CN107708334A - A kind of PCB preparation method and PCB - Google Patents
A kind of PCB preparation method and PCB Download PDFInfo
- Publication number
- CN107708334A CN107708334A CN201710890559.XA CN201710890559A CN107708334A CN 107708334 A CN107708334 A CN 107708334A CN 201710890559 A CN201710890559 A CN 201710890559A CN 107708334 A CN107708334 A CN 107708334A
- Authority
- CN
- China
- Prior art keywords
- pcb
- preparation
- copper
- stepped throughhole
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
Abstract
The invention discloses the preparation method of PCB a kind of and PCB, the preparation method includes：Core material is completed to press to form PCB with outer layer core plate after inner line figure makes；Stepped throughhole is made on the pcb and heavy copper plating is carried out to the stepped throughhole；The stepped throughhole axially includes first through hole portion and the second through-hole section along it, and the aperture in the first through hole portion is more than the aperture of the second through-hole section；Radial direction of the layers of copper of the stepped throughhole inwall along the stepped throughhole is disconnected at least two parts to be formed and be mutually not turned on.In the embodiment of the present invention, the layers of copper of stepped throughhole inwall on PCB can form mutually be not turned on four parts by opening operation twice, can be separately as a network connectivity layer per part layers of copper, so that a stepped throughhole position realizes four network connectivity layers, number of vias can be greatly reduced, improve PCB wiring density.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed substrate) technical field, more particularly to one kind
PCB preparation method and PCB.
Background technology
With the development of high density integrated circuit technology and microelectric technique, the volume of electronic product become it is lighter, thinner,
It is smaller.At present, in high multi-layer PCB makes wires design, different interlayer network connections are all to utilize via, and a via leads to
Often only design a network connectivity layer.Because each via occupies certain area, the bigger design grid of PCB capacity on pcb board face
Network is more, and the quantity of via is more, and the design area in such pcb board face is bigger, and this can not just meet that electronic product is thinner
Smaller requirement.
The content of the invention
It is an object of the invention to provide the preparation method of PCB a kind of and PCB, overcomes product cloth present in prior art
The defects of line density is low.
To use following technical scheme up to this purpose, the present invention：
A kind of PCB preparation method, the preparation method include：
Core material is completed to press to form PCB with outer layer core plate after inner line figure makes；
Stepped throughhole is made on the pcb and heavy copper plating is carried out to the stepped throughhole；It is described stepped logical
Hole axially includes first through hole portion and the second through-hole section along it, and the aperture in the first through hole portion is more than the hole of the second through-hole section
Footpath；
Radial direction of the layers of copper of the stepped throughhole inwall along the stepped throughhole is disconnected to be formed mutually be not turned on to
Few two parts.
Optionally, the stepped throughhole axially also includes third through-hole portion along it, and second through-hole section is located at first
Between through-hole section and third through-hole portion；The aperture in the third through-hole portion is more than the aperture of the second through-hole section.
Optionally, the preparation method also includes：Remove all or at least a portion copper of the second through-hole section side wall
Layer so that axial direction of the layers of copper of the stepped throughhole inwall along the stepped throughhole disconnects at least two for being formed and being mutually not turned on
Part.
Optionally, in the preparation method, using holes drilled through, chemical etching or laser ablation mode, described the is removed
Whole layers of copper or at least a portion layers of copper of two through-hole section side walls.
Optionally, it is described by way of holes drilled through, remove the method bag of whole layers of copper of the second through-hole section side wall
Include：
Columnar through holes are bored at the stepped throughhole of the PCB；The aperture of the columnar through holes is more than the second through-hole section
Aperture, while less than the first through hole portion and the aperture in third through-hole portion.
Optionally, in the preparation method, using holes drilled through, chemical etching or laser ablation mode, in the ladder
Shape through-hole wall forms the cut-off rule of at least two longitudinal directions, so as to by the layers of copper of the stepped throughhole inwall along described stepped
The radial direction of through hole is divided at least two parts being mutually not turned on.
