CN101990372B - Method for manufacturing ceramic-based interconnected rigid circuit board - Google Patents
Method for manufacturing ceramic-based interconnected rigid circuit board Download PDFInfo
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- CN101990372B CN101990372B CN2010102490810A CN201010249081A CN101990372B CN 101990372 B CN101990372 B CN 101990372B CN 2010102490810 A CN2010102490810 A CN 2010102490810A CN 201010249081 A CN201010249081 A CN 201010249081A CN 101990372 B CN101990372 B CN 101990372B
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Abstract
The invention discloses a method for manufacturing a ceramic-based interconnected rigid circuit board, which is characterized by comprising the following steps of: A. manufacturing an aluminum nitride ceramic circuit board; B. manufacturing an epoxy resin circuit board; C. laminating the aluminum nitride ceramic circuit board and the epoxy resin circuit board; D. manufacturing a through hole passing through the upper surface and the lower surface of the multilayer board on the multilayer board obtained in the step C by adopting laser drilling equipment, processing the hole with a conducting material and then drying to obtain a through hole; and E. cutting the circuit board into preset specifications by adopting laser cutting equipment to obtain the ceramic-based rigid circuit board. The invention aims to overcome the defects in the prior art and provide the manufacturing method of the ceramic-based interconnected rigid circuit board with simple process, high integrated level and good thermal conductivity.
Description
Technical field
The present invention relates to the manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base.
Background technology
In the industry ordinary epoxy resin multi-layer sheet is arranged at present, flexible electric circuit board (soft board) is arranged, the rigid-flexible combined circuit plate of epoxy resin+flexible electric circuit board is arranged, have with common Al
2O
3Be the ceramic circuit board of main component, their pluses and minuses are following:
The ordinary epoxy resin multi-layer sheet: series of advantages such as the number of plies is many, wiring density is high, technical maturity, easy welding component are arranged, but its thermal conductivity and poor radiation, the harmomegathus size is difficult to control, and reliability also is difficult to promote;
Common aluminium oxide ceramic circuit board: have high-cooling property and corrosion-resistant, have higher insulation property and excellent high frequency characteristics, the coefficient of expansion low, advantage such as stable chemical performance and thermal conductivity are high, and be nontoxic; But owing to it has the characteristic of high rigidity simultaneously, so matter is crisp, the machine work difficulty is big, and simultaneously owing to its surfacing, difficult the realization interlayer conduction also is difficult to and the effective formation multilayer circuit board that combines of other layer through electroplating;
Traditional circuit board advantage is single, can not have high thermal conductivity simultaneously, and high integration can not satisfy market circuit board is had high connectivity, high density, demand that thermal conductivity is good.
Summary of the invention
The objective of the invention is in order to overcome weak point of the prior art, provide a kind of technology simple, have a manufacturing approach of the interconnected rigid circuit board of ceramic base of high integration and good thermal conductivity.
In order to achieve the above object, the present invention adopts following scheme:
The manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base is characterized in that may further comprise the steps:
A, making aluminium nitride ceramics circuit board
A1, in the aluminium nitride ceramics copper-clad plate of pre-treatment, making layer pattern;
A2, utilize laser drilling device on preposition, to offer location hole;
B, making epoxy circuit board
B1, the epoxy resin copper-clad plate is cut into the size suitable with ceramic copper-clad plate;
The method of b2, employing machine drilling is offered the hole of implementing epoxy resin copper-clad plate upper and lower faces on epoxy resin copper-clad plate preposition;
B3, plating one deck conductive layer makes it become via on above-mentioned hole;
B4, electro-coppering is carried out in the epoxy resin copper-clad plate among the step b3;
B5, the circuitous pattern on the film is transferred in the epoxy resin copper-clad plate;
B6, the circuitous pattern in the epoxy resin copper-clad plate of step b5 is carried out electro-coppering;
Carry out etching behind b7, the completing steps b6, move back the film processing;
B8, do not need the local solder-mask printing printing ink of soldering of electronic components in above-mentioned epoxy resin copper-clad plate;
B9, that its naked copper surface to be welded of epoxy resin copper-clad plate is carried out the exposed position of surface treatment protection is not oxidized;
B10, in above-mentioned epoxy resin copper-clad plate according to designing requirement silk-screen character;
C, pressing aluminium nitride ceramics circuit board and epoxy circuit board
C1, between aluminium nitride ceramics circuit board and epoxy circuit board, dielectric layer is set;
The mode of c2, employing hot pressing will be pressed into one at aluminium nitride ceramics circuit board and epoxy circuit board, become multi-layer sheet;
Adopt laser drilling device to make the through hole that runs through said multi-layer sheet upper and lower surface on D, the multi-layer sheet in step C, adopt the electric conducting material perforation, oven dry makes it become via then;
E, employing laser cutting device cut into predetermined specification to the multi-layer sheet described in the step D, promptly get the rigid-flexible circuit board of ceramic base.
