JPS63274193A - Manufacture of printed board - Google Patents
Manufacture of printed boardInfo
- Publication number
- JPS63274193A JPS63274193A JP10889087A JP10889087A JPS63274193A JP S63274193 A JPS63274193 A JP S63274193A JP 10889087 A JP10889087 A JP 10889087A JP 10889087 A JP10889087 A JP 10889087A JP S63274193 A JPS63274193 A JP S63274193A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit boards
- circuit board
- center
- narrow groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 6
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 230000004907 flux Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント基板の製造方法に係り、とくに複数
を一体化したプリント基板を分割するのに好適なプリン
ト基板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a printed circuit board, and particularly to a method of manufacturing a printed circuit board suitable for dividing a plurality of integrated printed circuit boards.
従来、プリント基板を製造する場合、生産性を向上する
ために複数のプリント基板を一体化して各プリント基板
に電子部品を組立てるとともにフラックスおよびはんだ
付けしたのち、複数のプリント基板を分割する方法が実
施されている。Conventionally, when manufacturing printed circuit boards, in order to improve productivity, the method used was to integrate multiple printed circuit boards, assemble electronic components on each printed circuit board, apply flux and solder, and then divide the multiple printed circuit boards. has been done.
また、従来、前記複数のプリント基板を分割する場合、
その作業を容易にするため、たとえば、第4図に示すよ
うにそれぞれに部品挿入穴eを有する2枚のプリント基
板1a、lbの分割位置にそうて間隔をおいて細溝fを
形成したものが実施されている。Furthermore, conventionally, when dividing the plurality of printed circuit boards,
In order to facilitate this work, for example, as shown in Fig. 4, two printed circuit boards 1a and 1b each having a component insertion hole e are formed with narrow grooves f spaced apart at the dividing positions. is being implemented.
しかるに前記のような構成では、つぎの工程で部品挿入
穴〇に電子部品(図示せず)を自動組立し、フラックス
(図示せず)およびはんだ付け(図示せず)を行なった
場合、作業中にフラックスおよびはんだ付けが細溝fか
らフラックスおよびはんだがプリント基板1a、lb上
に上がってくる恐れがある。However, in the above configuration, if electronic components (not shown) are automatically assembled into the component insertion hole 〇 in the next step, and flux (not shown) and soldering (not shown) are performed, There is a risk that flux and solder may come up from the narrow grooves f onto the printed circuit boards 1a and lb.
そこで、前記の問題を解決するため、従来、たとえば、
日刊工業新聞社発行、高橋幸雄著「プレス打抜きと型設
計」の第228頁乃至第230頁に記載されているブツ
シュバック抜きが提案されている。Therefore, in order to solve the above problem, conventionally, for example,
Bushback punching is proposed as described on pages 228 to 230 of "Press Punching and Mold Design" by Yukio Takahashi, published by Nikkan Kogyo Shimbun.
このブツシユバツク抜きは、前記文献の第229頁およ
び同頁第241図に記載されているように、細溝を形成
する抜きかすを該細溝内に押し戻す方法であって、前記
文献には記載されていないが、複数の材料を分割する場
合には、前記抜きかすの両端部の複数個の材料を連結す
る部分(第4図に示すg)を切断するものと思われる。As described in page 229 and FIG. 241 of the same page of the above-mentioned document, this bush-back removal is a method of pushing back the scraps forming the narrow grooves into the narrow grooves, and is not described in the above-mentioned document. However, when dividing a plurality of materials, it is thought that the portions (g in Fig. 4) connecting the plurality of materials at both ends of the scraps are cut.
前記のブツシュバック抜きにおいては、前記文献の第2
30頁にも記載されているように細溝と抜きかすとのク
リアランスを小さくする必要がある。In order to eliminate the above-mentioned bushback, the second part of the above-mentioned document
As described on page 30, it is necessary to reduce the clearance between the narrow groove and the scraps.
そのため材料が金属性にて形成されている場合にはその
伸縮性が小さいので、抜きかすを細溝内にブツシュバッ
ク抜きしたさいに発生する材料の伸びおよびそりは少な
いが、本発明が適用するプリント基板のようにたとえば
ガラスエポキシ材を使用する場合には、その伸縮性が比
較的大きいので、抜きかすを細溝内にブツシュバック抜
きしたさいにプリント基板が大きな伸びを発生して電子
部品の挿入穴の間隔が大きくなり、かつプリント基板の
そりも大きくなる。Therefore, when the material is made of metal, its elasticity is small, so there is little elongation or warping of the material that occurs when scraps are punched back into narrow grooves, but the present invention is applicable. For example, when glass epoxy material is used for printed circuit boards, the elasticity of the material is relatively large, so when the scraps are pushed back into the narrow grooves, the printed circuit board stretches a lot, causing electronic problems. The intervals between the insertion holes of the components become larger, and the warpage of the printed circuit board also becomes larger.