Optionally, the preparation method also includes：Disconnect being formed in the layers of copper of the stepped throughhole inwall and be mutually not turned on
Multi-section point after, first the stepped throughhole is filled and led up using vacuum resin consent, then make the figure circuit of outer layer core plate.
Optionally, the core material includes at least two.
Optionally, in the preparation method of the PCB, the internal layer circuit of the core material is carried out using image transfer techniques
Graphic making.
A kind of PCB, the PCB are made of as above any preparation method.
Beneficial effects of the present invention：
In the embodiment of the present invention, the layers of copper of the stepped throughhole inwall on PCB can be formed as by opening operation twice
At least four parts being mutually not turned on, can be separately as a network connectivity layer per part layers of copper so that connects with this part layers of copper
Mutual conduction between the different graphic line layer connect, so that a stepped throughhole position realizes at least four networks company
Layer is connect,, can on the PCB of same area compared with an existing lead to the hole site only realizes the scheme of a network connectivity layer
Greatly reduce number of vias, improve PCB wiring density.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is PCB provided in an embodiment of the present invention preparation method flow chart；
Fig. 2 be it is provided in an embodiment of the present invention brill columnar through holes after PCB sectional view；
Fig. 3 be it is provided in an embodiment of the present invention formation stepped throughhole after PCB sectional view；
Fig. 4 is the sectional view of the PCB after stepped throughhole provided in an embodiment of the present invention metallization；
Fig. 5 is the sectional view of the PCB after layers of copper disconnection for the first time in stepped throughhole provided in an embodiment of the present invention；
Fig. 6 is the top view after second of disconnection of layers of copper in stepped throughhole provided in an embodiment of the present invention.
Embodiment
To enable goal of the invention, feature, the advantage of the present invention more obvious and understandable, below in conjunction with the present invention
Accompanying drawing in embodiment, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that disclosed below
Embodiment be only part of the embodiment of the present invention, and not all embodiment.Based on the embodiment in the present invention, this area
All other embodiment that those of ordinary skill is obtained under the premise of creative work is not made, belongs to protection of the present invention
Scope.
Referring to Fig. 1, Fig. 1 shows PCB preparation method flow.
In the present embodiment, PCB preparation method comprises the following steps：
S101, according to normal process flow, complete core material inner line figure make after by core material with it is outer
Layer core plate presses to form PCB.
In this step, specific manufacture craft is：
1) sawing sheet
According to design requirement, a copper-clad plate greatly is cut into required size, is easy to rear process operations.
Copper-clad plate is formed by copper foil and insulating materials (glass cloth and resin etc.) pressing, and according to thickness of slab, copper is thick, material is different
There is different size.
After sawing sheet, edges of boards burr needs fillet to handle；Need to be toasted after sawing sheet, to increase dimensional stability, avoid
Harmomegathus；Sawing sheet notes also consistent through, latitude direction and engineering instruction, avoids warpage issues.
2) internal layer circuit is made using pattern transfer principle
Internal layer circuit is to make multiple-plate core process, and multi-layer sheet quality is exerted a decisive influence, its Making programme
It is followed successively by：Pre-treatment, press mold, contraposition/exposure, develop, etching, move back film, practice shooting, AOI (Automatic Optical
Inspection, automatic optics inspection).
The purpose of pre-treatment：The pollutant on copper face is removed, increases copper face roughness, follow-up pad pasting is more firm.
The purpose of press mold：Substrate copper face is sticked into photosensitive dry film through hot pressing mode, as the basis for being subsequently formed circuit.
The purpose of exposure：The circuit image on the film (egative film) is transferred on photosensitive dry film through UV light irradiations.Technique is former
Reason：The dry film of white light transmission part sees UV light and photopolymerization reaction occurs, and the lighttight dry film of black does not react.
The purpose of development：The dry film that photopolymerization reaction does not occur is dissolved using sodium carbonate, allows image to display.Work
Skill principle：The dry film of photopolymerization reaction does not occur to be dissolved by sodium carbonate, and the dry film that photopolymerization reaction occurs can not dissolve
Fall, be retained in plate face, anticorrosion protection layer during as subsequent etch.
