TW201821912A - Optoelectronic printed circuit board automated process equipment and automated process method - Google Patents

Optoelectronic printed circuit board automated process equipment and automated process method Download PDF

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Publication number
TW201821912A
TW201821912A TW105140921A TW105140921A TW201821912A TW 201821912 A TW201821912 A TW 201821912A TW 105140921 A TW105140921 A TW 105140921A TW 105140921 A TW105140921 A TW 105140921A TW 201821912 A TW201821912 A TW 201821912A
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Taiwan
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machine
process equipment
line
printing
automatic
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TW105140921A
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Chinese (zh)
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李浩民
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百竟工業股份有限公司
李浩民
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Priority to TW105140921A priority Critical patent/TW201821912A/en
Priority to CN201710625684.8A priority patent/CN107241863B/en
Publication of TW201821912A publication Critical patent/TW201821912A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The invention discloses an optoelectronic printed circuit board automated process equipment and an automated process method, which comprises: a line printing automated process equipment, an anti-welding printing automated process equipment, a text printing automated process equipment and a electrical test Automated process equipment. The invention mainly uses the line exposure machine of the line printing automated process equipment to set the process equipment positioning information needed in the process on the copper foil substrate and the drilling machine according to the process equipment positioning information on the copper foil substrate to drill the corresponding of the positioning hole so that the process equipment can be based on the positioning hole for copper foil substrate automatic positioning settings.

Description

光電印刷電路板自動化製程設備及自動化製程方法 Photoelectric printed circuit board automatic process equipment and method

本發明係為一種光電印刷電路板自動化製程設備及自動化製程方法，尤係指可全程自動化之大尺寸光電印刷電路板製程設備及方法。 The invention relates to an automatic manufacturing equipment and method for an optoelectronic printed circuit board, in particular to a large-size optoelectronic printed circuit board process device and method that can be fully automated.

習知印刷電路板製程，需要依照製程中不同的作業程序來對應使用不同的設備機台，而各個設備機台在進行操作前則大都需要先將電路機板依照設備機台的特殊設定需求來將電路機板進行正確的定位設置調整才能進行操作，因此，除了需要在每一設備機台配置一定數量的人力以便將電路機板擺置於設備機台所需之正確位置，且更需要額外的搬運人力或利用載運工具來協助於各個設備機台間搬移電路機板以便進行下一道的製程步驟。而以傳統人力來進行設備機台之電路機板的定位設置調整不僅較為費時且耗費人力，而電路機板在不同設備機台間來回搬運也容易發生不慎掉落損毀的情事。 Knowing the printed circuit board process, you need to use different equipment according to different operating procedures in the process. Before operating each equipment, most of the equipment needs to be based on the special setting requirements of the equipment. The circuit board can be operated only after the correct positioning settings are adjusted. Therefore, in addition to the need to configure a certain amount of manpower on each equipment machine to place the circuit board in the correct position required by the equipment machine, it also requires additional The transportation manpower or the use of transportation tools to help move the circuit board between the various equipment to carry out the next process steps. However, it is not only time-consuming and labor-intensive to adjust the positioning settings of the circuit board of the equipment with traditional manpower, and the circuit board is also easily accidentally dropped and damaged when it is moved back and forth between different equipment.

本發明主要係利用線路印刷自動化製程設備之線路曝光機來將製程中所需之製程設備定位資訊設置於銅箔基板，並藉由定位鑽孔機 依據製程設備定位資訊於銅箔基板上來鑽設對應的定位孔，以便製程設備可依據定位孔來進行銅箔基板的自動定位設置。 The present invention mainly uses a line exposure machine of a line printing automation process equipment to set the positioning information of the process equipment required in the process on a copper foil substrate, and uses a positioning drilling machine Corresponding positioning holes are drilled on the copper foil substrate according to the positioning information of the processing equipment, so that the processing equipment can automatically set the copper foil substrate according to the positioning holes.

一種光電印刷電路板自動化製程設備，包括：線路印刷自動化製程設備、防焊印刷自動化製程設備、文字印刷自動化製程設備及電性測試自動化製程設備。其中，該線路印刷自動化製程設備之輸出端，則是以自動輸送帶來連接至該防焊印刷自動化製程設備之輸入端；該防焊印刷自動化製程設備之輸出端，則是以自動輸送帶來連接至該文字印刷自動化製程設備之輸入端；該文字印刷自動化製程設備之輸出端，則是以自動輸送帶來連接至該電性測試自動化製程設備之輸入端。 An automated manufacturing process equipment for optoelectronic printed circuit boards includes: line printing automation process equipment, solder mask printing automation process equipment, text printing automation process equipment, and electrical test automation process equipment. Among them, the output end of the line printing automation process equipment is connected to the input end of the solderless print automation process equipment by an automatic conveying belt; the output end of the solderless print automation process equipment is brought by an automatic conveyance Connected to the input end of the text printing automation process equipment; the output end of the text printing automation process equipment is connected to the input end of the electrical test automation process equipment by an automatic conveying belt.

