CN106455333A - Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved - Google Patents
Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved Download PDFInfo
- Publication number
- CN106455333A CN106455333A CN201611030164.4A CN201611030164A CN106455333A CN 106455333 A CN106455333 A CN 106455333A CN 201611030164 A CN201611030164 A CN 201611030164A CN 106455333 A CN106455333 A CN 106455333A
- Authority
- CN
- China
- Prior art keywords
- pcb
- burr
- copper
- gong
- manufacturing process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
Abstract
The invention discloses a manufacturing process of a PCB metal covered edge plate with a gong side and a copper burr improved. The manufacturing process comprises the following steps which are sequentially carried out: firstly, electrotinning on naked copper surface of the surface of a PCB; secondly, mounting a metal edge on a plate edge gong of the PCB; thirdly, etching a burr formed by the metal edge of the plate edge and copper layers on the upper and lower surfaces of the PCB, which are intersected, so as to remove the burr; and fourthly, fading a tin layer. The invention aims at providing a manufacturing process of the PCB metal covered edge plate with the copper burr and the gong side improved, and the problem of poor copper burr is solved by improving the flow of the manufacturing process of the gong metal covered edge.
Description
Technical field
The present invention relates to pcb board material processing technique field, especially a kind of PCB metal hemming edge plate improve gong side copper burr
Processing technology.
Background technology
After existing metal hemming edge board manufacturing method, mainly plank sawing sheet or pressing, routinely drilled, then gong
Go out to need the side of coated metal.Which suffers from the drawback that：In production process, the layers of copper of plate face can form copper burr at edge, it is impossible to
Meet customer requirement.
Content of the invention
It is an object of the invention to provide a kind of PCB metal hemming edge plate improves the processing technology of gong side copper burr, by improving
The fabrication processing of gong metal hemming edge, solves the bad problem of copper burr.
The technical scheme is that：A kind of PCB metal hemming edge plate improves the processing technology of gong side copper burr, including successively
The following steps for carrying out：
Step 1：To electrotinning on the copper face of pcb board surface exposure；
Step 2：To needing the side of category covered with gold leaf on the edges of boards gong of pcb board；
Step 3：The layers of copper of the upper and lower surface of metal edges and pcb board to edges of boards the formed burr that crosses is etched removing
Remove burr；
Step 4：Take off tin layers.
Improve in the processing technology of gong side copper burr in above-mentioned PCB metal hemming edge plate, also wrap after described step 4
Include：
Step 5：The via of circuit connection between layers is got out in PCB surface.
Improve in the processing technology of gong side copper burr in above-mentioned PCB metal hemming edge plate, in step 4, pass through chemical drugs water erosion
Quarter takes off tin layers.
Beneficial effects of the present invention are as follows：
Electrotinning is carried out before the side that the present invention goes out to need coated metal in gong, then gong goes out the edges of boards of metal parcel, passes through
The copper burr formed in copper bound edge when getting rid of gong side by etching, is finally drilled.Avoid and formed during gong metal edges
Copper burr.
Specific embodiment
With reference to specific embodiment, technical scheme is described in further detail, but do not constitute right
Any restriction of the present invention.
A kind of PCB metal hemming edge plate improves the processing technology of gong side copper burr, including the following steps for carrying out successively：
Step 1：To electrotinning on the copper face of pcb board surface exposure；Certainly, need before this to cut into baseplate material
Then multi-layer sheet is cut into production work required size by production work required size；
Step 2：To needing the side of category covered with gold leaf on the edges of boards gong of pcb board；
Step 3：The layers of copper of the upper and lower surface of metal edges and pcb board to edges of boards the formed burr that crosses is etched removing
Remove burr；
Step 4：Tin layers are taken off, and tin layers are taken off particularly by chemical medicinal liquid etching.
Step 5：The via of circuit connection between layers is got out in PCB surface.
Instant invention overcomes easily there is copper burr in present metal hemming edge pcb board Making programme, it is impossible to which meeting client will
The problem that asks.This specific embodiment solves side by the fabrication processing of improvement PCB metal hemming edge plate gong side copper burr
Edge copper burr problem, improves the production quality of metal hemming edge pcb board.
Above-described be only presently preferred embodiments of the present invention, all made in the range of the spirit and principles in the present invention appoint
What modification, equivalent and improvement etc., should be included within the scope of the present invention.
Claims (3)
1. a kind of PCB metal hemming edge plate improves the processing technology of gong side copper burr, it is characterised in that as follows including carried out successively
Step：
Step 1：To electrotinning on the copper face of pcb board surface exposure；
Step 2：To needing the side of category covered with gold leaf on the edges of boards gong of pcb board；
Step 3：The layers of copper of the upper and lower surface of metal edges and pcb board to edges of boards the formed burr that crosses is etched removing and drapes over one's shoulders
Cutting edge of a knife or a sword；
Step 4：Take off tin layers.
