CN107660078B - Semi-metallization manufacturing process for printed circuit board edge and drilling device thereof - Google Patents
Semi-metallization manufacturing process for printed circuit board edge and drilling device thereof Download PDFInfo
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- CN107660078B CN107660078B CN201711036064.7A CN201711036064A CN107660078B CN 107660078 B CN107660078 B CN 107660078B CN 201711036064 A CN201711036064 A CN 201711036064A CN 107660078 B CN107660078 B CN 107660078B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
本发明公开一种印制电路板板边半金属化制作工艺及其钻孔装置。工艺包括如下步骤：采用“钻孔装置”对电路板钻孔；采用化学沉铜的方式将电路板所有孔金属化；贴感光膜，经曝光将电路图形转移到电路板的板面；经电镀铜加厚孔内铜层和镀锡保护电路图形；采用“钻孔装置”加工电路板断面半金属化孔；碱性蚀刻去铜毛刺；通过光学扫描检验电路图形的外观缺点；将电路板焊点图形做到板面，形成永久性涂层；通过丝网图形漏印，将元器件符号、标志印刷到电路板的板面；表面焊料加工，无铅喷锡或化学沉镍金；检测电路板断面半金属化孔的开、短路。完善印制电路板断面半金属化孔加工工艺流程，确保了印制电路板断面半金属化孔的完整性。
The invention discloses a semi-metallic manufacturing process for the edge of a printed circuit board and a drilling device thereof. The process includes the following steps: using a "drilling device" to drill holes into the circuit board; using electroless copper plating to metallize all holes in the circuit board; applying photosensitive film, and transferring the circuit pattern to the surface of the circuit board after exposure; electroplating The copper layer and tin plating in the copper thickening hole protect the circuit pattern; a "drilling device" is used to process the semi-metalized hole in the cross-section of the circuit board; alkaline etching is used to remove copper burrs; the appearance defects of the circuit pattern are inspected through optical scanning; the circuit board is soldered The dot pattern is applied to the board surface to form a permanent coating; component symbols and logos are printed on the board surface through silk screen pattern printing; surface solder processing, lead-free spray tin or chemical nickel gold; detection circuit Opening and short circuiting of semi-metalized holes in the plate section. Improve the processing process of semi-metalized holes in the cross-section of printed circuit boards to ensure the integrity of semi-metalized holes in cross-sections of printed circuit boards.
Description
技术领域Technical field
本发明涉及印制电路板技术领域，特别是涉及一种印制电路板板边半金属化制作工艺及其钻孔装置。The invention relates to the technical field of printed circuit boards, and in particular to a semi-metallic manufacturing process for the edges of printed circuit boards and a drilling device thereof.
背景技术Background technique
印制电路板为印制电路或印制线路成品板的通称，在印制电路板中，金属化孔为孔壁镀覆有金属的孔，半金属化孔为印制电路板成品板边断面半圆金属化孔。Printed circuit board is the general name for printed circuits or finished printed circuit boards. In printed circuit boards, metalized holes are holes whose walls are plated with metal, and semi-metalized holes are the edge sections of finished printed circuit boards. Semi-circular metallized hole.
传统对此类半金属化的孔进行加工，通常在成品时或在阻焊后完成，会带来以下的不利影响：印制电路板断面半金属化孔孔边有铜毛刺；印制电路板成品时，非电路部分铜已去除，断面半孔内金属镀层易被拉脱。进一步的，传统采用铣切方式对电路板断面半金属化孔进行加工，容易造成断面半金属化孔的不完整性。The traditional processing of such semi-metalized holes is usually completed during the finished product or after soldering, which will bring the following adverse effects: There are copper burrs on the edges of the semi-metalized holes in the cross-section of the printed circuit board; In the finished product, the copper in the non-circuit parts has been removed, and the metal plating in the half-hole of the cross-section is easily pulled off. Furthermore, the traditional milling method is used to process the semi-metalized holes in the cross-section of the circuit board, which can easily cause the incompleteness of the semi-metalized holes in the cross-section.