したがって、電子部品を自動的に部品挿入穴にインサー
タする場合、その自動挿入率が低下する。Therefore, when automatically inserting an electronic component into a component insertion hole, the automatic insertion rate decreases.
また、前記抜きかすが細溝内に強く押し込まれていない
場合には、はんだ付は時の熱で抜きかすが細溝内から抜
は出す恐れがある。Furthermore, if the scraps are not strongly pushed into the narrow grooves, the heat during soldering may cause the scraps to be pulled out of the narrow grooves.
本発明の目的は、前記従来技術のように細溝内から抜け
かすが抜は出すのを防止し、かつ部品挿入穴の間隔の変
化およびプリント基板のそりを少くすることを可能にし
たプリント基板の製造方法を提供することにある。An object of the present invention is to provide a printed circuit board that prevents debris from coming out of the narrow grooves as in the prior art, and that also reduces the change in the interval between component insertion holes and the warpage of the printed circuit board. The purpose is to provide a manufacturing method.
c問題点を解決するための手段〕
前記の目的は複数を一体化したプリント基板のそれぞれ
に電子部品を組立てたのち、前記複数のプリント基板を
分割するプリント基板の製造方法において、前記複数を
一体化したプリント基板の分割位置にそうて設置された
細溝の抜きかすの両端部をハーフカットし、かつその両
端部を中央部に向って下方に傾斜する傾斜面を形成する
とともに中央部を両端先端部より下方にくぼませ、前記
各プリント基板に電子部品を組立てたのち、前記細溝の
両端部の前記複数のプリント基板を連結する部分を切断
して前記複数のプリント基板を分割することによって達
成される。[Means for Solving Problem c] The above object is to provide a printed circuit board manufacturing method in which electronic components are assembled on each of a plurality of integrated printed circuit boards, and then the plurality of printed circuit boards are divided. Half-cut both ends of the slotted scraps installed at the dividing positions of the printed circuit board, and form an inclined surface that slopes downward toward the center, and cut the center part at both ends. By making a depression downward from the tip, and after assembling electronic components on each of the printed circuit boards, cutting the portions connecting the plurality of printed circuit boards at both ends of the narrow groove to divide the plurality of printed circuit boards. achieved.
本発明は、複数を一体化したプリント基板の分割位置に
そうて設置された細溝の両端部をハーフカットし、かつ
その両端部に中央部に向って下方に傾斜する傾斜面を形
成するとともに中央部を両端先端部より下方にくぼませ
て、この傾斜面の両側面で抜きかすが細溝内から抜き出
しに<<シているので、抜きかすを完全にプリント基板
にブツシュバック抜きをする必要がなくなる。The present invention involves half-cutting both ends of a thin groove installed at the dividing position of a printed circuit board that integrates a plurality of circuit boards, and forming an inclined surface that slopes downward toward the center at both ends. The center part is depressed below the tips of both ends, and the scraps are pulled out from the thin grooves on both sides of this slope, so it is necessary to completely remove the scraps from the printed circuit board. disappears.
したがってプリント基板の部品挿入穴の間隔の変化およ
びプリント基板のそりを減少することができる。Therefore, changes in the interval between the component insertion holes of the printed circuit board and warpage of the printed circuit board can be reduced.
以下、本発明の一実施例を示す第1図乃至第3図につい
て詳細に説明する。Hereinafter, FIGS. 1 to 3 showing one embodiment of the present invention will be described in detail.
第1図に示すように、プレス抜き加工後の2枚一体化し
たプリント基vi1の分割位置にそうて2個の溝fと3
個のつなぎ棧gとを形成するとともに各プリント基板1
a、1bに部品挿入穴〇を形成している。As shown in Fig. 1, two grooves f and 3 are placed at the dividing position of the two integrated printed circuit boards vi1 after press punching.
each printed circuit board 1.
Component insertion holes 〇 are formed in a and 1b.
