JP3766206B2 - Fixing method of film substrate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor package including a film substrate using a film material as a substrate, and more particularly to a fixing method for fixing a film substrate with a frame.
[0002]
[Prior art]
Conventionally, in BGA type and CSP type semiconductor packages, ceramics, plastics, or the like are used as an insulating substrate, but a film material may be used for the purpose of reducing the thickness, weight, and cost.
[0003]
When a film material is used as a substrate, the substrate is too thin, so that it is likely to be deformed, and handling during transport and implementation of fine processing are difficult.
[0004]
Therefore, as shown in FIGS. 6 and 7, the film substrate 10 is thermocompression-bonded and fixed to a metal rectangular flat frame 20 using a thermocompression tape 30, thereby facilitating conveyance and the film substrate 10. Deformation and expansion / contraction are prevented, and manufacturing can be performed with high accuracy.
[0005]
At this time, a substantially rectangular window 40 is formed in the frame 20 at a portion where the semiconductor package is formed.
[0006]
In this way, the film substrate 10 fixed to the frame 20 is subjected to processing for conducting the front and back of the film substrate 10 at a position where the solder ball is disposed.
[0007]
Thereafter, wiring by a lead and a semiconductor element mounting portion are formed on the surface of the film substrate 10, the semiconductor element is mounted on the semiconductor element mounting portion, and the semiconductor element and the lead are connected by wire bonding or the like. The mold part 50 which seals and seals a semiconductor element, a lead | read | reed, and a wire with mold resin is formed (refer FIG. 8).
[0008]
Next, a solder ball is disposed on the back surface of the film substrate 10 and joined to the film substrate 10 by reflow, and then the film substrate 10 is cut along the outer periphery of the mold portion 50 as shown in FIG. Thus, a single BGA type or CSP type semiconductor package can be obtained.
[0009]
[Problems to be solved by the invention]
After the semiconductor package is manufactured as described above, since the film substrate is bonded to the frame after the semiconductor package is separated through a thermocompression tape, the frame and the film substrate must be completely separated. It was difficult.
[0010]
Therefore, all the frames to which the film substrate is bonded have been crushed and discarded as industrial waste.
[0011]
However, processing costs are added to the industrial waste, and a new frame must always be purchased, which increases the manufacturing cost.
[0012]
Therefore, a method that can easily recycle the frame has been desired.
[0014]
[Means for Solving the Problems]
In the present invention, in the film substrate fixing method for fixing a film substrate to be a package substrate to a frame in which a plurality of substantially rectangular windows are formed at predetermined positions and a semiconductor package forming portion is provided, by the film substrate is bored a plurality of film pushing holes tucked respectively, by placing the film substrate to the frame upper surface, press-fitting the punch from above of the film substrate to the film pushing hole, the film to form a convex portion on the substrate, it is to St. provide fixing method of the film substrate, characterized in that to fix the same projections on fitted so the frame the film substrate to the film pushing hole.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, a film material is used as the substrate of the semiconductor package, and the film material is used as the film substrate.
[0016]
Since the film material is thin, it is easily deformed and difficult to handle, and is used by being fixed to a metal rectangular flat frame.
[0017]
In the frame, a substantially rectangular window is formed in the semiconductor package forming portion, and a plurality of film pushing holes are formed in predetermined positions on the periphery of the frame.
[0018]
A film substrate is mounted on the upper surface of the frame, and a film substrate is pushed into the film pushing hole by press-fitting a punch into the film pushing hole from above the film substrate.
[0019]
The punch has a substantially cylindrical convex portion that is press-fitted into the film pressing hole at the tip of the punch, and the convex portion has a film pressing hole to be fitted with the film pressing hole across the film substrate. The projection is provided with dimensions that take into account the dimensions and the thickness of the film substrate.
[0020]
By pressing the convex portion into the film pressing hole, a convex portion that fits into the film pressing hole is formed on the film substrate.
[0021]
Therefore, the film substrate is fixed to the frame by fitting the convex portion formed on the film substrate into the film pressing hole formed in the frame.
[0022]
【Example】
Embodiments of the present invention will be described in detail with reference to the drawings.
[0023]
As shown in FIG. 1, a rectangular plate 3 made of metal, particularly copper, which fixes a film material to be a film substrate 1, has a substantially rectangular window 3 formed in a portion where a semiconductor package is formed, Further, a plurality of film pushing holes 4 are formed in the peripheral edge portion of the frame 2.
[0024]
