1295149 ’舉't R修(更)正本 九、發明說明： 【發明所屬之技術領域】 本發明係有關電子機器所使用之撓性印刷電路板之穿 孔加工模具裝置，特別是有關使用穿孔用衝頭而穿孔形成狹 縫孔或分割用狹縫等之細長開口部的穿孔加工模具裝置。 【先前技術】 在具可撓性的撓性印刷電路板上形成用以收納非通孔 或電子零件的開口部等之方法中，係廣泛進行利用穿孔用衝 頭的穿孔加工。通常是在絕緣基板上利用銅羯等物形成必要 的導艘回路’並在利用覆蓋膜(C〇Verlay f ilm)、抗銲層 (solder resist layer)等物施行被覆之後再進行穿孔加 工0 在以往的穿孔加工中，於上模與下模之間插入撓性印 刷電路板，而利用上模的壓板一邊按壓撓性印刷電路板且進 行穿孔的方法係屬習知(例如，參照專利文獻丨）。第1〇囷 所顯示係為專利文獻1記載的金屬模。此金屬模係由上模 11和下模12所構成，上模η係由嵌著有穿孔用衝頭13的 基端部之板11a、及具有被插入穿孔用衝頭13的前端部之 支持孔lib的壓板(專利文獻丨中為上模板)Uc所構成，下 模12係具有插入著前述穿孔用衝頭13的前端部用以打穿撓 性印刷電路板的衝頭孔(pUnch h〇le)12a，且該衝頭孔12a 的下部被徐徐地擴徑而設置有錐度部12b。 如第11圖所示，在上模u和下模12之間插入挽性印 刷電路板14，使下模12所立設的引導銷插通於未圖示之挽 性印刷電路板U所開設的導引孔而進行位置對準。 12951491295149 'lifting 't R repair (more) original nine, invention description: [Technical Field of the Invention] The present invention relates to a perforated processing die device for a flexible printed circuit board used in an electronic device, and more particularly to the use of a punch for punching A perforating die device that pierces the elongated opening portion such as a slit hole or a slit for slit by the head. [Prior Art] In a method of forming an opening or the like for a non-through hole or an electronic component on a flexible flexible printed circuit board, a punching process using a punch for punching is widely performed. Usually, a necessary guide circuit is formed on a insulating substrate by using a copper crucible or the like, and is subjected to a coating process by using a cover film (C〇Verlay f ilm), a solder resist layer, or the like, and then performing the punching process. In the conventional piercing process, a flexible printed circuit board is inserted between the upper die and the lower die, and a method of pressing the flexible printed circuit board and punching it by the presser of the upper die is known (for example, refer to the patent document丨). The first embodiment shows the metal mold described in Patent Document 1. This metal mold is composed of an upper mold 11 and a lower mold 12, and the upper mold η is supported by a plate 11a in which the base end portion of the punch 13 is inserted, and a front end portion having a punch 13 inserted therein. The press plate of the hole lib (the upper plate in the patent document) is composed of Uc, and the lower die 12 has a punch hole into which the front end portion of the punch 13 for punching is inserted to penetrate the flexible printed circuit board (pUnch h〇) Le) 12a, and the lower portion of the punch hole 12a is gradually expanded in diameter to provide a tapered portion 12b. As shown in Fig. 11, the lead printed circuit board 14 is inserted between the upper mold u and the lower mold 12, and the guide pins erected on the lower mold 12 are inserted into the unillustrated printed circuit board U. The guide holes are aligned for alignment. 1295149
年 B修(更)正本I 如第12圖所示，當上模u逐漸降下來之後，首先、 壓板11c係在與下模12之間挾入撓性印刷電路板14 ，以矯 正撓性印刷電路板u之歪斜或料料。此壓板llc係藉 彈簧機構(未圓示）而將撓性印刷板14挾人並維持固 定，於此狀態，在上模板Ua以及被嵌設在其上之穿孔用衝 頭13 一體下降之後，穿孔用衝頭13的前端部被插入下模的 衝頭孔12a ’撓性印刷電路板μ係受穿孔用衝頭13與下模 12之剪切力而被打穿。 如第13圖所示，穿孔用衝頭a若穿過下模的衝頭孔 12a而插通到錐度部i2b的位置，則撓性印刷電路板之板屑 (以下’僅稱之為「板屬」）15係朝下模12的下方落下，不 會發生該板屑15塞滿下模12内的情況。為此，有必要將穿 孔用衝頭13之全長及與下模12間之衝程(朝向下模的衝頭 孔12a之插通長度)增長。 一般來說，穿孔用衝頭13之全長為短者的加工精度係 較佳，且在嵌設於上模板Ua之際、突出長度為短者係可提 升垂直角度的精度。再者，與下模12間之衝程為短者係摩 擦小即可了事，金屬模的壽命亦變長。於是，穿孔用衝頭 13的全長及衝程係以盡可能短者為佳，而有關將撓性印刷 電路板14穿孔所需要的衝程，係只要撓性印刷電路板14的 前端部從下模12的表面朝衝頭孔12a插通0· 3麵〜〇· 5 nun 左右的話即足夠。 相對地’有關從下模的衝頭孔12a之表面截至錐度部 12b的最上部為止的長度，即使下模12係使用了例如1^鋼 等之高硬度材質，而為了確保強度，有必要是2 mm以上。因 1295149 Μ. Γ2Π ^ — 年 U修(更)正本 此，如同前述，在撓性印刷電路板14之穿孔衝程設定為〇 3 咖〜0.5 _左右的場合時，如第14圖所示，在穿孔用衝頭 13的前端部未穿過下模的衝頭孔⑶而插通到錐度部伽 的位置之情況下，板屬15係塞滿下模的衝頭孔〗2a之内部， 如虛線G部分所示，形成板屑π被依序蓄積下去。 在前述穿錢_ 設長度尺寸比寬度尺寸 還長很多的狹縫孔或分割用狹縫等之細長開口部的形狀之 場合，在該穿孔用衝頭13上昇之際、板屑15係瞬間地吸附 於穿孔用衝頭13的前端部下面而被昇起，如第15囷所示， 有時會捲起而朝下模12的上方隆起。此傾向係顯著地發生 於細長的板屑15之中央部分。 如此，既隆起於下模12的表面之板屑15係在次一步 驟中要裝载新的撓性印刷電路板14之際被挾入下模12之 間，而在進行穿孔加工時於撓性印刷電路板14產生打痕等 之不理想的情況。 因此，在要裝載新的撓性印刷電路板14之際，每次要 確認下模12的表面上有無板屑15，而萬一存在有板屑15 時’必需在利用氣艘喷氣或刷子將板屑15除去之後，再裝 載下一個撓性印刷電路板14 ,具有所謂作業效率惡化的問 題。 此外、亦考量到以板屑15不隆起於下模12表面的方 式’將下模12的下部形成密閉構造而將板屑15以空氣吸引 排出的方法，但是在要對撓性印刷電路板14進行穿孔加工 的部位有複數個且係以同一系統進行吸引的場合時，在板屑 15被排出的瞬間，複數個部位當中的任一個部位之吸引壓 1295149 9δΓΓ2：Τ^ 年；！丨:更)正本 力係降低而具有所謂的無法連續地進行吸引排出操作的缺 點。雖然只要對進行穿孔加工的所有部位個別地設置吸引裝 置的話就可解決，但是金屬模構造係多變複雜而在現實上有 其困難。 除此之外，在狹縫孔形成部預先開設小直徑的預備 孔’再將設置有突起的狹縫孔用衝頭抵接於預備孔以斷開板 屑的穿孔加工方法(例如參照專利文獻2)亦屬習知。 【專利文獻1】日本國專利特開平7 — 24792號公報 【專利文獻2】曰本國專利特開平7—24793號公報 【發明内容】 發明所欲解決之_, 專利文獻1所記載的發明中，因為穿孔用衝頭的前端 部從下模的衝頭孔截至朝錐度部突出的位置為止的衝程長 之緣故，所以在加工精度及垂直角度的精度提升上有其困 難，且因摩擦多的原因，使得金屬模的壽命容易變短。而當 衝程縮短時，板屑被蓄積在衝頭孔的内部，有時其板屑飛出 下模的表面，而具有所謂的作業效率惡化的不理想情況。 專利文獻2所記載的發明中，係使用設置有突起的狹 縫孔用衝頭而將板屑斷開，但是在局部穿孔細的形狀等之場 合時，欲以鑽孔加工方式進行開穿預備孔係變困難。