发明内容Contents of the invention
本发明的目的是克服现有技术中的不足之处，提供一种印制电路板板边半金属化制作工艺及其钻孔装置，完善印制电路板断面半金属化孔加工工艺流程，利用碱性蚀刻过程，有效去除半金属化孔成型过程中在印制电路板断面产生的铜毛刺和铜皮碎屑，进一步确保了印制电路板断面半金属化孔的完整性。The purpose of the present invention is to overcome the deficiencies in the prior art, provide a printed circuit board edge semi-metallized manufacturing process and its drilling device, improve the printed circuit board cross-section semi-metalized hole processing process, and utilize The alkaline etching process effectively removes the copper burrs and copper debris produced in the cross-section of the printed circuit board during the semi-metalized hole forming process, further ensuring the integrity of the semi-metalized hole in the cross-section of the printed circuit board.
本发明的目的是通过以下技术方案来实现的：The purpose of the present invention is achieved through the following technical solutions:
一种印制电路板板边半金属化制作工艺，包括如下步骤：A printed circuit board edge semi-metalization manufacturing process includes the following steps:
采用“钻孔装置”对电路板钻孔；Use a "drilling device" to drill holes into the circuit board;
采用化学沉铜的方式将电路板所有孔金属化；Use electroless copper plating to metallize all holes on the circuit board;
贴感光膜，经曝光将电路图形转移到电路板的板面；Apply photosensitive film and transfer the circuit pattern to the surface of the circuit board after exposure;
经电镀铜加厚孔内铜层和镀锡保护电路图形；Electroplated copper thickens the copper layer in the hole and tin plating to protect the circuit pattern;
采用“钻孔装置”加工电路板断面半金属化孔；Use a "drilling device" to process semi-metalized holes in the cross-section of the circuit board;
碱性蚀刻去铜毛刺；Alkaline etching to remove copper burrs;
通过光学扫描检验电路图形的外观缺点；Check the appearance defects of circuit graphics through optical scanning;
将电路板焊点图形做到板面，形成永久性涂层；Apply the circuit board solder joint pattern to the board surface to form a permanent coating;
通过丝网图形漏印，将元器件符号、标志印刷到电路板的板面；Print component symbols and logos onto the surface of the circuit board through screen printing;
表面焊料加工，无铅喷锡或化学沉镍金；Surface solder processing, lead-free spray tin or electroless nickel gold;
检测电路板断面半金属化孔的开、短路。Detect open and short circuits of semi-metalized holes in the cross-section of circuit boards.
一种钻孔装置，包括：基座、驱动部、旋转轴、竖直升降凸轮、水平往复凸轮、竖直升降连杆、水平往复连杆、竖直升降滑杆、水平往复滑杆、中间连接块、钻头；A drilling device, including: a base, a driving part, a rotating shaft, a vertical lifting cam, a horizontal reciprocating cam, a vertical lifting connecting rod, a horizontal reciprocating connecting rod, a vertical lifting sliding rod, a horizontal reciprocating sliding rod, and an intermediate connection blocks, drill bits;
所述旋转轴转动设于所述基座上，所述旋转轴的转轴与水平面平行；The rotating shaft is rotated on the base, and the rotating axis of the rotating shaft is parallel to the horizontal plane;
所述竖直升降凸轮及所述水平往复凸轮安装于所述旋转轴上；The vertical lifting cam and the horizontal reciprocating cam are installed on the rotating shaft;
所述竖直升降连杆的中部铰接于所述基座上，所述竖直升降连杆的一端与所述竖直升降凸轮的凸轮面抵接，所述竖直升降连杆的另一端与所述竖直升降滑杆的一端抵接，所述中间连接块固设于所述竖直升降滑杆的另一端；The middle part of the vertical lifting link is hinged to the base, one end of the vertical lifting link is in contact with the cam surface of the vertical lifting cam, and the other end of the vertical lifting link is in contact with the cam surface of the vertical lifting cam. One end of the vertical lifting slide rod is in contact with the other end of the vertical lifting slide rod; the intermediate connecting block is fixed on the other end of the vertical lifting slide rod;
