JP2514858Y2 - Resin burr removal device - Google Patents
Resin burr removal deviceInfo
- Publication number
- JP2514858Y2 JP2514858Y2 JP1988156229U JP15622988U JP2514858Y2 JP 2514858 Y2 JP2514858 Y2 JP 2514858Y2 JP 1988156229 U JP1988156229 U JP 1988156229U JP 15622988 U JP15622988 U JP 15622988U JP 2514858 Y2 JP2514858 Y2 JP 2514858Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin burr
- resin
- pin
- lead frame
- burr
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Nonmetal Cutting Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】 （産業上の利用分野） 本考案は、樹脂バリ除去装置に関し、特に電子部品の
モールド外装を形成した際に生じる樹脂バリを除去しう
る樹脂バリ除去装置に関する。TECHNICAL FIELD The present invention relates to a resin burr removing apparatus, and more particularly to a resin burr removing apparatus capable of removing a resin burr generated when a mold exterior of an electronic component is formed.
（従来の技術） 電子部品は、例えば熱硬化性樹脂や熱可塑性樹脂をモ
ールドして外装を形成している。(Prior Art) An electronic component has an exterior formed by molding a thermosetting resin or a thermoplastic resin, for example.
電子部品にモールド外装を形成するには、一般的に素
子をリードフレームに接続し、このリードフレームを金
型内にセットし、熱硬化性樹脂等を金型内に注入して行
なう。In order to form a mold exterior on an electronic component, generally, an element is connected to a lead frame, the lead frame is set in a mold, and a thermosetting resin or the like is injected into the mold.
この場合、第４図に示す通り、リードフレーム21に形
成された打抜き孔22に樹脂バリ23が生じる。従来、この
樹脂バリ23を、先端が平坦なピンを押圧して除去してい
る。In this case, as shown in FIG. 4, a resin burr 23 is formed in the punching hole 22 formed in the lead frame 21. Conventionally, the resin burr 23 is removed by pressing a pin having a flat tip.
（発明が解決しようとする課題） しかし、リードフレーム21には半田メッキ等がされて
いて、モールドの際にこのメッキの一部が溶けて樹脂バ
リ23の表面に付着する。そのために、先端が平坦なピン
24で樹脂バリ23を押圧すると、第５図（イ）及び（ロ）
に示す通り、樹脂バリ23はメッキに引かれて電子部品25
よりも幅が狭く電子部品25の端子26となる部品に付着す
る欠点があった。(Problems to be Solved by the Invention) However, since the lead frame 21 is plated with solder or the like, a part of this plating is melted and adhered to the surface of the resin burr 23 during molding. Therefore, a pin with a flat tip
When the resin burr 23 is pressed by 24, it is shown in Fig. 5 (a) and (b).
As shown in, the resin burr 23 is pulled by the plating and the electronic component 25
The width of the electronic component 25 is narrower than that of the electronic component 25, and there is a drawback that the electronic component 25 adheres to the component that becomes the terminal 26.
本考案の目的は、以上の欠点を改良し、樹脂バリを確
実に除去しうる樹脂バリ除去装置を提供するものであ
る。An object of the present invention is to provide a resin burr removing device which can improve the above drawbacks and can reliably remove resin burr.
（課題を解決するための手段） 本考案は、上記の目的を達成するために、素子をリー
ドフレームに接続した状態で樹脂モールドにより外装を
形成したときに生じる樹脂バリを、ピンを押圧すること
によって除去しうる樹脂バリ除去装置において、先端の
中央部が窪み両側が尖った鋭角で、その尖った部分の一
方が樹脂バリの端子により近い方に押圧されるピンを有
することを特徴とする樹脂バリ除去装置を提供するもの
である。(Means for Solving the Problem) In order to achieve the above object, the present invention is to press a pin against a resin burr that occurs when an exterior is formed by resin molding with an element connected to a lead frame. In a resin burr removing device that can be removed by a resin, a resin is characterized in that the center part of the tip has a dent and the both sides have sharp angles, and one of the sharp parts has a pin that is pressed closer to the terminal of the resin burr. A deburring device is provided.