前記細溝fの抜きかすdは第2図に示すように、プレス
加工によりその両端部に中央部iに向って下方に傾斜す
る傾斜面りを形成するとともにこの傾斜面りに両端部を
接続する中央部iを前記両端先端部より下方にくぼませ
ている。また前記抜きかすdは、その両端部をハーフカ
ットし、この抜きかすdが前記細溝fから抜は出さない
ようにしている。As shown in FIG. 2, the scraps d of the narrow grooves f are press-worked to form inclined surfaces sloping downward toward the center i at both ends thereof, and connect both ends to the inclined surfaces. The central portion i is recessed below the tips of both ends. Further, the scraps d are half-cut at both ends to prevent the scraps d from coming out of the narrow grooves f.
つぎに2枚のプリント基板1a、Ibを分離する場合に
は、第3図に示すように、先づ部品挿入穴eに電子部品
2をインサータにより自動組立を行ない、フラックス(
図示せず)およびはんだ付け(図示せず)の作業を行な
ったのち、つなぎ棧gを切断すると、2枚のプリント基
板1a、lbが分離する。なお、このとき、抜きかすと
つなぎ41 gとは接続された状態になる。Next, when separating the two printed circuit boards 1a and Ib, as shown in FIG.
After performing soldering (not shown) and soldering (not shown), the connecting rod g is cut, and the two printed circuit boards 1a and lb are separated. Incidentally, at this time, the scrap and the tether 41g are in a connected state.
本発明によれば、抜きかすが細溝より抜は出しに<<、
部品挿入穴の間隔の変形およびプリント基板のそりを減
少することができる。According to the present invention, the scraps are pulled out from the narrow groove.
Deformation of the interval between component insertion holes and warpage of the printed circuit board can be reduced.
第1図は本発明の一実施例である2枚一体に形成された
プリント基板の斜視図、第2図は第1図のB−B矢視断
面図、第3図は第1図に示す2枚一体のプリント基板を
電子部品組立後分割した状態の斜視図、第4図は従来の
2枚を一体に形成されたプリント基板の斜視図である。
1、la、lb・・・プリント基板、d・・・抜きかす
、e・・・部品挿入穴、f・・・細溝、g・・・つなぎ
横、h・・・傾斜面、i・・・中央部、2・・・電子部
品。
代理人 弁理士 秋 本 正 実
弟4
第1図
第2図
第3図Fig. 1 is a perspective view of a printed circuit board integrally formed with two boards according to an embodiment of the present invention, Fig. 2 is a sectional view taken along the line B-B in Fig. 1, and Fig. 3 is shown in Fig. 1. FIG. 4 is a perspective view of a two-piece printed circuit board divided after electronic components are assembled, and FIG. 4 is a perspective view of a conventional two-piece printed circuit board. 1, la, lb...Printed circuit board, d...Dams, e...Component insertion hole, f...Small groove, g...Connection side, h...Slanted surface, i...・Central part, 2...Electronic parts. Agent Patent attorney Tadashi Akimoto Younger brother 4 Figure 1 Figure 2 Figure 3
Claims (1)
品を組立てたのち、前記複数のプリント基板を分割する
プリント基板の製造方法において、前記複数を一体化し
たプリント基板の分割位置にそうて設置された細溝の抜
きかすの両端部をハーフカットし、かつその両端部に中
央部に向って下方に傾斜する傾斜面を形成するとともに
中央部を両端先端部より下方にくぼませ、前記各プリン
ト基板に電子部品を組立したのち、前記細溝の両端部の
前記複数のプリント基板を連結する部分を切断して前記
複数のプリント基板を分割することを特徴とするプリン
ト基板の製造方法。1. In a printed circuit board manufacturing method in which electronic components are assembled on each of a plurality of integrated printed circuit boards, and then the plurality of printed circuit boards are divided, the electronic components are installed at the dividing positions of the plurality of integrated printed circuit boards. Half-cut both ends of the slotted scraps, form slopes that slope downward toward the center, and recess the center downward from the ends of each of the printed circuit boards. A method of manufacturing a printed circuit board, comprising: assembling electronic components, and then cutting portions connecting the plurality of printed circuit boards at both ends of the narrow groove to divide the plurality of printed circuit boards.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10889087A JPS63274193A (en) | 1987-05-06 | 1987-05-06 | Manufacture of printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10889087A JPS63274193A (en) | 1987-05-06 | 1987-05-06 | Manufacture of printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63274193A true JPS63274193A (en) | 1988-11-11 |
Family
ID=14496198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10889087A Pending JPS63274193A (en) | 1987-05-06 | 1987-05-06 | Manufacture of printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63274193A (en) |
-
1987
- 1987-05-06 JP JP10889087A patent/JPS63274193A/en active Pending
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