CN102378500A - Method for removing burrs of half-edge hole - Google Patents
Method for removing burrs of half-edge hole Download PDFInfo
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- CN102378500A CN102378500A CN2010102507667A CN201010250766A CN102378500A CN 102378500 A CN102378500 A CN 102378500A CN 2010102507667 A CN2010102507667 A CN 2010102507667A CN 201010250766 A CN201010250766 A CN 201010250766A CN 102378500 A CN102378500 A CN 102378500A
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- edge hole
- copper
- plated
- tin
- zinc
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Abstract
The invention discloses a method for removing burrs of a half-edge hole. The method comprises the following steps: firstly, depositing copper on a drilled substrate; then successively plating copper and tin; then, carrying out milling processing on the shape of the half-edge hole; and finally, etching and stripping tin. In the method for removing the burrs of the half-edge hole provided by the invention, a chemical method is used for replacing an artificial method in the prior art to remove the burrs on the hole wall of the half-edge hole, thereby saving a large amount of manpower, financial resources and time; and the burrs are completely removed at one time by adopting the chemical method, thereby reducing production cost while ensuring the quality of the product and improving production efficiency. The method disclosed by the invention is suitable for production on a large scale.
Description
Technical field
The invention belongs to the half-edge hole metallization process of printed board edges of boards, be specifically related to a kind of method of half-edge hole deburring.
Background technology
The half-edge hole metallization process of printed board edges of boards has been the technology of comparative maturity in PCB processing; But; This type printed board edges of boards have the lateral opening PCB of whole row's metallized semi; Its volume ratio is less, is used on the support plate daughter board as a motherboard mostly, welds together through the lateral opening pins with motherboard and other components and parts of these metallized semis.If residual jagged on the lateral opening hole wall of these metallized semis, when in subsequent processes, it being welded, will cause problems such as the insecure or rosin joint of leg, can cause the bridge joint short circuit between the two pins when serious.
Therefore, how to remove the burr on the half-edge hole hole wall, the product quality of controlling well after the half-edge hole metallization moulding of printed board edges of boards is a difficult problem in the PCB technical process always.
Present many producers adopt to bore processing or mill processing the half-edge hole of printed board edges of boards is processed, and its processing step is generally boring-heavy copper-plating-half-edge hole profile and mills processing/half-edge hole profile brill processing-artificial deburring-mill once more processing/brill processing-manual work deburring once more.Yet, no matter be to bore processing or mill processing, the direction of rotation of its cutter all is a clockwise direction; When cutter is worked into wherein an end points; Because half-edge hole hole wall metal layer closely links to each other with substrate layer, can prevent metal layer in the separating of the extension that adds man-hour and metal layer and half-edge hole hole wall, the half-edge hole hole wall after yet can guaranteeing here to process can not produce burr; And another end points opposite with it is owing to have no support attached to the copper on the half-edge hole hole wall; When cutter turned round forward, receiving external force to influence the interior metal layer of half-edge hole hole wall will take place with the direction of rotation of cutter to curl, thereby produces burr; And to remove these burrs; Can only repair with repairing the plate cutter through manual work; And after milling processing/brill manufacturing procedure once more, also need to remove burr through manual work once more; Its inefficiency, and it is also undesirable to handle quality, even also exist manual operation and repair the error of plate cutter hole wall is caused hard defects and causes the ruined risk of half-edge hole hole wall.
Summary of the invention
The purpose of this invention is to provide a kind of method that adopts chemical method efficiently to remove the half-edge hole burr of printed board edges of boards.
The present invention adopts following technical scheme to realize:
A kind of method of half-edge hole deburring, the step of this method comprises:
At first on the base material of having holed, sink copper;
Secondly carry out copper facing and zinc-plated successively;
Carry out the half-edge hole profile then and mill processing;
Carry out etching at last and move back tin.
In above-mentioned copper-plated process, copper-plated thickness is 15～20 μ m, if copper-plated thickness is too little, mills in the course of processing milling cutter in follow-up half-edge hole profile and when griffing, very easily the copper facing in the half-edge hole hole wall is taken out of, causes scrapping of base material; If copper-plated thickness is too big, control requires just than higher in follow-up etch process, and the etching cost is bigger, is inappropriate for batch process.
Through testing and verification, in above-mentioned copper-plated process, it is good that copper-plated thickness adopts 17 μ m.
Erode in order to protect copper in backing material plate face and the half-edge hole hole in etch process, can not be etched agent; With deburring better; Before the half-edge hole profile is milled processing technology, carry out zinc-plated to base material; This tin is as the protective layer of copper, and in above-mentioned zinc-plated process, zinc-plated thickness is 7-15 μ m.
Through testing and verification, in above-mentioned zinc-plated process, it is good that zinc-plated thickness adopts 10 μ m.
In above-mentioned etching process, can adopt commercial copper chloride and ammoniacal liquor as etchant, also can adopt other etchants according to actual needs certainly, such as the hydrogen peroxide etching solution.
