CN106255321B - A kind of gong plate edges of boards are without dust technique - Google Patents
A kind of gong plate edges of boards are without dust technique Download PDFInfo
- Publication number
- CN106255321B CN106255321B CN201610648463.8A CN201610648463A CN106255321B CN 106255321 B CN106255321 B CN 106255321B CN 201610648463 A CN201610648463 A CN 201610648463A CN 106255321 B CN106255321 B CN 106255321B
- Authority
- CN
- China
- Prior art keywords
- gong
- knife
- plate
- wiring board
- speed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Abstract
The present invention provides a kind of gong plate edges of boards without dust technique, including：Gong band designs;Cutting for wiring board inside groove is a little set to interior groove center, and cutting for wiring board outline border is a little set to outside wiring board gong plate processing unit, prevents wiring board gong plate processing cell edges bumps from dust glue residue occur;Tools selection;It selects beat after grabbing knife to be no more than the gong cutter holder head of 30um, and designs the bastard gong knife and serration gong knife for selecting dimension according to gong band；Gong plate is processed;Successively carry out thick gong and smart gong using bastard gong knife and serration gong knife according to the design of gong band, when thick gong remove on wiring board should not part, the coarse edges of boards that when smart gong forms thick gong carry out polishing deburring；High-pressure washing;Residual dust glue residue on wiring board after the processing of gong plate is rinsed well.The technique can effectively improve product processing quality, and implementation cost is relatively low, and comparison " spraying ink bound edge " 40% or more mode cost reduction has the powerful market competitiveness.
Description
Technical field
The present invention relates to wiring board manufacture fields, and in particular to a kind of gong plate edges of boards are without dust technique.
Background technology
With the technological innovation of electronic product, common gong plate edges of boards quality has been unable to meet the demand in market, many clients
Electronic product develop to the direction of high-performance, no pollution, zero dust, zero soft flocks.Without dust plate on current high electronic market
Ratio is greatly improving, and is to ensure edges of boards without dust, each PCB producers generally using the method for spraying ink bound edge, but its at
This high efficiency is low.
Invention content
In view of the above-mentioned problems, the present invention provides a kind of gong plate edges of boards without dust technique, including：
Gong band designs;Cutting for wiring board inside groove is a little set to interior groove center, and cutting for wiring board outline border is a little set to line
Outside the plate gong plate processing unit of road, prevent wiring board gong plate processing cell edges bumps from dust glue residue occur;
Tools selection;It selects beat after grabbing knife to be no more than the gong cutter holder head of 30um, and corresponding rule is selected according to the design of gong band
The bastard gong knife and serration gong knife of lattice；
Gong plate is processed;It is designed according to gong band, successively bastard gong knife and serration gong knife is used to carry out wiring board in gong machine
Thick gong and smart gong, when thick gong remove on wiring board should not part, when smart gong carries out polishing to the coarse edges of boards that thick gong is formed and repaiies
Side；
High-pressure washing;Residual dust glue residue on wiring board after the processing of gong plate is rinsed well.
Preferably, the bastard gong knife of selection is consistent with the knife diameter specification of serration gong knife, prevents from leading to gong plate because of the angles R difference
Corner's residual dust glue residue of formation.
Further, when carrying out the processing of gong plate, when gong wiring board inside groove, the knife diameter offset of thick gong and thin gong compares bastard
Small 0.04 ~ the 0.09mm of knife diameter of gong knife and serration gong knife;When gong wiring board outline border, the knife diameter offset of thick gong and thin gong compares bastard
Big 0.06 ~ the 0.12mm of knife diameter of gong knife and serration gong knife.
Further, carry out gong plate processing when, thick gong knife diameter compensation it is smaller by 0.01 than the knife diameter offset of thin gong ~
0.02mm。
Preferably, when carrying out the processing of gong plate, when the knife diameter of the bastard gong knife and serration gong knife that use is 0.8 ~ 1.0mm
When, the gong machine speed of mainshaft is set as 38 ~ 40krpm, cuts speed and is set as 0.2 ~ 0.7m/min, withdrawing speed is set as 4 ~ 8m/min, thick gong
Plate speed is set as 2 ~ 6mm/sec, and the bastard gong knife service life is set as 5 ~ 10m, and smart gong plate speed is set as 6 ~ 20 mm/sec, serration gong knife service life
It is set as 8 ~ 15m.
