JP3070563B2 - Tape-type semiconductor device assembling carrier and tape-type semiconductor device manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a TAB (Tape Au
BGA (Ball Gr) using tomated bonding tape
The present invention relates to a tape type semiconductor device such as an id Array) and a CSP (Chip Size Package). In particular, it relates to a method for manufacturing such a tape-type semiconductor device.

[0002]

2. Description of the Related Art Generally, when a tape-type semiconductor device is manufactured, a plurality of bare chips (semiconductor chips) are mounted on a long TAB tape on which a metal wiring pattern is formed, resin sealing of the chips by potting, and external terminals. (Continuous solder ball formation) and the like are sequentially performed while transporting a TAB tape. This method is TA
T from one reel wound with B tape to the other reel
Since the AB tape is transported, dedicated equipment and a large laying area are required. Therefore, conventionally, a long TAB tape is cut into a certain length to make a strip-shaped TAB tape,
After mounting a plurality of bare chips on the tape, there are cases where steps such as resin sealing of the chips and solder ball attachment are performed by existing equipment. FIG. 16 shows a strip-shaped TAB tape on which a plurality of bare chips are mounted.

However, a strip-shaped T as shown in FIG.
Since the AB tape 1 is a thin flexible tape, there is a problem that it is difficult to handle in the manufacturing process, that is, the handling property is poor.

Further, when the bare chip 2 is mounted on the TAB tape 1 or when the chip is sealed with a resin, the TAB tape 1 has a problem that "wrinkles" and "slack" occur. Also, if the flatness of the tape is impaired due to "wrinkles" or the positional accuracy of the metal wiring pattern on the TAB tape is reduced, solder balls cannot be attached. This is because when solder balls are mounted on the TAB tape as external terminals of the bare chip, a large number of solder balls are mounted at one time.

Accordingly, the present inventors have studied the improvement of handling properties and the removal of "wrinkles" when manufacturing a tape-type semiconductor device using a strip-shaped TAB tape. As a result, a strip-shaped TA has been developed so that it can be loaded into a magazine that is widely used for existing equipment.
The B tape was stuck on a metal frame, thereby improving the handleability and correcting "wrinkles".

[0006]

However, as a result of diligent studies, it has been found that merely sticking a strip-shaped TAB tape to a metal frame improves the handleability but does not solve the following problems. .

[0007] First, as shown in FIG.
When the outer periphery of the B tape 1 is simply pasted on the metal frame 3, a problem has occurred in that more "wrinkles" and the like are generated on the tape. The reason is that when the tape is adhered to the frame, the adhesive layer made of a thermoplastic resin provided on the tape surface is crushed and protrudes outside, which causes "wrinkles".

Therefore, there is still a problem that merely attaching the strip-shaped TAB tape to the metal frame may hinder the mounting of the solder balls as the external terminals and may reduce the dimensional accuracy of the wiring pattern. Remains.

Second, when the entire outer periphery of the strip-shaped TAB tape is attached to the metal frame, there is a problem that the recycling of the metal frame becomes difficult. The reason for this is
For example, when cutting a completed tape-type semiconductor device from a tape with high precision by dicing, the blade used for dicing is very thin and circular (diameter φ30 mm) and large.
This is because the metal frame may be cut at the time of dicing to take the width. When the recycling of the metal frame becomes difficult as described above, the secondary problem that the loss of the metal frame rebounds to the product cost as it is, which hinders cost reduction.

Third, as shown in FIG. 18, since the TAB tape 1 is bonded to the frame 3 while being heated by the heater 4, if the metal frame 3 has a larger thermal expansion coefficient than the TAB tape 1, There is a problem that "wrinkles" occur. This is because frame 3 and TAB
This is because when the tape 1 is at room temperature, the frame 3 shrinks more than the TAB tape 1.

