TWI301735B - - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of punching a flexible printed circuit board used in an electronic device, and more particularly to a processed or unused portion for a non-through hole for mounting an electronic component. The shape processing such as removal is a punching method in which the opening is punched by a punch for punching. [Prior Art] For the method of forming a non-through hole or an opening for accommodating an electronic component on a flexible flexible printed circuit board, a punching process using a punch for punching is widely used. Usually, a necessary conductor loop is formed on a insulating substrate by a copper foil or the like, and coating is performed by a cover film (C〇Verlay film), a solder resist layer, or the like, and then a punching process is performed. θ In the conventional piercing process, a flexible printed circuit board is inserted between the upper die and the lower die, and a method of pressing the flexible printed circuit board and punching it by the presser of the upper die is known (for example, refer to the patent) Literature 丨). The metal mold described in Patent Document 1 is shown in Fig. 7 . This metal mold is composed of an upper mold 丨丨 and a lower mold 12, and the upper mold π is supported by a plate 11a in which the base end portion of the punch 13 is inserted and a front end portion having a punch a punch inserted therein. The press plate of the hole lib (the upper plate in the patent document 1) hc, and the lower mold a has a punch hole into which the front end portion of the punch punch 13 is inserted to penetrate the flexible printed circuit board. 12a, and the lower portion of the punch hole i2a is gradually expanded in diameter to provide the tapered portion 12b. As shown in FIG. 8, the flexible printed circuit board 14 is inserted between the upper mold 11 and the lower mold 12, and the guide pins erected on the lower mold 12 are inserted into the flexible printed circuit board 14 (not shown). The guide holes are aligned for alignment.

As shown in Fig. 9, after the upper mold π is gradually lowered, first, the press plate 11c is inserted into the flexible printed circuit board between the lower mold 12 to correct the deflection, the skew or bending of the printed circuit board 14, and the like. The platen hc is inserted into and held fixed by the spring mechanism (not shown), and in this state, after the upper die plate Ha and the punching punch 13 embedded thereon are integrally lowered The tip end portion of the punching punch 13 is inserted into the punch hole 12a of the lower mold, and the flexible printed circuit board 14 is pierced by the shearing force of the punch 13 and the lower mold. As shown in FIG. 10, the punching punch 13 is inserted into the taper portion 12b through the punch hole 12a of the lower die, and the plate 15 of the user printed circuit board 14 is dropped toward the lower die 12. This does not occur when the swarf 15 is filled in the lower mold 12. For this reason, it is necessary to increase the total length of the punching punch 13 and the stroke with the lower die 12 (the insertion length of the punch hole 12a toward the lower die). In general, the machining accuracy of the short length of the wearing contact 13 is two in the upper template 11 & the shorter the protruding length is (4) the accuracy of the shuttle angle. Furthermore, the stroke between the lower die 12 and the lower die 12 can be avoided to extend the life of the metal mold. Therefore, the stroke is as short as possible to the helmet. The only thing required is the flexible printed circuit board. The front end of the flexible printed circuit board 14 is facing from the bottom surface. When the hole 12a is inserted into the Q·3_~Q·5 coffee, the surface of the punch hole is like the taper portion of the hole, so that the lower mold 12 is used, for example, “special hardness material” In order to ensure the strength, it is necessary to be 2 or more. = 6 1301735 2. Correction, when the stroke of the flexible printing mine reverse 14 is set to about 3 mm to G. 5 mm, the front end of the figure is shown in Fig. 13 In the case where the lower die ^砰 hole is used for the position of the master: ===