The manufacturing approach of the interconnected rigid circuit board of aforesaid a kind of ceramic base is characterized in that the pre-treatment described in the steps A comprises the operation of inspection to the ceramic copper-clad board raw material, oil removing, pickling, oven dry.
The manufacturing approach of the interconnected rigid circuit board of aforesaid a kind of ceramic base; It is characterized in that the making internal layer figure described in the steps A is included in covers one deck light-sensitive medium on the copper layer of ceramic copper-clad plate; The film of on light-sensitive medium, placing the band predetermined pattern makes public, and develops then, etching, dries after moving back film.
The manufacturing approach of the interconnected rigid circuit board of aforesaid a kind of ceramic base is characterized in that the conductive layer described in the step b3 is a kind of in copper coating or the silvering.
The manufacturing approach of the interconnected rigid circuit board of aforesaid a kind of ceramic base is characterized in that the transfer of circuitous pattern described in the step b5 comprises pad pasting, exposure, development, etching, five operations of stripping.
The manufacturing approach of the interconnected rigid circuit board of aforesaid a kind of ceramic base is characterized in that the surface treatment described in the step b9 is to be coated with a kind of in machine aided weldering protective agent or the plated metal coating.
The manufacturing approach of the interconnected rigid circuit board of aforesaid a kind of ceramic base is characterized in that the dielectric layer described in the step C is PP layer and PI layer.
The manufacturing approach of the interconnected rigid circuit board of aforesaid a kind of ceramic base is characterized in that a kind of in silver slurry or the copper slurry of the electric conducting material described in the step D.
In sum, beneficial effect of the present invention:
One, adopts laser drilling device and laser cutting device the aluminium nitride ceramics circuit board to be punched and cut among the present invention and effectively overcome problems such as al nitride ceramic board matter is crisp, the machine work difficulty is big;
Two, solved al nitride ceramic board through the mode that adopts silver slurry or copper to starch perforation because its surfacing is difficult for through electroplating the problem of realization interlayer conduction;
Three, the present invention reaches combining closely of aluminium nitride ceramics circuit board and epoxy circuit board through prolonging hot pressing time and combining to reduce pressing-in temp, efficiently solves the problem of epoxy circuit board non-refractory;
Four, circuit board of the present invention has high integration and good thermal conductivity simultaneously, for electronic package provides new technology platform.
Description of drawings
Fig. 1 is a schematic flow sheet of the present invention.
Embodiment
Below in conjunction with embodiment and description of drawings the present invention is done and to further describe:
Embodiment 1
The manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base of the present invention may further comprise the steps:
A, making aluminium nitride ceramics circuit board
A1, in the aluminium nitride ceramics copper-clad plate of pre-treatment, making layer pattern;
Mainly comprise: supplied materials inspection → oil removing → pickling → oven dry → press mold → exposure → development → etching → striping → operations such as oven dry;
Concrete way is: the aluminium nitride ceramics copper-clad base plate to through passed examination carries out surface clean; With sodium peroxydisulfate the copper layer that covers of aluminium nitride ceramics copper-clad base plate is carried out little erosion; The greasy dirt and surperficial oxide on the copper layer covered in removal; This more effectively prevents the damage of aluminium nitride ceramics copper-clad base plate with respect to the cleaning that the method that adopts physics is carried out circuit board substrate, dries through after the aluminium nitride ceramics copper-clad base plate pickling of little erosion; Printing one deck photosensitive-ink or the subsides light-sensitive surface on the copper layer of covering at the aluminium nitride ceramics copper-clad base plate; Treat after photosensitive-ink or the light-sensitive surface drying, paint the circuitous pattern film with the light of having made and be placed on covering on the copper layer of aluminium nitride ceramics copper-clad base plate, carry out circuit pattern exposure; Aluminium nitride ceramics copper-clad base plate to after the exposure develops; Demonstrate through exposure light solid circuitous pattern, the aluminium nitride ceramics copper-clad base plate after adopting etching solution to above-mentioned exposure carries out etching, wherein will carry out three etchings; Etching speed is undertaken by 1.5m/min for the first time; Etching speed is pressed 2.0m/min for the second time, and etching speed is undertaken by 5.5m/min for the third time, moves back film oven dry back and removes defective products with the automated optical Equipment Inspection; Cleaning, drying gets into next operation then;