The purpose of acid etching：The copper corrosion exposed after development is fallen using etching solution, forms line pattern.Technique is former
Reason：Dissolved because copper can be etched liquid, etching solution can be dissolved in by the copper that dry film is protected, and by the copper of dry film protection
It will not dissolve, ultimately form circuit.
Move back the purpose of film：The resist layer for protecting copper face is peeled off using highly basic, exposes line pattern.
The purpose of target practice：The wad cutter of edges of boards is gone out using CCD para-position, riveted when being easy to subsequently be laminated.
AOI purpose：The shortcomings that detecting on circuit, repaired, improve qualification rate.Technological principle：First by circuit text
Part calls in AOI equipment, and AOI device scans material object printed line road is made comparisons with the simulation files in equipment, finds out different position,
That is shortcoming position.
3) multiple core plates are laminated
Lamination flow is followed successively by：To target, brown, walkthrough/riveted, lamination, pressing plate, target practice/milling side.
To the purpose of target：The wad cutter of edges of boards is gone out using CCD para-position, riveted when being easy to subsequently be laminated.
The purpose of brown：Roughening, cleaning copper face, enhancement line and resin contact surface area are allowed to press tighter, avoid
Layering.
The purpose of walkthrough/riveted：Multiple core materials are nailed together using rivet, interlayer is produced when avoiding subsequently pressing
Sliding.
The purpose of lamination：Multiple plates folded in advance are built up into multi-layer plate form to be pressed.
The purpose of pressing plate：The core material stacked is pressed into by multi-layer sheet by hot pressing mode.
The purpose on target practice/milling side：Follow-up milling side, the positioning hole of drilling are provided；The unnecessary side milling being laminated around back plate is fallen,
The edges of boards of formation rule, are easy to following process.
S102, multiple core plates press on the PCB to be formed make metallization stepped throughhole.
In this step, the manufacture craft for the shoulder hole that metallizes is：
1) as shown in Fig. 2 PCB predeterminated position bore the first columnar through holes, first columnar through holes by PCB the first face
Second face relative with the first face is through to, the first columnar through holes aperture is A.
2) as shown in figure 3, carrying out the first control deep drilling at first columnar through holes in PCB the first face, the in the second face
At one columnar through holes carry out second control deep drilling, formed its top and bottom be large aperture, the stepped throughhole that middle part is small-bore.
Wherein, the drilling hole depth of the first control deep drilling and the drilling hole depth sum of the second control deep drilling are led to less than whole first column
The depth in hole；Meanwhile first control deep drilling boring aperture with second control deep drilling boring aperture can with identical, can also difference
(boring aperture of the first control deep drilling shown in Fig. 3 is identical with the boring aperture of the second control deep drilling), but aperture A is all higher than, from
And form stepped throughhole.
For convenience of description, in the present embodiment, the macropore path portion at the top of stepped throughhole is hereafter referred to as first through hole
Portion, the aperture path portion at middle part are referred to as the second through-hole section, the macropore path portion of bottom is referred to as third through-hole portion.
3) as shown in figure 4, carrying out heavy copper plating to stepped throughhole, the stepped throughhole of metallization is formed.
After being metallized in stepped throughhole so that line conduction between all layers.
S103, as shown in figure 5, at PCB stepped throughhole, pass through holes drilled through, chemical etching or laser ablation side
The mode of formula, remove whole layers of copper of the second through-hole section side wall of stepped throughhole so that the layers of copper edge of stepped throughhole inwall
The axial direction of stepped throughhole, which disconnects, forms the upper copper layer being mutually not turned on and underlying copper layer.
Wherein, the method for the second through-hole section side wall layers of copper is removed using holes drilled through mode to be included：
The second columnar through holes are bored at PCB stepped throughhole；The aperture of second columnar through holes is more than the second through-hole section
Aperture, while less than first through hole portion and the aperture in third through-hole portion.
S104, as shown in fig. 6, at PCB stepped throughhole, using holes drilled through, chemical etching or laser ablation side
Formula, the cut-off rule of two longitudinal directions is formed in stepped throughhole inwall, by upper copper layer and underlying copper layer respectively along stepped throughhole
Radial direction be divided into the left and right two parts being mutually not turned on so that the whole layers of copper of stepped throughhole is divided into what is be mutually not turned on
Four parts, form four network connectivity layers.
