CN111118501A - Tin surface protective agent and preparation method thereof - Google Patents
Tin surface protective agent and preparation method thereof Download PDFInfo
- Publication number
- CN111118501A CN111118501A CN202010014992.9A CN202010014992A CN111118501A CN 111118501 A CN111118501 A CN 111118501A CN 202010014992 A CN202010014992 A CN 202010014992A CN 111118501 A CN111118501 A CN 111118501A
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- CN
- China
- Prior art keywords
- mixture
- tin surface
- stirring
- tin
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
Abstract
The invention relates to the technical field of printed circuit board technical preparations, in particular to a tin surface protective agent and a preparation method thereof. The tin surface protective agent comprises, by weight, 3-8 parts of hexamethylenetetramine, 2-10 parts of urea, 0.7-1.1 parts of polyethylene glycol 300, 0.1-0.3 part of benzotriazole, 0.1-0.3 part of alkyl benzimidazole, 0.1-0.3 part of thiouracil, 0.5-1.0 part of monoethanolamine and 80-94 parts of water. When the tin surface protective film is applied, the oxidation-reduction potential of the metal tin can be changed, so that the tin surface is more difficult to chemically react with strong base, and a protective film can be formed on the tin surface, so that the strong base and the tin surface are isolated, and the tin surface is protected; meanwhile, the requirement of the thickness of the tin surface of the circuit board can be reduced to 2-4 mu m, and the requirement of etching resistance can be completely met, so that the consumption of metal tin is greatly saved, and conditions are created for reducing the cost of enterprises.
Description
Technical Field
The invention relates to the technical field of printed circuit board technical preparations, in particular to a tin surface protective agent and a preparation method thereof.
Background
It is known that alkaline etching is an essential process in the process of processing printed circuit boards, and generally means that after a copper plating process is completed on a circuit, a layer of tin is plated on the surface of copper, so that an electroplated tin surface is used as an anti-etching layer, and then a dry film is stripped by strong alkali to etch the circuit; tin is an amphoteric metal and can react with strong base; therefore, in the manufacture of printed wiring boards, tin with a thickness of 5-8 μm is usually used to achieve the etching resistance (if the tin layer is too thin, the etching resistance is not achieved). However, due to the high cost of metallic tin and the inability of the prior art to minimize tin thickness, significant pressure is placed on the manufacturing and processing costs of the enterprise.
Disclosure of Invention
In view of the above-mentioned disadvantages of the prior art, one of the objects of the present invention is to provide a tin surface protective agent; the invention also aims to provide a preparation method of the tin surface protective agent.
In order to achieve the above object, the present invention adopts a first technical solution as follows:
a tin surface protective agent comprises, by weight, 3-8 parts of hexamethylenetetramine, 2-10 parts of urea, 0.7-1.1 parts of polyethylene glycol 300, 0.1-0.3 part of benzotriazole, 0.1-0.3 part of alkylbenzimidazole, 0.1-0.3 part of thiouracil, 0.5-1.0 part of monoethanolamine and 80-94 parts of water. The oxidation-reduction potential of the metal tin can be changed by utilizing hexamethylenetetramine, urea and thiouracil, so that the metal tin is more difficult to chemically react with strong base; the alkyl benzimidazole and the benzotriazole can form a protective film on the tin surface to prevent the metal tin from being attacked and corroded by strong alkali by isolating the strong alkali from the tin surface; the monoethanolamine is utilized to provide an alkaline environment for each composition component so as to promote the dissolution of each component; the polyethylene glycol 300 can be used as a solubilizer to further enhance the dissolving effect of each component in water, and can also be used as a wetting agent to enable each component to better act on the tin surface.
Preferably, the alkylbenzimidazole is 2-ethylbenzimidazole.
Preferably, the thiouracil is 2-thiouracil.
Preferably, the paint comprises, by weight, 5 parts of hexamethylenetetramine, 5 parts of urea, 1.0 part of polyethylene glycol 300, 0.2 part of benzotriazole, 0.2 part of alkylbenzimidazole, 0.1 part of thiouracil, 0.5 part of monoethanolamine and 88 parts of water.
