CN106507592A - The technique that wiring board edges of boards are interrupted copper-clad turmeric - Google Patents
The technique that wiring board edges of boards are interrupted copper-clad turmeric Download PDFInfo
- Publication number
- CN106507592A CN106507592A CN201611028335.XA CN201611028335A CN106507592A CN 106507592 A CN106507592 A CN 106507592A CN 201611028335 A CN201611028335 A CN 201611028335A CN 106507592 A CN106507592 A CN 106507592A
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- CN
- China
- Prior art keywords
- wiring board
- copper
- boards
- clad
- turmeric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides the technique that a kind of wiring board edges of boards are interrupted copper-clad turmeric, first the position of copper-clad turmeric is needed to produce forming tank wiring board edges of boards, heavy copper, turmeric process are carried out to wiring board again, finally do not need the region of copper-clad turmeric to remove wiring board edges of boards, obtain the wiring board that edges of boards are interrupted copper-clad turmeric.The beneficial effects of the present invention is：To wiring board first time gong groove, then heavy copper, turmeric process is carried out to wiring board, make groove position copper-clad, the turmeric of wiring board edges of boards, pass through second gong groove again, the edges of boards part for not needing copper-clad turmeric is removed, you can realize wiring board edges of boards interruption copper-clad turmeric, reduce the improvement cost of production line.
Description
Technical field
The present invention relates to wiring board manufacture field, refers in particular to the technique that a kind of wiring board edges of boards are interrupted copper-clad turmeric.
Background technology
Wiring board also known as printed circuit board (PCB), are the carriers of electronic devices and components electrical connection, belong to important electronic unit.?
In conventional wiring board design, customer requirement edges of boards are non-metallic standard, because being typically provided with counting between each layer of wiring board
Word ground connection and analogue ground, the connection between both earthing modes have particular/special requirement, if will be same to edges of boards or wooden partition bag,
Then be possible to the isolation for destroying digital grounding and analogue ground, make product go wrong, therefore common customer do not allow edges of boards or
Wooden partition has the situation of gold filled.
With developing rapidly for digital/analog signal technology, the wiring board of carrying signal serves vital effect,
In order to adapt to prior art, wiring board is also constantly being reformed, such as in order to adapt to the integrity that EMC is required or ensured signal, is being had
There are assist side edges of boards and arranges copper-clad, gold-plated in Customer design, it is desirable to the industry such as higher such as radio frequency, space flight, military project, meeting in order that
Wiring board obtains more preferable shield effectiveness or in order to improve the reasons such as impedance matching effect, between may require that wiring board edges of boards do
Disconnected copper-clad turmeric is processed.
The technological process of production of existing wiring board is：Front operation-pressing-drilling-heavy copper-electric plating of whole board-outer graphics-
Graphic plating-etching-outer layer AOI- silk-screens welding resistance-character-turmeric-molding-test-FQC- packagings, existing production technology is
The wiring board covered with gold leaf through manufacturing edges of boards interruption on request, needs new technique to realize being interrupted edges of boards wiring board covered with gold leaf
Manufacture.
Content of the invention
The technical problem to be solved is：There is provided in the case of changing less to the existing technological process of production a kind of
The technique that wiring board edges of boards are interrupted copper-clad turmeric.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is：A kind of wiring board edges of boards interruption copper-clad sinks
The technique of gold, is comprised the following steps successively：
S1, wiring board edges of boards are needed the position of copper-clad produce forming tank；
S2, heavy Copper treatment is done to wiring board；
S3, wiring board is done turmeric process；
S4, forming tank is produced in non-for wiring board edges of boards copper-clad position.
Further, in step S1, forming tank is made in the way of gong groove.
Further, in step S4, forming tank is made in the way of gong groove.
Further, also include the step of front operation, pressing, drilling before step S1 successively.
Further, electric plating of whole board, outer graphics, graphic plating, etching, outer layer are also included between step S2, S3 successively
The step of AOI, silk-screen welding resistance, character.
Further, the step of also including test, FQC, packaging after step S4.
The beneficial effects of the present invention is：To wiring board first time gong groove, then heavy copper, turmeric process is carried out to wiring board,
Groove position copper-clad, the turmeric of wiring board edges of boards is made, then by second gong groove, the edges of boards part for not needing copper-clad turmeric is removed,
Wiring board edges of boards interruption copper-clad turmeric is can achieve, the improvement cost of production line is reduced.
Description of the drawings
The idiographic flow of the present invention is described in detail in detail below in conjunction with the accompanying drawings：
Fig. 1 is the schematic flow sheet of the present invention.
