CN110093639A - A kind of shield tin additive and etching solution - Google Patents
A kind of shield tin additive and etching solution Download PDFInfo
- Publication number
- CN110093639A CN110093639A CN201910324497.5A CN201910324497A CN110093639A CN 110093639 A CN110093639 A CN 110093639A CN 201910324497 A CN201910324497 A CN 201910324497A CN 110093639 A CN110093639 A CN 110093639A
- Authority
- CN
- China
- Prior art keywords
- shield
- tin
- additive
- etching solution
- shield tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
Abstract
The present invention discloses a kind of shield tin additive and etching solution, and the shield tin additive includes urea and diammonium hydrogen phosphate.Not only can be reduced former tin stings erosion amount, promotes production efficiency, reduces production cost, can also improve etch-rate, is conducive to reduce lateral erosion rate, greatly improves the toughness of resist layer.
Description
Technical field
The present invention relates to electroplating additive more particularly to a kind of shield tin additive and etching solutions.
Background technique
Tin is a kind of argenteous metal, and nontoxic, stable chemical performance hardly reacts with air at normal temperature,
One layer of fine and close oxidation film can be formed on surface, prevention continues to aoxidize, and there is good welding and ductility etc..Traditional electricity
Tin plating solution mainly has acid and alkaline two major classes, and acid system is divided into sulfate, methane sulfonic acid system and fluoboric acid system again
It is tin plating etc..Alkaline Tin Plating Solntion is stable and covering power is good, the disadvantage is that operating temperature is high, current efficiency is low, brightless etc..
Methane sulfonic acid system with its deposition rate height, the advantages that waste water is easily processed and be applied to continuous electroplating production
In.The disadvantages of borofluoride tin plating electrolyte cost is higher than sulfate bath, and there is also the pollutions of fluoride, is almost not used.
In actual production using it is more be sulfate, methane sulfonic acid system Acidic Bright Tin Plating Process.
It is tin plating to be now widely used for electronics, food, automobile and other industries.How especially assist side industry prevents
It moves back and stings tin in membrane process excessively and cause excessive wiring board to be scrapped, increase production cost, reduces production efficiency, those skilled in the art
Member is setting about studying to this respect always, it would be desirable to find a kind of shield tin agent or other methods to reduce and sting tin amount, with increasing
Add production efficiency.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, a kind of shield tin additive and etching solution are proposed in the present invention, it is intended to solve existing
Wiring board occurs stinging the problem of excessive situation of tin causes wiring board to be scrapped in moving back membrane process.
Technical scheme is as follows:
A kind of shield tin additive, wherein according to mass fraction meter, including following components:
2~6 parts of urea；
2~6 parts of diammonium hydrogen phosphate.
The shield tin additive, wherein further include following components according to mass fraction meter:
1~5 part of surfactant.
The shield tin additive, wherein the surfactant is neopelex or detergent alkylate sulphur
Acid.
The shield tin additive, wherein further include following components according to mass ratio:
1~5 part of stabilizer.
The shield tin additive, wherein the stabilizer is potassium iodide, ammonium iodide, sodium iodide, ammonium thiocyanate, sulphur cyanogen
Sour potassium, sodium sulfocyanate, magnesium rhodanate or calcium thiocyanate.
A kind of etching solution, wherein contain shield tin additive as described above in the etching solution.
The etching solution, wherein the shield tin additive additive amount is the 3 ‰ -5 ‰ of etching solution.
The utility model has the advantages that shield tin additive provided by the present invention and etching solution, not only can be reduced former tin stings erosion amount,
Promote production efficiency, reduce production cost, etch-rate can also be improved, is conducive to reduce lateral erosion rate, greatly improves resist layer
Toughness.
Specific embodiment
The present invention provides a kind of shield tin additive and etching solution, to make the purpose of the present invention, technical solution and effect more
Clear, clear, the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only used to
It explains the present invention, is not intended to limit the present invention.
A kind of shield tin additive provided by the present invention not only can be reduced original for being added in alkaline etching liquid
Tin stings erosion amount, promotes production efficiency, reduces production cost, can also improve etch-rate, is conducive to reduce lateral erosion rate, mention significantly
The toughness of high resistance to corrosion layer.