A2, utilize laser drilling device on preposition, to offer location hole;
Mainly comprise: laser drilling → cleaning → operations such as oven dry;
Specific practice is: utilize laser drilling device to offer the location hole that connects upper and lower two-tier circuit plate in the place of setting to above-mentioned aluminium nitride ceramics copper-clad base plate, after cleaning up and dry with clean water, get into next operation;
B, making epoxy circuit board
B1, the epoxy resin copper-clad plate is cut into the size suitable with ceramic copper-clad plate;
Adopt cutting equipment that the epoxy resin copper-clad plate is cut out, be cut into the size suitable with ceramic copper-clad plate;
B2, employing machine drilling, methods such as radium-shine laser drill or punching are offered the hole of implementing epoxy resin copper-clad plate upper and lower faces on epoxy resin copper-clad plate preposition; These holes can be location hole, instrument connection or hole in piece part etc., and hole of the present invention is mainly hole in piece part.
B3, plating one deck conductive layer makes it become via on above-mentioned hole wall;
Epoxy resin copper-clad plate after boring is two-layer up and down leads the real conducting of copper body; Must on borehole wall, plate conductive layer metallizes the resin of the non-conductor part of hole wall; To carry out electro-coppering operation afterwards, accomplish the metal hole wall that enough conducts electricity and weld; Remove dirt in the hole after the boring earlier, sink copper and electro-coppering then;
B4, electro-coppering is carried out in above-mentioned epoxy resin copper-clad plate;
The complete copper-plated purpose of plate is that the copper of thickening hole wall is thick;
B5, the circuitous pattern on the film is transferred in the epoxy resin copper-clad plate;
Mainly comprise pad pasting → exposure → operations such as development;
Concrete way is:
Pad pasting:
After making the via completion, utilize heating roller pressing mode, the dry film of in the epoxy resin copper-clad plate of cleaning, fitting is as etching resistance agent; Because dry film is to ultraviolet-sensitive, promptly react for avoiding dry film not fit accomplishing, dry film is fitted should operation in the yellow light area environment; Wherein used dry film is meant as photosensitive resist agent anti-etching or that anti-plate is used, is made up of polyester film, photoresist film and three parts of polyethylene protective film.
Wherein photoresist is a kind of photosensitive material.Photoresist film is the main body of dry film, is mostly the photosensitive material of negativity, and its thickness is looked its purposes difference has some kinds of specifications, and the thinnest can be tens microns, and the thickest reaches 100 microns.The main component of photosensitive layer photoresist is photo polymerization monomer, light trigger, binding agent.
Polyester film is the carrier that supports photosensitive layer, makes the photosensitive material photoresist apply film forming, and thickness is generally 25um.Polyester film is removed before developing after exposure.Oxygen spreads to resist layer when preventing to make public, and destroys free radical, causes that photosensitivity descends.
Polyethylene protective film is the diaphragm that covers on the photosensitive layer, prevents dirt pollution dry films such as dust, and avoids when the volume film, and is inter-adhesive between every layer of resist film.Polyethylene protective film is removed when pad pasting.
Exposure:
The epoxy resin copper-clad plate material that pad pasting is accomplished utilizes the mode of image transfer, and the circuit pattern on the work egative film (film) that design is accomplished adopts fully automatic exposure machine or semi-automatic exposure machine with ultraviolet exposure, is transferred on the dry film.The work egative film (film) of exposure usefulness is taked the negative film mode, and the part of hollowed-out translucent is circuit and Liu Tong district.
Develop:
The epoxy resin copper-clad plate material that exposure is accomplished, ultraviolet irradiation be the partially polymerized sclerosis of dry film in zone excessively.Through the specific liquid medicine Na that develops
2CO
3The weakly alkaline solution flushing can expose material copper layer with partly washing out without light stiffening.Through the material that develops and accomplish, can find out the shape, the form that form circuit.