俾使審查委員能對於本發明之技術特徵，有更進一步之了解，以下謹以一具體實施例，且佐以圖式作詳細說明。 In order to enable the review committee to have a further understanding of the technical features of the present invention, a specific embodiment is described below with detailed description accompanied by drawings.

1‧‧‧光電印刷電路板自動化製程設備 1‧‧‧ Photoelectric printed circuit board automation process equipment

2‧‧‧線路印刷自動化製程設備 2‧‧‧line printing automation process equipment

21‧‧‧基板酸洗刷磨機 21‧‧‧Substrate pickling and scrubbing machine

22‧‧‧線路油墨塗佈機 22‧‧‧Line Ink Coating Machine

23‧‧‧線路烘烤爐 23‧‧‧line baking oven

24‧‧‧線路曝光機 24‧‧‧line exposure machine

25‧‧‧線路顯影機 25‧‧‧line developing machine

26‧‧‧線路蝕刻機 26‧‧‧Line Etching Machine

27‧‧‧線路去膜機 27‧‧‧line film remover

28‧‧‧定位鑽孔機 28‧‧‧Positioning drilling machine

3‧‧‧防焊印刷自動化製程設備 3‧‧‧Automatic process equipment for solder mask printing

31‧‧‧二次酸洗刷磨機 31‧‧‧Second pickling and scrubbing machine

32‧‧‧防焊油墨塗佈機 32‧‧‧Solderproof ink coating machine

33‧‧‧防焊烘烤爐 33‧‧‧Solderproof baking oven

34‧‧‧防焊曝光機 34‧‧‧Solderproof exposure machine

35‧‧‧防焊顯影機 35‧‧‧Solderproof developing machine

4‧‧‧文字印刷自動化製程設備 4‧‧‧Text Printing Automation Process Equipment

41‧‧‧文字印刷機 41‧‧‧Text Printing Machine

42‧‧‧文字烘烤爐 42‧‧‧Text baking oven

5‧‧‧電性測試自動化製程設備 5‧‧‧ Electricity test automation process equipment

51‧‧‧電路板成型機 51‧‧‧Circuit board forming machine

52‧‧‧電性測試機 52‧‧‧electricity testing machine

第一圖 本發明之功能方塊圖。 First diagram A functional block diagram of the present invention.

第二圖 線路印刷自動化製程設備之功能方塊圖。 The second figure is the functional block diagram of the automatic printing process equipment.

第三圖 防焊印刷自動化製程設備之功能方塊圖。 The third figure is a functional block diagram of the solder mask printing automation process equipment.

第四圖 文字印刷自動化製程設備之功能方塊圖。 The fourth figure is a functional block diagram of the text printing automation process equipment.

第五圖 電性測試自動化製程設備之功能方塊圖。 Figure 5 Functional block diagram of automated test equipment.

實施例一，請參閱第一至五圖；一種光電印刷電路板自動化 製程設備及自動化製程方法，該光電印刷電路板自動化製程設備1，包括：線路印刷自動化製程設備2、防焊印刷自動化製程設備3、文字印刷自動化製程設備4及電性測試自動化製程設備5。其中，該線路印刷自動化製程設備2之輸出端，則是以自動輸送帶來連接至該防焊印刷自動化製程設備3之輸入端；該防焊印刷自動化製程設備3之輸出端，則是以自動輸送帶來連接至該文字印刷自動化製程設備4之輸入端；該文字印刷自動化製程設備4之輸出端，則是以自動輸送帶來連接至該電性測試自動化製程設備5之輸入端。 First embodiment, please refer to the first to fifth drawings; a photoelectric printed circuit board automation Process equipment and automatic process method. The optoelectronic printed circuit board automation process equipment 1 includes: line printing automation process equipment 2, solder resist printing automation process equipment 3, text printing automation process equipment 4 and electrical test automation process equipment 5. Among them, the output terminal of the line printing automation process equipment 2 is connected to the input terminal of the solder mask printing automation process equipment 3 by an automatic conveyance belt; the output terminal of the solder mask printing automation process equipment 3 is an automatic terminal. The conveyor belt is connected to the input terminal of the text printing automation process equipment 4; the output terminal of the text printing automation process equipment 4 is connected to the input terminal of the electrical test automation process equipment 5 by an automatic conveyor belt.