所述水平往复连杆的中部铰接于所述基座上，所述水平往复连杆的一端与所述水平往复凸轮的凸轮面抵接，所述水平往复连杆的另一端与所述水平往复滑杆的一端抵接，所述水平往复滑杆滑动穿设于所述中间连接块，所述钻头安装于所述水平往复滑杆的另一端；The middle part of the horizontal reciprocating link is hinged to the base, one end of the horizontal reciprocating link is in contact with the cam surface of the horizontal reciprocating cam, and the other end of the horizontal reciprocating link is in contact with the horizontal reciprocating cam. One end of the sliding rod is in contact, the horizontal reciprocating sliding rod slides through the middle connecting block, and the drill bit is installed on the other end of the horizontal reciprocating sliding rod;
所述驱动部驱动所述旋转轴旋转，以使得所述竖直升降凸轮带动所述竖直升降连杆转动，进而使得所述竖直升降连杆带动所述竖直升降滑杆沿竖直方向往复升降；The driving part drives the rotating shaft to rotate, so that the vertical lifting cam drives the vertical lifting link to rotate, and then the vertical lifting link drives the vertical lifting slide bar in the vertical direction. reciprocating lifting and lowering;
所述驱动部驱动所述旋转轴旋转，以使得所述水平往复凸轮带动所述水平往复连杆转动，进而使得所述水平往复连杆带动所述水平往复滑杆沿水平方向往复移动。The driving part drives the rotating shaft to rotate, so that the horizontal reciprocating cam drives the horizontal reciprocating connecting rod to rotate, and then the horizontal reciprocating connecting rod drives the horizontal reciprocating slide rod to reciprocate in the horizontal direction.
在其中一个实施例中，所述驱动部的输出端设有主动齿轮，所述旋转轴上设有从动齿轮，所述主动齿轮与所述从动齿轮啮合。In one embodiment, a driving gear is provided at the output end of the driving part, a driven gear is provided on the rotating shaft, and the driving gear meshes with the driven gear.
在其中一个实施例中，所述驱动部为电机驱动结构。In one embodiment, the driving part is a motor driving structure.
在其中一个实施例中，所述竖直升降连杆的一端通过滚轮与所述竖直升降凸轮的凸轮面抵接，所述竖直升降连杆的另一端通过滚轮与所述竖直升降滑杆的一端抵接。In one embodiment, one end of the vertical lifting link contacts the cam surface of the vertical lifting cam through a roller, and the other end of the vertical lifting link contacts the vertical lifting slide through a roller. One end of the rod touches.
在其中一个实施例中，所述水平往复连杆的一端通过滚轮与所述水平往复凸轮的凸轮面抵接，所述水平往复连杆的另一端通过滚轮与所述水平往复滑杆的一端抵接。In one embodiment, one end of the horizontal reciprocating link contacts the cam surface of the horizontal reciprocating cam through a roller, and the other end of the horizontal reciprocating link contacts one end of the horizontal reciprocating slide bar through a roller. catch.
本发明公开的一种印制电路板板边半金属化制作工艺及其钻孔装置，完善印制电路板断面半金属化孔加工工艺流程，利用碱性蚀刻过程，有效去除半金属化孔成型过程中在印制电路板断面产生的铜毛刺和铜皮碎屑，进一步确保了印制电路板断面半金属化孔的完整性。The invention discloses a semi-metalized production process for the edge of a printed circuit board and a drilling device thereof, which improves the process flow of semi-metalized hole processing on the cross-section of the printed circuit board, and utilizes an alkaline etching process to effectively remove the semi-metalized hole molding The copper burrs and copper scraps produced in the cross section of the printed circuit board during the process further ensure the integrity of the semi-metalized holes in the cross section of the printed circuit board.
附图说明Description of the drawings
图1为本发明一实施例的钻孔装置的结构图；Figure 1 is a structural diagram of a drilling device according to an embodiment of the present invention;
图2为图1所示的钻孔装置去除基座后的结构图。Figure 2 is a structural view of the drilling device shown in Figure 1 with the base removed.
具体实施方式Detailed ways
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施方式。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本发明的公开内容理解的更加透彻全面。In order to facilitate understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough understanding of the disclosure of the present invention will be provided.
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or intervening elements may also be present. When an element is said to be "connected" to another element, it can be directly connected to the other element or there may also be intervening elements present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation manner.
