JP2813138B2 - Manufacturing method of film substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a film substrate used when IC chips mounted on an IC card or the like are sequentially formed.

[0002]

2. Description of the Related Art Generally, an IC chip mounted on an IC card or the like is formed in a large amount sequentially by an automation process, and is usually formed using a film substrate as shown in FIG.

[0003] That is, in FIG.
After bonding a copper foil 3 on a strip-shaped plastic film 2, masking and etching are performed to form predetermined patterns 4 and 4, and a conductive plating 5 (usually gold plating) is formed on the copper foil 3. ) Is applied, and then the film 2
In addition, a plurality of holes 6 for feeding the film are formed at an equal pitch.

In the film substrate 1 formed as described above, an IC (not shown) is mounted on each of the patterns 4 and 4, and an IC chip is connected to each of the patterns by bonding. Thereafter, each IC chip is separated from the film substrate, and each is mounted on, for example, an IC card or the like.

[0005]

The above-mentioned film substrate 1
The transfer pins (not shown) of the transfer device are inserted into the plurality of holes 6 and 6, and the transfer and the stop are performed in the process of mounting the IC. In feeding the film substrate 1, the holes 6 and 6 usually have a circular shape, and a round pin is used as a feed pin to facilitate and secure the engagement between them. Film 2 is 0.1-0.2
mm, on the other hand, the feed pins are made of metal, so that the film substrate 1 is transported and stopped each time in the IC mounting process and the IC chip separating process, so that the metal feed pins are In the case of the thin film to which an external force is applied, the hole 6 is deformed, and sometimes a transport error or displacement occurs.

The present invention has been made in view of the above circumstances, and has as its object to reinforce a hole for feeding a film in a film substrate to eliminate the above-mentioned conventional drawbacks.

[0007]

[0008]

According to the present invention, a copper foil is adhered on a film, masking is performed, etching is performed to form a predetermined pattern, and a conductive plating is formed on the copper foil. Thereafter, in the method of manufacturing a film substrate for forming a plurality of holes for feeding the film in the film, the holes for feeding the film are formed in a circular shape, and the holes for feeding the film are formed. Prior to the formation of the hole, a copper foil having an area including a circular hole is left in the portion where the hole is to be formed at the time of the etching, and the hole for feeding the film is formed in a circular shape. This is a method for manufacturing a film substrate in which a copper foil is provided on a peripheral edge of a hole.

[0009]

[0010]

According to the method of manufacturing a film substrate of the present invention, a conventional copper foil is used to reinforce the hole without using a new process. Only by leaving a copper foil having an area including a circular hole in the portion at the time of the etching, a film substrate structure in which the hole is reinforced can be realized.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to an embodiment shown in FIG. Incidentally, the film substrate of this embodiment is the same as that of FIG.
4 is basically the same as that of the film substrate shown in FIG. 4, and therefore, in this embodiment, the same components as those in FIG.

In FIG. 1, a film substrate 1 is formed by bonding a copper foil 3 on a strip-shaped plastic film 2 and then performing masking and etching to form predetermined patterns 4 and 4.
Further, a conductive plating 5, in this example, gold plating, is applied on the copper foil 3, and thereafter, a plurality of holes 6, 6 for feeding the film are formed in the film 2 at an equal pitch. This is the same as the above-mentioned conventional one.

In the film substrate 1 formed as described above, an IC (not shown) is placed on each of the patterns 4 and 4, and bonding is performed.
A C chip is formed for each pattern, and thereafter, each IC chip is separated from the film substrate, and each is mounted on, for example, an IC card or the like.

In this embodiment, a copper foil is provided on the peripheral edge 6a of the film feeding holes 6, 6 formed in a circular shape.

Prior to formation of the holes 6 and 6, the copper foil 3 having an area including a circular hole at the portion where the holes 6 and 6 are to be formed remains before the holes 6 and 6 are formed. (FIG. 2), and further, the film feed holes 6,
6 is formed in a circular shape, and a copper foil 3 is provided on a peripheral edge 6a of the hole (FIG. 3).

That is, masking is performed on the area where the holes 6 and 6 are to be formed, so as to cover the area including the circular hole. Thereafter, etching is performed to remove the copper foil 3 having the area including the circular hole. It is left at the time of etching,
Then, the hole 6 for feeding the film is provided inside the remaining copper foil.
6 is formed in a circular shape, and a copper foil 3 is provided on a peripheral edge 6a of the hole.

In this embodiment, the film substrate 1
On a plastic film 2 having a width of 5 mm, a copper foil 3 shown in FIG. 2 is formed in a disk shape having a diameter of 3.5 mm.
A hole 6 having a diameter of 2.5 mm is formed, and a copper foil having a width of about 0.5 mm is provided on a peripheral edge 6a of the hole. However, this numerical value is an example, and it is needless to say that the numerical value is not limited to this.

Further, in the embodiment, the copper foil 3 shown in FIG. 2 is a disc-shaped one, and has a hole 6 formed therein and a peripheral edge 6a of the hole.
However, the copper foil 3 may be formed in a ring shape and the hole 6 may be formed inside the ring. However, in this case, since the hole 6 is formed inside the ring, processing accuracy is required.

[0019]

[0020]

According to the method of manufacturing a film substrate of the present invention, a conventional copper foil is used for etching the hole without using a new process for reinforcing the hole. Only by leaving a copper foil having an area including a circular hole in the portion to be formed at the time of the etching, a film substrate structure in which the hole is reinforced can be realized.
Therefore, since the hole is reinforced without using a new process for reinforcing the hole, a film substrate that can avoid a transport error and a displacement can be obtained at substantially the same cost as the conventional process time. It is.

[Brief description of the drawings]

FIG. 1 is a plan view showing a film substrate according to the present invention.

FIGS. 2A and 2B are views showing a portion where a film feeding hole is to be formed on a film substrate, wherein FIG. 2A is a plan view and FIG.

FIGS. 3A and 3B are views showing a portion where a film feeding hole is formed on a film substrate, wherein FIG. 3A is a plan view and FIG.

FIG. 4 is a plan view showing a conventional film substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Film board 2 Plastic film 3 Copper foil 4 Pattern 5 Plating 6 Hole 6a Peripheral edge

Claims (1)

(57) [Claims] 1. A masking method comprising the steps of: adhering a copper foil onto a film;
Performing etching and forming a predetermined pattern
Then, plating for conductivity is further performed on the copper foil,
Then, a plurality of holes for feeding the film are formed in the film.
In the method for manufacturing a film substrate to be formed, the hole for feeding the film is formed in a circular shape.
Prior to the formation of the film feeding hole,
Place a copper foil with an area that includes a circular hole
Remaining at the time of cutting, and
Hole is formed in a circular shape, and copper foil is provided on the peripheral edge of the hole.
A method for producing a film substrate.