CN106231817A - A kind of manufacture method of HDI plate - Google Patents
A kind of manufacture method of HDI plate Download PDFInfo
- Publication number
- CN106231817A CN106231817A CN201610603204.3A CN201610603204A CN106231817A CN 106231817 A CN106231817 A CN 106231817A CN 201610603204 A CN201610603204 A CN 201610603204A CN 106231817 A CN106231817 A CN 106231817A
- Authority
- CN
- China
- Prior art keywords
- blind hole
- manufacture method
- plate
- circuit board
- layer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention discloses the manufacture method of a kind of HDI plate, comprises the following steps: prepared substrate and on substrate make internal layer circuit obtain internal layer circuit plate, internal layer circuit plate and Copper Foil pressing are obtained multilayer circuit board；Multilayer circuit board offers blind hole by laser drilling, and at the inwall upper conductive film of blind hole；Filling perforation successively on the multilayer circuit board offer blind hole, electroplate and make outer-layer circuit and prepare wiring board；Blind hole is first filled and led up by the present invention, the most there is not the problem that stannum is bad of passing through, and then make blind hole not be subject to destroy during to graphic plating stannum；After tin plating, the employing of cutting half bore is slightly dragged for, essence is dragged for the mode with refine and copper wire is diminished to 0.5mil, walks and is removed by copper wire when etching.
Description
Technical field
The invention belongs to the making field of wiring board, be more particularly to the manufacture method of a kind of HDI plate.
Background technology
The traditional design of module product is ventilating hole plate, but along with electronic product constantly develops to direction light, thin, little, visitor
Design is changed into high density printed wiring board (HDI) product design, traditional technology and technological process by family can not meet new product
Demand for development, high density printed wiring board (HDI) product is that the problem solving blind hole broken walks positive (Tenting) flow process, no
Walking graphic plating, and module product must walk the negative film flow process of figure electricity, the flow process of new technology must pull against problem above.Module is produced
Product, when molding procedure cutting metal half bore, owing to being to cut metallic copper with profile milling cutter, are easily generated copper wire in working angles,
Cause scrappage the highest.
Summary of the invention
The present invention provides the manufacture method of a kind of HDI plate.
According to an aspect of the present invention, it is provided that the manufacture method of a kind of HDI plate, comprise the following steps:
The manufacture method of a kind of HDI plate, comprises the following steps:
Prepared substrate on the substrate making internal layer circuit obtain internal layer circuit plate, by described internal layer circuit plate and Copper Foil
Pressing obtains multilayer circuit board；
Described multilayer circuit board offers blind hole by laser drilling, and on the inwall of blind hole, plates conducting film；
Filling perforation successively on the described multilayer circuit board offer blind hole, making outer-layer circuit prepare wiring board and electroplate；
Go after cutting half bore in the circuit board and obtain HDI plate through post processing.
In some embodiments, acid is used to clean the copper face of multilayer circuit board before described plating.
In some embodiments, described plating is tin plating.
In some embodiments, the cutter walking speed of described cutting half bore is 2.5cm/min, and rotating speed is 45r/min.
In some embodiments, described cutting half bore includes slightly dragging for successively, essence is dragged for and refine.
In some embodiments, the cutting output that the described cutting output slightly dragged for is dragged for more than essence, the cutting output that described essence is dragged for is big
Cutting output in refine.
In some embodiments, the aperture of described half bore is 0.4mm.
It has the beneficial effect that blind hole is first filled and led up by the present invention, and the most there is not blind hole during to graphic plating stannum, to pass through stannum bad
Problem, it is possible to can effectively plate last layer protection stannum above blind hole, protects blind hole not to be destroyed during etching；Cutting half after tin plating
Hole employing is slightly dragged for, essence is dragged for the mode with refine and copper wire is diminished to 0.5mil, walks and is removed by copper wire when etching.
Detailed description of the invention
The present invention provides the manufacture method of a kind of HDI plate, comprises the following steps:
Prepared substrate also makes internal layer circuit on substrate and obtains internal layer circuit plate, by internal layer circuit plate and Copper Foil pressing much
Sandwich circuit board.The upper and lower surface of the substrate of selection is provided with the layers of copper of 18um, and the thickness of substrate is 0.1mm, and the size of substrate is
2300mm × 2200mm, cuts out by substrate into plate and becomes the size of 600mm × 550mm to be processed.Need after internal layer circuit completes
It tested, the most just can carry out following operation.By the operation of internal layer circuit plate and Copper Foil pressing successively
For: brown, combine, overlap, pressing, disassemble, drag for limit and edging.
