JPH01258486A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH01258486A JPH01258486A JP8506088A JP8506088A JPH01258486A JP H01258486 A JPH01258486 A JP H01258486A JP 8506088 A JP8506088 A JP 8506088A JP 8506088 A JP8506088 A JP 8506088A JP H01258486 A JPH01258486 A JP H01258486A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- wiring board
- cutting
- dummy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 abstract description 10
- 238000005520 cutting process Methods 0.000 abstract description 6
- 238000004080 punching Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Details Of Cutting Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は１分割溝部の抜きかすをもとにもどすいわゆる
ブツシュパックを利用したプリント配線基板の製造方法
に係り、とくに抜きかすを除去するのに好適なプリント
配線基板の製造方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a printed wiring board using a so-called bush pack for returning the punching debris from the one-divided groove, and in particular to a method for removing punching debris. The present invention relates to a method of manufacturing a printed wiring board suitable for.
従来１分割溝部の抜きかすをもとにもどすいわゆるブツ
シュパックについては、たとえば１日刊工業新聞社発行
高橋幸雄著［プレス打抜きと型設計」の第２２８頁乃至
第２３０頁に記載されている。The so-called bush pack for returning the punched waste from the conventional one-divided groove is described, for example, on pages 228 to 230 of ``Press Punching and Mold Design'' by Yukio Takahashi, published by Nikkan Kogyo Shimbun.
このブツシュパックを用いたプリント配線基板の製造方
法は、たとえば第５図乃至第５図に示す方法が実施され
ている。As a method of manufacturing a printed wiring board using this bush pack, for example, the method shown in FIGS. 5 to 5 is carried out.
すなわち、第３図に示すように、組立工程での自動化や
ハンドリングを容易にするため、基板ダミー部１４を設
け、かつ分割を容易にする之め、基板１の周辺にそうて
間隔をおいて複数の分割溝４′。That is, as shown in FIG. 3, in order to facilitate automation and handling in the assembly process, a board dummy part 14 is provided, and in order to facilitate division, parts are placed around the board 1 at intervals. A plurality of dividing grooves 4'.
４’ 、ｃ’ 、ｅｔ’を設けている。筐たこれら複数
の分割溝４′、枦、ｃ’、ｄ’内にははんだ工程におけ
るはんだおよびフラックス上りを防止するため、第４図
に示すように抜きかすａ 、 ｈ 、 ｃ 、 ｄ、を
嵌挿して該分割溝α′、枦、ｃ’、ｃｔを塞いでいる。4', c', et' are provided. In order to prevent solder and flux from rising during the soldering process, scraps a, h, c, and d are placed in the plurality of dividing grooves 4', holes, c', and d' of the housing, as shown in Fig. 4. It is fitted and inserted to close the dividing grooves α', ridges, c', and ct.
ついで、プリント配線板１に電子部品２を組立てたのち
、プレス分割型により、第５図に示すように、複数の分
割溝４′、枦、ｃ’、ｄ’間のつなぎ機↓を切断する方
法が実施されている。Next, after assembling the electronic component 2 on the printed wiring board 1, a press dividing die is used to cut the joints ↓ between the plurality of dividing grooves 4', ridges, c', and d', as shown in FIG. method is implemented.
上記従来技術においては、つなぎ機りを切断したとき、
基板ダミー部１４および抜きかすａ、Ｉｋ。In the above conventional technology, when the tether is cut,
Board dummy portion 14 and scraps a, Ik.
ｂ、ｄが個片となりて残る九め、これを除去するのが非
常に困難となる問題があった。There was a problem in that b and d remained as individual pieces, making it extremely difficult to remove them.
本発明の目的は、上記従来技術の問題点を解決するため
、この抜きかすを容易に除去可能とするプリント配線基
板の製造方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a printed wiring board that allows easy removal of the scraps in order to solve the problems of the prior art described above.
上記目的を達成するため１本発明のプリント配線基板の
製造方法に２いては、抜きかすと、分割溝の基板ダミー
部側端面とを互いに係合する凹凸部にて喰い付かせて、
プリント配線基板を基板ダミー部および抜きかすと分割
するものである。In order to achieve the above objects, (1) the method for manufacturing a printed wiring board according to the present invention includes: (1) making the scraps stick to the end surface of the dividing groove on the board dummy portion side at the uneven portions that engage with each other;
This is to separate a printed wiring board into a board dummy part and scraps.
上記のように、抜きかすと分割溝の基板ダミー側端面と
を互いに係合する凹凸部にて喰い付かせて両者を一体化
しているため、抜きかすをプレス分割型により容易に取
り出すことができる。As mentioned above, the scraps and the end surface of the dividing groove on the board dummy side are made to stick together at the uneven parts that engage with each other and are integrated, so the scraps can be easily taken out by the press dividing mold. .