該線路印刷自動化製程設備2，則包括：基板酸洗刷磨機21、線路油墨塗佈機22、線路烘烤爐23、線路曝光機24、線路顯影機25、線路蝕刻機26、線路去膜機27及定位鑽孔機28。 The line printing automation process equipment 2 includes: a substrate pickling and scrubbing machine 21, a line ink coating machine 22, a line baking furnace 23, a line exposure machine 24, a line developing machine 25, a line etching machine 26, and a line film removing machine. 27 and 28 positioning drilling machine.

該基板酸洗刷磨機21之輸出端，則是以自動輸送帶來連接至該線路油墨塗佈機22之輸入端；該線路油墨塗佈機22之輸出端，則是以自動輸送帶來連接至該線路烘烤爐23之輸入端；該線路烘烤爐23之輸出端，則是以自動輸送帶來連接至該線路曝光機24之輸入端；該線路曝光機24之輸出端，則是以自動輸送帶來連接至該線路顯影機25之輸入端；該線路顯影機25之輸出端，則是以自動輸送帶來連接至該線路蝕刻機26之輸入端；該線路蝕刻機26之輸出端，則是以自動輸送帶來連接至該線路去膜機27之輸入端；該線路去膜機27之輸出端，則是以自動輸送帶來連接至該定位鑽孔機28之輸入端。 The output terminal of the substrate pickling and scrubbing machine 21 is connected to the input terminal of the line ink coating machine 22 by an automatic conveying belt; the output terminal of the line ink coating machine 22 is connected by an automatic conveying belt. To the input terminal of the line baking furnace 23; the output terminal of the line baking furnace 23 is connected to the input terminal of the line exposure machine 24 by an automatic conveyor belt; the output terminal of the line exposure machine 24 is It is connected to the input terminal of the line developing machine 25 by an automatic conveying belt; the output terminal of the line developing machine 25 is connected to the input terminal of the line etching machine 26 by an automatic conveying belt; the output of the line etching machine 26 The terminal is connected to the input terminal of the line film removing machine 27 by an automatic conveying belt; the output terminal of the line film removing machine 27 is connected to the input terminal of the positioning drilling machine 28 by an automatic conveying belt.

而該線路印刷自動化製程設備2之輸入端，即為該基板酸洗刷磨機21之輸入端；該線路印刷自動化製程設備2之輸出端，即為該定位 鑽孔機28之輸出端。 The input end of the line printing automation process equipment 2 is the input end of the substrate pickling and scrubbing machine 21; the output end of the line printing automation process equipment 2 is the positioning. Output of drilling machine 28.

該防焊印刷自動化製程設備3，則包括：二次酸洗刷磨機31、防焊油墨塗佈機32、防焊烘烤爐33、防焊曝光機34及防焊顯影機35。 The automatic solder mask printing process equipment 3 includes a secondary pickling brush mill 31, a solder mask ink coating machine 32, a solder mask baking oven 33, a solder mask exposure machine 34, and a solder mask developing machine 35.

該二次酸洗刷磨機31之輸出端，則是以自動輸送帶來連接至該防焊油墨塗佈機32之輸入端；該防焊油墨塗佈機32之輸出端，則是以自動輸送帶來連接至該防焊烘烤爐33之輸入端；該防焊烘烤爐33之輸出端，則是以自動輸送帶來連接至該防焊曝光機34之輸入端；該防焊曝光機34之輸出端，則是以自動輸送帶來連接至該防焊顯影機35之輸入端。 The output end of the secondary pickling scrubbing machine 31 is connected to the input end of the solder resist ink coating machine 32 by an automatic conveying belt; the output end of the solder resist ink coating machine 32 is automatically conveyed. Bring the input terminal connected to the soldering proof baking oven 33; the output terminal of the soldering proof baking oven 33 is connected to the input terminal of the solder proof exposure machine 34 by an automatic conveying belt; the solder proof exposure machine The output end of 34 is connected to the input end of the solder resist developing machine 35 by an automatic conveying belt.

而該防焊印刷自動化製程設備3之輸入端，即為該二次酸洗刷磨機31之輸入端；該防焊印刷自動化製程設備3之輸出端，即為該防焊顯影機35之輸出端。 The input terminal of the solder mask printing automation process equipment 3 is the input terminal of the secondary pickling brush mill 31; the output terminal of the solder mask printing automation process equipment 3 is the output terminal of the solder mask developing machine 35. .