SUMMARY OF THE INVENTION An object of the present invention is to provide a tape-type semiconductor device assembly capable of improving the handleability at the time of manufacturing a tape-type semiconductor device, eliminating manufacturing defects due to tape "wrinkling", and recyclable. It is an object of the present invention to provide a carrier for tape and a method for manufacturing a tape-type semiconductor device with high product non-stop.

[0012]

In order to achieve the above object, a first invention is a carrier for assembling a tape type semiconductor device in which a semiconductor chip is mounted on a TAB tape, wherein the carrier is a thin metal plate. And a metal frame consisting of
The TAB in a strip shape protruding inside the metal frame.
And a plurality of attachment portions for attaching a tape. According to such a configuration, the metal frame can be kept away from the outer peripheral edge of the TAB tape even when the TAB tape is bonded to the mounting portion by protruding the sticking portion inside the metal frame. Therefore, T
In the dicing step of cutting the tape-type semiconductor device completed on the AB tape from the TAB tape, the relationship that the dicer blade does not hit the metal frame can be easily realized, and the carrier can be recycled. Also, TAB
Since the tape is attached to the metal frame, the handling is greatly improved in the process of assembling the semiconductor device. Further, it is easy to cope with a magazine system widely used in existing semiconductor manufacturing apparatuses.

According to a second invention, in addition to the structure of the carrier according to the first invention, there is provided a tape-type semiconductor device assembling carrier in which the coefficient of thermal expansion of the carrier is smaller than that of the TAB tape.

When manufacturing a tape-type semiconductor device using such a carrier, first, the outer periphery of the strip-shaped TAB tape is attached to the mounting portion of the carrier while heating the carrier and the strip-shaped TAB tape. Paste the part. When the carrier and the TAB tape reach room temperature after application, the TAB tape has a larger coefficient of thermal expansion than the carrier, so the TAB tape shrinks more than the carrier, and as a result, the mounting portion of the carrier pulls the TAB tape outward. State. As a result, "wrinkles" do not occur on the tape after application.

Next, a semiconductor chip is mounted on the strip-shaped TAB tape attached to the carrier. At this time, since the TAB tape is being pulled by the mounting portion, generation of “wrinkles” due to heat during chip mounting is suppressed.

Next, the mounted semiconductor chip is sealed with a liquid resin. Also at this time, since the TAB tape is in a state of being pulled by the attachment portion, occurrence of “wrinkles” when the applied liquid resin is heated and cured can be suppressed.

Next, a plurality of solder balls serving as external terminals of the tape type semiconductor device are mounted on the strip-shaped TAB tape at a time. At this time, since the TAB tape keeps the flatness while being pulled by the mounting portion,
A plurality of solder balls are well placed.

Finally, the tape-type semiconductor device completed through the above steps is cut from the tape by dicing. At this time, since the semiconductor device is cut by dicing, the accuracy of the external dimensions of the completed tape-type semiconductor device becomes very high.

According to a third aspect of the present invention, in addition to the structure of the carrier according to the first aspect, the mounting portion is curved, and a tip portion of the mounting portion is formed flat for attaching the TAB tape. The present invention provides a tape-type semiconductor device assembling carrier. When a tape-type semiconductor device is manufactured using such a carrier, a chip mounting step, a chip sealing step, a solder ball attaching step, and a dicing step are performed in the same manner as in the manufacturing method using the carrier according to the second invention. However, in the tape attaching step in this case, the strip-shaped TA is attached to the attaching portion of the carrier while the curved attaching portion of the carrier is temporarily extended inside the metal frame.
Attach the outer periphery of the B tape. Due to this, during production,
The TAB tape can be always stretched flat.

According to a fourth aspect of the present invention, in addition to the structure of the carrier according to the first aspect of the present invention, the mounting portion is curved, and a tip of the mounting portion is bent so as to be hooked on a sprocket hole of the TAB tape. The present invention provides a tape-type semiconductor device assembling carrier. When a tape-type semiconductor device is manufactured using such a carrier, a chip mounting step, a chip sealing step, a solder ball attaching step, and a dicing step are performed in the same manner as in the manufacturing method using the carrier according to the second invention. However, in the tape mounting process in this case,
The curved mounting portion of the carrier is temporarily extended to the inside of the metal frame, the tip of the mounting portion is hooked on a sprocket hole of the strip-shaped TAB tape, and the strip-shaped TAB tape is mounted on the mounting portion of the carrier. Attach the outer periphery of. Thereby, the TAB tape can always be kept flat during the manufacturing.