B6, the circuitous pattern in the epoxy resin copper-clad plate of step b5 is carried out electro-coppering, increase the thickness of circuitous pattern part copper;
Carry out etching behind b7, the completing steps b6, move back the film processing;
Etching:
Through the epoxy resin copper-clad plate material that develops and accomplish, through the acid CuCl of etching liquid medicine
2Flushing, can the copper layer exposed part without dry film protection be removed, and stay protected circuit.
The material that etching is accomplished promptly is that our required line type becomes, and etching is the crucial processing procedure of circuit moulding.
Stripping:
Material through etching is accomplished still leaves the dry film that has hardened on the plate face, utilize stripping soup NaOH, and dry film is separated with material fully, and right pickling neutralization washing again makes circuit exposed fully, and the copper layer exposes fully.
B8, do not need the printing ink of solder-mask printing in the localities of soldering of electronic components in above-mentioned epoxy resin copper-clad plate;
After cleaning, drying is carried out in above-mentioned epoxy resin copper-clad plate, do not needing the local solder-mask printing printing ink of soldering of electronic components; In drying baker, make public after the low temperature prebake and develop, carrying out hot curing then; When solder-mask printing printing ink can effectively prevent soldering of electronic components, scolding tin was bonded at non-welding zone, and solder-mask printing printing ink some conductting layers on also can protective circuit plate erosion of not making moist simultaneously increases the aesthetic measure of product simultaneously;
B9, that its naked copper surface to be welded of epoxy resin copper-clad plate is carried out the exposed position of surface treatment protection is not oxidized;
Be coated with machine aided weldering protective agent, to protect exposed part not reoxidize and to guarantee to meet performance requirement.
B10, in above-mentioned epoxy resin copper-clad plate according to designing requirement silk-screen character;
On the one side that the epoxy resin copper-clad plate is not with the aluminium nitride ceramics circuit board combines according to the designing requirement silk-screen on character such as numeral number;
C, pressing aluminium nitride ceramics circuit board and epoxy circuit board
C1, between aluminium nitride ceramics circuit board and epoxy circuit board, dielectric layer is set;
Described dielectric layer is the PP layer.
The mode of c2, employing hot pressing will be pressed into one at aluminium nitride ceramics circuit board and epoxy circuit board, become multi-layer sheet;
Realize that through prolonging hot pressing time and combining to reduce pressing-in temp aluminium nitride ceramics circuit board and epoxy circuit board combine closely.
Adopt laser drilling device to make the through hole that runs through said multi-layer sheet upper and lower surface on D, the multi-layer sheet in step C, adopt the electric conducting material perforation, oven dry makes it become via then;
Utilize laser drilling device to offer the through hole that connects the multi-layer sheet upper and lower surface, after cleaning up and dry with clean water, utilize silver slurry grout in the place of setting; Fill up the silver slurry to the hole that needs conducting; Wherein said silver slurry is the commercially available prod, and drying forming makes it become via then.
E, adopt laser cutting device to cut into predetermined specification to circuit board, after detection of electrons, the qualified ceramic base flex-rigid multiple-layer circuit board that is is packed then and is got final product with the clear water cleaning and drying.
