CN116997083A - Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method - Google Patents
Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method Download PDFInfo
- Publication number
- CN116997083A CN116997083A CN202310965881.XA CN202310965881A CN116997083A CN 116997083 A CN116997083 A CN 116997083A CN 202310965881 A CN202310965881 A CN 202310965881A CN 116997083 A CN116997083 A CN 116997083A
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- Prior art keywords
- pcb
- manufacturing
- special
- edge
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 238000009713 electroplating Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000005553 drilling Methods 0.000 claims abstract description 19
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000004381 surface treatment Methods 0.000 claims abstract description 9
- 230000008021 deposition Effects 0.000 claims abstract description 8
- 238000000151 deposition Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical group [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000008719 thickening Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims 1
- 238000001465 metallisation Methods 0.000 description 12
- 229910052755 nonmetal Inorganic materials 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 235000013405 beer Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a method for manufacturing a PCB with special-shaped board edges and a PCB manufactured by the method, wherein the method for manufacturing the PCB comprises the following steps: drilling holes in the PCB and routing special-shaped metallized board edges on board edges of the PCB; respectively drilling the front and back sides of the PCB after copper deposition and electroplating of the PCB, and pre-drilling the junction of the metalized board edge and the non-metalized board edge of the PCB; and carrying out outer layer etching and surface treatment on the PCB, and routing out a non-metallized plate edge during forming to finish the manufacture of the PCB. The invention can remove the edge burrs of the metallized plate, and by adopting the technical scheme for manufacturing the PCB special-shaped plate edge, a complete and reliable manufacturing method of the PCB special-shaped plate edge is formed, and the production quality of PCB products is ensured.
Description
Technical Field
The invention relates to the field of PCB (printed Circuit Board) production and manufacturing, in particular to a method for manufacturing a PCB with special-shaped edges and a PCB manufactured by the method.
Background
At present, the PCB is mainly manufactured by half holes and special-shaped holes; in the daily production process, according to actual production requirements, a PCB with special-shaped board edges can be produced, the board edges are designed to be special-shaped, and the manufacturing method of local metallization is rarely introduced at present; if the conventional PCB manufacturing method is used for producing the PCB with the special-shaped board edges and the local metallization, the edge of the metallization board is easy to have a flash condition, and the product quality of the PCB is affected.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a manufacturing method of a special-shaped board edge PCB and a PCB manufactured by the manufacturing method, which can remove the edge burrs of a metalized board edge, and form a complete and reliable manufacturing method of the special-shaped board edge of the PCB by the technical scheme of manufacturing the special-shaped board edge of the PCB, thereby ensuring the production quality of PCB products.
The invention adopts the following technical scheme:
a method for manufacturing a PCB with special-shaped board edges comprises the following steps:
drilling holes in the PCB and routing special-shaped metallized board edges on board edges of the PCB;
respectively drilling the front and back sides of the PCB after copper deposition and electroplating of the PCB, and pre-drilling the junction of the metalized board edge and the non-metalized board edge of the PCB;
and carrying out outer layer etching and surface treatment on the PCB, and routing out a non-metallized plate edge during forming to finish the manufacture of the PCB.
Further, copper deposition and electroplating are carried out on the PCB, and the method comprises the following steps:
depositing a copper layer in a drilled hole of the PCB, and electroplating and thickening the copper layer deposited in the hole;
and manufacturing a circuit pattern on the PCB through pattern transfer, and electroplating copper in the PCB hole and surface copper to a standard thickness value.
Further, after the outer layer etching is performed, a layer of insulating ink is covered on the surface of the PCB for solder resist, and characters of components are silk-screened on the surface of the PCB.
Further, the surface treatment method is to produce a copper protection layer on the exposed solder surface of the PCB, wherein the copper protection layer is a nickel-gold layer, a tin layer, an OSP film or a silver layer.
Further, the PCB is manufactured by the manufacturing method of the special-shaped board edge PCB, the board edge of the manufactured PCB is specially-shaped, local metallization is designed at the special-shaped board edge, and the joint of the metallized board edge and the non-metallized board edge of the finished board is flat and has no burrs.