The second technical scheme adopted by the invention is as follows:
the preparation method of the tin surface protective agent comprises the following steps
S1, mixing and stirring the monoethanolamine and 50% of water according to the weight part ratio until the monoethanolamine is completely dissolved to obtain a primary mixture;
s2, adding the polyethylene glycol 300 into the primary mixture according to the weight part ratio, mixing and stirring until the polyethylene glycol 300 is completely dissolved to obtain a secondary mixture;
s3, adding hexamethylene tetramine into the secondary mixture according to the weight part ratio, stirring and mixing until the hexamethylene tetramine is completely dissolved to obtain a tertiary mixture;
s4, adding urea into the third mixture according to the weight part ratio, stirring and mixing until the urea is completely dissolved, and obtaining a fourth mixture;
s5, adding benzotriazole into the fourth-time mixture according to the weight part ratio, stirring and mixing until the benzotriazole is completely dissolved to obtain a fifth-time mixture;
s6, adding the thiouracil into the fifth-order mixture according to the weight part ratio, stirring and mixing until the thiouracil is completely dissolved to obtain a sixth-order mixture;
s7, adding the alkyl benzimidazole into the mixture for six times according to the weight part ratio, stirring and mixing until the alkyl benzimidazole is completely dissolved to obtain a mixture for seven times;
s8, adding the remaining 50 percent of water into the mixture for seven times according to the weight part ratio, and continuously stirring for at least 60min to obtain the tin surface protective agent.
By adopting the scheme, in the alkaline etching process of the printed circuit board, the tin surface protective agent is added into the strong alkaline solution, so that the oxidation-reduction potential of the metal tin can be changed, the tin surface is more difficult to chemically react with strong alkali, and a layer of protective film can be formed on the tin surface, so that the strong alkali and the tin surface are isolated, and the tin surface is protected; meanwhile, the tin surface protective agent is applied to reduce the requirement of the thickness of the tin surface of the circuit board to 2-4 mu m, and the requirement of etching resistance can be completely met, so that the consumption of metal tin is greatly saved, and conditions are created for reducing the enterprise cost.
Detailed Description
The following detailed description of embodiments of the invention, but the invention can be practiced in many different ways, as defined and covered by the claims.
The first embodiment is as follows:
s1, mixing and stirring 0.5kg of monoethanolamine and 44kg of water until the monoethanolamine is completely dissolved to obtain a primary mixture;
s2, adding 1.0kg of polyethylene glycol 300 into the primary mixture, mixing and stirring until the polyethylene glycol 300 is completely dissolved to obtain a secondary mixture;
s3, adding 5.0kg of hexamethylenetetramine into the secondary mixture, stirring and mixing until the hexamethylenetetramine is completely dissolved to obtain a tertiary mixture;
s4, adding 5.0kg of urea into the third mixture, stirring and mixing until the urea is completely dissolved to obtain a fourth mixture;
s5, adding 0.2kg of benzotriazole into the fourth-time mixture, stirring and mixing until the benzotriazole is completely dissolved to obtain a fifth-time mixture;
s6, adding 0.1kg of 2-thiouracil into the five-time mixture, stirring and mixing until the thiouracil is completely dissolved to obtain a six-time mixture;
s7, adding 0.2kg of alkyl benzimidazole into the mixture for six times, stirring and mixing until the alkyl benzimidazole is completely dissolved to obtain a mixture for seven times;
s8, adding the rest 44kg of water into the mixture for seven times according to the weight part ratio, and continuously stirring for at least 60min to obtain the tin surface protective agent.
Example two:
s1, mixing and stirring 1.0kg of monoethanolamine and 40kg of water until the monoethanolamine is completely dissolved to obtain a primary mixture;
s2, adding 0.5kg of polyethylene glycol 300 into the primary mixture, mixing and stirring until the polyethylene glycol 300 is completely dissolved to obtain a secondary mixture;
s3, adding 8.0kg of hexamethylenetetramine into the secondary mixture, stirring and mixing until the hexamethylenetetramine is completely dissolved to obtain a tertiary mixture;
s4, adding 10.0kg of urea into the third mixture, stirring and mixing until the urea is completely dissolved to obtain a fourth mixture;
s5, adding 0.2kg of benzotriazole into the fourth-time mixture, stirring and mixing until the benzotriazole is completely dissolved to obtain a fifth-time mixture;
s6, adding 0.1kg of 2-thiouracil into the five-time mixture, stirring and mixing until the thiouracil is completely dissolved to obtain a six-time mixture;
s7, adding 0.2kg of alkyl benzimidazole into the mixture for six times, stirring and mixing until the alkyl benzimidazole is completely dissolved to obtain a mixture for seven times;
and S8, adding the residual 40kg of water into the mixture for seven times according to the weight part ratio, and continuously stirring for at least 60min to obtain the tin surface protective agent.