（作用） ピンの先端の両側が尖った鋭角となっていて、その尖
った部分の一方を、樹脂バリの端子を形成するリードフ
レームにより近い方に押圧することにより、樹脂バリの
表面に付着しているメッキごと樹脂バリを切断でき、樹
脂バリが端子に付着するのを防止できる。(Function) Both ends of the pin have sharp acute angles, and one of the sharp parts is attached to the surface of the resin burr by pressing it closer to the lead frame forming the terminal of the resin burr. The resin burr can be cut together with the plating, and the resin burr can be prevented from adhering to the terminals.
（実施例） 以下、本考案を実施例に基づいて説明する。(Examples) Hereinafter, the present invention will be described based on examples.
第１図において、１は樹脂バリ除去装置のコ字形のピ
ンである。ピン１の両先端２及び３は、中央が窪み両側
が尖った鋭角になっている。４は、ピン１に連結された
シャフトであり、その往復運動によりピン１を上下動で
きる。In FIG. 1, reference numeral 1 is a U-shaped pin of the resin deburring device. Both ends 2 and 3 of the pin 1 have an acute angle in which the center is hollow and both sides are sharp. Reference numeral 4 denotes a shaft connected to the pin 1, and the reciprocating motion of the shaft 4 can move the pin 1 up and down.
次に、上記実施例を用いて樹脂バリを除去する動作を
説明する。Next, the operation of removing the resin burr will be described using the above embodiment.
先ず、第２図に示す通り、ピン１の下方にモールドに
より外装を形成し、電子部品５を保持した状態のリード
フレーム６を配置する。First, as shown in FIG. 2, an exterior is formed below the pin 1 by molding, and the lead frame 6 holding the electronic component 5 is arranged.
次に、第３図に示す通り、ピン１を下方に移動し、リ
ードフレーム６の孔７の中に形成された樹脂バリ８をそ
の表面に付着したメッキごと切断し孔７から除去する。
この際、ピン１の先端２及び３の両側が尖った鋭角にな
っているため、樹脂バリ８に付着したメッキの両端を切
断でき、樹脂バリ８が端子９と反対側のリードフレーム
面10に付着することなく、樹脂バリ８を完全にリードフ
レーム６から除去できる。そのため、その後にリードフ
レーム６を搬送する際に、搬送途中でリードフレーム６
に付着した樹脂バリが搬送路に落ち、その樹脂バリのた
めに搬送できなくなったりあるいは搬送し難くなるとい
う製造時の不良を防止できる。Next, as shown in FIG. 3, the pin 1 is moved downward, and the resin burr 8 formed in the hole 7 of the lead frame 6 is cut together with the plating adhered to the surface thereof and removed from the hole 7.
At this time, since both ends of the tip 2 and 3 of the pin 1 have sharp acute angles, both ends of the plating adhered to the resin burr 8 can be cut off, and the resin burr 8 is attached to the lead frame surface 10 on the side opposite to the terminal 9. The resin burr 8 can be completely removed from the lead frame 6 without adhering. Therefore, when the lead frame 6 is subsequently transported, the lead frame 6 is
It is possible to prevent a defect at the time of manufacturing in which the resin burr adhering to the resin drops on the transfer path, and the resin burr makes the transfer impossible or difficult.
なお、端子９の幅は電子部品５の幅とほぼ同一になっ
ている。The width of the terminal 9 is almost the same as the width of the electronic component 5.
（考案の効果） 以上の通り、本考案によれば、ピンの先端の両側を鋭
角とし、その尖った部分の一方を樹脂バリの端子により
近い方に押圧することにより、除去した樹脂バリが再び
端子に付着する不良を防止しうる樹脂バリ除去装置が得
られる。(Effect of the Invention) As described above, according to the present invention, both sides of the tip of the pin are formed into an acute angle, and one of the sharpened portions is pressed closer to the terminal of the resin burr, so that the removed resin burr is again removed. It is possible to obtain a resin burr removing device that can prevent defects attached to terminals.