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which the invention belongs. The terminology used herein in the description of the invention is for the purpose of describing specific embodiments only and is not intended to limit the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
一种印制电路板板边半金属化制作工艺，包括如下步骤：A printed circuit board edge semi-metalization manufacturing process includes the following steps:
采用“钻孔装置”对电路板钻孔；Use a "drilling device" to drill holes into the circuit board;
采用化学沉铜的方式将电路板所有孔金属化；Use electroless copper plating to metallize all holes on the circuit board;
贴感光膜，经曝光将电路图形转移到电路板的板面；Apply photosensitive film and transfer the circuit pattern to the surface of the circuit board after exposure;
经电镀铜加厚孔内铜层和镀锡保护电路图形；Electroplated copper thickens the copper layer in the hole and tin plating to protect the circuit pattern;
采用“钻孔装置”加工电路板断面半金属化孔；Use a "drilling device" to process semi-metalized holes in the cross-section of the circuit board;
碱性蚀刻去铜毛刺；Alkaline etching to remove copper burrs;
通过光学扫描检验电路图形的外观缺点；Check the appearance defects of circuit graphics through optical scanning;
将电路板焊点图形做到板面，形成永久性涂层；Apply the circuit board solder joint pattern to the board surface to form a permanent coating;
通过丝网图形漏印，将元器件符号、标志印刷到电路板的板面；Print component symbols and logos onto the surface of the circuit board through screen printing;
表面焊料加工，无铅喷锡或化学沉镍金；Surface solder processing, lead-free spray tin or electroless nickel gold;
检测电路板断面半金属化孔的开、短路。Detect open and short circuits of semi-metalized holes in the cross-section of circuit boards.
通过上述的印制电路板板边半金属化制作工艺，电路板断面半金属化孔成型方式由铣切加工转换为钻孔加工，电路板断面半金属化孔成型的工位设计在图形电镀后和碱性蚀刻前，借助碱性蚀刻过程，去除半孔边的铜毛刺和铜皮，克服了金属化半孔孔内镀层在机械加工时被拉脱，克服了金属化半孔孔内镀层在机械加工时半孔孔边铜毛刺，消除因半孔边铜毛刺和孔壁镀层被拉脱或松动而产生的PCBA开/短路现象。Through the above-mentioned semi-metalized production process of the edge of the printed circuit board, the semi-metalized hole forming method of the circuit board cross-section is converted from milling processing to drilling processing. The work station for forming the semi-metalized hole of the circuit board cross-section is designed after pattern plating. Before alkaline etching, the alkaline etching process is used to remove copper burrs and copper skin around the half-hole, thus overcoming the problem that the plating inside the metallized half-hole is pulled off during machining, and overcoming the problem that the plating inside the metallized half-hole is pulled off during machining. During machining, the half-hole edge copper burrs can be eliminated to eliminate the PCBA open/short circuit phenomenon caused by the half-hole edge copper burrs and hole wall plating being pulled off or loosened.
电路板断面半金属化孔成型方式由铣切加工转换为钻孔加工，为了更好的适应机械自动化生产，对钻孔装置的结构进行改进。The semi-metalized hole forming method of circuit board cross-section is converted from milling to drilling. In order to better adapt to mechanical automated production, the structure of the drilling device is improved.
例如，如图1及图2所示，钻孔装置10包括：基座100、驱动部200、旋转轴300、竖直升降凸轮410、水平往复凸轮420、竖直升降连杆510、水平往复连杆520、竖直升降滑杆610、水平往复滑杆620、中间连接块700、钻头800。For example, as shown in Figures 1 and 2, the drilling device 10 includes: a base 100, a driving part 200, a rotating shaft 300, a vertical lifting cam 410, a horizontal reciprocating cam 420, a vertical lifting link 510, and a horizontal reciprocating link. Rod 520, vertical lifting slide rod 610, horizontal reciprocating slide rod 620, intermediate connecting block 700, drill bit 800.
旋转轴300转动设于基座100上，旋转轴300的转轴与水平面平行。The rotating shaft 300 is rotatably mounted on the base 100, and the rotating axis of the rotating shaft 300 is parallel to the horizontal plane.