該文字印刷自動化製程設備4，則包括：文字印刷機41與文字烘烤爐42。該文字印刷機41之輸出端，則是以自動輸送帶來連接至該文字烘烤爐42之輸入端。而該文字印刷自動化製程設備4之輸入端，即為該文字印刷機41之輸入端；該文字印刷自動化製程設備4之輸出端，即為該文字烘烤爐42之輸出端。 The text printing automatic process equipment 4 includes a text printing machine 41 and a text baking oven 42. The output end of the text printing machine 41 is connected to the input end of the text baking oven 42 by an automatic conveying belt. The input terminal of the text printing automation process equipment 4 is the input terminal of the text printing machine 41; the output terminal of the text printing automation process equipment 4 is the output terminal of the text baking furnace 42.

該電性測試自動化製程設備5，則包括：電路板成型機51與電性測試機52。該電路板成型機51之輸出端，則是以自動輸送帶來連接至該電性測試機52之輸入端。而該電性測試自動化製程設備5之輸入端，即為該電路板成型機51之輸入端；該電性測試自動化製程設備5之輸出端，即為該電性測試機52之輸出端。 The electrical test automation process equipment 5 includes a circuit board forming machine 51 and an electrical test machine 52. The output end of the circuit board forming machine 51 is connected to the input end of the electrical testing machine 52 by an automatic conveying belt. The input terminal of the electrical test automation process equipment 5 is the input terminal of the circuit board forming machine 51; the output terminal of the electrical test automation process equipment 5 is the output terminal of the electrical test machine 52.

該光電印刷電路板自動化製程設備1之該線路印刷自動化 製程設備2中，該基板酸洗刷磨機21，則是用於將銅箔基板進行清潔及刷磨、微蝕的粗化處理程序。該線路油墨塗佈機22，則是用於將經粗化處理之銅箔基板之底面進行光阻膜的塗佈處理程序。該線路烘烤爐23，則是用於將已塗佈光阻膜之銅箔基板進行光阻膜的烘烤處理程序；而該線路烘烤爐23，則是使用LED燈來進行線路烘烤作業程序，具有節能省電的優點。該線路曝光機24，則是用於將底片上的設計線路及製程設備定位資訊來轉移至銅箔基板之光阻膜；而該線路曝光機24，則是使用LED燈來進行線路曝光作業程序，具有節能省電的優點。該線路顯影機25，則是利用顯影劑來保留銅箔基板之光阻膜中所要留存的部分。該線路蝕刻機26，則是利用蝕刻劑來去除銅箔基板上未覆蓋光阻膜的金屬區域。該線路去膜機27，則是用於去除銅箔基板上所留存之光阻膜以形成設計線路及製程設備定位資訊。該定位鑽孔機28，則是用於在已形成設計線路之銅箔基板上鑽設零件孔，並依據銅箔基板上之製程設備定位資訊來鑽設對應之複數定位孔；其中，該定位鑽孔機28，則會藉由影像感測器來檢視、判讀自動輸送帶運載之銅箔基板上的製程設備定位資訊以預先進行銅箔基板的擺置定位調整後，再進行後續的定位鑽孔作業程序。 The line printing automation of the optoelectronic printed circuit board automation process equipment 1 In the process equipment 2, the substrate pickling and scrubbing machine 21 is a roughening process program for cleaning, brushing, and micro-etching a copper foil substrate. The line ink coating machine 22 is a coating process program for applying a photoresist film to the bottom surface of the roughened copper foil substrate. The circuit baking furnace 23 is a baking process for photoresist film on a copper foil substrate coated with a photoresist film. The circuit baking furnace 23 is a circuit baking using LED lights. The operation program has the advantages of energy saving and power saving. The line exposure machine 24 is used to transfer the design circuit and process equipment positioning information on the negative film to the photoresist film of the copper foil substrate; and the line exposure machine 24 uses LED lights to perform the line exposure process. , Has the advantages of energy saving. The line developing machine 25 uses a developer to retain a portion of the photoresist film of the copper foil substrate to be retained. The line etching machine 26 uses an etchant to remove metal areas on the copper foil substrate that are not covered with a photoresist film. The line film removing machine 27 is used to remove the photoresist film remaining on the copper foil substrate to form a design circuit and process equipment positioning information. The positioning drilling machine 28 is used to drill part holes in the copper foil substrate on which the design circuit has been formed, and to drill corresponding plural positioning holes according to the process equipment positioning information on the copper foil substrate; wherein, the positioning The drilling machine 28 will use an image sensor to view and interpret the positioning information of the process equipment on the copper foil substrate carried by the automatic conveyor belt to perform the positioning and adjustment of the copper foil substrate in advance, and then perform subsequent positioning drilling. Hole procedure.