In above-mentioned technology of moving back tin, can adopt commercial nitric acid and copper inhibitor to move back tin and handle, also can select to use other tin stripping liquids according to actual needs certainly.
Beneficial effect of the present invention is following:
(1) in terms of existing technologies; The present invention is in the treatment process of half-edge hole deburring; Before the half-edge hole profile is milled processing technology, base material has been carried out zinc-plated processing; This zinc-plated conduct the protective layer of copper, go can effectively protect in the follow-up deburring technology copper in backing material plate face and the half-edge hole hole not to be destroyed.
(2) in the method for above-mentioned deburring; Adopt commercial copper chloride and ammoniacal liquor as etchant, to mill the copper on the burr that produces in the machining process in profile on the corrosion half-edge hole hole wall, only be left tin this moment on the burr after the etchant corrosion; Thereby after moving back the process of tin processing; This burr is Lock-out, and the hard defects of having avoided manual pick in the prior art half-edge hole hole wall to be caused when repairing the plate cutter and repair have been evaded the ruined risk of hole wall quality.
(3) method of this half-edge hole deburring provided by the invention has chemically replaced burr on the available technology adopting manual method removal half-edge hole hole wall; Great amount of manpower, financial resources and time have been practiced thrift; Adopt chemical method that the processing of burr is settled at one go; Also guaranteed the quality of product when reducing production costs, improved production efficiency, be suitable for producing in enormous quantities.
Embodiment
Disclosed all characteristics in this specification, or the step in disclosed all methods or the process except mutually exclusive characteristic and/or the step, all can make up by any way.
Embodiment 1: a kind of method of half-edge hole deburring, and the step of this method comprises: at first carry out the base-material blanking, and this base-material is holed, and then on the base material of having holed, sink copper; Secondly carry out copper facing and zinc-plated successively, in the copper facing process, copper-plated thickness is 15 μ m, and in tin plating technique, zinc-plated thickness is 7 μ m; Carry out the half-edge hole profile then and mill processing; Adopt copper chloride to carry out etching following closely as etchant; In etch process, because carried out the tin plating technique processing this moment before milling half-edge hole technology, tin is as the protective layer of copper; Protected the copper in base-material plate face and the half-edge hole hole can not eroded by copper chloride; This copper chloride only corrodes and mills the copper on the burr that the half-edge hole hole wall produces after the half-edge hole PROCESS FOR TREATMENT, and only remaining tin on the burr after etch process is handled adopts nitric acid to move back tin at last; Promptly get rid of the tin on the burr with nitric acid, this moment, burr was handled the back Lock-out through above-mentioned a series of chemical methodes.
Embodiment 2: a kind of method of half-edge hole deburring, and the step of this method comprises: at first carry out the base-material blanking, and this base-material is holed, and then on the base material of having holed, sink copper; Secondly carry out copper facing and zinc-plated successively, in the copper facing process, copper-plated thickness is 17 μ m, and in tin plating technique, zinc-plated thickness is 10 μ m; Carry out the half-edge hole profile then and mill processing; Adopt ammoniacal liquor to carry out etching following closely as etchant; In etch process, because carried out the tin plating technique processing this moment before milling half-edge hole technology, tin is as the protective layer of copper; Protected the copper in base-material plate face and the half-edge hole hole can not eroded by ammoniacal liquor; This ammoniacal liquor only corrodes and mills the copper on the burr that the half-edge hole hole wall produces after the half-edge hole PROCESS FOR TREATMENT, and only remaining tin on the burr after etch process is handled adopts nitric acid to move back tin at last; Promptly get rid of the tin on the burr with nitric acid, this moment, burr was handled the back Lock-out through above-mentioned a series of chemical methodes.
Embodiment 3: a kind of method of half-edge hole deburring, and the step of this method comprises: at first carry out the base-material blanking, and this base-material is holed, and then on the base material of having holed, sink copper; Secondly carry out copper facing and zinc-plated successively, in the copper facing process, copper-plated thickness is 20 μ m, and in tin plating technique, zinc-plated thickness is 15 μ m; Carry out the half-edge hole profile then and mill processing; Adopt ammoniacal liquor to carry out etching following closely as etchant; In etch process, because carried out the tin plating technique processing this moment before milling half-edge hole technology, tin is as the protective layer of copper; Protected the copper in base-material plate face and the half-edge hole hole can not eroded by ammoniacal liquor; This ammoniacal liquor only corrodes and mills the copper on the burr that the half-edge hole hole wall produces after the half-edge hole PROCESS FOR TREATMENT, and only remaining tin on the burr after etch process is handled adopts copper inhibitor to move back tin at last; Promptly get rid of the tin on the burr with copper inhibitor, this moment, burr was handled the back Lock-out through above-mentioned a series of chemical methodes.
The present invention is not limited to aforesaid embodiment.The present invention expands to any new feature or any new combination that discloses in this manual, and the arbitrary new method that discloses or step or any new combination of process.
Claims (7)
1. the method for a half-edge hole deburring, it is characterized in that: the step of this method comprises:
At first on the base material of having holed, sink copper;
Secondly carry out copper facing and zinc-plated successively;
Carry out the half-edge hole profile then and mill processing;
Carry out etching at last and move back tin.