而在無 預備孔之下對衝頭設置突起之後，則會造成穿孔的形狀變 形。 於是，本發明之目的為提供一種穿孔加工模具裝置， 該穿孔加工模具裝置係為在挽性印刷電路板穿孔形成細長 開口部之穿孔加工中，即便是所使用之穿孔用衝頭未從下模 1295149 I晷12·妒日修(更诞本 的衝頭孔朝向錐度部突出的位置插通之短衝程的金屬模，板 屑亦不會捲起於下模的表面而從下模的錐度部被依序朝下 方排出。 解決課題之手段 本發明係為達成上述目的而提案者，申請專利範圍第1 項所記載的發明所提供之撓性印刷電路板之穿孔加工模具 裝置係為在撓性印刷電路板穿孔形成細長開口部的穿孔加 工’其特徵為’於前述細長開口部之長度方向中央部附近位 置且在側緣部之單側或兩側上，將1個或複數個凸狀的穿孔 部連設於前述細長開口部。 若依此構成，則即使是於細長開口部之長度方向中央 部附近位置且在側緣部之單側或兩側進行穿孔加工，藉由在 不受妨害的部位上連設凸狀的穿孔部，而使得與前述細長開 口部之長度方向側緣部相接之凸狀的直線部分或曲線部分 在下模和板屑之間產生摩擦力，所以可抑制板屑捲起。 ，，申請專利範圍第2項所記載之明係提供如申請 專利範圍第1顿記載之撓性印刷電雜之穿孔加工模具 裝置，其中，於上述細長開口部為在途中彎曲的場合時，於 該細長開口部之長度方向兩端部與料部之中央部·你Year B Repair (More) Original I As shown in Fig. 12, after the upper mold u is gradually lowered, first, the pressure plate 11c is inserted into the flexible printed circuit board 14 between the lower mold 12 to correct the flexible printing. The board u is skewed or material. The platen llc is configured to hold the flexible printed circuit board 14 by a spring mechanism (not shown), and in this state, after the upper die plate Ua and the punching punch 13 embedded thereon are integrally lowered, The tip end portion of the punching punch 13 is inserted into the punch hole 12a of the lower mold. The flexible printed circuit board μ is pierced by the shear force of the punch 13 and the lower mold 12. As shown in Fig. 13, when the punching punch a is inserted through the punch hole 12a of the lower die and inserted into the tapered portion i2b, the chip of the flexible printed circuit board (hereinafter referred to as "plate only" The genus "15" falls down the lower mold 12, and the swarf 15 does not become filled in the lower mold 12. For this reason, it is necessary to increase the total length of the punching punch 13 and the stroke between the lower die 12 (the insertion length of the punch hole 12a toward the lower die). In general, the precision of the short length of the punching punch 13 is preferably short, and the accuracy of the vertical angle can be improved when the protruding length is short when the upper template Ua is fitted. Further, the stroke between the lower mold and the lower mold 12 is short, and the life of the metal mold is also long. Therefore, the total length and stroke of the punching punch 13 are preferably as short as possible, and the stroke required to perforate the flexible printed circuit board 14 is as long as the front end portion of the flexible printed circuit board 14 is from the lower mold 12 It is sufficient if the surface is inserted into the punch hole 12a and the 0. 3 face ~ 〇 · 5 nun is left and right. Relatively speaking, the length from the surface of the punch hole 12a of the lower mold to the uppermost portion of the tapered portion 12b is such that a high-hardness material such as 1^ steel is used for the lower mold 12, and in order to secure strength, it is necessary to 2 mm or more. Since 1295149 Μ. Γ2Π ^ - year U repair (more), as in the above, when the perforation stroke of the flexible printed circuit board 14 is set to 〇3 咖~0.5 _, as shown in Fig. 14, When the front end portion of the punching punch 13 does not pass through the punch hole (3) of the lower mold and is inserted into the position of the taper portion, the plate 15 is filled with the inside of the punch hole 2a of the lower mold, such as a broken line. As shown in part G, the formation of swarf π is sequentially accumulated. In the case of the shape of the slit opening such as the slit hole or the slit for which the length dimension is much longer than the width dimension, when the punch punch 13 is raised, the chip 15 is instantaneously It is attracted to the lower surface of the tip end portion of the punch 13 for punching, and as shown in Fig. 15, it may be rolled up and raised toward the upper side of the lower mold 12. This tendency occurs remarkably in the central portion of the elongated swarf 15. Thus, the chips 15 which are bulged on the surface of the lower mold 12 are drawn between the lower molds 12 when the new flexible printed circuit board 14 is loaded in the next step, and are scratched during the punching process. The printed circuit board 14 produces an undesired situation such as a scratch. Therefore, when a new flexible printed circuit board 14 is to be loaded, it is necessary to confirm the presence or absence of the swarf 15 on the surface of the lower mold 12, and in the event that the swarf 15 is present, it is necessary to use the air jet or the brush. After the chip 15 is removed, the next flexible printed circuit board 14 is loaded, which has a problem that the work efficiency is deteriorated. Further, a method of forming the closed portion of the lower mold 12 into a closed structure and sucking and discharging the chips 15 by air in such a manner that the swarf 15 does not rise on the surface of the lower mold 12 is considered, but the flexible printed circuit board 14 is required. When there are a plurality of portions for performing the perforation processing and are sucked by the same system, the suction pressure of any one of the plurality of portions is 1295149 9δΓΓ2: Τ^ years at the moment when the swarf 15 is discharged.