該光電印刷電路板自動化製程設備1之該防焊印刷自動化製程設備3中，該二次酸洗刷磨機31，則是再次將銅箔基板進行清潔及刷磨、微蝕的粗化處理程序。該防焊油墨塗佈機32，則是用於將經粗化處理之銅箔基板之頂面進行防焊感光漆的塗佈處理程序。該防焊烘烤爐33，則是用於將已塗佈防焊感光漆之銅箔基板進行防焊感光漆的烘烤處理程序；而該防焊烘烤爐33，則是使用LED燈來進行防焊烘烤作業程序，具有節能 省電的優點。該防焊曝光機34，則是用於將底片上的防焊區域來轉移至銅箔基板之防焊感光漆；而該防焊曝光機34，則是使用LED燈來進行防焊曝光作業程序，具有節能省電的優點；其中，該防焊曝光機34，則會藉由影像感測器來檢視、判讀自動輸送帶運載之銅箔基板上該些定位孔以預先進行銅箔基板的擺置定位調整後，再進行後續的防焊曝光作業程序。該防焊顯影機35，則是利用顯影劑來保留銅箔基板之防焊感光漆中所要留存的部分。 In the solder mask printing automation process equipment 3 of the photoelectric printed circuit board automation process equipment 1, the secondary pickling and scrubbing mill 31 is a roughening process for cleaning, brushing, and micro-etching the copper foil substrate again. The solder mask ink coater 32 is a coating process for applying a solder mask to the top surface of the roughened copper foil substrate. The soldering-proof baking oven 33 is a baking process for soldering the copper foil substrate coated with the soldering-proof photosensitive paint, and the soldering-proof baking oven 33 uses LED lights to Energy-saving baking operation program with energy saving Advantages of power saving. The solder mask exposure machine 34 is used to transfer the solder mask area on the negative to the copper foil substrate. The solder mask exposure machine 34 uses LED lights to perform the solder mask exposure process. It has the advantages of energy saving and power saving. Among them, the solder mask exposure machine 34 will use an image sensor to inspect and judge the positioning holes on the copper foil substrate carried by the automatic conveyor to pre-position the copper foil substrate. After the positioning adjustment is performed, the subsequent welding exposure operation procedure is performed. The solder resist developing machine 35 uses a developer to retain a portion of the solder resist photosensitive paint on the copper foil substrate.

該光電印刷電路板自動化製程設備1之該文字印刷自動化製程設備4中，該文字印刷機41，則是用於將數碼文字、零件標號、品牌資訊印製於銅箔基板；其中，該文字印刷機41，則會藉由影像感測器來檢視、判讀自動輸送帶運載之銅箔基板上該些定位孔以預先進行銅箔基板的擺置定位調整後，再進行後續的文字印刷作業程序。該文字烘烤爐42，則是用於將已印製文字之銅箔基板進行文字漆墨的烘烤處理程序；而該文字烘烤爐42，則是使用LED燈來進行文字烘烤作業程序，具有節能省電的優點。 In the text printing automation process equipment 4 of the photoelectric printed circuit board automatic manufacturing process equipment 1, the text printing machine 41 is used to print digital characters, part numbers, and brand information on a copper foil substrate; among which, the text printing The machine 41 will use an image sensor to inspect and interpret the positioning holes on the copper foil substrate carried by the automatic conveyor belt to perform the positioning and adjustment of the copper foil substrate in advance, and then perform subsequent text printing operation procedures. The character baking oven 42 is a baking process program for performing text paint and ink on a copper foil substrate on which characters have been printed; and the character baking oven 42 is a character baking process program using LED lights. , Has the advantages of energy saving.

該光電印刷電路板自動化製程設備1之該電性測試自動化製程設備5中，該電路板成型機51，則是用於將已印製文字之銅箔基板進行二次零件鑽孔，並依據設定尺寸裁切成型為複數電路機板；其中，該電路板成型機51，則會藉由影像感測器來檢視、判讀自動輸送帶運載之銅箔基板上該些定位孔以預先進行銅箔基板的擺置定位調整後，再進行後續的鑽孔裁切作業程序。該電性測試機52，則是用於檢測已成型之電路機板的導通、斷路及阻抗數值等電路特性；其中，該電性測試機52，則會藉由影 像感測器來檢視、判讀自動輸送帶運載之銅箔基板上該些定位孔以預先進行銅箔基板的擺置定位調整後，再進行後續的電性測試作業程序。 In the electrical test automation process equipment 5 of the photoelectric printed circuit board automation process equipment 1, the circuit board forming machine 51 is used for drilling secondary parts of copper foil substrates with printed characters, and according to the setting The size is cut and formed into a plurality of circuit board. Among them, the circuit board forming machine 51 uses an image sensor to inspect and interpret the positioning holes on the copper foil substrate carried by the automatic conveyor belt to perform the copper foil in advance. After the positioning of the substrate is adjusted, subsequent drilling and cutting operations are performed. The electrical tester 52 is used to detect circuit characteristics such as the on, open circuit and impedance values of the formed circuit board. Among them, the electrical tester 52 is After inspecting and judging the positioning holes on the copper foil substrate carried by the automatic conveyor with a sensor, the positioning and adjustment of the copper foil substrate is adjusted in advance, and then the subsequent electrical test operation procedures are performed.