Embodiment 2
The manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base of the present invention may further comprise the steps:
A, making aluminium nitride ceramics circuit board
A1, in the aluminium nitride ceramics copper-clad plate of pre-treatment, making layer pattern;
Mainly comprise: supplied materials inspection → oil removing → pickling → oven dry → press mold → exposure → development → etching → striping → operations such as oven dry;
Concrete way is: the aluminium nitride ceramics copper-clad base plate to through passed examination carries out surface clean; With ammonium persulfate the copper layer that covers of aluminium nitride ceramics copper-clad base plate is carried out little erosion; The greasy dirt and surperficial oxide on the copper layer covered in removal; This more effectively prevents the damage of aluminium nitride ceramics copper-clad base plate with respect to the cleaning that the method that adopts physics is carried out circuit board substrate, dries through after the aluminium nitride ceramics copper-clad base plate pickling of little erosion; Printing one deck photosensitive-ink or the subsides light-sensitive surface on the copper layer of covering at the aluminium nitride ceramics copper-clad base plate; Treat after photosensitive-ink or the light-sensitive surface drying, paint the circuitous pattern film with the light of having made and be placed on covering on the copper layer of aluminium nitride ceramics copper-clad base plate, carry out circuit pattern exposure; Aluminium nitride ceramics copper-clad base plate to after the exposure develops; Demonstrate through exposure light solid circuitous pattern, the aluminium nitride ceramics copper-clad base plate after adopting etching solution to above-mentioned exposure carries out etching, wherein will carry out three etchings; Etching speed is undertaken by 1.5m/min for the first time; Etching speed is pressed 2.0m/min for the second time, and etching speed is undertaken by 5.5m/min for the third time, moves back film oven dry back and removes defective products with the automated optical Equipment Inspection; Cleaning, drying gets into next operation then;
A2, utilize laser drilling device on preposition, to offer location hole;
Mainly comprise: laser drilling → cleaning → operations such as oven dry;
Specific practice is: utilize laser drilling device to offer the location hole that connects upper and lower two-tier circuit plate in the place of setting to above-mentioned aluminium nitride ceramics copper-clad base plate, after cleaning up and dry with clean water, get into next operation;
B, making epoxy circuit board
B1, the epoxy resin copper-clad plate is cut into the size suitable with ceramic copper-clad plate;
Adopt cutting equipment that the epoxy resin copper-clad plate is cut out, be cut into the size suitable with ceramic copper-clad plate;
Methods such as b2, using plasma etching, chemical etching or photic pore-forming are offered the hole of implementing epoxy resin copper-clad plate upper and lower faces on epoxy resin copper-clad plate preposition; These holes can be location hole, instrument connection or hole in piece part etc., and hole of the present invention is mainly hole in piece part.
B3, plating one deck conductive layer makes it become via on above-mentioned hole;
Epoxy resin copper-clad plate after boring is two-layer up and down leads the real conducting of copper body; Must on borehole wall, plate conductive layer metallizes the resin of the non-conductor part of hole wall; To carry out electro-coppering operation afterwards, accomplish the metal hole wall that enough conducts electricity and weld; Remove dirt in the hole after the boring earlier, carry out electrosilvering then;
B4, electro-coppering is carried out in above-mentioned epoxy resin copper-clad plate;
The complete copper-plated purpose of plate is that the copper of thickening hole wall is thick;
B5, the circuitous pattern on the film is transferred in the epoxy resin copper-clad plate;
Mainly comprise pad pasting → exposure → operations such as development;
Concrete way is:
Pad pasting:
After making the via completion, utilize heating roller pressing mode, the dry film of in the epoxy resin copper-clad plate of cleaning, fitting is as etching resistance agent; Because dry film is to ultraviolet-sensitive, promptly react for avoiding dry film not fit accomplishing, dry film is fitted should operation in the yellow light area environment; Wherein used dry film is meant as photosensitive resist agent anti-etching or that anti-plate is used, is made up of polyester film, photoresist film and three parts of polyethylene protective film.
Wherein photoresist is a kind of photosensitive material.Photoresist film is the main body of dry film, is mostly the photosensitive material of negativity, and its thickness is looked its purposes difference has some kinds of specifications, and the thinnest can be tens microns, and the thickest reaches 100 microns.The main component of photosensitive layer photoresist is photo polymerization monomer, light trigger, binding agent.
Polyester film is the carrier that supports photosensitive layer, makes the photosensitive material photoresist apply film forming, and thickness is generally 25um.Polyester film is removed before developing after exposure.Oxygen spreads to resist layer when preventing to make public, and destroys free radical, causes that photosensitivity descends.
Polyethylene protective film is the diaphragm that covers on the photosensitive layer, prevents dirt pollution dry films such as dust, and avoids when the volume film, and is inter-adhesive between every layer of resist film.Polyethylene protective film is removed when pad pasting.
Exposure:
The epoxy resin copper-clad plate material that pad pasting is accomplished utilizes the mode of image transfer, and the circuit pattern on the work egative film (film) that design is accomplished adopts fully automatic exposure machine or semi-automatic exposure machine with ultraviolet exposure, is transferred on the dry film.The work egative film (film) of exposure usefulness is taked the negative film mode, and the part of hollowed-out translucent is circuit and Liu Tong district.