丨: More) The original system is lowered and has a so-called defect that the suction and discharge operations cannot be continuously performed. Although the suction device can be separately provided for all the portions where the punching is performed, the metal mold structure is complicated and difficult in reality. In addition, a slit-hole forming portion is provided with a small-diameter preliminary hole in advance, and a slit hole provided with a projection is abutted against the preliminary hole to break the chip. 2) It is also a custom. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 7-24793 (Patent Document 2). In the invention described in Patent Document 1, Since the tip end portion of the punching punch has a long stroke from the punch hole of the lower die to the position protruding toward the tapered portion, there is difficulty in improving the precision of the machining accuracy and the vertical angle, and the friction is large. This makes the life of the metal mold easy to shorten. On the other hand, when the stroke is shortened, the swarf is accumulated inside the punch hole, and sometimes the swarf flies out of the surface of the lower mold, which has an undesirable situation in which the so-called work efficiency is deteriorated. In the invention described in Patent Document 2, the swarf is broken by the punch for the slit hole provided with the protrusion. However, when the shape is partially perforated or the like, the hole is to be opened by the drilling method. The hole system becomes difficult. When the protrusion is provided under the punching hole without the preliminary hole, the shape of the punch is deformed. Accordingly, it is an object of the present invention to provide a perforating processing die apparatus which is used in a perforation process in which a thinned opening portion is formed by perforating a printed circuit board, even if the perforating punch used is not from the lower die 1295149 I晷12·妒日修 (The short-stroke metal mold inserted into the punch hole at the position where the punch hole protrudes toward the taper portion, the chip is not rolled up on the surface of the lower mold and is tapped from the taper of the lower mold. The present invention is directed to achieve the above object, and the perforated processing die device for a flexible printed circuit board according to the invention of claim 1 is flexible. a perforation process in which a printed circuit board is perforated to form an elongated opening portion is characterized in that it is located at a position near a central portion in the longitudinal direction of the elongated opening portion and on one side or both sides of the side edge portion, and one or a plurality of convex shapes are formed. The perforated portion is connected to the elongated opening. According to this configuration, the perforation is applied to one side or both sides of the side edge portion even at a position near the center portion in the longitudinal direction of the elongated opening portion. By arranging a convex perforated portion on the unaffected portion, a convex straight portion or a curved portion that is in contact with the longitudinal side edge portion of the elongated opening portion is between the lower mold and the chip Since the frictional force is generated, it is possible to suppress the rolling of the swarf. The stencil of the second embodiment of the present invention provides a flexible printing electrical perforation processing die device as described in the first application of the patent application. When the elongated opening is curved on the way, the both ends of the elongated opening are in the longitudinal direction and the center of the material portion.
若依此構成，則即使是於上述細長開口㈣力治士说If it is constructed in this way, even if it is in the above-mentioned slender opening (four)