該光電印刷電路板自動化製程方法，係應用於該光電印刷電路板自動化製程設備1，藉以實現產線全程自動化之目的。該光電印刷電路板自動化製程方法，包括： The automated manufacturing method of the optoelectronic printed circuit board is applied to the automated process equipment 1 of the optoelectronic printed circuit board, so as to realize the purpose of automation of the entire production line. The method for automatically manufacturing an optoelectronic printed circuit board includes:

步驟一：整合該光電印刷電路板自動化製程設備1中，需要進行預先定位調整設置之所有機台的定位參數，並將之對應設定為製程設備定位資訊。 Step 1: Integrate the optoelectronic printed circuit board automated manufacturing equipment 1 with the positioning parameters of all the machines that need to be adjusted and set in advance, and set them as the positioning information of the manufacturing equipment.

步驟二：使用底片繪圖機，將設計線路及該製程設備定位資訊來繪製於底片上。 Step 2: Use the film plotter to draw the design circuit and the positioning information of the process equipment on the film.

步驟三：使用該線路曝光機24、該線路顯影機25及該線路蝕刻機26，將底片之設計線路及該製程設備定位資訊來轉移至銅箔基板。 Step 3: Use the line exposure machine 24, the line developing machine 25, and the line etching machine 26 to transfer the design line of the negative film and the positioning information of the process equipment to the copper foil substrate.

步驟四：使用該定位鑽孔機28，並依據銅箔基板上之該製程設備定位資訊，來鑽設對應之複數定位孔。 則銅箔基板於該光電印刷電路板自動化製程設備1中進行產製流程時，設備機台即可藉由影像感測器來檢視、判讀自動輸送帶運載之銅箔基板上該些定位孔來預先進行銅箔基板的擺置定位調整，再進行設備機台所要執行的製程作業。 Step 4: Use the positioning drilling machine 28 and drill corresponding positioning holes according to the positioning information of the process equipment on the copper foil substrate. Then, when the copper foil substrate is manufactured in the optoelectronic printed circuit board automatic manufacturing equipment 1, the equipment machine can use an image sensor to inspect and judge the positioning holes on the copper foil substrate carried by the automatic conveyor. The copper foil substrate is positioned and adjusted in advance, and then the manufacturing process to be performed by the equipment machine is performed.

本發明主要係利用該線路印刷自動化製程設備2之該線路曝光機24來將製程中所需之製程設備定位資訊設置於銅箔基板，並藉由該定位鑽孔機28依據製程設備定位資訊於銅箔基板上來鑽設對應之該些定位孔，以便設備機台可依據該些定位孔來進行銅箔基板的自動定位設置；如 此，即可達到全程自動化的產製流程來大幅提升製程產出效率、製程良率並可相對減少人力資源的使用及節省人事成本的費用。 The present invention mainly uses the line exposure machine 24 of the line printing automatic process equipment 2 to set the positioning information of the process equipment required in the process on the copper foil substrate, and the positioning drilling machine 28 according to the process equipment positioning information in the Corresponding positioning holes are drilled on the copper foil substrate so that the equipment machine can perform automatic positioning settings of the copper foil substrate according to the positioning holes; In this way, a fully automated production process can be achieved to greatly improve process output efficiency, process yield, and relatively reduce the use of human resources and save personnel costs.

上述實施例僅為說明本發明之原理及其功效，並非限制本發明；因此，習於此技術之人士對上述實施例進行修改及變化仍不脫本發明之精神。本發明已具備產業上利用性、新穎性及進步性，並符合發明專利要件，爰依法提起申請。 The above embodiments are only for explaining the principle of the present invention and its effects, and are not a limitation on the present invention; therefore, those skilled in the art can modify and change the above embodiments without departing from the spirit of the present invention. The invention has industrial applicability, novelty, and progress, and meets the requirements of invention patents, and has filed an application according to law.