In this step, bradawl nozzle can be used in PCB the first face or the second face, two on the hole side of stepped throughhole
Position is respectively along the axially downwardly drilling of stepped throughhole, you can and the layers of copper under two positions is removed, forms two cut-off rules, will
Upper copper layer/underlying copper layer is broken as two parts.
Afterwards, stepped throughhole is filled and led up using vacuum resin consent, then completes the graphic making of outer layer core plate, realized
Heterogeneous networks circuit.
In the present embodiment, the layers of copper of stepped throughhole inwall first disconnects forming upper and lower two parts, and upper and lower two parts divide again
Left and right two parts Duan Kai not be formed, finally cause layers of copper to be divided into four parts, can be connected per part layers of copper separately as a network
Connect layer so that mutual conduction between the different graphic line layer being connected with this part layers of copper, so that a stepped throughhole
Realize four network connectivity layers in position.In fact, radial direction of the layers of copper of stepped throughhole inwall along stepped throughhole is disconnected into behaviour
Make, with order of the layers of copper of stepped throughhole inwall along the axial opening operation of stepped throughhole is not limited, can first carry out
Preceding paragraph operates, and can also first carry out consequent operation.
In other embodiments, also more than two longitudinal cut-off rules can be formed in stepped throughhole inwall, by upper copper
Layer and underlying copper layer are divided at least three parts being mutually not turned on along the radial direction of stepped throughhole respectively, so that a ladder
Shape lead to the hole site realizes the network connectivity layer of more than four.
It should be noted that：Formed the layers of copper of stepped throughhole inwall is longitudinally disconnected in two-part step up and down,
In addition to removing the mode of whole layers of copper of the second through-hole section side wall, remove the second through-hole section side wall one can also be used
The mode of point layers of copper is realized；In addition, when the second through-hole section runs through multilayer, the multi-section split-phase of the second through-hole section side wall can be removed
The layers of copper mutually separated so that the layers of copper of stepped throughhole inwall, which longitudinally disconnects, forms the three parts being mutually not turned on or more multi-section
Point.
In addition, for the stepped throughhole of other structures, the of first through hole portion and small-bore such as only including large aperture
Two through-hole sections, it also can first remove the part layers of copper of the second through-hole section side wall so that axially disconnection forms phase to stepped throughhole along it
The two parts being mutually not turned on, then radial direction of every part layers of copper along stepped throughhole is disconnected forming at least two parts.
Compared with an existing lead to the hole site only realizes the scheme of a network connectivity layer, on the PCB of same area,
Number of vias can be greatly reduced, improve PCB wiring density.
Described above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Embodiment is stated the present invention is described in detail, it will be understood by those within the art that：It still can be to preceding
State the technical scheme described in each embodiment to modify, or equivalent substitution is carried out to which part technical characteristic；And these
Modification is replaced, and the essence of appropriate technical solution is departed from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a kind of PCB preparation method, it is characterised in that the preparation method includes：
Core material is completed to press to form PCB with outer layer core plate after inner line figure makes；
Stepped throughhole is made on the pcb and heavy copper plating is carried out to the stepped throughhole；The stepped throughhole edge
It axially includes first through hole portion and the second through-hole section, and the aperture in the first through hole portion is more than the aperture of the second through-hole section；Will
Radial direction of the layers of copper of the stepped throughhole inwall along the stepped throughhole disconnects at least two parts to be formed and be mutually not turned on.
2. PCB according to claim 1 preparation method, it is characterised in that the stepped throughhole axially also wraps along it
Third through-hole portion is included, second through-hole section is between first through hole portion and third through-hole portion；The hole in the third through-hole portion
Footpath is more than the aperture of the second through-hole section.
3. PCB according to claim 2 preparation method, it is characterised in that the preparation method also includes：Described in removal
The all or at least a portion layers of copper of second through-hole section side wall so that the layers of copper of the stepped throughhole inwall is along described stepped
The axial direction of through hole disconnects at least two parts for being formed and being mutually not turned on.
