JPS63274193A - Manufacture of printed board - Google Patents

Abstract

PURPOSE:To prevent the dropping of a removed piece from a narrow groove by the heat of soldering by half-cutting both the ends of the narrow groove provided along the dividing position of a printed board integrated with a plurality of the printed boards and by recessing the center of the removed piece downwards from both the ends. CONSTITUTION:Two grooves (f) and three connecting bridges (g) are formed along the dividing position of a printed board 1 integrated with two after press- cutting and holes (e) for inserting parts are formed on each printed board 1a, 1b. The removed piece (d) of the above-mentioned narrow groove (f) is so formed that both the ends of the piece are made to have an inclined surface (h) inclined downwards toward the center (i) and the center (i) which connects both the ends to the inclined surfaces (h) is recessed downwards than the above- mentioned both the ends. The above-mentioned removed piece (d) is also half-cut at both the ends and is prevented from dropping from the narrow groove (f). When the connecting bridge (g) is cut after soldering, the two printed boards 1a, 1b are separated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a printed circuit board, and particularly to a method of manufacturing a printed circuit board suitable for dividing a plurality of integrated printed circuit boards.

[Conventional technology]

Conventionally, when manufacturing printed circuit boards, in order to improve productivity, the method used was to integrate multiple printed circuit boards, assemble electronic components on each printed circuit board, apply flux and solder, and then divide the multiple printed circuit boards. has been done.

Furthermore, conventionally, when dividing the plurality of printed circuit boards,
In order to facilitate this work, for example, as shown in Fig. 4, two printed circuit boards 1a and 1b each having a component insertion hole e are formed with narrow grooves f spaced apart at the dividing positions. is being implemented.

However, in the above configuration, if electronic components (not shown) are automatically assembled into the component insertion hole 〇 in the next step, and flux (not shown) and soldering (not shown) are performed, There is a risk that flux and solder may come up from the narrow grooves f onto the printed circuit boards 1a and lb.

Therefore, in order to solve the above problem, conventionally, for example,
Bushback punching is proposed as described on pages 228 to 230 of "Press Punching and Mold Design" by Yukio Takahashi, published by Nikkan Kogyo Shimbun.

As described in page 229 and FIG. 241 of the same page of the above-mentioned document, this bush-back removal is a method of pushing back the scraps forming the narrow grooves into the narrow grooves, and is not described in the above-mentioned document. However, when dividing a plurality of materials, it is thought that the portions (g in Fig. 4) connecting the plurality of materials at both ends of the scraps are cut.

[Problem that the invention seeks to solve]

In order to eliminate the above-mentioned bushback, the second part of the above-mentioned document
As described on page 30, it is necessary to reduce the clearance between the narrow groove and the scraps.

Therefore, when the material is made of metal, its elasticity is small, so there is little elongation or warping of the material that occurs when scraps are punched back into narrow grooves, but the present invention is applicable. For example, when glass epoxy material is used for printed circuit boards, the elasticity of the material is relatively large, so when the scraps are pushed back into the narrow grooves, the printed circuit board stretches a lot, causing electronic problems. The intervals between the insertion holes of the components become larger, and the warpage of the printed circuit board also becomes larger.

Therefore, when automatically inserting an electronic component into a component insertion hole, the automatic insertion rate decreases.

Furthermore, if the scraps are not strongly pushed into the narrow grooves, the heat during soldering may cause the scraps to be pulled out of the narrow grooves.

An object of the present invention is to provide a printed circuit board that prevents debris from coming out of the narrow grooves as in the prior art, and that also reduces the change in the interval between component insertion holes and the warpage of the printed circuit board. The purpose is to provide a manufacturing method.

[Means for Solving Problem c] The above object is to provide a printed circuit board manufacturing method in which electronic components are assembled on each of a plurality of integrated printed circuit boards, and then the plurality of printed circuit boards are divided. Half-cut both ends of the slotted scraps installed at the dividing positions of the printed circuit board, and form an inclined surface that slopes downward toward the center, and cut the center part at both ends. By making a depression downward from the tip, and after assembling electronic components on each of the printed circuit boards, cutting the portions connecting the plurality of printed circuit boards at both ends of the narrow groove to divide the plurality of printed circuit boards. achieved.

[For production]

The present invention involves half-cutting both ends of a thin groove installed at the dividing position of a printed circuit board that integrates a plurality of circuit boards, and forming an inclined surface that slopes downward toward the center at both ends. The center part is depressed below the tips of both ends, and the scraps are pulled out from the thin grooves on both sides of this slope, so it is necessary to completely remove the scraps from the printed circuit board. disappears.

Therefore, changes in the interval between the component insertion holes of the printed circuit board and warpage of the printed circuit board can be reduced.

〔Example〕

Hereinafter, FIGS. 1 to 3 showing one embodiment of the present invention will be described in detail.

As shown in Fig. 1, two grooves f and 3 are placed at the dividing position of the two integrated printed circuit boards vi1 after press punching.
each printed circuit board 1.
Component insertion holes 〇 are formed in a and 1b.

As shown in FIG. 2, the scraps d of the narrow grooves f are press-worked to form inclined surfaces sloping downward toward the center i at both ends thereof, and connect both ends to the inclined surfaces. The central portion i is recessed below the tips of both ends. Further, the scraps d are half-cut at both ends to prevent the scraps d from coming out of the narrow grooves f.

Next, when separating the two printed circuit boards 1a and Ib, as shown in FIG.
After performing soldering (not shown) and soldering (not shown), the connecting rod g is cut, and the two printed circuit boards 1a and lb are separated. Incidentally, at this time, the scrap and the tether 41g are in a connected state.

〔Effect of the invention〕

According to the present invention, the scraps are pulled out from the narrow groove.
Deformation of the interval between component insertion holes and warpage of the printed circuit board can be reduced.

[Brief explanation of drawings]

Fig. 1 is a perspective view of a printed circuit board integrally formed with two boards according to an embodiment of the present invention, Fig. 2 is a sectional view taken along the line B-B in Fig. 1, and Fig. 3 is shown in Fig. 1. FIG. 4 is a perspective view of a two-piece printed circuit board divided after electronic components are assembled, and FIG. 4 is a perspective view of a conventional two-piece printed circuit board. 1, la, lb...Printed circuit board, d...Dams, e...Component insertion hole, f...Small groove, g...Connection side, h...Slanted surface, i...・Central part, 2...Electronic parts. Agent Patent attorney Tadashi Akimoto Younger brother 4 Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] 1. In a printed circuit board manufacturing method in which electronic components are assembled on each of a plurality of integrated printed circuit boards, and then the plurality of printed circuit boards are divided, the electronic components are installed at the dividing positions of the plurality of integrated printed circuit boards. Half-cut both ends of the slotted scraps, form slopes that slope downward toward the center, and recess the center downward from the ends of each of the printed circuit boards. A method of manufacturing a printed circuit board, comprising: assembling electronic components, and then cutting portions connecting the plurality of printed circuit boards at both ends of the narrow groove to divide the plurality of printed circuit boards.