[0021]

Next, embodiments of the present invention will be described with reference to the drawings.

(First Embodiment) FIG. 1 is a perspective view showing a state in which a strip-shaped tape is attached to a tape-type semiconductor device assembling carrier according to a first embodiment of the present invention. 2 is a sectional view taken along line AA of FIG.

A tape type semiconductor device assembling carrier 10 of the form shown in FIGS. 1 and 2 is used for attaching a metal frame 11 made of a thin metal plate and a strip-shaped TAB tape 1 protruding inside the metal frame 11. A plurality of mounting parts 1
And 2. A metal wiring pattern (not shown) is formed on the strip-shaped TAB tape 1 in advance. The metal frame 11 and each attaching part 12 are formed integrally. Each of the affixing portions 12 is a tape type semiconductor device (for example, BGA or C
SP) is formed at a position where the dicer blade does not hit when cutting the tape from the tape. Metal frame 11
Means that even if the TAB tape 1 is attached to the
There is a gap between the outer peripheral edge of the AB tape 1 and a position where the blade does not hit during dicing.

The coefficient of thermal expansion of the semiconductor device assembling carrier 10 is smaller than that of the strip-shaped TAB tape 1 to be attached. For example, when the base material of the strip-shaped TAB tape 1 is polyimide, copper or a 42 alloy (42Ni—Fe alloy) is selected as the material of the metal frame 11 (the coefficient of thermal expansion of the polyimide is 300 to 40).
0 ppm, coefficient of thermal expansion of 42 alloy 50 to 55 pp
m).

Next, a method of manufacturing a tape-type semiconductor device using the tape-type semiconductor device assembling carrier 10 will be described. 3 to 7 are process diagrams for explaining the manufacturing process of the tape-type semiconductor device according to the present embodiment.

First, as shown in FIG.
The tape 1 is placed on the lower heater block 13. Then, the mounting portion 12 of the tape-type semiconductor device assembling carrier 10 is aligned with the outer peripheral portion of the TAB tape 1. After that, the upper heater block 13 is lowered, and the TAB tape 1 is attached to the mounting portion 12 of the tape-type semiconductor device assembling carrier 10 while being heated by the upper and lower heater blocks 13. At this time, a thermoplastic resin layer (for example, polyimide) is formed on the TAB tape 1 as an adhesive.

Then, the carrier 10 and the TAB tape 1
Is at room temperature, the TAB tape 1 has a larger coefficient of thermal expansion than the tape-type semiconductor device assembling carrier 10, so that the TAB tape 1 contracts more than the carrier 10, and as a result, the mounting portion 12 of the carrier 10 Is pulling the TAB tape 1 outward. Therefore,
No "wrinkles" on the tape due to the adhesive.

Next, a plurality of carriers 10 to which the TAB tape 1 has been attached as described above are stored in a magazine 14 shown in FIG. The carrier 10 is taken out from the loader side magazine 14 as shown in FIG.
At 5, the bare chip 2 is mounted on the TAB tape 1. In such a chip mounting, the bare chip 2 is adhered to the TAB tape 1 by melting the thermoplastic resin on the TAB tape 1 by heat. Thereafter, a desired metal wiring pattern (not shown) on the TAB tape 1 and a surface electrode of the bare chip 2 are connected by face-down bonding.
After the bonding is completed, the carrier 10 to which the tape 1 on which the plurality of bare chips 2 are mounted is attached is stored in the magazine 14 on the unloader side.