以下、本発明の一実施例を示す第１図および第２図によ
り説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be explained below with reference to FIGS. 1 and 2.
第１図に示すように分割溝シｔ 、１ｐ 、、′ｊ’の
基板ダミー部１Ｇ側端面と抜きかナシ、ｆ、ｙ、Ａとに
は互いに係合する凹部ｉ′と凸部ｉとが形成されている
。As shown in FIG. 1, the end faces of the dividing grooves t, 1p, . is formed.
そのため、第２図に示すように、プリント配線基板１上
に電子部品２を組立てたのち、プリント配線基板１を基
板ダミー部１Ｇと分割するさい、複数の抜きかす／、
、 ｆ 、 ｙ 、 Ｉはそれぞれ一対の凹部ｊ′と凸
部ｊとにより係合した状態で喰い付かせて基板ダミー部
１Ｇと一体化しているため、つなぎ機りを切断したとき
、複数の抜きかす＜、ｆ、ｙ。Therefore, as shown in FIG. 2, after assembling the electronic components 2 on the printed wiring board 1, when dividing the printed wiring board 1 into the board dummy part 1G, a plurality of scraps /,
, f, y, and I are integrated with the board dummy part 1G by being engaged with a pair of concave parts j' and convex parts j, so that when cutting the splicing machine, there will be multiple extractions. Kasu <, f, y.
ｌをプリント配線基板１かも容易に除去することができ
る。The printed wiring board 1 can also be easily removed.
本発明によれば、プレス分割後の抜きかすが基板ダミー
部に喰いつき、一体になっているため。According to the present invention, the scraps after press separation bite into the board dummy part and become integrated.
抜きかすをプリント配線基板から容易に除去することが
できる。The scraps can be easily removed from the printed wiring board.
第１図は本発明の一実施例であるプリント配線基板の製
造方法を示す斜視図、第２図はプリン配線基板を抜きか
すおよび基板ダミー部と分割た状態を示す斜視図、第３
図は従来のプリント１線基板の製造方法を示す斜視図、
第４図は第３１のＡ−Ａ断面図、第５図はプリント配線
基板を」きかすおよび基板ダミー部と分割した状態を示
゛斜視図である。
１・・・プリント配線基板。
１４・・・基板ダミー部、
ａ’ 、４’ 、 ｃ’ 、ｃｌ’ 、４’ 、／！’
、 ｙ’ 、Ｊ’ −分割溝。
’ ＊ ’ ＊ ’ ＊ ｃｔ＠ ’ ａ ｆ＃ ｊ’
＊ ’ ”’抜きかす。
ル・・・つなぎ機、 ２・・・電子部品。FIG. 1 is a perspective view showing a method for manufacturing a printed wiring board according to an embodiment of the present invention, FIG. 2 is a perspective view showing a printed wiring board separated into scraps and a board dummy part, and FIG.
The figure is a perspective view showing a conventional method of manufacturing a printed one-line board.
FIG. 4 is a sectional view taken along line 31, and FIG. 5 is a perspective view showing the printed wiring board divided into a blank and a board dummy part. 1...Printed wiring board. 14... Board dummy part, a', 4', c', cl', 4', /! '
, y', J' - dividing groove. ' * ' * ' * ct@ ' a f# j'
＊ ''''Dumps. Le...Connecting machine, 2...Electronic parts.
Claims (1)
分割溝の基板ダミー部側端面とを互いに係合する凹凸部
にて喰い付かせてプリント配線基板を基板ダミー部およ
び抜きかすと分割するプリント配線基板の製造方法。1. In a method of manufacturing a printed wiring board, the printed wiring board is divided into a board dummy part and a printed wiring board by causing the scraps and the end surface of the dividing groove on the board dummy part side to bite at the uneven parts that engage with each other. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8506088A JPH01258486A (en) | 1988-04-08 | 1988-04-08 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8506088A JPH01258486A (en) | 1988-04-08 | 1988-04-08 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01258486A true JPH01258486A (en) | 1989-10-16 |
Family
ID=13848093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8506088A Pending JPH01258486A (en) | 1988-04-08 | 1988-04-08 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01258486A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006218566A (en) * | 2005-02-09 | 2006-08-24 | Nippon Mektron Ltd | Punching method of flexible printed circuit board |
-
1988
- 1988-04-08 JP JP8506088A patent/JPH01258486A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006218566A (en) * | 2005-02-09 | 2006-08-24 | Nippon Mektron Ltd | Punching method of flexible printed circuit board |
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