CN105992468A - Method for processing PCB in-hole circuit - Google Patents
Method for processing PCB in-hole circuit Download PDFInfo
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- CN105992468A CN105992468A CN201510092848.6A CN201510092848A CN105992468A CN 105992468 A CN105992468 A CN 105992468A CN 201510092848 A CN201510092848 A CN 201510092848A CN 105992468 A CN105992468 A CN 105992468A
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- hole
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Abstract
An embodiment of the invention discloses a method for processing a PCB in-hole circuit, and the method is used for solving the problems of the existing PCB in-hole wiring technology that an in-hole circuit precision is difficult to master and a circuit on a PCB is prone to damage. The method comprises the steps of: providing a PCB multilayer board, wherein a plated-through hole is formed in the PCB multilayer board; arranging a corrosion resistant layer on the hole wall of the plated-through hole; removing part of the corrosion resistant layer on the hole wall of the plated-through hole by using a drilling tool; and removing hole copper, which is not protected by the corrosion resistant layer, of the plated-through hole through etching, wherein the reserved hole copper forms at least two independent in-hole circuits.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to the processing method of circuit in a kind of PCB aperture.
Background technology
Integrated level now with printed circuit board (PCB) (Printed Circuit Board, PCB) is more and more higher,
Lines closeness is increasing, and pcb board free space is fewer and feweri, and conventional plated-through hole design exists
Some field can not meet requirement, and the demand walking multi-line in a plated through-hole can gradually manifest,
At present bulk article does not also occur.
In the PCB aperture of prior art, the processing method of circuit is: carry out the multi-layer PCB Making programme of routine,
The internal layer completing multi-layer PCB makes and the making of outer layer metal hole；Utilize less than current plated through-hole directly
The drill bit in footpath, prolongs plated through-hole Side wall drill aperture, thus is removed by the partial hole copper of metalized sidewall, not
Removed hole copper forms circuit in hole, owing to being drilled with aperture at the hole wall of plated through-hole, ultimately forms
Via is no longer the circular port of standard.
But, plated through-hole diameter is the least, when cabling is more in plated through-hole, uses drill bit
Sidewall is holed, is difficult to grasp to the precision of circuit, if circuit is close from grommet on PCB,
Hole wall at plated through-hole bores aperture, may destroy the circuit on PCB.
Summary of the invention
Embodiments provide the processing method of cabling in a kind of PCB aperture, to solve existing PCB
In hole, in routing technology hole, circuit precision is difficult to grasp and the problem of circuit on destructible PCB.
The present invention provides the processing method of cabling in a kind of PCB aperture, it is characterised in that including:
Thering is provided PCB multilayer board, described PCB multilayer board has plated through-hole；
Hole wall at described plated through-hole arranges resist layer；
Drill is utilized to be removed by the part resist layer on the hole wall of described plated through-hole；
The hole copper etching do not protected by resist layer of described plated through-hole being removed, the hole copper of reservation is formed extremely
Circuit in few two holes independent of each other.
As can be seen from the above technical solutions, the embodiment of the present invention has the advantage that
In the embodiment of the present invention, the hole wall at the plated through-hole of PCB multilayer board arranges resist layer, utilizes and bores
Part resist layer on the hole wall of plated through-hole is removed by cutter, by not protected by resist layer of plated through-hole
Hole copper etching is removed, and the hole copper of reservation forms circuit at least two holes independent of each other, anti-by arranging
Lose layer and control the size of drill so that the hole copper of part being removed, in formation hole during circuit, is not breaking
The prototype of bad plated through-hole, when this improves multi-line in hole, the precision of the course of processing, also will not break
Circuit on bad PCB, improves the efficiency of processing.