4. PCB according to claim 3 preparation method, it is characterised in that in the preparation method, using holes drilled through,
Chemical etching or laser ablation mode, remove whole layers of copper or at least a portion layers of copper of the second through-hole section side wall.
5. PCB according to claim 4 preparation method, it is characterised in that it is described by way of holes drilled through, remove institute
Stating the method for whole layers of copper of the second through-hole section side wall includes：
Columnar through holes are bored at the stepped throughhole of the PCB；The aperture of the columnar through holes is more than the aperture of the second through-hole section,
Simultaneously less than the first through hole portion and the aperture in third through-hole portion.
6. PCB according to claim 1 preparation method, it is characterised in that in the preparation method, using holes drilled through,
Chemical etching or laser ablation mode, the cut-off rule of at least two longitudinal directions is formed in the stepped throughhole inwall, so that will
Radial direction of the layers of copper of the stepped throughhole inwall along the stepped throughhole is divided at least two parts being mutually not turned on.
7. PCB according to claim 3 preparation method, it is characterised in that the preparation method also includes：In the rank
, first will be described stepped using vacuum resin consent after the layers of copper of scalariform through-hole wall disconnects the multi-section point to be formed and be mutually not turned on
Through hole is filled and led up, then makes the figure circuit of outer layer core plate.
8. PCB according to claim 1 preparation method, it is characterised in that the core material includes at least two.
9. PCB according to claim 1 preparation method, it is characterised in that in the preparation method of the PCB, utilize figure
The inner line figure that the core material is carried out as transfer techniques makes.
10. a kind of PCB, it is characterised in that the PCB is made according to any preparation method of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710890559.XA CN107708334A (en) | 2017-09-27 | 2017-09-27 | A kind of PCB preparation method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710890559.XA CN107708334A (en) | 2017-09-27 | 2017-09-27 | A kind of PCB preparation method and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107708334A true CN107708334A (en) | 2018-02-16 |
Family
ID=61175089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710890559.XA Pending CN107708334A (en) | 2017-09-27 | 2017-09-27 | A kind of PCB preparation method and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107708334A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110719691A (en) * | 2018-07-11 | 2020-01-21 | 中兴通讯股份有限公司 | Connection device between circuit networks, realization method, equipment and storage medium |
| CN112351583A (en) * | 2019-08-09 | 2021-02-09 | 深南电路股份有限公司 | Circuit board, manufacturing method thereof and milling cutter |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050130480A1 (en) * | 2002-12-12 | 2005-06-16 | Broadcom Corporation | Via providing multiple electrically conductive paths |
| CN102946695A (en) * | 2012-10-31 | 2013-02-27 | 华为技术有限公司 | Through hole structure, printed circuit board, and manufacture method of through hole structure |
| CN103517579A (en) * | 2012-06-20 | 2014-01-15 | 深南电路有限公司 | Circuit board and processing method thereof |
| CN105992468A (en) * | 2015-03-02 | 2016-10-05 | 深南电路股份有限公司 | Method for processing PCB in-hole circuit |
-
2017
- 2017-09-27 CN CN201710890559.XA patent/CN107708334A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050130480A1 (en) * | 2002-12-12 | 2005-06-16 | Broadcom Corporation | Via providing multiple electrically conductive paths |
| CN103517579A (en) * | 2012-06-20 | 2014-01-15 | 深南电路有限公司 | Circuit board and processing method thereof |
| CN102946695A (en) * | 2012-10-31 | 2013-02-27 | 华为技术有限公司 | Through hole structure, printed circuit board, and manufacture method of through hole structure |
| CN105992468A (en) * | 2015-03-02 | 2016-10-05 | 深南电路股份有限公司 | Method for processing PCB in-hole circuit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110719691A (en) * | 2018-07-11 | 2020-01-21 | 中兴通讯股份有限公司 | Connection device between circuit networks, realization method, equipment and storage medium |
| CN112351583A (en) * | 2019-08-09 | 2021-02-09 | 深南电路股份有限公司 | Circuit board, manufacturing method thereof and milling cutter |
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Application publication date: 20180216 |