Example three:
s1, mixing and stirring 0.8kg of monoethanolamine and 46.3kg of water until the monoethanolamine is completely dissolved to obtain a primary mixture;
s2, adding 0.9kg of polyethylene glycol 300 into the primary mixture, mixing and stirring until the polyethylene glycol 300 is completely dissolved to obtain a secondary mixture;
s3, adding 3.0kg of hexamethylenetetramine into the secondary mixture, stirring and mixing until the hexamethylenetetramine is completely dissolved to obtain a tertiary mixture;
s4, adding 2.0kg of urea into the third mixture, stirring and mixing until the urea is completely dissolved to obtain a fourth mixture;
s5, adding 0.1kg of benzotriazole into the fourth-time mixture, stirring and mixing until the benzotriazole is completely dissolved to obtain a fifth-time mixture;
s6, adding 0.3kg of 2-thiouracil into the five-time mixture, stirring and mixing until the thiouracil is completely dissolved to obtain a six-time mixture;
s7, adding 0.3kg of alkyl benzimidazole into the mixture for six times, stirring and mixing until the alkyl benzimidazole is completely dissolved to obtain a mixture for seven times;
and S8, adding the rest 46.3kg of water into the mixture for seven times according to the weight part ratio, and continuously stirring for at least 60min to obtain the tin surface protective agent.
When the printed circuit board is subjected to alkaline etching treatment (the common treatment procedure is film stripping-washing-etching-washing-tin stripping-washing-drying), the tin surface protective agent prepared in the first to third examples is used in the film stripping stage according to the process conditions mentioned in the first table, and after the alkaline etching treatment is carried out under the same process conditions in a traditional manner (i.e. under the condition that the tin surface protective agent is not added), the method can be clearly determined from the test data mentioned in the second table: the tin surface protective agent can effectively avoid the problem of poor circuit board etching caused by the attack and corrosion of strong base on the metal tin in the film stripping stage and the subsequent alkaline etching process, and the tin thickness can be completely controlled to be 2-4 mu m through repeated experiments, so that the etching resistance requirement of the etching process can be completely met, the using amount of the metal tin is effectively saved, and conditions are created for reducing the enterprise cost.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. A tin surface protective agent is characterized in that: the composition comprises, by weight, 3-8 parts of hexamethylenetetramine, 2-10 parts of urea, 0.7-1.1 parts of polyethylene glycol 300, 0.1-0.3 part of benzotriazole, 0.1-0.3 part of alkylbenzimidazole, 0.1-0.3 part of thiouracil, 0.5-1.0 part of monoethanolamine and 80-94 parts of water.
2. The tin surface protective agent of claim 1, wherein: the alkyl benzimidazole is 2-ethyl benzimidazole.
3. The tin surface protective agent of claim 1, wherein: the thiouracil is 2-thiouracil.
4. The tin surface protective agent of claim 1, wherein: the composition comprises, by weight, 5 parts of hexamethylenetetramine, 5 parts of urea, 1.0 part of polyethylene glycol 300, 0.2 part of benzotriazole, 0.2 part of alkylbenzimidazole, 0.1 part of thiouracil, 0.5 part of monoethanolamine and 88 parts of water.
