JPH07120739B2 - Lead cutting method - Google Patents
Lead cutting methodInfo
- Publication number
- JPH07120739B2 JPH07120739B2 JP61055753A JP5575386A JPH07120739B2 JP H07120739 B2 JPH07120739 B2 JP H07120739B2 JP 61055753 A JP61055753 A JP 61055753A JP 5575386 A JP5575386 A JP 5575386A JP H07120739 B2 JPH07120739 B2 JP H07120739B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- hybrid
- cutting
- tip
- crushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005520 cutting process Methods 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子部品の外部リードの形成に関し、特にハイ
ブリッドICのリード切断成形方法に関する。Description: TECHNICAL FIELD The present invention relates to the formation of external leads for electronic components, and more particularly to a lead cutting and molding method for hybrid ICs.
従来ハイブリッドICの外部リードを形成する場合、第10
図に示すようにハイブリッドIC4のリード１を上からリ
ード押さえ14にて押さえた後、上刃13と下刃12とで切断
していた。また第８図はリード切断前のハイブリッドIC
の外形を示す平面図であり、第９図は前記第10図に示し
た従来の方式でリード切断を行った後のハイブリッドIC
の外形を示す平面図である。When forming the external leads of the conventional hybrid IC,
As shown in the figure, the lead 1 of the hybrid IC 4 was pressed from above by the lead presser 14 and then cut by the upper blade 13 and the lower blade 12. Figure 8 shows a hybrid IC before cutting the leads.
9 is a plan view showing the outer shape of the hybrid IC after cutting the leads by the conventional method shown in FIG.
3 is a plan view showing the outer shape of FIG.
上述した従来の方式を用いてリード切断を行った場合、
リード先端は直線状に切断されているため、完成された
ハイブリッドICを実際にプリント板等にセットしようと
する時、プリント板の穴にハイブリッドICのリードが入
りにくいという欠点があり、これがロボットを使った実
装を行う場合に重大な障害となっていた。When lead cutting is performed using the conventional method described above,
Since the tip of the lead is cut straight, there is a drawback that when you try to actually set the completed hybrid IC on the printed board etc., the lead of the hybrid IC is hard to enter the hole of the printed board, which is It was a serious obstacle to the implementation used.
本発明の目的はプリント板の穴にスムーズに嵌入するよ
うにリードを切断成形する方法を提供することにある。An object of the present invention is to provide a method of cutting and forming leads so that they are fitted smoothly into the holes of the printed board.
前記目的を達成するため、本発明に係るリードの切断成
形方法は、ハイブリッドIC製造の最終工程として、内部
配線及び外装の完了したハイブリッドICの外部リードに
切断工程と押潰工程とを行い、ハイブリッドICに設けた
角状リードの尖端をほぼ錐状に加工するリードの切断成
形方法であって、 切断工程は、ハイブリッドICに設けた角状リードの面側
縁を尖端にかけて斜めにくさび状に切欠く処理であり、 押潰工程は、切断工程に引続いてくさび状に斜めに切欠
れたリードの尖端の側縁と直交する方向の面を先端にか
けて斜めに押し潰し、リード先端をほぼ錐状に成形加工
する処理である。In order to achieve the above-mentioned object, the lead cutting and molding method according to the present invention performs a cutting step and a crushing step on an external lead of a hybrid IC whose internal wiring and exterior are completed, as a final step of manufacturing a hybrid IC. This is a lead cutting and shaping method in which the tip of the rectangular lead provided on the IC is processed into a substantially conical shape.The cutting step is performed by cutting the side edge of the square lead provided on the hybrid IC diagonally into a wedge shape. The crushing process is a crushing process.The crushing process is performed by squeezing the surface of the lead, which was cut out diagonally in a wedge shape following the cutting process, in a direction orthogonal to the side edge of the tip, and crushing the lead diagonally. It is a process of forming into.