Accompanying drawing explanation
In order to be illustrated more clearly that embodiment of the present invention technical scheme, below will be to embodiment and prior art
In description, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only
It is only some embodiments of the present invention, for those of ordinary skill in the art, is not paying creativeness
On the premise of work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic flow sheet of the processing method of circuit in a kind of PCB aperture in the embodiment of the present invention；
Fig. 2 is the schematic diagram of PCB multilayer board in the embodiment of the present invention；
Fig. 3 is the schematic diagram forming resist layer in the embodiment of the present invention；
Fig. 4 is the schematic diagram of many prismatics drill bit in the embodiment of the present invention；
Fig. 5 is the schematic diagram forming resist layer figure in the embodiment of the present invention；
Fig. 6 is to form the schematic diagram of circuit in hole in the embodiment of the present invention.
Detailed description of the invention
Embodiments provide the processing method of circuit in a kind of PCB aperture, be used for solving existing
In PCB aperture, in routing technology hole, circuit precision is difficult to grasp and the problem of circuit on destructible PCB.
In order to make those skilled in the art be more fully understood that the present invention program, real below in conjunction with the present invention
Execute the accompanying drawing in example, the technical scheme in the embodiment of the present invention be clearly and completely described, it is clear that
Described embodiment is only the embodiment of a present invention part rather than whole embodiments.Based on
Embodiment in the present invention, those of ordinary skill in the art are obtained under not making creative work premise
The every other embodiment obtained, all should belong to the scope of protection of the invention.
Below by specific embodiment, it is described in detail respectively.
Refer to Fig. 1, the processing method of circuit in the embodiment of the present invention a kind of PCB aperture of offer, it may include:
101, providing PCB multilayer board, PCB multilayer board has plated through-hole；
In the embodiment of the present invention, it is provided that a kind of PCB multilayer board, PCB multilayer board has plated through-hole, as
Shown in Fig. 2, PCB multilayer board 20 has the plated through-hole of circle, and the hole wall 201 of plated through-hole is copper.
It should be noted that PCB multilayer board can use one piece of dual platen to make internal layer, two pieces of single sided boards are made
Outer layer, or two pieces two-sided make internal layer, two pieces of one sides make outer layer, replaced one by adhesive material
Rise and conductive pattern is interconnected forming four layers or six layers of PCB multilayer board, concrete making by design requirement
Process and the number of plies do not limit.
102, the hole wall at plated through-hole arranges resist layer；
In the embodiment of the present invention, as it is shown on figure 3, use electroplating technology at hole wall 201 table of plated through-hole
Face plating last layer stannum or slicker solder, as resist layer 301, it should be noted that resist layer 301 can also be
Other erosion-resisting material, does not limits.
103, drill is utilized to be removed by the part resist layer on the hole wall of plated through-hole；
In the embodiment of the present invention, drill has many prismatics drill bit, and as shown in Figure 4, drill bit 401 is Rhizoma Sparganii
Shape drill bit, it should be noted that the diameter of drill bit is not more than the diameter of plated through-hole, the shape of drill bit with
Depending on material is according to practical situation, do not limit, control drill bit 401 and be perpendicular to plated through-hole
It is positioned over the first opening part of plated through-hole, controls drill and carry out the rotation of presetting angle, so that bore
Resist layer 301 in rotational angle is removed by the corner angle of 401 when rotating, then by drill bit 401 from gold
The first opening part in genusization hole moves to the second opening part, be formed in parallel with plated through-hole axis three
Bar resist layer independent of each other figure 501, it should be noted that the quantity of resist layer figure 501 and width
Depend on presetting angle and the corner angle quantity of drill bit 401 that drill rotates, do not limit.
104, the hole copper etching do not protected by resist layer of plated through-hole is removed.
In the embodiment of the present invention, use alkaline etching technique the plated through-hole shown in Fig. 5 is etched, not by
The hole copper of resist layer figure 501 protection will be removed, and the hole copper of reservation is formed in three holes independent of each other
Circuit, it should be noted that in hole the quantity of circuit and width depend on presetting angle that drill rotates with
And the corner angle quantity of drill bit 401, do not limit.Such as in hole circuit can be four, six
Bar, or more a plurality of etc..
In some embodiments of the invention, after step 104, resist layer figure 501 is removed,
Obtain circuit 601 in hole as shown in Figure 6.