竖直升降凸轮410及水平往复凸轮420安装于旋转轴300上。The vertical lifting cam 410 and the horizontal reciprocating cam 420 are installed on the rotating shaft 300 .
竖直升降连杆510的中部铰接于基座100上，竖直升降连杆510的一端与竖直升降凸轮410的凸轮面抵接，竖直升降连杆510的另一端与竖直升降滑杆610的一端抵接，中间连接块700固设于竖直升降滑杆610的另一端。The middle part of the vertical lifting link 510 is hinged on the base 100. One end of the vertical lifting link 510 is in contact with the cam surface of the vertical lifting cam 410, and the other end of the vertical lifting link 510 is in contact with the vertical lifting slide rod. One end of the vertical lifting slide rod 610 is in contact with the middle connecting block 700 , and the middle connecting block 700 is fixed on the other end of the vertical lifting slide rod 610 .
水平往复连杆520的中部铰接于基座100上，水平往复连杆520的一端与水平往复凸轮420的凸轮面抵接，水平往复连杆520的另一端与水平往复滑杆620的一端抵接，水平往复滑杆620滑动穿设于中间连接块700，钻头800安装于水平往复滑杆620的另一端。The middle part of the horizontal reciprocating link 520 is hinged to the base 100 , one end of the horizontal reciprocating link 520 is in contact with the cam surface of the horizontal reciprocating cam 420 , and the other end of the horizontal reciprocating link 520 is in contact with one end of the horizontal reciprocating sliding rod 620 , the horizontal reciprocating sliding rod 620 slides through the middle connecting block 700, and the drill bit 800 is installed on the other end of the horizontal reciprocating sliding rod 620.
驱动部200驱动旋转轴300旋转，以使得竖直升降凸轮410带动竖直升降连杆510转动，进而使得竖直升降连杆510带动竖直升降滑杆610沿竖直方向往复升降。The driving part 200 drives the rotating shaft 300 to rotate, so that the vertical lifting cam 410 drives the vertical lifting link 510 to rotate, and then the vertical lifting link 510 drives the vertical lifting slide bar 610 to reciprocate in the vertical direction.
驱动部200驱动旋转轴300旋转，以使得水平往复凸轮420带动水平往复连杆520转动，进而使得水平往复连杆520带动水平往复滑杆620沿水平方向往复移动。The driving part 200 drives the rotating shaft 300 to rotate, so that the horizontal reciprocating cam 420 drives the horizontal reciprocating connecting rod 520 to rotate, and then the horizontal reciprocating connecting rod 520 drives the horizontal reciprocating sliding rod 620 to reciprocate in the horizontal direction.
进一步的，驱动部200的输出端设有主动齿轮910，旋转轴300上设有从动齿轮920，主动齿轮910与从动齿轮920啮合，从而实现驱动部200对旋转轴300的驱动，在本实施例中，驱动部200为电机驱动结构。Further, the output end of the driving part 200 is provided with a driving gear 910, and the rotating shaft 300 is provided with a driven gear 920. The driving gear 910 meshes with the driven gear 920, thereby realizing the driving of the rotating shaft 300 by the driving part 200. In this article In the embodiment, the driving part 200 is a motor driving structure.
进一步的，竖直升降连杆510的一端通过滚轮与竖直升降凸轮410的凸轮面抵接，竖直升降连杆510的另一端通过滚轮与竖直升降滑杆610的一端抵接。水平往复连杆520的一端通过滚轮与水平往复凸轮420的凸轮面抵接，水平往复连杆520的另一端通过滚轮与水平往复滑杆620的一端抵接。通过设置滚轮，可以使得装置整体运行更顺畅。Further, one end of the vertical lifting link 510 is in contact with the cam surface of the vertical lifting cam 410 through a roller, and the other end of the vertical lifting link 510 is in contact with one end of the vertical lifting slide bar 610 through a roller. One end of the horizontal reciprocating connecting rod 520 is in contact with the cam surface of the horizontal reciprocating cam 420 through a roller, and the other end of the horizontal reciprocating connecting rod 520 is in contact with one end of the horizontal reciprocating sliding rod 620 through a roller. By setting up rollers, the overall operation of the device can be made smoother.