Develop:
The epoxy resin copper-clad plate material that exposure is accomplished, ultraviolet irradiation be the partially polymerized sclerosis of dry film in zone excessively.Through the specific liquid medicine K that develops
2CO
3The weakly alkaline solution flushing can expose material copper layer with partly washing out without light stiffening.Through the material that develops and accomplish, can find out the shape, the form that form circuit.
B6, the circuitous pattern in the epoxy resin copper-clad plate of step b5 is carried out electro-coppering, increase the thickness of circuitous pattern part copper;
Carry out etching behind b7, the completing steps b6, move back the film processing;
Etching:
Through the epoxy resin copper-clad plate material that develops and accomplish, through the acid CuCl of etching liquid medicine
2Flushing, can the copper layer exposed part without dry film protection be removed, and stay protected circuit.
The material that etching is accomplished promptly is that our required line type becomes, and etching is the crucial processing procedure of circuit moulding.
Stripping:
Material through etching is accomplished still leaves the dry film that has hardened on the plate face, utilize stripping soup NaOH, and dry film is separated with material fully, and right pickling neutralization washing again makes circuit exposed fully, and the copper layer exposes fully.
B8, do not need the printing ink of solder-mask printing in the localities of soldering of electronic components in above-mentioned epoxy resin copper-clad plate;
After cleaning, drying is carried out in above-mentioned epoxy resin copper-clad plate, do not needing the local solder-mask printing printing ink of soldering of electronic components; In drying baker, make public after the low temperature prebake and develop, carrying out hot curing then; When solder-mask printing printing ink can effectively prevent soldering of electronic components, scolding tin was bonded at non-welding zone, and solder-mask printing printing ink some conductting layers on also can protective circuit plate erosion of not making moist simultaneously increases the aesthetic measure of product simultaneously;
B9, that its naked copper surface to be welded of epoxy resin copper-clad plate is carried out the exposed position of surface treatment protection is not oxidized;
Be coated with machine aided weldering protective agent, to protect exposed part not reoxidize and to guarantee to meet performance requirement.
B10, in above-mentioned epoxy resin copper-clad plate according to designing requirement silk-screen character;
On the one side that the epoxy resin copper-clad plate is not with the aluminium nitride ceramics circuit board combines according to the designing requirement silk-screen on character such as numeral number;
C, pressing aluminium nitride ceramics circuit board and epoxy circuit board
C1, between aluminium nitride ceramics circuit board and epoxy circuit board, dielectric layer is set;
Described dielectric layer is the PP layer.
The mode of c2, employing hot pressing will be pressed into one at aluminium nitride ceramics circuit board and epoxy circuit board, become multi-layer sheet;
Realize that through prolonging hot pressing time and combining to reduce pressing-in temp aluminium nitride ceramics circuit board and epoxy circuit board combine closely.
Adopt laser drilling device to make the through hole that runs through said multi-layer sheet upper and lower surface on D, the multi-layer sheet in step C, adopt the electric conducting material perforation, oven dry makes it become via then;
Utilize laser drilling device to offer the through hole that connects the multi-layer sheet upper and lower surface, after cleaning up and dry with clean water, utilize copper slurry grout in the place of setting; Fill up the copper slurry to the hole that needs conducting; Wherein said copper slurry is the commercially available prod, and drying forming makes it become via then.
E, adopt laser cutting device to cut into predetermined specification to circuit board, after detection of electrons, the qualified ceramic base flex-rigid multiple-layer circuit board that is is packed then and is got final product with the clear water cleaning and drying.