The reason why the miscellaneous portion i2b is sequentially discharged is not produced, and the reason why the shaft-μ related plate member 15 flies out from the punch hole 12a is as follows. That is, in order to form a non-through-hole material for the flexible printed circuit board 14, in the case where the portion having the double-sided surface is subjected to the punching process, as shown in Fig. 13, the copper-fall portion 16a on the upper side of the chip 15 is formed as The copper box portion (10) on the lower side is also slightly larger than the trapezoidal. The reason is that the perforation plus 4 green shear force is cut. Therefore, as shown in Fig. 14, when the chip 15 of the flexible printed circuit board 14 is pressed into the inside of the punch hole 12a of the lower mold, the upper side thereof is formed into a convex shape like a broken line portion. The 5 series flew out toward the surface of the lower mold 12 according to the repulsive force. On the one hand, in the case where the portion which is not used for the flexible printed circuit board 14 is perforated, the mechanical strength becomes low when the side of the shop is shouted as the only insulating layer, so as shown in Fig. 15, the chip 15 becomes deflected. status. Therefore, as shown in Fig. 16, when the chip 15 of the flexible printed circuit board 14 is pressed into the inside of the punch hole 12a of the lower mold, the deflected chip 15 as shown by the broken line portion is difficult to keep under The inner peripheral surface of the punch hole 12a of the die, and 7 1301735 is punched in the punch] C{ μ q is adsorbed to the piercing eyebrow with _ ^ ^ when there is any original 13 to make the flexible printed circuit board 14 When the slab-shaped printed circuit board Τ=2Λ surface, when the new boring hole is processed in the lower-engineering process, the flying swarf 15 is smashed between the brush counters 14 and This is an unsatisfactory situation in which a printed circuit has a punching mark. When the new brewing_circuit board 14 is broken, there is no swarf 15 on the surface of each m, and in the event that there is a plate genus 15 ^, after removing the genus 15 by gas jet or brush, reload The next m printed circuit board 14 has a problem that the work efficiency is deteriorated. In addition, the second portion of the lower mold 12 is formed so that the swarf 15 does not fly out of the surface of the lower mold 12, and the lower portion of the lower mold 12 is formed into a closed structure. The method in which the chips 15 are sucked and discharged by air, but when the lining flexible printed circuit board 14 is subjected to the punching process, when there are a plurality of places and the system is suctioned, the swarf is discharged at any one of the plurality of parts. At the moment of 15, the suction pressure system is lowered, and there is a so-called "continuation of the suction and discharge operation that cannot be performed continuously." However, it is possible to solve the problem by separately providing the suction device for all the portions to be perforated. The mold structure is complicated and complicated, and it is difficult in reality. In addition, in order to prevent the occurrence of cracks in the periphery of the opening portion during the perforation processing, it is known that the hole is used in advance in the portion to be perforated. A method in which the opening δ is smaller than the opening portion (for example, refer to Patent Document 2 and Patent Document 3) or, before the opening portion is punched, a plurality of holes are previously opened in the inner periphery of the opening 1301735 by the age processing method. In the method (for example, refer to Patent Document 4), a preliminary hole for a small diameter is formed in the lining portion, and a method for piercing the slash hole of the slit is provided (for example, see Patent Document 5). [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Kaiping No. [Patent Document 5] Japanese Patent Laid-Open No. 7-2, No. [Abstract] [Problems to be Solved by the Invention]