Next, as shown in FIG. 5, a silicone-based or epoxy-based resin 17 is applied from the syringe 16 on the TAB tape 1 except for the back surface of the bare chip 2, and the side surface of the bare chip 2 is sealed. Here, the reason why the back surface of the bare chip 2 is not sealed is that the convenience of the user is provided so that the user can attach a heat radiation component as needed. In such a potting step, as in the bare chip mounting step shown in FIG. 4, one carrier 10 is taken out from the magazine on the loader side, and when the potting is completed, the carrier 10 is stored in the magazine on the unloader side. In addition, since the TAB tape 1 of the carrier 10 is pulled outward by the attachment portion 12, the occurrence of "wrinkles" when the applied liquid resin is heated and cured can be suppressed.

Next, as shown in FIG. 6, the carrier 10 is turned over, and a plurality of solder balls serving as external terminals of the tape type semiconductor device are provided on the side of the TAB tape 1 opposite to the side on which the bare chip 2 is mounted. Placed at once. Also in such a solder ball attaching process, one carrier 10 is taken out from the magazine on the loader side, and when the solder ball attaching is completed, the carrier 10 is stored in the magazine on the unloader side. In addition, since the TAB tape 1 of the carrier 10 is in a state of maintaining a flat surface without “wrinkles”, mounting of the solder balls can be easily performed.

Finally, as shown in FIG. 7, the tape-type semiconductor device 21 completed through the above-described steps is cut out of the TAB tape 1 by an ultra-thin circular blade 20 and placed on a tray 22. In such a dicing process, one carrier 10 is taken out of the magazine 14 on the loader side, and each of the completed tape-type semiconductor devices 21 is cut into a desired package outer shape. Since the metal frame 11 and the mounting portion 12 of the carrier 10 are located at positions where the blades do not hit during dicing, the carrier 10 can be reused without being damaged. In addition, a normal dicing apparatus in the semiconductor manufacturing field moves a blade while recognizing a cut portion as an image.
1. The accuracy of the outer dimensions is very high.

(Second Embodiment) FIG. 8 is a perspective view showing a state in which a strip-shaped tape is attached to a tape-type semiconductor device assembling carrier according to a second embodiment of the present invention. 9 is a cross-sectional view taken along line BB of FIG. 8, and FIG. 10 is a cross-sectional view that best illustrates a modification of the tape-type semiconductor device assembling carrier according to the second embodiment of the present invention.

A carrier 30 for assembling a tape type semiconductor device of the form shown in FIGS. 8 and 9 is for mounting a metal frame 31 made of a thin metal plate and a strip-shaped TAB tape 1 protruding inside the metal frame 31. Multiple mounting parts 32
It is composed of A metal wiring pattern is formed on the strip-shaped TAB tape 1 in advance. Metal frame 3
1 and each mounting part 32 are formed integrally. Each mounting portion 32 is curved, and a tip portion 32 of the mounting portion 32 is provided.
Only a is formed flat for attaching the TAB tape 1. In particular, the first embodiment refers to the mounting portion 32
Are different in shape. Although FIG. 9 shows a case where the distal end portion 32a of the mounting portion 32 is flat, the present invention is not limited to this, and the mounting portion 32 may have a shape as shown in FIG. That is, when the strip-shaped TAB tape 1 has a sprocket hole 33 as shown in FIG.

Each of the mounting portions 32 is formed at a location where the dicer blade does not come into contact with the completed tape-type semiconductor device when the completed tape-type semiconductor device is cut from the tape in a dicing process described later. The metal frame 31 has a T
Even if the AB tape 1 is stuck or hooked, TA
There is a gap between the outer peripheral edge of the B tape 1 and the blade is not in contact with the blade during dicing.

Next, a method of manufacturing a tape-type semiconductor device using the tape-type semiconductor device assembling carrier 30 will be described. 11 to 15 are process diagrams for explaining the manufacturing process of the tape-type semiconductor device according to the present embodiment.