Claims (8)
1. the manufacturing approach of the interconnected rigid circuit board of ceramic base is characterized in that may further comprise the steps:
A, making aluminium nitride ceramics circuit board
A1, in the aluminium nitride ceramics copper-clad plate of pre-treatment, making layer pattern;
A2, utilize laser drilling device on preposition, to offer location hole;
B, making epoxy circuit board
B1, the epoxy resin copper-clad plate is cut into the size suitable with ceramic copper-clad plate;
The method of b2, employing machine drilling is offered the hole of implementing epoxy resin copper-clad plate upper and lower faces on epoxy resin copper-clad plate preposition;
B3, plating one deck conductive layer makes it become via on above-mentioned hole;
B4, electro-coppering is carried out in the epoxy resin copper-clad plate among the step b3;
B5, the circuitous pattern on the film is transferred in the epoxy resin copper-clad plate;
B6, the circuitous pattern in the epoxy resin copper-clad plate of step b5 is carried out electro-coppering;
Carry out etching behind b7, the completing steps b6, move back the film processing;
B8, do not need the local solder-mask printing printing ink of soldering of electronic components in above-mentioned epoxy resin copper-clad plate;
B9, that its naked copper surface to be welded of epoxy resin copper-clad plate is carried out the exposed position of surface treatment protection is not oxidized;
B10, in above-mentioned epoxy resin copper-clad plate according to designing requirement silk-screen character;
C, pressing aluminium nitride ceramics circuit board and epoxy circuit board
C1, between aluminium nitride ceramics circuit board and epoxy circuit board, dielectric layer is set;
The mode of c2, employing hot pressing will be pressed into one at aluminium nitride ceramics circuit board and epoxy circuit board, become multi-layer sheet;
Adopt laser drilling device to make the through hole that runs through said multi-layer sheet upper and lower surface on D, the multi-layer sheet in step C, adopt the electric conducting material perforation, oven dry makes it become via then;
E, employing laser cutting device cut into predetermined specification to the multi-layer sheet described in the step D, promptly get the ceramic base rigid circuit board.
2. the manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base according to claim 1 is characterized in that the pre-treatment described in the steps A comprises the operation of inspection to the ceramic copper-clad board raw material, oil removing, pickling, oven dry.
3. the manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base according to claim 1; It is characterized in that the making internal layer figure described in the steps A is included in covers one deck light-sensitive medium on the copper layer of ceramic copper-clad plate; The film of on light-sensitive medium, placing the band predetermined pattern makes public, and develops then, etching, dries after moving back film.
4. the manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base according to claim 1 is characterized in that the conductive layer described in the step b3 is a kind of in copper coating or the silvering.
5. the manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base according to claim 1 is characterized in that the transfer of circuitous pattern described in the step b5 comprises pad pasting, exposure, development, etching, five operations of stripping.
6. the manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base according to claim 1 is characterized in that the surface treatment described in the step b9 is to be coated with a kind of in machine aided weldering protective agent or the plated metal coating.
7. the manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base according to claim 1 is characterized in that the dielectric layer described in the step C is PP layer and PI layer.
8. the manufacturing approach of the interconnected rigid circuit board of a kind of ceramic base according to claim 1 is characterized in that a kind of in silver slurry or the copper slurry of the electric conducting material described in the step D.
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| CN2010102490810A CN101990372B (en) | 2010-08-03 | 2010-08-03 | Method for manufacturing ceramic-based interconnected rigid circuit board |
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|---|---|---|---|
| CN2010102490810A CN101990372B (en) | 2010-08-03 | 2010-08-03 | Method for manufacturing ceramic-based interconnected rigid circuit board |
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| CN101990372A CN101990372A (en) | 2011-03-23 |
| CN101990372B true CN101990372B (en) | 2012-07-04 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102307431A (en) * | 2011-07-16 | 2012-01-04 | 中山市达进电子有限公司 | Typesetting method of rotary circuit board |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
| CN108161253B (en) * | 2017-11-13 | 2019-10-15 | 上海申和热磁电子有限公司 | A kind of method of aperture on double-sided copper-clad ceramic substrate single side copper foil |
| CN110572967B (en) * | 2019-10-09 | 2021-01-01 | 河源沃图电子科技有限公司 | Production method of circuit board for severe environment |
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| CN101232774A (en) * | 2007-01-24 | 2008-07-30 | 南京汉德森科技股份有限公司 | High heat conductivity ceramic base printed circuit board and method for making the same |
| KR20090047321A (en) * | 2007-11-07 | 2009-05-12 | 삼성전기주식회사 | Hybrid circuit board and fabrication method of the same |
| CN101711098A (en) * | 2009-04-16 | 2010-05-19 | 深圳市精诚达电路有限公司 | Twice laminating technique of flexible printed circuits |
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| CN101232774A (en) * | 2007-01-24 | 2008-07-30 | 南京汉德森科技股份有限公司 | High heat conductivity ceramic base printed circuit board and method for making the same |
| KR20090047321A (en) * | 2007-11-07 | 2009-05-12 | 삼성전기주식회사 | Hybrid circuit board and fabrication method of the same |
| CN101711098A (en) * | 2009-04-16 | 2010-05-19 | 深圳市精诚达电路有限公司 | Twice laminating technique of flexible printed circuits |
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