また、ピンの先端の他方の尖った部分によって、リー
ドフレーム面に付着しようとする樹脂バリを除去でき、
その後にリードフレームを搬送し易くでき製造時の不良
を防止できる樹脂バリ除去装置が得られる。Also, the other pointed portion of the tip of the pin can remove the resin burr that tends to adhere to the lead frame surface,
After that, it is possible to obtain a resin burr removing device which can easily carry the lead frame and prevent defects during manufacturing.
第１図は本考案の実施例の正面図、第２図及び第３図は
本考案の実施例により樹脂バリを除去する状態の正面
図、第４図はモールド後のリードフレームの断面図、第
５図（イ）及び（ロ）は従来の樹脂バリ除去装置により
樹脂バリを除去した状態の断面図及び裏面図を示す。 １…ピン、2,3…先端、６…リードフレーム、８…樹脂
バリ、９…端子。FIG. 1 is a front view of an embodiment of the present invention, FIGS. 2 and 3 are front views showing a state in which a resin burr is removed according to the embodiment of the present invention, and FIG. 4 is a sectional view of a lead frame after molding, FIGS. 5 (a) and 5 (b) show a cross-sectional view and a back view of a state in which the resin burr is removed by the conventional resin burr removing device. 1 ... Pin, 2, 3 ... Tip, 6 ... Lead frame, 8 ... Resin burr, 9 ... Terminal.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｌ 31:34 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display area // B29L 31:34
Claims (1)
脂モールドにより外装を形成したときに生じる樹脂バリ
を、ピンを押圧することによって除去しうる樹脂バリ除
去装置において、先端の中央が窪み両側が尖った鋭角
で、その尖った部分の一方が樹脂バリの端子により近い
方に押圧されるピンを有することを特徴とする樹脂バリ
除去装置。1. A resin burr removing device capable of removing a resin burr generated when an exterior is formed by a resin mold in a state where an element is connected to a lead frame by pressing a pin, in which the center of the tip is depressed and both sides are A resin deburring device having a sharp acute angle, one of which has a pin that is pressed closer to a terminal of the resin burr.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988156229U JP2514858Y2 (en) | 1988-11-30 | 1988-11-30 | Resin burr removal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988156229U JP2514858Y2 (en) | 1988-11-30 | 1988-11-30 | Resin burr removal device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0276006U JPH0276006U (en) | 1990-06-11 |
| JP2514858Y2 true JP2514858Y2 (en) | 1996-10-23 |
Family
ID=31434583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988156229U Expired - Lifetime JP2514858Y2 (en) | 1988-11-30 | 1988-11-30 | Resin burr removal device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2514858Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008001982A1 (en) * | 2006-06-26 | 2008-01-03 | M.I.Semiconductor Co., Ltd. | Apparatus and method for eliminating molding compound of semi-conductor and electronic device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5167357A (en) * | 1974-12-07 | 1976-06-10 | Toyoda Gosei Kk | TENZOPURASUCHITSUKUHAGURUMANO BARIJOKYOHOHO |
| JPS58124255A (en) * | 1982-01-21 | 1983-07-23 | Toshiba Corp | Lead frame for semiconductor device |
| JPS63107521A (en) * | 1986-10-24 | 1988-05-12 | Hitachi Ltd | Flash removing equipment |
| JPS6450454A (en) * | 1987-08-21 | 1989-02-27 | Hitachi Ltd | Manufacture of lead frame and semiconductor device |
-
1988
- 1988-11-30 JP JP1988156229U patent/JP2514858Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008001982A1 (en) * | 2006-06-26 | 2008-01-03 | M.I.Semiconductor Co., Ltd. | Apparatus and method for eliminating molding compound of semi-conductor and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0276006U (en) | 1990-06-11 |
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