Multilayer circuit board offers blind hole by laser drilling, and at the inwall upper conductive film of blind hole.At laser drilling
Before need to carry out pre-treatment, multilayer circuit board good for pressing is carried out brown or melanism so that the copper on multilayer circuit board
Colour-darkening.The operation of laser drilling is followed successively by: target practice, upper locating pin and boring.After chemical reaction deposits on blind pore wall
One layer of Organic Conductive Films so that the via hole re-plating, one layer of Organic Conductive Films protection multilayer circuit board of blind pore wall deposition
The phenomenon that hole is broken will not occur because blind pore wall is non-conductive during plating.
Filling perforation successively on the multilayer circuit board offer blind hole, making outer-layer circuit prepare wiring board and electroplate.First will
Blind hole is filled and led up, and the most there is not blind hole and passes through the problem that stannum is bad, it is possible to can effectively plate above blind hole during to graphic plating stannum
One layer of protection stannum, protects blind hole not to be destroyed during etching.Use acid to clean the copper face of multilayer circuit board before plating, electroplate as plating
Stannum, cleans copper face with acid and ensures the effect of electrotinning.The making of outer-layer circuit uses negative film flow process, and negative film flow process is followed successively by: pressure
Film, exposed and developed.According to the egative film that negative film process selecting is corresponding.After press mold, the time before plating controls in 24 hours, electricity
Stannum face should be avoided after plating to be scraped off, and operator handle with care wiring board, and interpolation frame is received plate and placed to treat next procedure.
Cut half bore in the circuit board and after post processing, obtain HDI plate.Confirm, before cutting half bore, the chi that plank is actual
Very little, according to actual size go out to cut half bore molding formula and do initial workpiece success after just can produce, it is ensured that the half bore product of HDI plate
Para-position is accurate.The aperture of half bore is 0.4mm, and the cutter footpath selecting cutter is 0.8mm.The cutter walking speed of cutting half bore is 2.5cm/min,
Rotating speed is 45r/min.Cutting half bore is cut in three times, includes successively slightly dragging for, essence is dragged for and refine.The cutting output slightly dragged for is dragged for more than essence
Cutting output, the cutting output that essence is dragged for is more than the cutting output of refine.After tin plating, the employing of cutting half bore is slightly dragged for, essence drags for the mode with refine
Copper wire is diminished to 0.5mil (or 0.0125mm), walks and when etching, copper wire is removed.
Post processing to wiring board includes striping etching stripping stannum anti-weldingization gold.Film can be first pressed dry again when making outer-layer circuit
Exposure, the dry film of exposed portion can occur macromolecular polymerization reaction, and when development, weak base does not comees out, and unexposed dry film can develop
Fall and expose copper face, stannum during electrotinning, can be electroplated, occur the part of polyreaction to have dry film cannot plate stannum, cut walking molding
After cutting half bore, carry out striping, use highly basic during striping so dry film can be removed.After striping, wiring board exposes copper,
Walk and the copper exposed can be etched away when etching, and the copper wire below the part protected by stannum can be protected, again guarantor after etching
The half-finished product plate of HDI module printed wiring board is peeled and made to the stannum protecting copper off.After completing the procedure, outer-layer circuit need to be checked
With half bore copper wire, carry out repairing improvement as being found bad need；Afterwards wiring board is carried out anti-welding process and changes gold process acquisition HDI
The finished product of module printed wiring board.Finally it is processed according to the fitted position of client, test function, appearance test, finally wraps
Take on goods.
Above-described is only some embodiments of the present invention, for those of ordinary skill in the art, is not paying
On the premise of going out creative work, it is also possible to making some deformation and this enters, these broadly fall into protection scope of the present invention.
Claims (7)
1. the manufacture method of a HDI plate, it is characterised in that comprise the following steps:
Prepared substrate on the substrate making internal layer circuit obtain internal layer circuit plate, by described internal layer circuit plate and Copper Foil pressing
Obtain multilayer circuit board；
Described multilayer circuit board offers blind hole by laser drilling, and at the inwall upper conductive film of blind hole；
Filling perforation successively on the described multilayer circuit board offer blind hole, making outer-layer circuit prepare wiring board and electroplate；
Cut half bore in the circuit board and obtain HDI plate through post processing.