以下、本発明の一実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図において、リード切断成形前のハイブリッドIC4
は切断型のダイ５上にセットされ、のこぎり歯状のポン
チ６が下降することによりまずハイブリッドIC4に設け
た角状リード１の両側縁を先端にかけて斜めに切欠き、
リード端をＶ形に成形する（第２図）。尚ダイ５上にセ
ットする時のリード切断成形前のハイブリッドICの位置
出しは例えばタイバー２に設けられた治具穴３を切断型
に設けたピンでガイドすることにより行う（ピンは図示
省略）。また第４図に示すリード１の先端にはＲが設け
られているが、これは例えば第１図のポンチ６及びダイ
５のリード先端に対応する部分をＲ加工することにより
可能となる。こうすることにより、ポンチ６及びダイ５
の加工が容易になるとともにポンチ６及びダイ５の寿命
を長くすることが可能である。さらにポンチ６及びダイ
５の加工を容易ならしめるために第３図に示すリード１
の側縁ａとｂを２回に分けて別々に切欠くことも可能で
ある。この場合、２回に分けてリード切断をするため、
前記の方法によりやや能率は悪くなる。次に第５図にお
いて、側縁と直交するハイブリッドIC4の下面を下型リ
ード押さえ７上にセットし、上型リード押さえ８でリー
ド１の上面を押さえた後、対をなす上型10及び下型９に
よりハイブリッドIC4の両面を先端にかけて斜めに押し
潰してリード尖端をほぼ錐状に成形加工する（第７
図）。In Fig. 1, hybrid IC4 before lead cutting and molding
Is set on the cutting die 5, and the saw tooth-shaped punch 6 descends to cut out diagonally from the side edges of the square lead 1 provided on the hybrid IC 4 to the tip,
The lead end is formed into a V shape (Fig. 2). Positioning of the hybrid IC before lead cutting and molding when set on the die 5 is performed by, for example, guiding the jig hole 3 provided in the tie bar 2 with a pin provided in the cutting die (pin is not shown). . Further, the lead 1 shown in FIG. 4 is provided with an R at the tip, but this can be done, for example, by processing the portion of the punch 6 and the die 5 corresponding to the lead tip of FIG. By doing this, punch 6 and die 5
Can be easily processed and the life of the punch 6 and the die 5 can be extended. Further, in order to facilitate the processing of the punch 6 and the die 5, the lead 1 shown in FIG.
It is also possible to divide the side edges a and b into two and cut them separately. In this case, since the lead is cut in two times,
The above method causes a little inefficiency. Next, referring to FIG. 5, the lower surface of the hybrid IC 4 orthogonal to the side edge is set on the lower die lead retainer 7, and the upper die lead retainer 8 is used to retain the upper surface of the lead 1. The both ends of the hybrid IC 4 are squeezed diagonally with the mold 9 to the tip to form the lead tip into a substantially conical shape (7th step).
Figure).
尚、第６図に前記方式によって潰し加工されたリード先
端の形状を詳細に図示してあるが、リード１の先端には
潰し加工による 11が発生する。この 11は潰し率（Ｔ−ｔ）/T×100（％）が大きいほど発生
量も多くなるため、潰し率はあまり大きくはできない。
また小さすぎては本来の効果が出ない。従って、潰し率
（Ｔ−ｔ）/T×100（％）は適切に設定する必要があ
り、通常の板厚Ｔが0.25〜0.5mm程度のハイブリッドIC
では50〜60％程度が良い。また第３図と第４図のΘ及び
第４図のＲに関しては、通常のリードの幅が0.5mm程度
のハイブリッドICでは、Θは45〜90度、Ｒは0.1mm程度
が適切である。Although the shape of the lead tip crushed by the above method is shown in detail in FIG. 6, the tip of the lead 1 is crushed. 11 occurs. this For No. 11, the larger the crushing rate (T−t) / T × 100 (%), the greater the amount of generation, so the crushing rate cannot be made too large.
If it is too small, the original effect will not be obtained. Therefore, it is necessary to properly set the crush rate (T-t) / T x 100 (%), and a hybrid IC with a normal plate thickness T of about 0.25 to 0.5 mm.
Then, about 50-60% is good. Regarding Θ in FIGS. 3 and 4, and R in FIG. 4, it is appropriate that Θ is 45 to 90 degrees and R is about 0.1 mm in a normal hybrid IC having a lead width of about 0.5 mm.
以上説明したように本発明はハイブリッドICのリード先
端の加工に際し、両側縁を斜め方向に切断する工程と、
上下面を押し潰す工程とを連続して行うことにより、リ
ード先端をほぼ錐状に加工するため、成形加工の自動化
が容易であり、ロボットを用いてハイブリッドICをプリ
ント板などに実装する場合にリード先端のほぼ錐状にな
った部分をガイドとして容易にプリント板の孔内に挿入
することができる効果を有するものである。As described above, the present invention, when processing the tip of the lead of the hybrid IC, a step of cutting both side edges in an oblique direction,
By continuously performing the process of crushing the upper and lower surfaces, the lead tip is processed into a substantially conical shape, which makes it easy to automate the molding process, and when mounting a hybrid IC on a printed circuit board using a robot. It has an effect that it can be easily inserted into the hole of the printed board by using the substantially pyramidal portion of the lead tip as a guide.