Specifically, the shield tin additive, according to mass fraction meter, including following components:
2~6 parts of urea；
2~6 parts of diammonium hydrogen phosphate；
Using the combination of urea and diammonium hydrogen phosphate, it can make etching solution that there is stable faintly acid, it is appropriate to obtain
Etching speed, be conducive to control etching solution pH value, keep etch-rate steady.
In order to further increase shield tin effect, the shield tin additive can also include with the following group according to mass fraction meter
Point:
1~5 part of surfactant；
1~5 part of stabilizer.
The uniformity that surfactant can ensure to etch by reducing surface tension.It is preferable to use be amenable to etchant and
Surfactant that can be compatible with etchant.The surfactant can be neopelex or detergent alkylate sulphur
Acid.
The stabilizer can be potassium iodide, ammonium iodide, sodium iodide, ammonium thiocyanate, potassium rhodanide, sodium sulfocyanate, sulphur cyanogen
Sour magnesium or calcium thiocyanate.The stabilizer can maintain corrosive liquid performance to stablize, and the side etching quantity of tin is effectively reduced, improves etching
Uniformity.
A kind of etching solution is also provided in the present invention, shield tin additive of the present invention is contained in the etching solution, shield tin adds
The additive amount for adding agent is the 3 ‰ -5 ‰ of etching solution quality.The etching solution is alkaline etching liquid, when addition sheet in alkaline etching liquid
After inventing the shield tin additive, not only can be reduced former tin stings erosion amount, promotes production efficiency, reduces production cost, also
Etch-rate can be improved, be conducive to reduce lateral erosion rate, greatly improve the toughness of resist layer.
Below by way of specific embodiment, specific embodiments of the present invention will be described in further detail.
Embodiment 1
The shield tin additive, raw material includes following components:
Urea 4g, diammonium hydrogen phosphate 4g, dodecyl benzene sulfonic acid 3g, ammonium iodide 3g.
Shield tin additive is added in suitable quantity of water and is stirred evenly, the aqueous solution of shield tin additive is obtained.
Two parts of each 500L of alkaline etching liquid are taken, any shield tin agent is not added in portion, and the aqueous solution of shield tin additive is added in portion.
Comparative test is etched to the wiring board of same size, the alkaline etching liquid of any shield tin agent is not added in comparison discovery
It is 0.3 μm/cyde that tin, which stings erosion amount,；And it is 0.1 μm/cyde that the alkaline etching liquid tin that shield tin additive is added, which stings erosion amount,
From the present embodiment as can be seen that being added to the alkaline etching machine of shield tin additive, etch-rate is not only increased, also
Lateral erosion rate is greatly reduced, the toughness of resist layer is improved.
Embodiment 2
The shield tin additive, raw material includes following components:
Urea 6g, diammonium hydrogen phosphate 6g, neopelex 5g, calcium thiocyanate 5g.
Shield tin additive is added in suitable quantity of water and is stirred evenly, the aqueous solution of shield tin additive is obtained.
Two parts of each 500L of alkaline etching liquid are taken, any shield tin agent is not added in portion, and the aqueous solution of shield tin additive is added in portion.
Comparative test is etched to the wiring board of same size, the alkaline etching liquid of any shield tin agent is not added in comparison discovery
It is 0.4 μ μm/cyde that tin, which stings erosion amount,；And it is 0.2 μ μm/cyde that the alkaline etching liquid tin that shield tin additive is added, which stings erosion amount,.
From the present embodiment as can be seen that being added to the alkaline etching machine of shield tin additive, etch-rate is not only increased, also
Lateral erosion rate is greatly reduced, the toughness of resist layer is improved.
Embodiment 3
The shield tin additive, raw material includes following components:
Urea 3g, diammonium hydrogen phosphate 3g, dodecyl benzene sulfonic acid 2g, potassium rhodanide 2g.
Shield tin additive is added in suitable quantity of water and is stirred evenly, the aqueous solution of shield tin additive is obtained.
Two parts of each 500L of alkaline etching liquid are taken, any shield tin agent is not added in portion, and the aqueous solution of shield tin additive is added in portion.
Comparative test is etched to the wiring board of same size, the alkaline etching liquid of any shield tin agent is not added in comparison discovery
Tin sting erosion amount be 0.5 μm/cyde,；And it is 0.2 μm/cyde that the alkaline etching liquid tin that shield tin additive is added, which stings erosion amount,.