Claims (2)

一種光電印刷電路板自動化製程設備，包括：線路印刷自動化製程設備、防焊印刷自動化製程設備、文字印刷自動化製程設備及電性測試自動化製程設備；該線路印刷自動化製程設備之輸出端，則是以自動輸送帶來連接至該防焊印刷自動化製程設備之輸入端；該防焊印刷自動化製程設備之輸出端，則是以自動輸送帶來連接至該文字印刷自動化製程設備之輸入端；該文字印刷自動化製程設備之輸出端，則是以自動輸送帶來連接至該電性測試自動化製程設備之輸入端；該線路印刷自動化製程設備，則包括：基板酸洗刷磨機、線路油墨塗佈機、線路烘烤爐、線路曝光機、線路顯影機、線路蝕刻機、線路去膜機及定位鑽孔機；而該線路烘烤爐與該線路曝光機，則均設置有複數LED燈；該基板酸洗刷磨機之輸出端，則是以自動輸送帶來連接至該線路油墨塗佈機之輸入端；該線路油墨塗佈機之輸出端，則是以自動輸送帶來連接至該線路烘烤爐之輸入端；該線路烘烤爐之輸出端，則是以自動輸送帶來連接至該線路曝光機之輸入端；該線路曝光機之輸出端，則是以自動輸送帶來連接至該線路顯影機之輸入端；該線路顯影機之輸出端，則是以自動輸送帶來連接至該線路蝕刻機之輸入端；該線路蝕刻機之輸 出端，則是以自動輸送帶來連接至該線路去膜機之輸入端；該線路去膜機之輸出端，則是以自動輸送帶來連接至該定位鑽孔機之輸入端；而該線路印刷自動化製程設備之輸入端，即為該基板酸洗刷磨機之輸入端；該線路印刷自動化製程設備之輸出端，即為該定位鑽孔機之輸出端；該防焊印刷自動化製程設備，則包括：二次酸洗刷磨機、防焊油墨塗佈機、防焊烘烤爐、防焊曝光機及防焊顯影機；而該防焊烘烤爐與該防焊曝光機，則均設置有複數LED燈；該二次酸洗刷磨機之輸出端，則是以自動輸送帶來連接至該防焊油墨塗佈機之輸入端；該防焊油墨塗佈機之輸出端，則是以自動輸送帶來連接至該防焊烘烤爐之輸入端；該防焊烘烤爐之輸出端，則是以自動輸送帶來連接至該防焊曝光機之輸入端；該防焊曝光機之輸出端，則是以自動輸送帶來連接至該防焊顯影機之輸入端；而該防焊印刷自動化製程設備之輸入端，即為該二次酸洗刷磨機之輸入端；該防焊印刷自動化製程設備之輸出端，即為該防焊顯影機之輸出端；該文字印刷自動化製程設備，則包括：文字印刷機與文字烘烤爐；而該文字烘烤爐，則設置有複數LED燈；該文字印刷機之輸出端，則是以自動輸送帶來連接至該文字烘烤爐之輸入端；而該文字印刷自動化製程設 備之輸入端，即為該文字印刷機之輸入端；該文字印刷自動化製程設備之輸出端，即為該文字烘烤爐之輸出端；該電性測試自動化製程設備，則包括：電路板成型機與電性測試機；該電路板成型機之輸出端，則是以自動輸送帶來連接至該電性測試機之輸入端；而該電性測試自動化製程設備之輸入端，即為該電路板成型機之輸入端；該電性測試自動化製程設備之輸出端，即為該電性測試機之輸出端。 An automated process equipment for optoelectronic printed circuit boards, including: automated circuit printing process equipment, automatic solder mask printing process equipment, automated text printing process equipment, and electrical test automation process equipment; the output end of the automated circuit printing process equipment is based on The automatic conveying belt is connected to the input end of the solderless printing automation process equipment; the output end of the solderless printing automatic process equipment is connected to the input end of the text printing automation process equipment by the automatic conveying belt; the text printing The output end of the automatic process equipment is connected to the input end of the electrical test automation process equipment by an automatic conveyor belt. The line printing automation process equipment includes: substrate pickling and scrubbing mills, line ink coating machines, and circuits. Baking furnace, line exposure machine, line developing machine, line etching machine, line film removing machine and positioning drilling machine; while the line baking furnace and the line exposure machine are provided with a plurality of LED lights; the substrate is acid-washed The output of the mill is connected to the line ink coating machine with an automatic conveyor belt. The input end; the output end of the line ink coating machine is connected to the input end of the line baking furnace by an automatic conveying belt; the output end of the line baking oven is connected to the line by an automatic conveying belt. The input terminal of the line exposure machine; the output terminal of the line exposure machine is connected to the input terminal of the line developing machine by an automatic conveying belt; the output terminal of the line exposure machine is connected to the input terminal of the line developing machine. Input of line etching machine; input of line etching machine The output end is connected to the input terminal of the line film removing machine by an automatic conveying belt; the output end of the line film removing machine is connected to the input terminal of the positioning drilling machine by an automatic conveying belt; and the The input end of the line printing automation process equipment is the input end of the substrate pickling and scrubbing machine; the output end of the line printing automation process equipment is the output end of the positioning drilling machine; the solder resist printing automation process equipment, It includes: a secondary pickling brush mill, a solder mask coating machine, a solder mask baking oven, a solder mask exposure machine, and a solder mask developing machine; and the solder mask oven and the solder mask exposure machine are both set There are multiple LED lights; the output end of the secondary pickling brush mill is connected to the input end of the solder resist ink coating machine by