Specific embodiment
By describing technology contents of the invention, structural features in detail, realizing purpose and effect, below in conjunction with embodiment
And coordinate accompanying drawing to be explained in detail.
Fig. 1 is referred to, a kind of wiring board edges of boards are interrupted the technique of copper-clad turmeric, comprise the following steps successively：
S1, wiring board edges of boards are needed the position of copper-clad produce forming tank；
S2, heavy Copper treatment is done to wiring board；
S3, wiring board is done turmeric process；
S4, forming tank is produced in non-for wiring board edges of boards copper-clad position.
Knowable to foregoing description, the beneficial effects of the present invention is：To wiring board first time gong groove, then wiring board is carried out
Heavy copper, turmeric process, make groove position copper-clad, the turmeric of wiring board edges of boards, then by second gong groove, will not need copper-clad turmeric
Edges of boards part removes, you can realizes wiring board edges of boards interruption copper-clad turmeric, reduces the improvement cost of production line.
Implement example
Wiring board is fixed on gong groove station, needs to wiring board the region of copper-clad to carry out gong groove process, wherein, molding
Then the width of groove is transported wiring board to next station, to wiring board more than the wiring board edges of boards width for processing covered with gold leaf is needed
Heavy Copper treatment is carried out, the edges of boards of wiring board are included that forming tank and non-copper clad sections all metallize, after heavy Copper treatment is finished, right
Wiring board cleaning, drying.
Then wiring board is carried out outer graphics, graphic plating, erosion to wiring board successively by the technological process of prior art
Wiring board after being disposed, then is done turmeric process, makes the edges of boards of wiring board by quarter, outer layer AOI, silk-screen welding resistance, the process of character
Layer gold is all plated including forming tank and non-copper clad sections, then to wiring board cleaning, drying.
Finally wiring board is fixed on gong groove station, second gong groove is carried out to wiring board and is processed, will not need copper-clad
The part of turmeric is removed by gong groove mode gong, finally obtains the wiring board that edges of boards are interrupted copper-clad turmeric.
After tested, after FQC, you can packaging prepares shipment.
Embodiment 1
In the step of forming tank is produced in the position that wiring board edges of boards are needed copper-clad, in the way of gong groove, make molding
Groove.
Wiring board is fixed on gong groove station, needs the region of copper-clad to carry out gong groove process wiring board with gong knife, its
In, more than the wiring board edges of boards width for processing covered with gold leaf is needed, in the present embodiment, the width ratio of forming tank needs the width of forming tank
The width in the region of copper-clad so advantageously ensures that copper-clad region less than 2 times of gong knife diameter more than 1 times of gong knife diameter
Width meets the requirement of client.
Embodiment 2
In the step of non-for wiring board edges of boards copper-clad position is produced forming tank, in the way of gong groove, make forming tank.
Wiring board is once again secured on gong groove station, does not need the region of copper-clad to carry out at gong groove wiring board with gong knife
Reason.
Embodiment 3
Before the step of forming tank is produced in the position that wiring board edges of boards are needed copper-clad, also include successively front operation,
The step of pressing, drilling.
Front operation includes sawing sheet, inner figure transfer (internal layer nog plate, internal layer pad pasting, film aligning, exposure, development, erosion
Carve, take off film), AOI, brown the step of, complete inner plating circuit make after, enter pressing working procedure, make multilayer circuit board, then
Drilling process is carried out to multilayer circuit board, is that follow-up heavy copper process is ready.
Embodiment 4
Between heavy Copper treatment being done to wiring board and wiring board done the step of turmeric is processed, also include full plate electricity successively
The step of plating, outer graphics, graphic plating, etching, outer layer AOI, silk-screen welding resistance, character.
After the multilayer circuit board that gong groove is finished carries out heavy Copper treatment, wiring board manufacturing process routinely continues to make line
Road plate.
Embodiment 5
After the step of non-for wiring board edges of boards copper-clad position is produced forming tank, also include test, FQC, bag successively
The step of dress.
The wiring board of interruption copper-clad turmeric is done last test, is FQC thereafter, packaging preparation is carried out to certified products finally
Shipment.
Embodiments of the invention are the foregoing is only, the scope of the claims of the present invention is not thereby limited, every using this
Equivalent structure or equivalent flow conversion that bright description and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (6)
1. a kind of wiring board edges of boards are interrupted the technique of copper-clad turmeric, comprise the following steps successively：
S1, wiring board edges of boards are needed the position of copper-clad produce forming tank；
S2, heavy Copper treatment is done to wiring board, make the forming tank of wiring board edges of boards plate layers of copper；
S3, wiring board is done turmeric process, make wiring board edges of boards forming tank layers of copper on plate layer gold；
S4, forming tank is produced in non-for wiring board edges of boards copper-clad position.
