (en) * | 1983-09-21 | 1985-04-24 | Allied Corporation | Method of making a printed circuit board |
| JPH03138994A (en) * | 1989-10-24 | 1991-06-13 | Matsushita Electric Ind Co Ltd | Circuit board having through holes |
| US6073344A (en) * | 1999-01-28 | 2000-06-13 | International Business Machines Corporation | Laser segmentation of plated through-hole sidewalls to form multiple conductors |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| US8932474B1 (en) * | 2013-03-05 | 2015-01-13 | Eastman Kodak Company | Imprinted multi-layer micro structure method |
| CN105472888A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Manufacturing method of circuit board |
| CN105764238A (en) * | 2015-06-25 | 2016-07-13 | 东莞生益电子有限公司 | A kind of manufacturing method of stepped groove PCB and PCB |
| CN107396543A (en) * | 2017-07-13 | 2017-11-24 | 苏州维业达触控科技有限公司 | The preparation method and dual-side imprinting conducting film of dual-side imprinting conducting film, circuit board and touch module |
-
2019
- 2019-12-31 CN CN201911421508.8A patent/CN110996509B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0138673A2 (en) * | 1983-09-21 | 1985-04-24 | Allied Corporation | Method of making a printed circuit board |
| JPH03138994A (en) * | 1989-10-24 | 1991-06-13 | Matsushita Electric Ind Co Ltd | Circuit board having through holes |
| US6073344A (en) * | 1999-01-28 | 2000-06-13 | International Business Machines Corporation | Laser segmentation of plated through-hole sidewalls to form multiple conductors |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| US8932474B1 (en) * | 2013-03-05 | 2015-01-13 | Eastman Kodak Company | Imprinted multi-layer micro structure method |
| CN105472888A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Manufacturing method of circuit board |
| CN105764238A (en) * | 2015-06-25 | 2016-07-13 | 东莞生益电子有限公司 | A kind of manufacturing method of stepped groove PCB and PCB |
| CN107396543A (en) * | 2017-07-13 | 2017-11-24 | 苏州维业达触控科技有限公司 | The preparation method and dual-side imprinting conducting film of dual-side imprinting conducting film, circuit board and touch module |
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