钻孔装置10的工作原理如下：The working principle of the drilling device 10 is as follows:
驱动部200驱动旋转轴300旋转，旋转轴300进而带动其上的竖直升降凸轮410及水平往复凸轮420作旋转运动；The driving part 200 drives the rotating shaft 300 to rotate, and the rotating shaft 300 then drives the vertical lifting cam 410 and the horizontal reciprocating cam 420 thereon to rotate;
由于竖直升降连杆510的中部铰接于基座100上，竖直升降凸轮410带动竖直升降连杆510绕基座100转动，竖直升降连杆510进而带动竖直升降滑杆610沿竖直方向往复升降，再而带动中间连接块700沿竖直方向往复升降；Since the middle part of the vertical lifting link 510 is hinged to the base 100, the vertical lifting cam 410 drives the vertical lifting link 510 to rotate around the base 100, and the vertical lifting link 510 in turn drives the vertical lifting slide bar 610 along the vertical axis. Lifts and lowers back and forth in the vertical direction, and then drives the intermediate connecting block 700 to lift and lower in the vertical direction;
由于水平往复连杆520的中部铰接于基座100上，水平往复凸轮420带动水平往复连杆520绕基座100转动，水平往复连杆520进而带动水平往复滑杆620沿水平方向往复移动，再而带动钻头800沿水平方向往复移动；Since the middle part of the horizontal reciprocating link 520 is hinged to the base 100, the horizontal reciprocating cam 420 drives the horizontal reciprocating link 520 to rotate around the base 100. The horizontal reciprocating link 520 then drives the horizontal reciprocating slide bar 620 to reciprocate in the horizontal direction. And drive the drill bit 800 to move back and forth in the horizontal direction;
由于水平往复滑杆620滑动穿设于中间连接块700，中间连接块700的竖直升降运动也带动了水平往复滑杆620沿竖直升降运动，进而带动了其上的钻头800沿竖直升降运动，于是，钻头800同时具有沿竖直方向及水平方向上的运动；Since the horizontal reciprocating sliding rod 620 slides through the middle connecting block 700, the vertical lifting movement of the middle connecting block 700 also drives the horizontal reciprocating sliding rod 620 to move vertically, and then drives the drill bit 800 thereon to move vertically. Movement, so the drill bit 800 has movement in both the vertical and horizontal directions;
在将印制电路板放置于指定位置时，钻头800在上述各个部件的配合下，沿水平及竖直方向运动，从而实现了对印制电路板的钻孔工作。When the printed circuit board is placed at a designated position, the drill bit 800 moves in the horizontal and vertical directions with the cooperation of the above-mentioned components, thereby realizing drilling of the printed circuit board.
要说明的是，钻孔装置10通过设置一个驱动部200，并在各个部件的配合下，从而实现了钻头800在水平及竖直方向上的运动，而无需设置两个驱动源，使得装置的整体结构更加紧凑，运行更加高效，节省成本。It should be noted that the drilling device 10 is provided with a driving part 200 and with the cooperation of various components, thereby realizing the movement of the drill bit 800 in the horizontal and vertical directions without the need to provide two driving sources, making the device The overall structure is more compact, the operation is more efficient, and the cost is saved.
本发明公开的一种印制电路板板边半金属化制作工艺及其钻孔装置，完善印制电路板断面半金属化孔加工工艺流程，利用碱性蚀刻过程，有效去除半金属化孔成型过程中在印制电路板断面产生的铜毛刺和铜皮碎屑，进一步确保了印制电路板断面半金属化孔的完整性。The invention discloses a semi-metalized production process for the edge of a printed circuit board and a drilling device thereof, which improves the process flow of semi-metalized hole processing on the cross-section of the printed circuit board, and utilizes an alkaline etching process to effectively remove the semi-metalized hole molding The copper burrs and copper scraps produced in the cross section of the printed circuit board during the process further ensure the integrity of the semi-metalized holes in the cross section of the printed circuit board.
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation modes of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the patent of the present invention should be determined by the appended claims.
Claims (3)
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