The invention described in Patent Document 1 is the same as the above, because the end portion is from the punch hole of the lower die to the position where the tapered portion protrudes. J (four) grain == hair: == the surface of the flying r die. However, recently two: Yes, r _:=:=:: Wear: 峨 Slit hole: = load = two = 1301735 underneath = when the protrusion is placed, the shape of the perforation will be deformed. Therefore, the object of the present invention is to provide a method for punching, which is directed to a non-through hole or a non-portion portion of a flexible printed circuit board, and is used for the purpose of removing the hole, and forming an opening for the use of the perforation. In the perforation and reinforcement method, even if the wearing method is not used from the lower mold! ίThe short-stroke metal mold inserted into the taper (4) position will not fly out of the surface of the lower mold and will be discharged downward from the lower taper portion. [Means for Solving the Problem] The present invention proposes a proposal for achieving the above object, and the invention recited in the j-th aspect of the patent application provides a method for punching a flexible printed circuit board, which is formed by opening a flexible printed circuit board. The perforation processing of the opening portion, and the portion of the crucible perforation processing is a case where a pattern forming portion of a copper foil is provided on one surface or both surfaces of the insulating layer, the perforation processing method is characterized in that the opening is performed by perforating Before the portion, the insulating layer is exposed by removing the pattern forming portion inside the opening portion by etching. According to this configuration, in the case where the pattern forming portion of the non-via hole in which the copper foil is provided is subjected to the punching process, the copper foil which is the inside of the opening portion is removed by etching in advance, so that the copper foil in the chip is removed. It becomes a σ layer and is easily bent to alleviate the repulsion and prevent the swarf from flying out on the surface of the mold. The invention described in the second aspect of the invention provides a method for perforating a flexible printed circuit board by punching a flexible printed circuit board to form an opening, and the portion of the punching process is The single layer or the double-sided layer of the insulating layer is adhered to the auxiliary material of the circuit board auxiliary material for the thin plate or the film. The perforation processing method is characterized in that the perforation and dew exposure are removed first as the opening portion. The auxiliary aid on the inner side is an auxiliary material on the inner side of the opening portion, so that the -Z* in the swarf and the portion of the n-insulating layer are sinused and bent to relieve the repulsion and prevent the surface from flying out. The brush circuit applies the meaning of the item described in item 3 to provide a kind of flexible printing, which is pre-processed at the time of pattern formation:::::: at least part of the surface or both sides. The early entry 抒 iff 1' ΐ 杂 ( 四 四 四 四 四 四 四 四 四 四 £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ In the case where the invention described in the second aspect of the present invention provides an exposed portion of the flexible printed insulating layer, the wearing 1301735 is embossed before the opening of the p portion, and the thief is in the exposed portion. When the solder resist layer is formed, the solder resist layer is formed on the two sides. In the case where the flexible printed circuit board is subjected to the punching process, the at least part of the portion where the copper box is formed is insulated by the paste side. The layer is exposed to convex _ mechanical strength ==, and the inner peripheral surface of the punch hole of the lower mold is not caused by the vacuum == punch, so that the swarf can be prevented from flying toward the upper portion of the lower mold. [Effect of the Invention] The present invention is characterized in that, as described above, the shape processing is performed for the non-through hole processing or the removal of the unnecessary portion for mounting the sub-parts of the flexible printed circuit board, and the opening is formed by using the punching punch to open the opening. In the perforation processing of the part, even if the short stroke length of the punching machine is not inserted from the hole of the lower die to the position protruding toward the tapered portion, the chip of the flexible printed circuit board does not fly. Since the surface of the lower mold is discharged from the tapered portion of the lower mold in an orderly downward direction, various unfavorable conditions caused by the swarf can be eliminated. Further, it is not necessary to confirm the presence or absence of swarf on the surface of the lower mold before starting the new boring process, and the work efficiency can be greatly improved. [Embodiment] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a description will be given of a suitable embodiment of the method for punching a flexible printed wiring board according to the present invention. Regarding the perforation processing method of the flexible printed circuit board of the present invention, the taper of the chip 12 i j 〇 1735 :::=:= Mo of the flexible printed circuit board is not sequentially discharged toward the lower side. For example, in the case of a conventional printed circuit board, the pre-existing paste is used to remove the inside of the opening, and the copper is thinned to make the insulating layer exposed. The convenience of the description of HL is described in detail with reference to Fig. 7 to Fig. 16 [Embodiment u, which is to make Lai Wei and omit the money description. The part (mr r's job board is made of Peng Qingcheng's pattern, and (2) is the χ-χ line. The flexible printed electric island (with ^1 缘 edge layer 17 on both sides of the copper drop 16a, 16b) Forming a circular opening nst_minute) 'The material for the money A paste is pierced through the opening portion to be finely smeared. The inner portion 18 of the broken line A as the opening portion is previously removed by the etching to remove the copper foil to expose the insulating layer 17 Line A uses the punch 13 to the virtual product of the above flexible circuit board 14;; = processing, as shown in Figure 2, the chip 15 will be stored = ί β head hole inside the 'but the plate 15 The inner portion 18 is bent, i, B16: t is removed and becomes only the insulating layer 17 so that it becomes easy. 邱c Qiu Bayouyou's inner portion 18 is easily deformed, and if it is false, the copper 6a, 16b remains. The repulsive force between the inner surfaces of 12a is moderated to prevent the second = = right = surface flying out. 'The swarf 15 series sequentially reaches the taper 412b of the lower mold and is efficiently discharged downward. 13 1301735 $ Γί f°°卩The towel's use of the inner part of the copper box to remove the copper box is in the range of 〇.3 within the distance of the dotted line A. The field is effective. Also = 'Let the copper fl 16a, 16b remain in the The dotted line A is located within a distance of 〇.3. Therefore, for example, when a non-through hole of one side (1) is formed from a circular island portion, the side portion 1δ is removed by using the side, and the precision is allowed. It is better to increase the amount of the inner portion of the copper to be removed to 0.6 φ φ 〜 0.8 Φ. (4) The shape of the opening formed by the thread is the longitudinal direction. In the above, it is preferable that the portion having the same shape as the shape and the distance from the broken line A is deleted by 3 2 = _ before the contraction is removed. However, the shape of the opening portion is used in the length. In the case where the direction and the width direction are divided, and the length of the child is on the jtr, if it is possible to remove the portion of the shop that is to be removed, the opening may be the same as the opening of the perforation: wFig. 3(1) to (3) For example, even if the knives of the broken line A perform the axis division _ on the respective shapes, the effect of == can be obtained. That is because the swarf in the longitudinal direction is easy to be repaid and "==the punch hole _ 15 Repulsive middle box - 乂上上之之之之例1 flexible printed circuit board 14 16- ^ 仁In the case of 疋ϋ 面 具有 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 1301735 Magnetic Shielding> Various thin plates such as a sheet, a light-shielding film, or a thin-walled auxiliary material for a circuit board are punched to form an opening (not shown), and before the opening is punched, By removing the auxiliary material as the inner side of the opening portion by a perforation process or the like, the portion of the swarf in which the auxiliary material is removed is only the insulating layer, and the swarf is removed to prevent the swarf from being scraped. The surface of the lower mold (4). For the area where the auxiliary material is to be removed, remove and remove the map! The copper (four) industry described in Figure 3 is perforated. [Embodiment 2] Fig. 4 is a view showing a perforation processing example in which the portion of the insulating layer which is not provided on the board and the portion of the insulating layer is opened to form an unused portion, and Fig. 1(4) is a top view, and (2) is a Υ γ line Sectional view. The lubricity shown in the dotted line D of the pull-up ^^^ Μ ’ is not set to be squirmed and insulated: J1. In the inner portion of the broken line D, on the side of the pattern formation, at least a part of the residual copper layer of the single-sided or double-sided layer of the crucible layer is processed, and the one side or both sides of the insulating layer l7 are read. The solder resist layers 21a, 21b are formed to the parent portion. If the punching punch 13 punches the closed portion of the above-mentioned warping, as shown in Fig. 5, ^ == in the punch hole (3) of the lower jaw, but because of her cross section