In some embodiments of the invention, the orifice ring of plated through-hole is divided at least two part, often
In one cylindrical void, circuit is by a part for orifice ring and the connection in PCB multilayer board.
Therefore, the hole wall at the plated through-hole of PCB multilayer board arranges resist layer, utilizes drill by gold
Part resist layer on the hole wall in genusization hole is removed, and is lost by the hole copper do not protected by resist layer of plated through-hole
Carving and remove, the hole copper of reservation forms circuit at least two holes independent of each other, by arrange resist layer and
Control the size of drill so that removed by the hole copper of part, in formation hole during circuit, do not destroying metal
Changing the prototype in hole, when this improves multi-line in hole, the precision of the course of processing, also will not destroy PCB
On circuit, improve the efficiency of processing.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and does not has in certain embodiment
The part described in detail, may refer to the associated description of other embodiments.
The microetch processing system provided the embodiment of the present invention above and equipment are described in detail, but
The explanation of above example is only intended to help to understand method and the core concept thereof of the present invention, should not be understood
For limitation of the present invention.Those skilled in the art, according to the thought of the present invention, in the present invention
In the technical scope disclosed, the change that can readily occur in or replacement, all should contain the protection model in the present invention
Within enclosing.
Claims (8)
1. the processing method of circuit in a PCB aperture, it is characterised in that including:
Thering is provided PCB multilayer board, described PCB multilayer board has plated through-hole；
Hole wall at described plated through-hole arranges resist layer；
Drill is utilized to be removed by the part resist layer on the hole wall of described plated through-hole；
The hole copper etching do not protected by resist layer of described plated through-hole being removed, the hole copper of reservation is formed extremely
Circuit in few two holes independent of each other.
Processing method the most according to claim 1, it is characterised in that
Described drill has many prismatics drill bit.
Processing method the most according to claim 1 and 2, it is characterised in that described utilize drill will
Part resist layer on the hole wall of described plated through-hole is removed and is included:
Control many prismatics drill bit of described drill to be perpendicular to described plated through-hole and be positioned over described plated through-hole
First opening part, the diameter of described many prismatics drill bit is not more than the diameter of described plated through-hole；
Controlling described drill and carry out the rotation of presetting angle, the corner angle of described many prismatics drill bit are by rotational angle
Interior resist layer is removed；
The described many prismatics drill bit described first opening part in described plated through-hole is moved to the second opening
Place, at least two resist layer figures independent of each other of the axis being formed in parallel with described plated through-hole.
Processing method the most according to claim 1, it is characterised in that
The material of described resist layer is stannum or slicker solder.
Processing method the most according to claim 4, it is characterised in that described at described plated through-hole
Hole wall resist layer be set include:
Electroplating technology is used to plate last layer stannum or slicker solder, with described one at the hole wall surface of described plated through-hole
Layer stannum or slicker solder are as resist layer.
Processing method the most according to claim 1, it is characterised in that described described drill is carried out
The rotation of presetting angle, the corner angle of described many prismatics drill bit are gone back after being removed by the resist layer in rotational angle
Including:
Remove described resist layer.
Processing method the most according to claim 1, it is characterised in that also include:
The orifice ring of described plated through-hole is divided at least two part, and in each described hole, circuit passes through
A part for described orifice ring and the connection in described PCB multilayer board.