From the present embodiment as can be seen that being added to the alkaline etching machine of shield tin additive, etch-rate is not only increased, also
Lateral erosion rate is greatly reduced, the toughness of resist layer is improved.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (7)
1. a kind of shield tin additive, which is characterized in that according to mass fraction meter, including following components:
2~6 parts of urea；
2~6 parts of diammonium hydrogen phosphate.
2. shield tin additive according to claim 1, which is characterized in that further include following components according to mass fraction meter:
1~5 part of surfactant.
3. shield tin additive according to claim 2, which is characterized in that the surfactant is dodecyl benzene sulfonic acid
Sodium or dodecyl benzene sulfonic acid.
4. shield tin additive according to claim 1, which is characterized in that further include following components according to mass ratio:
1~5 part of stabilizer.
5. shield tin additive according to claim 4, which is characterized in that the stabilizer is potassium iodide, ammonium iodide, iodate
Sodium, ammonium thiocyanate, potassium rhodanide, sodium sulfocyanate, magnesium rhodanate or calcium thiocyanate.
6. a kind of etching solution, which is characterized in that contain the shield tin addition as described in Claims 1 to 5 is any in the etching solution
Agent.
7. etching solution according to claim 6, which is characterized in that the shield tin additive additive amount is the 3 ‰-of etching solution
5‰。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910324497.5A CN110093639A (en) | 2019-04-22 | 2019-04-22 | A kind of shield tin additive and etching solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910324497.5A CN110093639A (en) | 2019-04-22 | 2019-04-22 | A kind of shield tin additive and etching solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110093639A true CN110093639A (en) | 2019-08-06 |
Family
ID=67445508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910324497.5A Pending CN110093639A (en) | 2019-04-22 | 2019-04-22 | A kind of shield tin additive and etching solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110093639A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111118501A (en) * | 2020-01-07 | 2020-05-08 | 深圳市星扬高新科技有限公司 | Tin surface protective agent and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0734256A (en) * | 1993-07-19 | 1995-02-03 | Otsuka Chem Co Ltd | Etching agent |
| CN1130408A (en) * | 1993-09-08 | 1996-09-04 | 菲布罗技术公司 | Copper etchant solution additives |
| CN101962776A (en) * | 2010-09-01 | 2011-02-02 | 济南德锡科技有限公司 | Solder stripping agent and preparation method thereof |
| CN106048612A (en) * | 2016-07-28 | 2016-10-26 | 昆山金易得环保科技有限公司 | Tin removing liquid and method for removing tin-contained layer on base material |
| CN107908084A (en) * | 2017-11-21 | 2018-04-13 | 东莞市广华化工有限公司 | A kind of new-type inorganic environmental protection moves back film liquid |
| CN109536965A (en) * | 2018-12-06 | 2019-03-29 | 江苏矽研半导体科技有限公司 | Stripping tin agent and preparation method thereof for removing the bad tin coating of semiconductor package part |
-
2019
- 2019-04-22 CN CN201910324497.5A patent/CN110093639A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0734256A (en) * | 1993-07-19 | 1995-02-03 | Otsuka Chem Co Ltd | Etching agent |
| CN1130408A (en) * | 1993-09-08 | 1996-09-04 | 菲布罗技术公司 | Copper etchant solution additives |
| CN101962776A (en) * | 2010-09-01 | 2011-02-02 | 济南德锡科技有限公司 | Solder stripping agent and preparation method thereof |
| CN106048612A (en) * | 2016-07-28 | 2016-10-26 | 昆山金易得环保科技有限公司 | Tin removing liquid and method for removing tin-contained layer on base material |
| CN107908084A (en) * | 2017-11-21 | 2018-04-13 | 东莞市广华化工有限公司 | A kind of new-type inorganic environmental protection moves back film liquid |
| CN109536965A (en) * | 2018-12-06 | 2019-03-29 | 江苏矽研半导体科技有限公司 | Stripping tin agent and preparation method thereof for removing the bad tin coating of semiconductor package part |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111118501A (en) * | 2020-01-07 | 2020-05-08 | 深圳市星扬高新科技有限公司 | Tin surface protective agent and preparation method thereof |
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Application publication date: 20190806 |
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