Compared with the prior art, the invention has the beneficial effects that:
cutting and drilling a PCB, namely, routing the PCB to form a special-shaped metalized board edge through routing, then normally depositing copper, carrying out full board electroplating, carrying out outer layer circuit and pattern electroplating, carrying out secondary drilling after electroplating, carrying out secondary drilling on the front side and the back side respectively, pre-drilling the joint of the metalized board edge and the two ends of the non-metalized board edge by using a drill bit, and then etching, AOI checking, welding resistance, character and surface treatment, and routing the non-metalized board edge and a finished board during forming; the edge of the PCB manufactured through the steps is specially-shaped, local metallization is designed at the position of the specially-shaped edge, and the finished board has the effect that the junction of the metalized edge and the non-metalized edge is flat and has no edge.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a special-shaped board edge PCB according to the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
Example 1
The embodiment provides a manufacturing method of a PCB with special-shaped board edges, the board edges of the PCB manufactured by the manufacturing method are special-shaped, local metallization is designed at the special-shaped board edges, and the joint of the metallization and the non-metallization is flat and has no burrs. The design of the special-shaped plate edge can be set into a round structure, a polygonal structure and the like according to actual production requirements, and the metallization position of the plate edge can also be set according to the actual production requirements, so that the special-shaped plate edge is not particularly limited.
As shown in fig. 1, the manufacturing process of the PCB board with the special-shaped board edge and the partial metallization design includes the following steps:
step S1: cutting the large copper-clad plate into a size suitable for production, and drilling a required hole in the PCB;
step S2: routing out special-shaped metalized board edges on the board edges of the PCB by utilizing routing boards;
step S3: copper deposition and electroplating are carried out on the PCB;
step S4: drilling the front and back sides of the PCB respectively, and pre-drilling the junction of the metalized board edge and the non-metalized board edge of the PCB;
step S5: and carrying out outer layer etching and surface treatment on the PCB, and routing out a non-metallized plate edge during forming to finish the manufacture of the PCB.
Wherein, the step S3 of copper deposition and electroplating of the PCB board comprises the following steps:
step S31: depositing a copper layer in a drilled hole of the PCB, and electroplating and thickening the copper layer deposited in the hole to a preset thickness value which can be 8-12 um;
step S32: and manufacturing a circuit pattern on the PCB by pattern transfer, and electroplating copper in the PCB hole and surface copper to a standard thickness value which can be 20-25 um.
After pattern electroplating is completed, secondary drilling is required to be carried out on the PCB, namely, the front and back sides of the PCB are respectively drilled, the joint of the two ends of the metalized board edge and the nonmetal board edge is pre-drilled by a drill bit, and after the joint of the metalized board edge and the nonmetal board edge is drilled, the flash at the joint of the metalized board edge and the nonmetal board edge can be removed, so that the joint of the metalized board edge and the nonmetal board edge is flat and has no flash.
Then, etching the outer layer of the PCB, namely removing the unnecessary copper layer, and leaving a required circuit pattern; a layer of insulating ink is covered on the surface of the PCB for solder resist to protect a circuit copper layer; and characters of components can be silk-screened on the surface of the PCB according to actual production requirements.
Then, carrying out surface treatment on the PCB, namely producing a copper protection layer on the exposed welding disc surface of the PCB, wherein the copper protection layer can be one of a nickel-gold layer, a tin layer, an OSP film or a silver layer; and finally, routing or beer the PCB into the size and shape required by the customer and routing out the non-metallized board edges, so that the PCB is molded.
The formed PCB is also subjected to PCB open circuit and short circuit test and FQC inspection to check whether the PCB meets the production requirement; and the PCB is subjected to vacuum packaging after being inspected, so that the PCB is prevented from being wetted. The PCB can be manufactured through the series of operations, the edges of the PCB manufactured through the procedures are specially-shaped, local metallization is designed at the positions of the specially-shaped edges, and the joint of the metalized edges and the non-metalized edges of the finished board is flat and has no burrs, so that the production quality of products is guaranteed.
Example two
The PCB is manufactured by the manufacturing method of the special-shaped board edge PCB, namely, after the PCB is cut and drilled, the PCB is designed to be a special-shaped metallized board edge by using a routing board, then copper deposition, full board electroplating, outer layer circuit and pattern electroplating are carried out normally, secondary drilling is carried out after electroplating, namely, secondary drilling is carried out on the front side and the back side respectively, the joint of the metallized board edge and the two ends of the non-metallized board edge is pre-drilled by a drill bit, then etching, AOI inspection, solder mask, characters and surface treatment are carried out, the non-metallized board edge and a finished board are manufactured during forming, and then the special-shaped board edge and the local metallized PCB is finally manufactured through the procedures of testing, FQC, packaging and the like; the edges of the manufactured PCB are specially-shaped, local metallization is designed at the positions of the specially-shaped edges, and the joint of the metallized edges and the non-metallized edges of the finished board is smooth and has no burrs, so that the processing quality of the product is ensured.
The PCB board in this embodiment and the method in the foregoing embodiment are based on two aspects under the same inventive concept, and the detailed description of the method implementation process has been described above, so those skilled in the art can clearly understand the structure and the production process of the PCB board in this embodiment according to the foregoing description, and the details are omitted herein for brevity.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.