5. A preparation method of a tin surface protective agent is characterized by comprising the following steps: comprises the following steps
S1, mixing and stirring the monoethanolamine and 50% of water according to the weight part ratio until the monoethanolamine is completely dissolved to obtain a primary mixture;
s2, adding the polyethylene glycol 300 into the primary mixture according to the weight part ratio, mixing and stirring until the polyethylene glycol 300 is completely dissolved to obtain a secondary mixture;
s3, adding hexamethylene tetramine into the secondary mixture according to the weight part ratio, stirring and mixing until the hexamethylene tetramine is completely dissolved to obtain a tertiary mixture;
s4, adding urea into the third mixture according to the weight part ratio, stirring and mixing until the urea is completely dissolved, and obtaining a fourth mixture;
s5, adding benzotriazole into the fourth-time mixture according to the weight part ratio, stirring and mixing until the benzotriazole is completely dissolved to obtain a fifth-time mixture;
s6, adding the thiouracil into the fifth-order mixture according to the weight part ratio, stirring and mixing until the thiouracil is completely dissolved to obtain a sixth-order mixture;
s7, adding the alkyl benzimidazole into the mixture for six times according to the weight part ratio, stirring and mixing until the alkyl benzimidazole is completely dissolved to obtain a mixture for seven times;
s8, adding the remaining 50 percent of water into the mixture for seven times according to the weight part ratio, and continuously stirring for at least 60min to obtain the tin surface protective agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010014992.9A CN111118501A (en) | 2020-01-07 | 2020-01-07 | Tin surface protective agent and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010014992.9A CN111118501A (en) | 2020-01-07 | 2020-01-07 | Tin surface protective agent and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111118501A true CN111118501A (en) | 2020-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010014992.9A Pending CN111118501A (en) | 2020-01-07 | 2020-01-07 | Tin surface protective agent and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN111118501A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111926332A (en) * | 2020-07-16 | 2020-11-13 | 深圳市点石源水处理技术有限公司 | Tin surface protective agent and preparation method and application thereof |
| CN114086169A (en) * | 2021-11-09 | 2022-02-25 | 南通群安电子材料有限公司 | Tin surface protective agent |
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| CN105331978A (en) * | 2015-12-03 | 2016-02-17 | 东莞市广华化工有限公司 | Novel inorganic environment-friendly membrane removing liquid |
| CN107815245A (en) * | 2017-11-02 | 2018-03-20 | 深圳市华宇节耗电子有限公司 | A kind of application of dodecyl triethoxysilane and the tin face protective agent for PCB manufactures and the guard method of tin face |
| CN107908084A (en) * | 2017-11-21 | 2018-04-13 | 东莞市广华化工有限公司 | A kind of new-type inorganic environmental protection moves back film liquid |
| CN109831879A (en) * | 2019-02-23 | 2019-05-31 | 上海富柏化工有限公司 | A kind of shield tin type PCB goes film liquid |
| CN110093639A (en) * | 2019-04-22 | 2019-08-06 | 深圳市泓达环境科技有限公司 | A kind of shield tin additive and etching solution |
-
2020
- 2020-01-07 CN CN202010014992.9A patent/CN111118501A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105331978A (en) * | 2015-12-03 | 2016-02-17 | 东莞市广华化工有限公司 | Novel inorganic environment-friendly membrane removing liquid |
| CN107815245A (en) * | 2017-11-02 | 2018-03-20 | 深圳市华宇节耗电子有限公司 | A kind of application of dodecyl triethoxysilane and the tin face protective agent for PCB manufactures and the guard method of tin face |
| CN107908084A (en) * | 2017-11-21 | 2018-04-13 | 东莞市广华化工有限公司 | A kind of new-type inorganic environmental protection moves back film liquid |
| CN109831879A (en) * | 2019-02-23 | 2019-05-31 | 上海富柏化工有限公司 | A kind of shield tin type PCB goes film liquid |
| CN110093639A (en) * | 2019-04-22 | 2019-08-06 | 深圳市泓达环境科技有限公司 | A kind of shield tin additive and etching solution |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111926332A (en) * | 2020-07-16 | 2020-11-13 | 深圳市点石源水处理技术有限公司 | Tin surface protective agent and preparation method and application thereof |
| CN111926332B (en) * | 2020-07-16 | 2022-05-27 | 深圳市点石源水处理技术有限公司 | Tin surface protective agent and preparation method and application thereof |
| CN114086169A (en) * | 2021-11-09 | 2022-02-25 | 南通群安电子材料有限公司 | Tin surface protective agent |
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| PB01 | Publication | ||
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Application publication date: 20200508 |