1295149 嗶】2.沪u修(更)正本 部之長度方向側緣部相接的凸狀之直線部分或曲線部分在 下模與板屑之間產生摩擦力，所以可抑制板屑捲起。 又，申請專利範圍第3項所記載的發明所提供之撓性 印刷電路板之穿孔加工模具裝置係為在撓性印刷電路板穿 孔形成細長開口部的穿孔加工，其特徵為，於前述細長開口 部之長度方向中央部附近位置且在側緣部之單側或兩側 上，將1個或複數個凹狀的非穿孔部連設於前述細長開口 部。 若依此構成，則即使是於細長開口部之長度方向中央 部附近位置且在側緣部之單側或兩側進行穿孔加工，藉由在 不受妨害_位上連設凹狀_穿孔部，而使得與前述細長 開口部之長度方向側緣部相接之凹狀的直線部分或曲線部 分在下模和板狀間產生摩擦力，所以可抑做屑捲起。 又’㈣專職㈣4項所記載之發鶴提供如申高 專利範園第3項所記載之撓性印刷祕板之穿孔加工模士 裝置，其中，於上述細長開口部為在途中彎曲的場合時，方 該細長開口部之長度方向兩端部與料部之中央部附近七 置且在側緣部之單側或_丨上，將丨個或複數個凹狀的 孔部連設於前述細長開口部。 若依此構成’則即使是於上述細長開口部為在途 曲的場合時，在料部和細長開口部之長度方向兩端部的: 央部附近位置且鱗部之單倾賴進行穿孔加卫 連設凹狀的非穿孔部，使得與前述細 口权長度方向舰部相細魄之直線部分或曲線 在下模與㈣之間產生摩擦力，触可抑偷雜起。 1295149 fi修(更)正本 【發明效果】 本發明係為，如同上述，在撓性印刷電路板穿孔形成 細長開口部之穿孔加工中，即便是所使用之穿孔用衝頭並未 從下模的衝頭孔插通到朝錐度部突出的位置之短衝程的金 屬棋，板屑亦不會捲起於下模的表面，而可從下模的錐度部 有效率地依序朝下方排出，所以可消除板屑所帶來的各種不 理想情況。且，成為在每次開始新的穿孔加工之前，不需要 確認下模的表面有無板屑的作業，可飛躍地提升作業效率。 【實施方式】 ~ 實施發明的最诖形Μ 以下，針對有關本發明之撓性印刷電路板之穿孔加工 模具裝置，茲舉出適當實施例作說明。在撓性印刷電路板穿 孔形成細長開口部之穿孔加工中，係把所謂的提供撓性印刷 電路板之板屑不捲起於下模的表面而從下模的錐度部依序 朝下方排出那樣的穿孔加工方法的目的，例如，藉由在對撓 性印刷電路板穿孔加工細長開口部之前，於該細長開口部之 長度方向中央部附近位置且在側緣部之單側或兩側上，將】 個或複數個凸狀的穿孔部連設於前述細長開口部而來實現。 此外，為說明方便，針對料10目至第15圓所說明 的構成屬同_構成部分，係使賴_魏並㈣複說明 省略。 【實施例1】 第1圖至第4圖細示在撓性印刷電路板上穿孔形成 細長開口部之穿孔加工的—例子，第！圖係撓性印刷電路板 之細長開口雜穿孔加X後的㈣15在内之下模12的平面 .1295149 r~Wl2.T9— 4 月 K H (更)正本 圓’第2圓係被第1圓顯示虛線Α所圍繞的部分之放大圓， =3，係撕在第2 _示之η線部財，板躲下模 内之舉動的_關，第4 _顯示凸狀㈣孔部之各 狀的解說平面圖。 如第1 ®至第3圖所示，於下模12的衝頭孔似，在 直線狀的細㈣畴20之長度方向巾央物職置，連設 1個或複數個凸狀的穿孔部2卜雖然該凸狀的穿孔部21只 要設置在距離前述細長開口部2Q之長度方向中央部5麵二 内的任—糊即可，但是在即舰行穿孔加I亦不受妨害的 場合時，在長度方向中央部附近之關偏移若干位置而;設 置者係較佳。 本實施例中，前述凸狀的穿孔部21為方形，係從細長 開口部20之長度方向侧緣部22朝直角方向突設。該凸狀的 穿孔部21之寬度W及長度L係由細長開口部2〇之寬度或撓 性印刷電路板的材質所設定，概略為寬度w及長度L皆〇.5 麵以上的話，則可阻擋板屑15捲起的力量。 前述凸狀的穿孔部21侧為使得從細長開口部2〇的 長度方向側騎22以直肖方式突㈣長度L的部分在下模 12與板屑15之間產生摩擦力，如第3圖之虛線8部分所示; 可抑制板屑15捲起。 前述凸狀的穿孔部21在金屬模加工中係以方形形態者 為佳，但是在形狀不方便作成方形的場合時，如第4圖所 示，亦可為其他形狀。第4圖（1)及(2)係顯示一梯形的例 子、同圖（3)及(4)為三角形、同圖（5)為鐮刀形，而同圖（6) 則是一半圓形的例子。有關同圖（1)所示的楔狀之梯形以外 12 .1295149 Γ……% 1? 19 ·1295149 哔] 2. The u-repair (more) of the main part of the longitudinal direction of the longitudinal direction of the convex portion of the straight portion or the curved portion of the friction between the lower mold and the chip, so that the chip rolling can be suppressed. Further, the perforated processing die device for a flexible printed circuit board according to the invention of claim 3 is a perforation process in which a flexible printed circuit board is perforated to form an elongated opening, and the elongated opening is formed in the elongated opening One or a plurality of concave non-perforated portions are connected to the elongated opening portion on one side or both sides of the side edge portion at a position near the center portion in the longitudinal direction of the portion. According to this configuration, the perforation processing is performed on one side or both sides of the side edge portion even in the vicinity of the center portion in the longitudinal direction of the elongated opening portion, and the concave-perforated portion is connected to the unprotected position. Further, a concave straight portion or a curved portion which is in contact with the longitudinal side edge portion of the elongated opening portion generates a frictional force between the lower mold and the plate shape, so that the curling can be suppressed. Moreover, the cranes described in the four items of (4) full-time (four) provide the perforation processing tool device of the flexible printing secret board as described in the third item of Shengao Patent Fanyuan, wherein when the elongated opening portion is curved on the way And the two ends of the elongated opening portion in the longitudinal direction and the vicinity of the central portion of the material portion are disposed on one side of the side edge portion, or one or a plurality of concave hole portions are connected to the slender side. Opening. According to this configuration, even when the elongated opening portion is in the middle of the road, both ends of the material portion and the elongated opening portion in the longitudinal direction are located near the central portion, and the scales are perforated and reinforced. A concave non-perforated portion is connected so that a straight line portion or a curve which is fine with the length of the ship in the length direction of the thin mouth generates a frictional force between the lower mold and the (four), and the contact can be prevented from being smashed. 