Claims (5)
1. The manufacturing method of the PCB with the special-shaped board edge is characterized by comprising the following steps of:
drilling holes in the PCB and routing special-shaped metallized board edges on board edges of the PCB;
respectively drilling the front and back sides of the PCB after copper deposition and electroplating of the PCB, and pre-drilling the junction of the metalized board edge and the non-metalized board edge of the PCB;
and carrying out outer layer etching and surface treatment on the PCB, and routing out a non-metallized plate edge during forming to finish the manufacture of the PCB.
2. The method for manufacturing the special-shaped board edge PCB according to claim 1, wherein the steps of copper deposition and electroplating of the PCB comprise the following steps:
depositing a copper layer in a drilled hole of the PCB, and electroplating and thickening the copper layer deposited in the hole;
and manufacturing a circuit pattern on the PCB through pattern transfer, and electroplating copper in the PCB hole and surface copper to a standard thickness value.
3. The method for manufacturing the special-shaped board edge PCB according to claim 1, wherein the method further comprises the steps of covering a layer of insulating ink on the surface of the PCB for solder resist after outer layer etching, and silk-screen printing characters of components on the surface of the PCB.
4. The method for manufacturing the special-shaped board edge PCB according to claim 1, wherein the surface treatment method is to produce a copper protection layer on the exposed solder surface of the PCB, and the copper protection layer is a nickel-gold layer, a tin layer, an OSP film or a silver layer.
5. A PCB board characterized in that it is manufactured by the method for manufacturing a profiled edge PCB according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310965881.XA CN116997083A (en) | 2023-08-02 | 2023-08-02 | Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310965881.XA CN116997083A (en) | 2023-08-02 | 2023-08-02 | Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116997083A true CN116997083A (en) | 2023-11-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310965881.XA Pending CN116997083A (en) | 2023-08-02 | 2023-08-02 | Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116997083A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030029717A1 (en) * | 2000-03-23 | 2003-02-13 | Rolf Schroder | Treatment of circuit support with impulse excitation |
| CN203722923U (en) * | 2014-02-20 | 2014-07-16 | 长沙牧泰莱电路技术有限公司 | Pcb |
| CN106455333A (en) * | 2016-11-15 | 2017-02-22 | 清远市富盈电子有限公司 | Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved |
| CN106507592A (en) * | 2016-11-18 | 2017-03-15 | 深圳崇达多层线路板有限公司 | The technique that wiring board edges of boards are interrupted copper-clad turmeric |
| CN108738248A (en) * | 2018-06-21 | 2018-11-02 | 江门崇达电路技术有限公司 | A kind of production method of PCB of the edges of boards with metallized semi-pore |
| CN111867278A (en) * | 2020-07-29 | 2020-10-30 | 惠州市协昌电子有限公司 | PCB semi-metallized hole machining process |
| CN114793390A (en) * | 2022-04-14 | 2022-07-26 | 广东通元精密电路有限公司 | Direct milling processing method for semi-metallized hole, semi-hole printed circuit board and application |
| WO2022271390A1 (en) * | 2021-06-25 | 2022-12-29 | Macdermid Enthone Inc. | Complex waveform for electrolytic plating |
-
2023
- 2023-08-02 CN CN202310965881.XA patent/CN116997083A/en active Pending
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|---|---|---|---|---|
| US20030029717A1 (en) * | 2000-03-23 | 2003-02-13 | Rolf Schroder | Treatment of circuit support with impulse excitation |
| CN203722923U (en) * | 2014-02-20 | 2014-07-16 | 长沙牧泰莱电路技术有限公司 | Pcb |
| CN106455333A (en) * | 2016-11-15 | 2017-02-22 | 清远市富盈电子有限公司 | Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved |
| CN106507592A (en) * | 2016-11-18 | 2017-03-15 | 深圳崇达多层线路板有限公司 | The technique that wiring board edges of boards are interrupted copper-clad turmeric |
| CN108738248A (en) * | 2018-06-21 | 2018-11-02 | 江门崇达电路技术有限公司 | A kind of production method of PCB of the edges of boards with metallized semi-pore |
| CN111867278A (en) * | 2020-07-29 | 2020-10-30 | 惠州市协昌电子有限公司 | PCB semi-metallized hole machining process |
| WO2022271390A1 (en) * | 2021-06-25 | 2022-12-29 | Macdermid Enthone Inc. | Complex waveform for electrolytic plating |
| CN114793390A (en) * | 2022-04-14 | 2022-07-26 | 广东通元精密电路有限公司 | Direct milling processing method for semi-metallized hole, semi-hole printed circuit board and application |
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