Preferably, when carrying out the processing of gong plate, when the knife diameter of the bastard gong knife and serration gong knife that use is 1.2 ~ 1.6mm
When, the gong machine speed of mainshaft is set as 33 ~ 37krpm, cuts speed and is set as 0.8 ~ 1.2m/min, withdrawing speed is set as 9 ~ 11m/min, slightly
Gong plate speed is set as 7 ~ 18mm/sec, and the bastard gong knife service life is set as 15 ~ 25m, and smart gong plate speed is set as 15 ~ 40 mm/sec, serration gong knife
Service life is set as 20 ~ 30m.
Preferably, when carrying out the processing of gong plate, when the knife diameter of the bastard gong knife and serration gong knife that use is 1.8 ~ 2.4mm
When, the gong machine speed of mainshaft is set as 28 ~ 30krpm, cuts speed and is set as 0.8 ~ 1.2m/min, withdrawing speed is set as 9 ~ 11m/min, slightly
Gong plate speed is set as 17 ~ 27mm/sec, and the bastard gong knife service life is set as 30 ~ 35m, and smart gong plate speed is set as 25 ~ 45 mm/sec, serration gong
The knife service life is set as 35 ~ 40m.
Further, when carrying out the processing of gong plate, the rotating speed deviation of gong machine main shaft is no more than ± 3 krpm.
Preferably, when gong plate is processed, polylith wiring board can be gathered into folds and is carried out at the same time processing；To plate thickness be 1.2 ~
When the wiring board of 1.6mm carries out gong plate, lamination quantity is folded no more than 3pnl/, in order to clean dust glue residue.
The present invention carries out smart gong using serration knife, carries out polishing deburring to wiring board edges of boards, keeps edges of boards more smooth, and needle
The optimization that gong plate processing control parameter has been carried out to the gong knife of different size, make dust glue residue remain the problem of be addressed, and
Product processing quality is effectively improved, and implementation cost is relatively low, comparison " spraying ink bound edge " 40% or more mode cost reduction,
With the powerful market competitiveness.
Specific implementation mode
Below in conjunction with specific embodiment, present invention is further described in detail.
Embodiment 1 carries out gong band design first;Cutting for wiring board inside groove is a little set to interior groove center, wiring board outline border
Cut a little be set to wiring board gong plate processing unit outside, prevent wiring board gong plate processing cell edges bumps there is dust glue
Slag;Then tools selection is carried out;It selects beat after grabbing knife to be no more than the gong cutter holder head of 30um, and is selected accordingly according to the design of gong band
The bastard gong knife and serration gong knife of specification；Then gong plate processing is carried out, wiring board to be processed is subjected to lamination, is set according to gong band
Meter successively uses bastard gong knife and serration gong knife to carry out thick gong and smart gong to wiring board in gong machine, and when thick gong removes wiring board
On should not part, the coarse edges of boards formed to thick gong when smart gong carry out polishing deburring；Last high-pressure washing;It will add by gong plate
Residual dust glue residue on wiring board after work is rinsed well.When gong plate is processed, polylith wiring board can be gathered into folds and meanwhile into
Row processing；When carrying out gong plate to the wiring board that plate thickness is 1.2 ~ 1.6mm, lamination quantity is folded no more than 3pnl/, in order to cleaning powder
Dirt glue residue.
When the knife diameter of the bastard gong knife and serration gong knife that use is 1.0mm, the gong machine speed of mainshaft is set as 38 ± 3
Krpm cuts speed and is set as 0.7m/min, and withdrawing speed is set as 8m/min, and thick gong plate speed is set as 5mm/sec, and the bastard gong knife service life is set as
10m, smart gong plate speed are set as 20 mm/sec, and the serration gong knife service life is set as 15m.When gong wiring board inside groove, the knife diameter offset of thick gong
For 0.94mm, the knife diameter offset of smart gong is 0.96 mm, and when gong wiring board outline border, the knife diameter offset of thick gong is 1.14mm, essence
The knife diameter offset of gong is 1.12 mm.