1295149 fi repair (further) original [Effect of the invention] The present invention is such that, as described above, in the perforation processing in which the flexible printed circuit board is perforated to form an elongated opening portion, even if the punch for punch used is not from the lower mold The punch hole is inserted into the short-stroke metal chess which protrudes toward the tapered portion, and the swarf is not rolled up on the surface of the lower mold, but can be efficiently discharged downward from the taper portion of the lower mold. It can eliminate all kinds of undesirable conditions caused by swarf. Further, it is not necessary to confirm the presence or absence of swarf on the surface of the lower mold before starting the new boring process, and the work efficiency can be greatly improved. [Embodiment] The final configuration of the present invention will be described below with reference to a suitable embodiment of the perforated processing die device for a flexible printed circuit board according to the present invention. In the punching process in which the flexible printed circuit board is formed by perforating the elongated opening portion, the so-called chip providing the flexible printed circuit board is not rolled up on the surface of the lower mold and is sequentially discharged downward from the taper portion of the lower mold. For the purpose of the perforation processing method, for example, before the elongated opening portion is punched into the flexible printed circuit board, at a position near the central portion in the longitudinal direction of the elongated opening portion and on one side or both sides of the side edge portion, It is achieved by connecting a plurality of convex perforations to the elongated opening. Further, for the convenience of explanation, the constituents described for the material 10 to the 15th circle are the same as the constituent parts, and the Lai Wei (4) is omitted. [Embodiment 1] Figs. 1 to 4 show an example of perforation processing in which an elongated opening portion is formed by perforation on a flexible printed circuit board. The figure is a flexible printed circuit board with an elongated opening and a perforation plus X (4) 15 inside the plane of the lower die 12. 1295149 r~Wl2.T9 - April KH (more) the original circle 'the second circle is the first circle Show the enlarged circle of the part surrounded by the dotted line ,, =3, tearing the η line in the 2nd _, and the board _ _ off the movement of the dies in the mold, the 4th _ shows the shape of the convex (four) hole Interpretation plan. As shown in the first to third figures, the punch hole of the lower mold 12 is similar to the length of the linear (four) domain 20, and one or a plurality of convex perforations are connected. In the case where the convex perforated portion 21 is provided in the surface of the central portion 5 in the longitudinal direction of the elongated opening portion 2Q, it is sufficient that the perforation plus I is not impaired. The position near the central portion in the longitudinal direction is offset by a plurality of positions; the installer is preferred. In the present embodiment, the convex perforated portion 21 has a square shape and protrudes in a direction perpendicular to the side edge portion 22 of the elongated opening portion 20. The width W and the length L of the convex perforated portion 21 are set by the width of the elongated opening 2〇 or the material of the flexible printed circuit board, and the width w and the length L are both 55 or more. Blocks the force of the coils 15 rolling up. The convex perforated portion 21 side is such that a portion that protrudes from the longitudinal direction side of the elongated opening portion 2 in a straight direction (4) length L generates a frictional force between the lower mold 12 and the chip 15, as shown in FIG. The dotted line 8 is shown; the chip 15 can be suppressed from being rolled up. The convex perforated portion 21 is preferably a square shape in the metal mold processing. However, when the shape is inconvenient to form a square shape, as shown in Fig. 4, other shapes may be employed. Fig. 4 (1) and (2) show an example of a trapezoid, the same figure (3) and (4) are triangular, the same figure (5) is a sickle shape, and the same figure (6) is a half circular shape. example. Regarding the wedge-shaped trapezoid shown in the same figure (1) 12 .1295149 Γ...% 1? 19 ·