an automatic conveying belt; the output end of the solder resist ink coating machine is The automatic conveying belt is connected to the input end of the soldering-proof baking oven; the output end of the soldering-proof baking furnace is connected to the input end of the welding-proof exposure machine by an automatic conveying belt; The output is connected to the solder mask by an automatic conveyor belt. The input end of the film machine; and the input end of the solder mask printing automation process equipment is the input terminal of the secondary pickling brush mill; the output end of the solder mask printing automation process equipment is the solder mask developing machine. The output terminal; the text printing automatic manufacturing equipment includes: a text printing machine and a text baking furnace; and the text baking furnace is provided with a plurality of LED lights; the output terminal of the text printing machine is an automatic conveyor belt To connect to the input terminal of the text baking oven; and the text printing automation process design The input terminal prepared is the input terminal of the text printing machine; the output terminal of the text printing automation processing equipment is the output terminal of the text baking oven; the electrical test automation processing equipment includes: circuit board forming Machine and electrical tester; the output end of the circuit board forming machine is connected to the input end of the electrical tester by an automatic conveyor belt; and the input end of the electrical test automation process equipment is the circuit The input terminal of the plate forming machine; the output terminal of the electrical test automation process equipment is the output terminal of the electrical test machine. 一種光電印刷電路板自動化製程方法，係應用於光電印刷電路板自動化製程設備，藉以實現產線全程自動化之目的；該光電印刷電路板自動化製程方法，包括：步驟一：整合該光電印刷電路板自動化製程設備中，需要進行預先定位調整設置之所有機台的定位參數，並將之對應設定為製程設備定位資訊；步驟二：使用底片繪圖機，將設計線路及該製程設備定位資訊來繪製於底片上；步驟三：使用該線路曝光機、該線路顯影機及該線路蝕刻機，將底片之設計線路及該製程設備定位資訊來轉移至銅箔基板；步驟四：使用該定位鑽孔機，並依據銅箔基板上之該製程設備定位資訊，來鑽設對應之複數定位孔； 則銅箔基板於該光電印刷電路板自動化製程設備中進行產製流程時，設備機台即可藉由影像感測器來檢視、判讀自動輸送帶運載之銅箔基板上該些定位孔來預先進行銅箔基板的擺置定位調整，再進行設備機台所要執行的製程作業。 An automated manufacturing method of an optoelectronic printed circuit board, which is applied to an automated manufacturing process of an optoelectronic printed circuit board, so as to achieve the purpose of automation of the entire production line. The automated manufacturing method of an optoelectronic printed circuit board includes the following steps: Step 1: Integrate the automation of the optoelectronic printed circuit board In the process equipment, the positioning parameters of all the machines that need to be pre-positioned and adjusted are set and correspondingly set as the process equipment positioning information. Step 2: Use a film plotter to draw the design circuit and the process equipment positioning information on the film. Step 3: Use the line exposure machine, the line developing machine, and the line etching machine to transfer the design line of the negative film and the process equipment positioning information to the copper foil substrate; Step 4: use the positioning drilling machine, and According to the positioning information of the process equipment on the copper foil substrate, drill corresponding positioning holes; Then, when the copper foil substrate is produced in the photoelectric printed circuit board automatic manufacturing equipment, the equipment machine can inspect and judge the positioning holes on the copper foil substrate carried by the automatic conveyor belt through an image sensor to preliminarily Perform the positioning and adjustment of the copper foil substrate, and then perform the process operations to be performed by the equipment machine.
TW105140921A 2016-12-09 2016-12-09 Optoelectronic printed circuit board automated process equipment and automated process method TW201821912A (en)

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CN111491446A (en) * 2019-01-28 2020-08-04 富泰华工业（深圳）有限公司 Circuit board line printing equipment and method
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