== Γ 崎 increased, as the dotted line E and the broken line F i Γ 1 wide 15 deflection is suppressed and becomes easy to maintain on the inner circumference of the punch hole 12a of the lower mold, without being worn Prevent the shop 15 from flying out toward the upper part of the lower mold 12. - and with the suppression of the deflection of the swarf 15 , in the dotted line D part to be perforated 15 1301735 2, 21b formed in the distance from the dotted line D 0. 3 coffee ^ within the range of the effect. That is, the insulation layer is exposed to the position of the 2t line in advance. And there is a __welding layer plus: b formed by the σ 卩, in consideration of the outline 丨 and = distance a 3 _ area =; 夕 ^ 〃 Therefore 'for example, in the circle that wants to penetrate h 0 biliary φ ~, recorded as G.4mmO~G.8mm (D-shaped convex part of D. The shape of the opening to be formed by the hole piercing method is the case where the length 1 Uf direction is approximately the same size, as described above, close to] The copper solder resist layers 21a, 21b are formed in a convex shape in advance: S is preferable. However, as long as the deflection of 15 is suppressed by the convex portion of the profile, the plate layer 15 is easily held by the punch U2a of the lower mold. The inner peripheral surface may be gentle, and the shape of the plate 15 and the perforating punch 13 may be different from the shape of the opening of the perforation. For example, as shown in the modification shown in Figs. 6(1) to (3) Even if a file having a convex cross section is formed by a copper box or solder resist layers 21a and 21b in various forms on the inner side of the broken line ,, the same effect as described above can be obtained by suppressing the deflection of the swarf. The invention can be variously changed without departing from the spirit of the invention, and the invention can be adapted to such changes. 16 1301735 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows a perforation processing example of a flexible printed circuit board of the present invention, in which (穿孔) is provided with a top view of an island-shaped copper foil at a perforation position. (2) Department (1) Fig. 2 is a longitudinal sectional view showing the behavior of the swarf in the lower mold when the island portion shown in Fig. 1 is punched. Fig. 3 (1) to (3) show For explaining the modification of the island portion shown in Fig. 1