1 -|· >] ^ K Ί ^ I —... —............................. ........................................................... 的形狀，因為任一形狀與方形的場合比較之下，用以抑制板 屑15上浮的抑制力係變弱，例如在第4圓(4)中，將細長開 口部20之長度方向側緣部22載至凸狀的穿孔部21之前端 為止的長度L1設定為比方形的場合還長者係較佳。 又，為確保下模12與前述穿孔部21的板屑15之間的 摩擦力，係以形成前述細長開口部2〇的長度方向側緣部22 與前述穿孔部21之外角01或02呈60。〜120。之範圍的直 線或曲線的方式來形成凸狀的穿孔部21者為較佳。特別是 在穿孔部21為第4圖（4)所示的三角形之場合，係以具有前 述外角01及Θ2雙方的角度呈60。〜120。的直線者為佳。 【實施例2】 第5圓至第7圖係在撓性印刷電路板穿孔形成細長開 口部的穿孔加工之一其他例，第5圖係撓性印刷電路板之細 長開口部於穿孔加工後的板屑15在内之下模12的平面圖， 第6圓係被第5囷顯示的虛線C所圍繞的部分之放大囷，第 7圖係顯示凹狀的非穿孔部之各種形狀的解說平面圖。 如第5囷及第6圖所示，在實施例2中之下模12的衝 頭孔12a係形成有寬度尺寸為較實施例丨的場合還寬的直線 狀之細長開口部30 ,在該細長開口部3〇之長度方向中央部 附近位置，朝内側連設1個或複數個凹狀的非穿孔部31。 雖然該凹狀的非穿孔部31只要設置在距離前述細長開口部 30之長度方向中央部5麵以内的任一單側即可，但是在即 使進行穿孔加工亦不受妨害的場合時，在長度方向中央部= 近之兩側偏移若干位置而作設置者係較佳。 、 本實施例中，前述凹狀的非穿孔部31為方形，係由細 13 1:) 1:) 1295149 i 長開口部30的長度方向側緣部32朝直角方向内侧突設。該 凹狀的非穿孔部31之寬度W及長度L係依據細長開口部3〇 的寬度或撓性印刷電路板的材質而被設定，但是概略為寬度 W及長度L皆0· 5 mm以上的話，則可阻擋板屑15捲起的力 量0 前述凹狀的非穿孔部31係由細長開口部30之長度方 向侧緣部32朝直角内侧突出，而因為其長度l的部分使下 模12與板屑15的非穿孔部31之間產生摩擦力，所以係與 實施例1中之第3囷虛線B部分所作說明同樣地可抑制板屑 15捲起。 前述凹狀的非穿孔部31在金屬模加工中係以方形形態 者為佳’但是在形狀不方便作成方形的場合，如第7圖所示， 亦可為其他形狀。第7囷（1)及(2)係顯示一梯形例，同圖（3) 及(4)為二角形’同圖（5)則是一半圓形的例子。有關同圖(1) 所示之楔狀的梯形以外的形狀，因為任一形狀與方形的場合 比較之下，用以抑制板屑15上浮的抑制力係變弱，例如: 第7圓（3)中，將細長開口部3〇之長度方向側緣部犯截至 凹狀的非穿孔部31哺端為止之長度[2設定為比 合#<县者傜鲂祛。 ^ 為確保下模12與板屑15的非穿孔部31之間的摩 力，係以形成前述細長開口部3〇的長度方向側緣部犯與 穿:：31之们或㈧呈6〇。〜120。之範圍的直線或曲絲 方式來設置凹狀的非穿孔部31者為佳,,丨是在非穿孔 31為第7 ®⑶所示的三角形之場合，_ 3及料雙方的角度E6(r〜12『的直線者為佳。 更)正太: ,1295149 【實施例3】 =8圖係顯示在換性印刷電路板穿孔形成有呈寶曲的 软穿孔加工的—例子，如第8圖⑴所示，下模 衝頭孔12a係形成和緩的曲線狀，於該曲線狀的衝頭 孔12a之細長開口部4〇的長度方向 設1個或複數個凸狀的穿孔部41。 町阳置上連 /述凸狀的穿孔部41在金屬模加工中係以方形形態者 為佳’但亦與實施例1的場合同樣可以是梯形、三角形、鐮 刀形、半m形等之其他形狀。又，針對穿孔部41的長度， 以及相對於長度方向彳麟部42的外肖等亦與實施例1的場 合同樣。如同圖示，藉由將該凸狀的穿孔部41=形2 曲線狀的細· 口部4G料側，餅在對減15捲起的抑 制上更具赦要。 而且，如同第8囷⑵所示，在細長開口部40 f曲且 直，部分為挾著曲_分那樣_狀之場合，藉由在細長開 口《Ρ 40之長度方向兩端部與雙曲部43的起點之中央部附近 位置且側緣部42之單側或兩側上，各自連設〗個或複數個 凸狀的穿孔部4卜而可有效地抑制㈣15捲起。 【實施例4】 第9圖係顯示在撓性印刷電路板穿孔形成有臀曲的細 長開口部之穿孔加工的一其他例，如同第9圖⑴所示，下 模12的衝碩孔i2a係形成有寬度尺寸為比實施例3的場合 ^寬的和緩曲線狀，而在該曲線狀的衝頭孔12a之細長開口 部50的長度方向令央部附近位置，連設j個或複數個凹狀 的非穿孔部51。 15 1295149 (爽)止本i 別it凹狀的非穿孔部51在金屬模加王巾彳細方形形態 者為佳，但亦與實施例〗的場合同樣可以是梯形、三角形、 錄刀形、半圓形等之其他形狀。又，針對非穿孔部51之長 度，=及相對於長度方向側緣部52的外角等等亦與實施例 1的場合同樣。如同圖示，藉由將該凹狀的非穿孔部51預 先形成在曲線狀的細細口部5G的外側， 15捲起的抑制上更具效果。 接著’如同第9圖⑵所示，在細長開口部5〇彎曲且 直線部分為挾著曲線部分那樣的形狀之場合，藉由在細長開 口部50之長度方向兩端部和彆曲部53的起點之中央部附近 位置且側緣部52之單側或兩側上，各自連設j 4固或複數個 凹狀的非穿孔部51，使得在對板屑15捲起的抑制上具有效 果。 此外，有關本發明，只要在不逸脫本發明的精神之下 係可進行各種改變，而且，本發明可及於該改變者乃理所當 然。 【囷式簡單說明】 【第1圖】係顯示有關本發明之撓性印刷電路板的穿孔加 工之實施例1 ,為細長開口部既穿孔加工後的板屑在内之下 模的平面圓。 【第2圖】係被第1圖的虛線A所圍繞的部分之放大囷。 【第3囷】係顯示在第2圖的X — X線部位中，板屑在下 模内之舉動的縱剖面圖。 【第4圓】（1)〜（6)係顯示實施例1之凸狀的穿孔部之各 1295149 ^_______ I η ：L2i ::!修(更)正本 種形狀的解說平面圖。 係ΪΓί關本發明之撓性印刷電路板的穿孔加 模的ί面圖。開口部既穿孔加工後的板屬在内之下 2 被第5圖的虛線C所圍繞的部分之放大圖。 各種形狀的職平面目。 _非牙孔邛之 工之【=係顯5有關本發明之撓性印刷電路板的穿^ 德的二:二肉 〜⑵係 '幫曲的細長開口部既穿孔加卫 後的板屑在内之下模的平面圖。 係=有關本發明之撓性印刷電路板的穿孔加 ,’（）〜⑵係彎觸細長和部崎孔加工後 的板屑在内之下模的平面圖。 2 1〇圖】係顯示以往的穿孔模之概略構造的縱剖面圖。 電路顯^吏㈣1〇圖所示的穿孔模之撓性印刷 板之牙孔加工模具裝置之縱剖面圖。 【第12圖】係顯示第^目所示的穿孔加工模具裝置 一步驟的縱剖面圖。 【第13圖】係顯示第η目所示的穿孔力口工模具裝置— 一步驟的縱剖面圖。 一人 —【第14圖】係顯示在以往的穿孔模，且在衝頭的衝程 短的情況時板屬在下模内之舉動的縱剖關。 #、、、 【第15圖】係顯示在以往的穿孔模，於細長開口部之長 度尺寸為比起寬度尺寸長很多的情況時板屑在下模内的舉 動，（1)為平面圖，而（2)係（1)的γ—γ線剖面圖。 17 _ -T「 “ 脚一 i# ^ 1295149 奔2 a ?”:(更)正本 【主要元件符號說明】 ll·····上模 12…..下模 12a….衝頭孔 12b….錐度部 13……穿孔用衝頭 14……撓性印刷電路板 15......板屑 20, 30…細長開口部 21，3l···凸狀的穿孔部 22, 32…側緣部 40, 50…細長開口部 41, 51…凹狀的非穿孔部 42,52…側緣部 43, 53…聲曲部 181 -|· >] ^ K Ί ^ I —... —................................... .................................................. The shape of the ..... is because the suppression force for suppressing the floating of the chip 15 is weakened in comparison with the case of any square shape. For example, in the fourth circle (4), the elongated opening portion 20 is The length L1 of the longitudinal direction side edge portion 22 to the front end of the convex perforated portion 21 is preferably set to be longer than that of the square shape. Further, in order to secure the frictional force between the lower mold 12 and the chips 15 of the perforated portion 21, the longitudinal side edge portion 22 forming the elongated opening portion 2''' and the outer peripheral portion 01 or 02 of the above-mentioned perforated portion 21 are 60. . ~120. It is preferable that the convex perforated portion 21 is formed in a straight line or a curved line. In particular, when the perforated portion 21 is a triangle shown in Fig. 4 (4), it is 60 at an angle having both the outer corners 01 and Θ2. ~120. The straight line is better. [Embodiment 2] The fifth to seventh drawings are other examples of the punching process in which the flexible printed circuit board is formed by the perforation forming the elongated opening portion, and the fifth drawing is the elongated opening portion of the flexible printed circuit board after the punching process. The plan of the inner die 12 of the chip 15 is enlarged, and the sixth circle is enlarged by the portion surrounded by the broken line C shown by the fifth line. Fig. 7 is a plan view showing various