2. PCB metal hemming edge plate according to claim 1 improves the processing technology of gong side copper burr, it is characterised in that：Institute
Also include after the step of stating 4：
Step 5：The via of circuit connection between layers is got out in PCB surface.
3. PCB metal hemming edge plate according to claim 2 improves the processing technology of gong side copper burr, it is characterised in that：Step
In rapid 4, tin layers are taken off by chemical medicinal liquid etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611030164.4A CN106455333A (en) | 2016-11-15 | 2016-11-15 | Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611030164.4A CN106455333A (en) | 2016-11-15 | 2016-11-15 | Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106455333A true CN106455333A (en) | 2017-02-22 |
Family
ID=58221503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611030164.4A Pending CN106455333A (en) | 2016-11-15 | 2016-11-15 | Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106455333A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484339A (en) * | 2017-07-27 | 2017-12-15 | 中国船舶重工集团公司第七二四研究所 | A kind of earthed circuit implementation method for improving microwave multi-layer boards matching properties |
| CN107660078A (en) * | 2017-10-30 | 2018-02-02 | 惠州市和信达线路板有限公司 | Printed circuit board edges of boards semi-metal manufacture craft and its drilling equipment |
| CN109743841A (en) * | 2019-01-08 | 2019-05-10 | 博罗县鸿源华辉电子有限公司 | A kind of processing technology of the PCB substrate without burr |
| CN109831876A (en) * | 2019-02-28 | 2019-05-31 | 深圳崇达多层线路板有限公司 | A method of improve because circuit board song leads to the burr that drills |
| CN111225496A (en) * | 2020-01-10 | 2020-06-02 | 东莞市五株电子科技有限公司 | Metal half-clad structure, manufacturing process and PCB |
| CN116997083A (en) * | 2023-08-02 | 2023-11-03 | 清远市富盈电子有限公司 | Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3675318A (en) * | 1969-05-14 | 1972-07-11 | Siemens Ag | Process for the production of a circuit board |
| CN103179805A (en) * | 2011-12-21 | 2013-06-26 | 珠海方正科技多层电路板有限公司 | Metal half hole molding method and manufacture method of printed circuit board |
| CN104768338A (en) * | 2015-04-28 | 2015-07-08 | 清远市富盈电子有限公司 | PCB edge semi-hole metallization manufacturing process |
| CN104918422A (en) * | 2015-05-21 | 2015-09-16 | 东莞市五株电子科技有限公司 | Method for manufacturing semi-metallized hole of printed circuit board |
-
2016
- 2016-11-15 CN CN201611030164.4A patent/CN106455333A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3675318A (en) * | 1969-05-14 | 1972-07-11 | Siemens Ag | Process for the production of a circuit board |
| CN103179805A (en) * | 2011-12-21 | 2013-06-26 | 珠海方正科技多层电路板有限公司 | Metal half hole molding method and manufacture method of printed circuit board |
| CN104768338A (en) * | 2015-04-28 | 2015-07-08 | 清远市富盈电子有限公司 | PCB edge semi-hole metallization manufacturing process |
| CN104918422A (en) * | 2015-05-21 | 2015-09-16 | 东莞市五株电子科技有限公司 | Method for manufacturing semi-metallized hole of printed circuit board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484339A (en) * | 2017-07-27 | 2017-12-15 | 中国船舶重工集团公司第七二四研究所 | A kind of earthed circuit implementation method for improving microwave multi-layer boards matching properties |
| CN107660078A (en) * | 2017-10-30 | 2018-02-02 | 惠州市和信达线路板有限公司 | Printed circuit board edges of boards semi-metal manufacture craft and its drilling equipment |
| CN107660078B (en) * | 2017-10-30 | 2023-10-31 | 惠州市和信达线路板有限公司 | Semi-metallization manufacturing process for printed circuit board edge and drilling device thereof |
| CN109743841A (en) * | 2019-01-08 | 2019-05-10 | 博罗县鸿源华辉电子有限公司 | A kind of processing technology of the PCB substrate without burr |
| CN109831876A (en) * | 2019-02-28 | 2019-05-31 | 深圳崇达多层线路板有限公司 | A method of improve because circuit board song leads to the burr that drills |
| CN111225496A (en) * | 2020-01-10 | 2020-06-02 | 东莞市五株电子科技有限公司 | Metal half-clad structure, manufacturing process and PCB |
| CN111225496B (en) * | 2020-01-10 | 2023-03-10 | 东莞市五株电子科技有限公司 | Manufacturing process of metal semi-clad structure |
| CN116997083A (en) * | 2023-08-02 | 2023-11-03 | 清远市富盈电子有限公司 | Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170222 |