8. a PCB multilayer board, it is characterised in that described PCB multilayer board has the metallization of circle
Hole, has a circuit at least two holes independent of each other in described plated through-hole, described at least two each other
In independent hole, circuit connects the circuit of the zones of different on described PCB multilayer board surface respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510092848.6A CN105992468A (en) | 2015-03-02 | 2015-03-02 | Method for processing PCB in-hole circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510092848.6A CN105992468A (en) | 2015-03-02 | 2015-03-02 | Method for processing PCB in-hole circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105992468A true CN105992468A (en) | 2016-10-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510092848.6A Pending CN105992468A (en) | 2015-03-02 | 2015-03-02 | Method for processing PCB in-hole circuit |
Country Status (1)
| Country | Link |
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| CN (1) | CN105992468A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529291A (en) * | 2017-09-27 | 2017-12-29 | 生益电子股份有限公司 | A kind of PCB preparation methods and PCB |
| CN107592756A (en) * | 2017-09-27 | 2018-01-16 | 生益电子股份有限公司 | The preparation method of high-density multi-layered PCB a kind of and high-density multi-layered PCB |
| CN107708334A (en) * | 2017-09-27 | 2018-02-16 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN107708298A (en) * | 2017-09-27 | 2018-02-16 | 生益电子股份有限公司 | A kind of PCB processing method and PCB |
| CN107835588A (en) * | 2017-09-27 | 2018-03-23 | 生益电子股份有限公司 | The preparation method and multi-layer PCB of a kind of multi-layer PCB |
| CN108471679A (en) * | 2018-04-04 | 2018-08-31 | 生益电子股份有限公司 | A kind of processing method and PCB of the PCB of high-density wiring |
| CN109757037A (en) * | 2017-11-07 | 2019-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | High density circuit board and preparation method thereof |
| CN111182733A (en) * | 2020-01-16 | 2020-05-19 | 深圳市志金电子有限公司 | Circuit board manufacturing process with side wall circuit and circuit board manufacturing process |
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| US4847114A (en) * | 1984-01-26 | 1989-07-11 | Learonal, Inc. | Preparation of printed circuit boards by selective metallization |
| US20050196898A1 (en) * | 2004-03-02 | 2005-09-08 | Kwun-Yao Ho | Process of plating through hole |
| TW201021653A (en) * | 2008-11-20 | 2010-06-01 | yan-jun Xiao | Chemical and non-chemical via-hole formation methods for circuit board |
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| CN102143660A (en) * | 2010-01-28 | 2011-08-03 | 竞陆电子(昆山)有限公司 | Half-hole machining process for printed circuit board |
| CN203040018U (en) * | 2013-01-16 | 2013-07-03 | 遂宁市英创力电子科技有限公司 | High-performance half-hole circuit board |
| EP2792223A1 (en) * | 2011-12-13 | 2014-10-22 | Thales | Process for producing a printed circuit board |
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2015
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Patent Citations (7)
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|---|---|---|---|---|
| US4847114A (en) * | 1984-01-26 | 1989-07-11 | Learonal, Inc. | Preparation of printed circuit boards by selective metallization |
| US20050196898A1 (en) * | 2004-03-02 | 2005-09-08 | Kwun-Yao Ho | Process of plating through hole |
| TW201021653A (en) * | 2008-11-20 | 2010-06-01 | yan-jun Xiao | Chemical and non-chemical via-hole formation methods for circuit board |
| CN102143660A (en) * | 2010-01-28 | 2011-08-03 | 竞陆电子(昆山)有限公司 | Half-hole machining process for printed circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529291A (en) * | 2017-09-27 | 2017-12-29 | 生益电子股份有限公司 | A kind of PCB preparation methods and PCB |
| CN107592756A (en) * | 2017-09-27 | 2018-01-16 | 生益电子股份有限公司 | The preparation method of high-density multi-layered PCB a kind of and high-density multi-layered PCB |
| CN107708334A (en) * | 2017-09-27 | 2018-02-16 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN107708298A (en) * | 2017-09-27 | 2018-02-16 | 生益电子股份有限公司 | A kind of PCB processing method and PCB |
| CN107835588A (en) * | 2017-09-27 | 2018-03-23 | 生益电子股份有限公司 | The preparation method and multi-layer PCB of a kind of multi-layer PCB |
| CN109757037A (en) * | 2017-11-07 | 2019-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | High density circuit board and preparation method thereof |
| CN108471679A (en) * | 2018-04-04 | 2018-08-31 | 生益电子股份有限公司 | A kind of processing method and PCB of the PCB of high-density wiring |
| CN111182733A (en) * | 2020-01-16 | 2020-05-19 | 深圳市志金电子有限公司 | Circuit board manufacturing process with side wall circuit and circuit board manufacturing process |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161005 |
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| RJ01 | Rejection of invention patent application after publication |