shapes of the concave non-perforated portion. As shown in FIGS. 5 and 6, in the second embodiment, the punch hole 12a of the lower mold 12 is formed with a linear elongated opening 30 having a width larger than that of the embodiment ,. One or a plurality of concave non-perforated portions 31 are connected to the inner side at a position near the center portion in the longitudinal direction of the elongated opening portion 3A. The concave non-perforated portion 31 may be provided on either side of the surface of the central portion 5 in the longitudinal direction of the elongated opening 30. However, in the case where the punching process is not impaired, the length is It is preferable that the center portion of the direction is shifted to a certain position on both sides. In the present embodiment, the concave non-perforated portion 31 has a square shape and is formed by a thin 13 1:) 1:) 1295149 i. The longitudinal side edge portion 32 of the long opening portion 30 protrudes inward in the right-angle direction. The width W and the length L of the concave non-perforated portion 31 are set depending on the width of the elongated opening 3〇 or the material of the flexible printed circuit board, but the width W and the length L are both 0·5 mm or more. The force of the rolled up piece 15 is blocked. The concave non-perforated portion 31 protrudes from the longitudinal side edge portion 32 of the elongated opening portion 30 toward the inside of the right angle, and the lower mold 12 is caused by the portion of the length l thereof. Since the frictional force is generated between the non-perforated portions 31 of the swarf 15, the swarf 15 can be suppressed from being wound up in the same manner as the description of the third broken line B in the first embodiment. It is preferable that the concave non-perforated portion 31 has a square shape in the metal mold processing. However, when the shape is inconvenient to form a square shape, as shown in Fig. 7, other shapes may be employed. The seventh (1) and (2) show a trapezoidal example, and the same figures (3) and (4) are two-sided. The same figure (5) is a semi-circular example. Regarding the shape other than the wedge-shaped trapezoid shown in Fig. 1 (1), since any shape is compared with the square shape, the suppression force for suppressing the floating of the chip 15 is weakened, for example, the 7th circle (3) In the longitudinal direction side edge portion of the elongated opening portion 3〇, the length of the non-perforated portion 31 that has been recessed is set to be the ratio #2; ^ To ensure the friction between the lower die 12 and the non-perforated portion 31 of the chip 15, the side edge portion of the longitudinal direction forming the elongated opening portion 3 is punctured by: 31 or (8). ~120. In the case of a straight line or a curved wire in the range, it is preferable to provide the concave non-perforated portion 31. When the non-perforated 31 is a triangle as shown in the seventh ® (3), the angle _ 3 and the angle of the material are both E6 (r ~12 "The straight line is better. More) Zhengtai: , 1295149 [Embodiment 3] =8 shows the soft perforation processing in the perforation of the flexible printed circuit board to form a Baoqu - as shown in Figure 8 (1) As shown in the figure, the lower die punch hole 12a is formed in a gentle curved shape, and one or a plurality of convex through-hole portions 41 are provided in the longitudinal direction of the elongated opening portion 4'' of the curved punch hole 12a. It is preferable that the perforated portion 41 of the upper side of the town or the convex portion is formed in a square shape in the metal mold processing. However, similarly to the case of the first embodiment, the trapezoidal, triangular, sickle-shaped, semi-m-shaped, etc. may be used. shape. Further, the length of the perforated portion 41 and the outer ridge of the unicorn portion 42 with respect to the longitudinal direction are also the same as those of the first embodiment. As shown in the figure, by making the convex perforated portion 41 = the shape of the curved shape of the mouth portion 4G, the cake is more important in suppressing the reduction of 15 rolls. Further, as shown in the eighth (2), in the case where the elongated opening portion 40 is curved and straight, and the portion is in the form of a _ _ _ _ _ _ _ _ _ _ _ 40 At a position near the center of the starting point of the portion 43 and on one side or both sides of the side edge portion 42, one or a plurality