Then, the film substrate 1 is placed on the upper surface of the frame 2 and, as shown in FIGS. 2 and 3, the punch 5 is press-fitted into the film pressing hole 4 from above the film substrate 1, so that the film substrate 1 becomes the film pressing hole 4 Is pushed into.
[0025]
The punch 5 is formed with a substantially cylindrical convex portion 6 which is press-fitted into the film pushing hole 4 at the tip portion thereof. The dimension of the convex portion 6 is such that the thickness of the film substrate 1 is t1, and the frame 2 Where the thickness of the film push hole 4 is A and the diameter of the film pushing hole 4 is A, the substantially cylindrical height H is H = t2, and the diameter B of the substantially cylindrical bottom circle is B = A−2 × t1.
[0026]
Accordingly, when the convex portion 6 of the punch 5 is press-fitted into the film pushing hole 4, the film substrate 1 is pushed into the film pushing hole 4 by the convex portion 6 of the punch 5, so that the film substrate 1 is stretched at the periphery of the film pushing hole 4. As a result, a convex portion 7 is formed along the convex portion 6 of the punch 5 and is pressed against the inner surface of the film pushing hole 4.
[0027]
Here, the dimension of the convex part 6 of the punch 5 for forming the convex part 7 on the film substrate 1 is not limited to the above-mentioned dimension, but the thickness t 1 of the film substrate 1 and the thickness t 2 of the frame 2. Alternatively, since the optimum value for forming the convex portion 7 differs depending on the diameter A of the film pushing hole 4, the optimum size of the convex portion 6 of the punch 5 in forming the convex portion 7 for fixing the film substrate 1 do it.
[0028]
Thereafter, when the punch 5 is pulled out, the convex portion 7 formed on the film substrate 1 together with the convex portion 6 of the punch 5 may come off from the film pushing hole 4 only by pulling the punch 5 straight up. Therefore, as shown in FIG. 4, only the punch 5 can be pulled out by pulling the punch 5 while rotating or rotating.
[0029]
As described above, as shown in FIG. 5, the film substrate 1 can be fixed to the frame 2 by forming the projections 7 that fit into the film pushing holes 4 of the frame 2 on the film substrate 1.
[0030]
At this time, since the film substrate 1 is only fixed to the frame 2 by fitting the convex portion 7 to the film pushing hole 4, the frame 7 can be simply pulled out from the film pushing hole 4 or pushed out. The film substrate 1 can be easily separated from the frame 2, and the frame 2 can be reused only by performing a simple cleaning process such as ultrasonic cleaning.
[0031]
As another embodiment, not only one kind of hole diameter of the film pushing hole 4 disposed in the frame 2 but also several kinds of hole diameters may be used properly, and not only the peripheral edge of the frame 2 but also the frame 2 is perforated. You may form between the substantially rectangular windows 3 currently provided.
[0032]
In addition, notches and recesses for positioning and direction recognition may be formed on the periphery of the frame.
[0034]
【The invention's effect】
According to the present invention, a film substrate as a package substrate is placed on the upper surface of a frame in which a film pressing hole is formed, and a punch is press-fitted into the film pressing hole from above the film substrate to form a convex portion on the film substrate. At the same time, the film substrate can be fixed to the frame without using an adhesive such as a thermocompression bonding tape by fitting the convex portion into the film pressing hole.
[0035]
Therefore, the film substrate that is no longer needed can be easily peeled off from the frame, and the frame can be reused just by performing a simple cleaning process such as ultrasonic cleaning, reducing the amount of frame purchased. Manufacturing cost can be reduced.
[0036]
Furthermore, the amount of industrial waste discharged can also be reduced.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of the present invention.
FIG. 2 is an explanatory sectional view of the present invention.
FIG. 3 is a cross-sectional explanatory view of the present invention.
FIG. 4 is an explanatory sectional view of the present invention.
FIG. 5 is a cross-sectional view of a main part of the present invention.
FIG. 6 is a conventional explanatory diagram.
FIG. 7 is an explanatory side view of the prior art.
FIG. 8 is a side view illustrating a conventional manufacturing state.
FIG. 9 is a perspective view of a conventional manufacturing state.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Film substrate 2 Frame 3 Substantially rectangular window 4 Film pushing hole 5 Punch 6 Convex part 7 Convex part

Claims (1)

In the film substrate fixing method for fixing a film substrate (1) to be a package substrate to a frame (2) provided with a semiconductor package forming portion by drilling a plurality of substantially rectangular windows (3) at predetermined positions ,
In the periphery of the frame (2), a plurality of film pressing holes (4) into which the film substrate (1) is respectively pressed are formed,
The film is placed a substrate (1) to the frame (2) upper surface, by press-fitting a punch (5) from above the film substrate (1) on the film pushing hole (4), the film substrate ( and forming a convex portion (7) 1), characterized in that fixed to the frame of the film substrate by the protrusion (7) is fitted to the film pushing hole (4) (1) (2) And fixing method of the film substrate.

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