2. the method for half-edge hole deburring as claimed in claim 1 is characterized in that: in above-mentioned copper-plated process, copper-plated thickness is 15～20 μ m.
3. the method for half-edge hole deburring as claimed in claim 2 is characterized in that: in above-mentioned copper-plated process, copper-plated thickness is 17 μ m.
4. like the method for claim 1,2 or 3 described half-edge hole deburrings, it is characterized in that: in above-mentioned zinc-plated process, zinc-plated thickness is 7-15 μ m.
5. the method for half-edge hole deburring as claimed in claim 4 is characterized in that: in above-mentioned zinc-plated process, zinc-plated thickness is 10 μ m.
6. like the method for claim 1,2 or 3 described half-edge hole deburrings, it is characterized in that: in above-mentioned etching process, adopt copper chloride and ammoniacal liquor as etchant.
7. like the method for claim 1,2 or 3 described half-edge hole deburrings, it is characterized in that: in above-mentioned technology of moving back tin, adopt nitric acid and copper inhibitor to move back the tin processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102507667A CN102378500A (en) | 2010-08-11 | 2010-08-11 | Method for removing burrs of half-edge hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102507667A CN102378500A (en) | 2010-08-11 | 2010-08-11 | Method for removing burrs of half-edge hole |
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| CN102378500A true CN102378500A (en) | 2012-03-14 |
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| CN2010102507667A Pending CN102378500A (en) | 2010-08-11 | 2010-08-11 | Method for removing burrs of half-edge hole |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103327753A (en) * | 2013-05-20 | 2013-09-25 | 深圳崇达多层线路板有限公司 | Manufacturing method for metal semi-hole circuit board |
| CN104640379A (en) * | 2013-11-08 | 2015-05-20 | 珠海方正科技多层电路板有限公司 | Printed circuit board and manufacturing method thereof |
| CN105297020A (en) * | 2014-06-25 | 2016-02-03 | 优胜奈米科技有限公司 | Tin stripping additive and application thereof |
| CN107660078A (en) * | 2017-10-30 | 2018-02-02 | 惠州市和信达线路板有限公司 | Printed circuit board edges of boards semi-metal manufacture craft and its drilling equipment |
| CN109831876A (en) * | 2019-02-28 | 2019-05-31 | 深圳崇达多层线路板有限公司 | A method of improve because circuit board song leads to the burr that drills |
| CN111698843A (en) * | 2020-05-27 | 2020-09-22 | 西安金百泽电路科技有限公司 | Reworking method for milled slot plate with etched leakage half-edge hole |
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| CN101626662A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process for removing flash of half PTH hole by dry film etching method |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
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| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
| CN101790286A (en) * | 2010-02-04 | 2010-07-28 | 深南电路有限公司 | Process for machining holes |
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2010
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20040191490A1 (en) * | 2003-03-26 | 2004-09-30 | Masahiro Hara | Circuit board, process for producing the same and a power module employing the same |
| CN1842253A (en) * | 2005-03-28 | 2006-10-04 | 邓柏生 | Production technique for surface mounting multi-layer resistive plate |
| CN101626662A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process for removing flash of half PTH hole by dry film etching method |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
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| CN101790286A (en) * | 2010-02-04 | 2010-07-28 | 深南电路有限公司 | Process for machining holes |
| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103327753A (en) * | 2013-05-20 | 2013-09-25 | 深圳崇达多层线路板有限公司 | Manufacturing method for metal semi-hole circuit board |
| CN103327753B (en) * | 2013-05-20 | 2016-05-04 | 深圳崇达多层线路板有限公司 | A kind of preparation method of metal half hole wiring board |
| CN104640379A (en) * | 2013-11-08 | 2015-05-20 | 珠海方正科技多层电路板有限公司 | Printed circuit board and manufacturing method thereof |
| CN105297020A (en) * | 2014-06-25 | 2016-02-03 | 优胜奈米科技有限公司 | Tin stripping additive and application thereof |
| CN105297020B (en) * | 2014-06-25 | 2021-06-25 | 优胜奈米科技有限公司 | Tin stripping additive and application thereof |
| CN107660078A (en) * | 2017-10-30 | 2018-02-02 | 惠州市和信达线路板有限公司 | Printed circuit board edges of boards semi-metal manufacture craft and its drilling equipment |
| CN107660078B (en) * | 2017-10-30 | 2023-10-31 | 惠州市和信达线路板有限公司 | Semi-metallization manufacturing process for printed circuit board edge and drilling device thereof |
| CN109831876A (en) * | 2019-02-28 | 2019-05-31 | 深圳崇达多层线路板有限公司 | A method of improve because circuit board song leads to the burr that drills |
| CN111698843A (en) * | 2020-05-27 | 2020-09-22 | 西安金百泽电路科技有限公司 | Reworking method for milled slot plate with etched leakage half-edge hole |
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Application publication date: 20120314 |