of convex perforated portions 4 are connected to each other, and (4) 15 windings can be effectively suppressed. [Embodiment 4] Fig. 9 is a view showing another example of the punching process of the elongated opening portion in which the flexible printed circuit board is formed with the hip-curvature, and as shown in Fig. 9 (1), the punching hole i2a of the lower mold 12 is A gentle curve having a width dimension wider than that of the third embodiment is formed, and j or a plurality of concaves are connected in the vicinity of the central portion in the longitudinal direction of the elongated opening portion 50 of the curved punch hole 12a. A non-perforated portion 51. 15 1295149 (Shuang) stop this i is not concave in the non-perforated portion 51 in the metal mold plus the crown of the square shape is better, but also in the case of the embodiment can be trapezoidal, triangular, recorded, Other shapes such as semicircles. Further, the length of the non-perforated portion 51, the outer angle of the side edge portion 52 with respect to the longitudinal direction, and the like are also the same as those of the first embodiment. As shown in the figure, by forming the concave non-perforated portion 51 in advance on the outer side of the curved thin mouth portion 5G, the suppression of the 15 winding is more effective. Then, as shown in Fig. 9 (2), when the elongated opening 5 is bent and the straight portion is in the shape of the curved portion, the both ends of the elongated opening 50 and the other curved portion 53 are formed. At a position near the center of the starting point and on one side or both sides of the side edge portion 52, j 4 solid or a plurality of concave non-perforated portions 51 are respectively connected to each other, so that it is effective in suppressing the rolling of the chip 15 . Further, various changes can be made in the present invention without departing from the spirit and scope of the invention, and the invention may be practiced otherwise. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows a first embodiment of a perforated process for a flexible printed circuit board according to the present invention, which is a plane circle in which the elongated opening portion is formed by punching the processed chip. [Fig. 2] is an enlarged view of a portion surrounded by a broken line A of Fig. 1. [Third] is a longitudinal cross-sectional view showing the behavior of the chips in the lower mold in the X-X line portion of Fig. 2 . [Fourth Circle] (1) to (6) show the plan view of the shape of the convex portion of the convex portion of the first embodiment. 1295149 ^_______ I η : L2i ::! ΪΓ 关 关 关 关 关 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性An enlarged view of a portion surrounded by a broken line C of Fig. 5, in which the opening portion is both punctured and processed. Various shapes of the job plane. _Non-hole 邛 之 [============================================================================================= A plan view of the inner lower mold. </ RTI> The perforation of the flexible printed circuit board of the present invention is added, and '() to (2) are plan views of the lower die which are bent and slender and processed. Fig. 2 is a longitudinal sectional view showing a schematic structure of a conventional perforated mold. The circuit shows a longitudinal section of the dental hole processing mold device of the flexible printing plate of the perforated mold shown in Fig. 1 . [Fig. 12] is a longitudinal sectional view showing a step of a perforating die device shown in Fig. 2. [Fig. 13] is a longitudinal sectional view showing a perforating force die-mold device shown in the seventh item. One person - [Fig. 14] is a longitudinal section showing the behavior of the plate in the lower die when the stroke of the punch is short. #,,, [Fifteenth Figure] shows the behavior of the swarf in the lower die when the length of the elongated opening is longer than the width dimension, (1) is a plan view, and 2) A cross-sectional view of the γ-γ line of the system (1). 17 _ -T" "Foot one i# ^ 1295149 Ben 2 a ?": (more) original [main component symbol description] ll·····上模12.....lower die 12a....punch hole 12b... Cone portion 13 ... punching punch 14 ... flexible printed circuit board 15 ... swarf 20, 30 ... elongated opening 21, 3l · · convex perforated portion 22, 32 ... side Edge portion 40, 50... elongated opening portion 41, 51... concave non-perforated portion 42, 52... side edge portion 43, 53 ... sound portion 18