第１図は本発明の一実施例のリード切断時のリードと切
断型の配置関係を示す平面図、第２図は上記実施例によ
ってリード切断を行った後のハイブリッドICの外形を示
す平面図、第３図は第２図のリード先端の拡大図、第４
図はリード先端が円弧状になるように切断型の一部にＲ
加工を施した場合の切断後のリード先端を示す拡大図、
第５図は本発明の一実施例のリード先端を厚さ方向から
潰し加工を施す時の状態を示す側断面図、第６図は上記
実施例によって切断加工及び潰し加工を行った後のハイ
ブリッドICのリード先端を拡大図示した側面図、第７図
はリード先端の円弧状の切断及び厚さ方向からの潰し加
工を行った後のハイブリッドICを示す斜視図、第８図は
リード切断前のハイブリッドICの外形を示す平面図、第
９図は従来の方式でリード切断を行った後のハイブリッ
ドICの外形を示す平面図、第10図は従来の方式によるリ
ード切断時の状態を示す側断面図である。 １……リード、２……タイバー ３……治具穴、４……ハイブリッドIC ５……ダイ、６……ポンチ ７……下型リード押さえ、８……上型リード押さえ ９……下型、10……上型 11…… 、12……下刃 13……上刃、14……リード押さえFIG. 1 is a plan view showing an arrangement relationship between a lead and a cutting die at the time of cutting a lead according to an embodiment of the present invention, and FIG. 2 is a plan view showing an outer shape of a hybrid IC after the lead is cut according to the above embodiment. 3 is an enlarged view of the tip of the lead shown in FIG. 2, 4
The figure shows a part of the cutting die with R
An enlarged view showing the tip of the lead after cutting when processing is applied,
FIG. 5 is a side sectional view showing a state in which the tip of the lead of one embodiment of the present invention is crushed from the thickness direction, and FIG. 6 is a hybrid after cutting and crushing according to the above-mentioned embodiment. FIG. 7 is an enlarged side view of the lead tip of the IC. FIG. 7 is a perspective view showing the hybrid IC after the lead tip is cut in an arc shape and crushed from the thickness direction. FIG. 9 is a plan view showing the outer shape of the hybrid IC, FIG. 9 is a plan view showing the outer shape of the hybrid IC after the leads are cut by the conventional method, and FIG. 10 is a side section showing a state when the leads are cut by the conventional method. It is a figure. 1 ... Lead, 2 ... Tie bar 3 ... Jig hole, 4 ... Hybrid IC 5 ... Die, 6 ... Punch 7 ... Lower die lead retainer, 8 ... Upper die lead retainer 9 ... Lower die , 10 …… Upper mold 11 …… , 12 …… Lower blade 13 …… Upper blade, 14 …… Lead retainer
Claims (1)
部配線及び外装の完了したハイブリッドICの外部リード
に切断工程と押潰工程とを行い、ハイブリッドICに設け
た角状リードの尖端をほぼ錐状に加工するリードの切断
成形方法であって、 切断工程は、ハイブリッドICに設けた角状リードの面側
縁を尖端にかけて斜めにくさび状に切欠く処理であり、 押潰工程は、切断工程に引続いてくさび状に斜めに切欠
れたリードの尖端の側縁と直交する方向の面を尖端にか
けて斜めに押し潰し、リード先端をほぼ錐状に成形加工
する処理であることを特徴とするリードの切断成形方
法。1. As a final step of manufacturing a hybrid IC, a cutting step and a crushing step are performed on an external lead of the hybrid IC whose internal wiring and outer packaging are completed, and a tip of a rectangular lead provided on the hybrid IC is formed into a substantially conical shape. This is a method of cutting and forming a lead that is processed into a cutting process.The cutting process is a process in which the side edge of the square lead provided in the hybrid IC is cut into a wedge shape diagonally from the pointed end to the crushing process. Subsequently, the lead is characterized in that it is a process of forming the tip of the lead into a substantially conical shape by crushing the surface of the lead, which is cut out in a wedge shape obliquely, in a direction orthogonal to the side edge of the tip and crushing it diagonally. Cutting method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61055753A JPH07120739B2 (en) | 1986-03-13 | 1986-03-13 | Lead cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61055753A JPH07120739B2 (en) | 1986-03-13 | 1986-03-13 | Lead cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62213146A JPS62213146A (en) | 1987-09-19 |
| JPH07120739B2 true JPH07120739B2 (en) | 1995-12-20 |
Family
ID=13007601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61055753A Expired - Lifetime JPH07120739B2 (en) | 1986-03-13 | 1986-03-13 | Lead cutting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07120739B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4830768B2 (en) * | 2006-05-10 | 2011-12-07 | 日亜化学工業株式会社 | Semiconductor light emitting device and method for manufacturing semiconductor light emitting device |
| CN113843371B (en) * | 2021-09-29 | 2023-06-13 | 安徽世林照明股份有限公司 | Electronic element pin flattening process and equipment thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62104457U (en) * | 1985-08-21 | 1987-07-03 |
-
1986
- 1986-03-13 JP JP61055753A patent/JPH07120739B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62213146A (en) | 1987-09-19 |
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