Embodiment 2, when carrying out the processing of gong plate, when the knife diameter of the bastard gong knife and serration gong knife that use is 1.5mm, gong
Owner's rotating speed is set as 34 ± 3 krpm, cuts speed and is set as 1m/min, withdrawing speed is set as 10m/min, and thick gong plate speed is set as
17mm/sec, bastard gong knife service life are set as 25m, and smart gong plate speed is set as 35 mm/sec, and the serration gong knife service life is set as 30m, bastard gong
Knife and serration gong knife service life allow the deviation for having ± 2m.When gong wiring board inside groove, the knife diameter offset of thick gong is 1.44mm, essence
The knife diameter offset of gong is 1.46 mm, and when gong wiring board outline border, the knife diameter offset of thick gong is 1.60mm, and the knife diameter of smart gong is mended
It is 1.62 mm to repay value.
Embodiment 2, when carrying out the processing of gong plate, when the knife diameter of the bastard gong knife and serration gong knife that use is 1.5mm, gong
Owner's rotating speed is set as 34 ± 3 krpm, cuts speed and is set as 1m/min, withdrawing speed is set as 10m/min, and thick gong plate speed is set as
17mm/sec, bastard gong knife service life are set as 25m, and smart gong plate speed is set as 35 mm/sec, and the serration gong knife service life is set as 30m, bastard gong
The knife service life allows the deviation for having ± 5m, serration gong knife service life to allow the deviation for having ± 10m.When gong wiring board inside groove, thick gong
Knife diameter offset be 1.44mm, the knife diameter offset of smart gong is 1.46 mm, when gong wiring board outline border, the knife diameter compensation of thick gong
Value is 1.60mm, and the knife diameter offset of smart gong is 1.62 mm.
Embodiment 3, when carrying out the processing of gong plate, when the knife diameter of the bastard gong knife and serration gong knife that use is 2.0mm, gong
Owner's rotating speed is set as 30 ± 3 krpm, cuts speed and is set as 1m/min, withdrawing speed is set as 10m/min, and thick gong plate speed is set as
24mm/sec, bastard gong knife service life are set as 30m, and smart gong plate speed is set as 45 mm/sec, and the serration gong knife service life is set as 40m, bastard gong
Knife and serration gong knife service life allow the deviation for having ± 10m.When gong wiring board inside groove, the knife diameter offset of thick gong is 1.94mm,
The knife diameter offset of smart gong is 1.96 mm, and when gong wiring board outline border, the knife diameter offset of thick gong is 2.10mm, the knife diameter of smart gong
Offset is 2.12 mm.
In the above-described embodiments, the optimization that gong plate processing control parameter has been carried out for the gong knife of different size, makes dust
The problem of glue residue remains is addressed, and effectively improves product processing quality.
Although description of this invention combination embodiments above carries out, those skilled in the art
Member can carry out many replacements according to above-mentioned content, modifications and variations, be obvious.Therefore, it is all it is such substitute,
It improves and variation is included in the spirit and scope of appended claims.
Claims (8)
1. a kind of gong plate edges of boards are without dust technique, including：
Gong band designs;Cutting for wiring board inside groove is a little set to interior groove center, and cutting for wiring board outline border is a little set to wiring board
Gong plate is processed outside unit, prevents wiring board gong plate processing cell edges bumps from dust glue residue occur;
Tools selection;It selects beat after grabbing knife to be no more than the gong cutter holder head of 30um, and is designed according to gong band and select dimension
Bastard gong knife and serration gong knife；
Gong plate is processed;It is designed according to gong band, successively bastard gong knife and serration gong knife is used to carry out thick gong to wiring board in gong machine
With smart gong, when thick gong remove on wiring board should not part, the coarse edges of boards that when smart gong forms thick gong carry out polishing deburring；
High-pressure washing;Residual dust glue residue on wiring board after the processing of gong plate is rinsed well；
The bastard gong knife of selection is consistent with the knife diameter specification of serration gong knife, prevents the turning for causing gong plate to be formed because of the angles R difference
Locate residual dust glue residue.
2. according to a kind of gong plate edges of boards described in claim 1 without dust technique, it is characterised in that：When carrying out the processing of gong plate, gong
When wiring board inside groove, the knife diameter offset of thick gong and thin gong is smaller 0.04 ~ 0.09mm than the knife diameter of bastard gong knife and serration gong knife;Gong
When wiring board outline border, the knife diameter offset of thick gong and thin gong is bigger 0.06 ~ 0.12mm than the knife diameter of bastard gong knife and serration gong knife.