view. Figure 4 is a view showing a perforation processing example of the flexible printed circuit board of the present invention, (1)

The top view of the island-shaped copper foil is not provided at the piercing position. (2) A cross-sectional view of the Y line of the system (1). Fig. 5 is a longitudinal sectional view showing the behavior of the swarf in the lower mold when the island portion shown in Fig. 4 is punched. Fig. 6 (1) to (3) show a top view for explaining a modification of the island portion shown in Fig. 4. Fig. 7 is a longitudinal sectional view showing a schematic structure of a conventional piercing die. Fig. 81 is a longitudinal cross-sectional view showing a method of punching a flexible printed circuit board by a punching die shown in Fig. 7. Fig. 9 shows the second embodiment of the perforation processing method shown in Fig. 8 for showing the behavior of the chip in the lower mold under the condition that the punch stroke of the conventional punching mold is short. The figure is used to show that the swarf flies out of the punch hole of the lower die in the case where the punch stroke of the conventional punching die is short. Figure 13 shows a conventional perforated die that is placed on both sides with a sloppy part. 17 1301735

Production, vertical section of the chip during V hole machining. Fig. 14 is a longitudinal cross-sectional view showing the movement of the chip from the hole of the lower mold in the case where a partial punching process in which a copper box is provided on both sides by a conventional punching die is used. Fig. 15 is a longitudinal sectional view showing the swarf when only the insulating layer is partially perforated by the conventional punching die. Figure 16 is a longitudinal sectional view showing the use of a conventional perforated die only for the insulating layer

In the case of partial perforation, the swarf flies out of the punch hole of the lower die. [Main component symbol description] 11 ............Upper die 12............Lower die 12a..........punch hole 12b..........tapered portion 13 ........... punching punch Φ 14............flexible printed circuit board 15. ........... swarf 16a, 16b···copper foil 17...Insulation layer 18............inside part 21a, 21b of broken line A ···Anti-fresh layer 18

Claims (1)

1301735 X. Patent application scope: 1. A method for perforating a flexible printed circuit board, which is in the flexible printed circuit, which is in the shape of a hole, and is in the insulating layer. The single-sided double-sided arrangement is provided with a copper-made portion. The perforation processing method is characterized in that the hole is removed in advance and the pattern is formed inside the opening portion before the opening is punched. The insulating layer is formed by the portion. 2. A method for perforating and securing a flexible printed circuit board by punching a flexible printed circuit board to form an opening, and the portion of the punching is attached to one side or both sides of the insulating layer In the case of the auxiliary material portion of the auxiliary material for a circuit board such as a thin plate or a film, the punching method is characterized in that the auxiliary material inside the opening portion is removed before the opening is punched. The aforementioned insulating layer is exposed. 3. The perforated green of the surface printed circuit board is formed by the perforation processing in which the flexible printed circuit board 2 is formed with an opening, and the exposed portion is not provided with a copper box and exposed for the insulating layer. In the case of a part, the perforation processing method is characterized in that: before the opening is punched, the exposed portion is formed before the inside of the opening, and one side of the insulating layer is previously formed during the etching process of the pattern formation. At least a portion of the double-sided remains copper foil. 4. A method of punching a flexible printed circuit board by punching a hole in which an opening is formed, and a portion where the punching is not provided with a copper foil and exposing the insulating layer In the case of the part, the perforation 19 1301735 The processing method is characterized in that a solder resist layer is formed on one surface or both surfaces of the insulating layer in advance at the exposed portion on the inner side of the opening portion before the opening portion is punched. 20