First, as shown in FIG.
The B tape 1 is placed on the lower heater block 13.
Then, the leading end 32a of the mounting portion 32 of the tape-type semiconductor device assembling carrier 30 is aligned with the outer peripheral portion of the TAB tape 1. Thereafter, the upper heater block 13 is lowered, and the carrier 3 is placed between the upper and lower heater blocks 13.
0 and the TAB tape 1. At this time, the carrier 10
The curved mounting portion 32 temporarily extends inside the metal frame 31. In this state, the upper and lower heater blocks 13
Semiconductor device assembling carrier 30 while heating with
The TAB tape 1 is attached to the mounting portion 32 of the above. In addition,
On the TAB tape 1, a thermoplastic resin layer (for example, polyimide) is formed as an adhesive.

Thereafter, when the carrier 30 is taken out from between the heater blocks 13, the curved mounting portion 32 of the carrier 30 attempts to return to its original state due to its spring property, and as a result, the mounting portion 32 of the carrier 30 becomes a tension spring. Thus, the TAB tape 1 is pulled outward. Therefore, "wrinkles" due to the adhesive do not occur on the tape.

However, as shown in FIG.
When the AB tape 1 has a sprocket hole 33, the curved attachment portion 32 of the carrier 30 is temporarily extended to the inside of the metal frame 31 to oppose its spring property, and the distal end portion 32b of the attachment portion 32 is attached to the sprocket hole 33. And attach the TAB tape 1 to the carrier 30. As a result, the carrier 30 is prevented from wrinkling.
The TAB tape 1 is pulled outward by the attaching portion 32 of the above.

Next, a plurality of carriers 30 to which the TAB tape 1 has been attached as described above are stored in the magazine 14 shown in FIG. As shown in FIG. 12, one carrier 30 is taken out of the magazine 14 on the loader side, and the bare chip 2 is mounted on the tape 1 by the handler 15. In such a chip mounting, the thermoplastic resin on the TAB tape 1 is melted by heat and the bare chip 2 is attached to the TAB tape 1.
Is glued. Also at this time, since the TAB tape 1 of the carrier 30 is pulled outward by the mounting portion 32, generation of "wrinkles" due to heat at the time of chip mounting is suppressed. Thereafter, a desired metal wiring pattern (not shown) on the TAB tape 1 and a surface electrode of the bare chip 2 are connected by face-down bonding. After bonding, TAB with multiple bare chips 2 mounted
The carrier 30 to which the tape 1 is attached is stored in the magazine 14 on the unloader side.

Next, as shown in FIG.
A silicone-based or epoxy-based resin 17 is applied from the syringe 16 on the TAB tape 1 except for the back surface of the bare chip 2, and the side surface of the bare chip 2 is sealed. Here, the reason why the back surface of the bare chip 2 is not sealed is that the convenience of the user is provided so that the user can attach a heat radiation component as needed. Also in such a potting step, the carrier 30 is supplied and discharged in a magazine manner, similarly to the bare chip mounting step shown in FIG. Also, the TA of the carrier 30
Since the B tape 1 is pulled outward by the mounting portion 32, generation of “wrinkles” when the applied liquid resin is heated and cured can be suppressed.

Next, as shown in FIG.
Are turned upside down, and a plurality of solder balls serving as external terminals of the tape-type semiconductor device are mounted on the TAB tape 1 on the side opposite to the side on which the bare chip 2 is mounted. Also in such a solder ball attaching process, the carrier 30 is supplied and discharged in a magazine system. Carrier 3
Since the TAB tape 0 has a flat surface without "wrinkles", the solder balls can be easily mounted.

Finally, as shown in FIG. 15, the tape-type semiconductor device 21 completed through the above-described steps is cut from the TAB tape 1 by the circular blade 20 and placed on the tray 22. In such a dicing step, one carrier 30 is taken out of the magazine 14 on the loader side, and each of the completed tape-type semiconductor devices 21 is cut into a desired package outer shape. Since the metal frame 31 and the mounting portion 32 of the carrier 30 are located at positions where the blade does not contact during dicing, the carrier 30 can be reused without being damaged. Further, a normal dicing apparatus in the semiconductor manufacturing field moves a blade while recognizing a cut portion as an image.
Very high accuracy of external dimensions.