3. according to a kind of gong plate edges of boards described in claim 2 without dust technique, it is characterised in that：When carrying out the processing of gong plate, slightly
The knife diameter compensation of gong is smaller 0.01 ~ 0.02mm than the knife diameter offset of thin gong.
4. according to a kind of gong plate edges of boards described in claim 3 without dust technique, it is characterised in that：When carrying out the processing of gong plate, when
When the knife diameter of the bastard gong knife and serration gong knife that use is 0.8 ~ 1.0mm, the gong machine speed of mainshaft is set as 38 ~ 40krpm, cuts
Speed is set as 0.2 ~ 0.7m/min, and withdrawing speed is set as 4 ~ 8m/min, and thick gong plate speed is set as 2 ~ 6mm/sec, and the bastard gong knife service life is set as 5
~ 10m, smart gong plate speed are set as 6 ~ 20 mm/sec, and the serration gong knife service life is set as 8 ~ 15m.
5. according to a kind of gong plate edges of boards described in claim 3 without dust technique, it is characterised in that：When carrying out the processing of gong plate, when
When the knife diameter of the bastard gong knife and serration gong knife that use is 1.2 ~ 1.6mm, the gong machine speed of mainshaft is set as 33 ~ 37krpm, cuts
Speed is set as 0.8 ~ 1.2m/min, and withdrawing speed is set as 9 ~ 11m/min, and thick gong plate speed is set as 7 ~ 18mm/sec, and the bastard gong knife service life sets
For 15 ~ 25m, smart gong plate speed is set as 15 ~ 40 mm/sec, and the serration gong knife service life is set as 20 ~ 30m.
6. according to a kind of gong plate edges of boards described in claim 3 without dust technique, it is characterised in that：When carrying out the processing of gong plate, when
When the knife diameter of the bastard gong knife and serration gong knife that use is 1.8 ~ 2.4mm, the gong machine speed of mainshaft is set as 28 ~ 30krpm, cuts
Speed is set as 0.8 ~ 1.2m/min, and withdrawing speed is set as 9 ~ 11m/min, and thick gong plate speed is set as 17 ~ 27mm/sec, and the bastard gong knife service life sets
For 30 ~ 35m, smart gong plate speed is set as 25 ~ 45 mm/sec, and the serration gong knife service life is set as 35 ~ 40m.
7. according to claim 4 or a kind of 5 or 6 gong plate edges of boards without dust technique, it is characterised in that：Carry out gong plate processing
When, the rotating speed deviation of gong machine main shaft is no more than ± 3 krpm.
8. according to a kind of gong plate edges of boards described in claim 1 without dust technique, it is characterised in that：It, can will be more when gong plate is processed
Block wiring board, which gathers into folds, is carried out at the same time processing；When carrying out gong plate to the wiring board that plate thickness is 1.2 ~ 1.6mm, lamination quantity is no more than
3pnl/ is folded, in order to clean dust glue residue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610648463.8A CN106255321B (en) | 2016-08-10 | 2016-08-10 | A kind of gong plate edges of boards are without dust technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610648463.8A CN106255321B (en) | 2016-08-10 | 2016-08-10 | A kind of gong plate edges of boards are without dust technique |
Publications (2)
| Publication Number | Publication Date |
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| CN106255321A CN106255321A (en) | 2016-12-21 |
| CN106255321B true CN106255321B (en) | 2018-11-13 |
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| CN201610648463.8A Expired - Fee Related CN106255321B (en) | 2016-08-10 | 2016-08-10 | A kind of gong plate edges of boards are without dust technique |
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| CN106900139B (en) * | 2017-04-20 | 2019-05-14 | 胜宏科技（惠州）股份有限公司 | A kind of high-accuracy no technique edges LED circuit board moulding process |
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| CN107708307B (en) * | 2017-08-30 | 2019-10-29 | 奥士康精密电路（惠州）有限公司 | Gong plate method based on automatic identification parameter |
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| CN108381119A (en) * | 2018-01-29 | 2018-08-10 | 奥士康精密电路（惠州）有限公司 | A kind of PCB buries copper coin copper billet blind slot control depth method |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
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| KR100536897B1 (en) * | 2003-07-22 | 2005-12-16 | 삼성전자주식회사 | Connecting structure and method of circuit substrate |
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| CN102387668A (en) * | 2011-10-26 | 2012-03-21 | 高德（无锡）电子有限公司 | Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges |
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