2. the technique that wiring board edges of boards as claimed in claim 1 are interrupted copper-clad turmeric, it is characterised in that：In step S1, with gong
The mode of groove makes forming tank.
3. the technique that wiring board edges of boards as claimed in claim 1 are interrupted copper-clad turmeric, it is characterised in that：In step S4, with gong
The mode of groove makes forming tank.
4. the technique that wiring board edges of boards as claimed in claim 1 are interrupted copper-clad turmeric, it is characterised in that：Before step S1 also according to
Secondary including front operation, pressing, drilling the step of.
5. the technique that wiring board edges of boards as claimed in claim 1 are interrupted copper-clad turmeric, it is characterised in that：Between step S2, S3
The step of also including electric plating of whole board, outer graphics, graphic plating, etching, outer layer AOI, silk-screen welding resistance, character successively.
6. the technique that wiring board edges of boards as claimed in claim 1 are interrupted copper-clad turmeric, it is characterised in that：Also wrap after step S4
Test-FQC- is included the step of pack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611028335.XA CN106507592A (en) | 2016-11-18 | 2016-11-18 | The technique that wiring board edges of boards are interrupted copper-clad turmeric |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611028335.XA CN106507592A (en) | 2016-11-18 | 2016-11-18 | The technique that wiring board edges of boards are interrupted copper-clad turmeric |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106507592A true CN106507592A (en) | 2017-03-15 |
Family
ID=58327330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611028335.XA Pending CN106507592A (en) | 2016-11-18 | 2016-11-18 | The technique that wiring board edges of boards are interrupted copper-clad turmeric |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106507592A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111225496A (en) * | 2020-01-10 | 2020-06-02 | 东莞市五株电子科技有限公司 | Metal half-clad structure, manufacturing process and PCB |
| CN111465191A (en) * | 2020-04-01 | 2020-07-28 | 江苏苏杭电子有限公司 | Method for manufacturing winding connection printed circuit board for automobile |
| CN112235960A (en) * | 2020-10-28 | 2021-01-15 | 惠州市特创电子科技有限公司 | Gold immersion circuit board and preparation method thereof |
| CN113923897A (en) * | 2021-09-23 | 2022-01-11 | 依利安达(广州)电子有限公司 | PCB manufacturing method and PCB |
| CN116997083A (en) * | 2023-08-02 | 2023-11-03 | 清远市富盈电子有限公司 | Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003179330A (en) * | 2001-12-12 | 2003-06-27 | Hitachi Chem Co Ltd | Multi-layer printed wiring board and manufacturing method therefor |
| CN104254207A (en) * | 2014-07-31 | 2014-12-31 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of metalized board edge of circuit board |
| CN105007683A (en) * | 2015-07-03 | 2015-10-28 | 深圳市景旺电子股份有限公司 | Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization |
-
2016
- 2016-11-18 CN CN201611028335.XA patent/CN106507592A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003179330A (en) * | 2001-12-12 | 2003-06-27 | Hitachi Chem Co Ltd | Multi-layer printed wiring board and manufacturing method therefor |
| CN104254207A (en) * | 2014-07-31 | 2014-12-31 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of metalized board edge of circuit board |
| CN105007683A (en) * | 2015-07-03 | 2015-10-28 | 深圳市景旺电子股份有限公司 | Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111225496A (en) * | 2020-01-10 | 2020-06-02 | 东莞市五株电子科技有限公司 | Metal half-clad structure, manufacturing process and PCB |
| CN111225496B (en) * | 2020-01-10 | 2023-03-10 | 东莞市五株电子科技有限公司 | Manufacturing process of metal semi-clad structure |
| CN111465191A (en) * | 2020-04-01 | 2020-07-28 | 江苏苏杭电子有限公司 | Method for manufacturing winding connection printed circuit board for automobile |
| CN111465191B (en) * | 2020-04-01 | 2022-12-02 | 江苏苏杭电子有限公司 | Method for manufacturing winding connection printed circuit board for automobile |
| CN112235960A (en) * | 2020-10-28 | 2021-01-15 | 惠州市特创电子科技有限公司 | Gold immersion circuit board and preparation method thereof |
| CN113923897A (en) * | 2021-09-23 | 2022-01-11 | 依利安达(广州)电子有限公司 | PCB manufacturing method and PCB |
| CN116997083A (en) * | 2023-08-02 | 2023-11-03 | 清远市富盈电子有限公司 | Manufacturing method of special-shaped board edge PCB and PCB manufactured by manufacturing method |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170315 |