The manufacture method of HDI plate the most according to claim 1, it is characterised in that use acid to clean before described plating many
The copper face of sandwich circuit board.
The manufacture method of HDI plate the most according to claim 3, it is characterised in that described plating is tin plating.
The manufacture method of HDI plate the most according to claim 1, it is characterised in that the cutter walking speed of described cutting half bore is
2.5cm/min, rotating speed is 45r/min.
The manufacture method of HDI plate the most according to claim 1, it is characterised in that described cutting half bore includes slightly dragging for successively,
Essence is dragged for and refine.
The manufacture method of HDI plate the most according to claim 5, it is characterised in that the described cutting output slightly dragged for is dragged for more than essence
Cutting output, the cutting output that described essence is dragged for is more than the cutting output of refine.
The manufacture method of HDI plate the most according to claim 1, it is characterised in that the aperture of described half bore is 0.4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610603204.3A CN106231817A (en) | 2016-07-27 | 2016-07-27 | A kind of manufacture method of HDI plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610603204.3A CN106231817A (en) | 2016-07-27 | 2016-07-27 | A kind of manufacture method of HDI plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106231817A true CN106231817A (en) | 2016-12-14 |
Family
ID=57534745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610603204.3A Pending CN106231817A (en) | 2016-07-27 | 2016-07-27 | A kind of manufacture method of HDI plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106231817A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109056015A (en) * | 2018-10-19 | 2018-12-21 | 莆田市涵江区依吨多层电路有限公司 | The mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method |
| CN110121239A (en) * | 2019-04-10 | 2019-08-13 | 江门崇达电路技术有限公司 | A kind of production method of mechanical blind hole half bore |
| CN111741614A (en) * | 2020-06-05 | 2020-10-02 | 广州美维电子有限公司 | Fine circuit PCB processing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103327753A (en) * | 2013-05-20 | 2013-09-25 | 深圳崇达多层线路板有限公司 | Manufacturing method for metal semi-hole circuit board |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
| CN104582319A (en) * | 2013-10-18 | 2015-04-29 | 珠海方正科技高密电子有限公司 | Metallized semi-hole forming method and printed circuit board manufacturing method |
| CN104640358A (en) * | 2014-12-17 | 2015-05-20 | 江苏博敏电子有限公司 | Half-hole plate manufacturing method |
| CN105392288A (en) * | 2015-11-18 | 2016-03-09 | 江门崇达电路技术有限公司 | Method for manufacturing metalized blind holes on PCB |
-
2016
- 2016-07-27 CN CN201610603204.3A patent/CN106231817A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103327753A (en) * | 2013-05-20 | 2013-09-25 | 深圳崇达多层线路板有限公司 | Manufacturing method for metal semi-hole circuit board |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
| CN104582319A (en) * | 2013-10-18 | 2015-04-29 | 珠海方正科技高密电子有限公司 | Metallized semi-hole forming method and printed circuit board manufacturing method |
| CN104640358A (en) * | 2014-12-17 | 2015-05-20 | 江苏博敏电子有限公司 | Half-hole plate manufacturing method |
| CN105392288A (en) * | 2015-11-18 | 2016-03-09 | 江门崇达电路技术有限公司 | Method for manufacturing metalized blind holes on PCB |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109056015A (en) * | 2018-10-19 | 2018-12-21 | 莆田市涵江区依吨多层电路有限公司 | The mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method |
| CN110121239A (en) * | 2019-04-10 | 2019-08-13 | 江门崇达电路技术有限公司 | A kind of production method of mechanical blind hole half bore |
| CN110121239B (en) * | 2019-04-10 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of mechanical blind hole and half hole |
| CN111741614A (en) * | 2020-06-05 | 2020-10-02 | 广州美维电子有限公司 | Fine circuit PCB processing method |
| CN111741614B (en) * | 2020-06-05 | 2021-12-17 | 广州美维电子有限公司 | Fine circuit PCB processing method |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 224100 No. 9, Yong Sheng Road, Dafeng Development Zone, Yancheng City, Jiangsu. Applicant after: JIANGSU BOMIN ELECTRONICS CO., LTD. Address before: 224100 Electronic Information Industry Park, Yancheng City, Jiangsu. Applicant before: JIANGSU BOMIN ELECTRONICS CO., LTD. |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161214 |