[0043]

According to the present invention described above, the following effects can be obtained.

According to the first and second aspects of the present invention, the tape-type semiconductor device completed on the TAB tape is formed by projecting the sticking portion for sticking the strip-shaped TAB tape inside the metal frame. In the dicing step of cutting from the metal frame, the relationship that the dicer blade does not hit the metal frame can be easily realized, so that the carrier can be recycled. Further, by attaching the TAB tape to the metal frame, the handling property is greatly improved in the process of assembling the semiconductor device. Further, the carrier can be supplied to and discharged from the manufacturing apparatus by a magazine method widely used in existing semiconductor manufacturing apparatuses.

In addition to the effects of the first and second aspects of the present invention, in the third and fourth aspects of the present invention, the difference in the coefficient of thermal expansion between the TAB tape and the carrier is particularly considered in order to eliminate "wrinkles" in the tape. The material of the TAB tape and the carrier can be freely set without performing the above.

According to the fifth aspect of the present invention, when the carrier having a larger thermal expansion coefficient than the TAB tape according to the second aspect is used and the carrier and the strip-shaped TAB tape are affixed while being heated, at room temperature, TA from carrier
The B tape shrinks, and as a result, the mounting portion of the carrier is T
The AB tape is pulled outward. This allows the TAB tape to be always stretched flat at the stage of manufacturing the tape-type semiconductor device. Therefore,
There is no production failure due to "wrinkles" of the tape.

According to the sixth aspect of the present invention, as described in the third aspect, the mounting portion is curved, and only the tip end of the mounting portion is T-shaped.
When a flat carrier is used to attach the AB tape, and the curved attachment portion is temporarily extended to the inside of the metal frame, and the outer peripheral portion of the strip-shaped TAB tape is attached to the attachment portion, the carrier Is pulling the TAB tape outward. This allows the TAB tape to be always stretched flat at the stage of manufacturing the tape-type semiconductor device. Therefore, manufacturing failure due to “wrinkles” of the tape does not occur.

According to the seventh aspect of the present invention, as described in the fourth aspect, the mounting portion is curved, and only the tip end of the mounting portion is T-shaped.
Using a carrier bent so as to be hooked on the sprocket hole of the AB tape, temporarily extend the curved mounting portion to the inside of the metal frame, hook the tip of the mounting portion on the sprocket hole of the strip-shaped TAB tape, and attach it to the mounting portion. When the outer peripheral portion of the strip-shaped TAB tape is mounted, the mounting portion of the carrier pulls the TAB tape outward. This allows the TAB tape to be always stretched flat at the stage of manufacturing the tape-type semiconductor device. Therefore, manufacturing failure due to “wrinkles” of the tape does not occur.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state in which a strip-shaped tape is attached to a tape-type semiconductor device assembling carrier according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a view showing a step of attaching a strip-shaped tape to the tape-type semiconductor device assembling carrier according to the first embodiment of the present invention.

FIG. 4 is a diagram illustrating a process of mounting a bare chip on the tape after the process illustrated in FIG. 3;

FIG. 5 is a view showing a step of potting and sealing a bare chip on a tape after the step shown in FIG. 4;

FIG. 6 is a view showing a step of placing a solder ball on the tape after the step shown in FIG. 5;

FIG. 7 is a diagram showing a step of separating the tape-type semiconductor device completed through the step shown in FIG. 6 from the tape.

FIG. 8 is a perspective view showing a state in which a strip-shaped tape is attached to a tape-type semiconductor device assembling carrier according to a second embodiment of the present invention.

FIG. 9 is a sectional view taken along line BB of FIG. 8;

FIG. 10 is a sectional view best illustrating a modification of the tape-type semiconductor device assembling carrier according to the second embodiment of the present invention.

FIG. 11 is a view showing a step of attaching a strip-shaped tape to a tape-type semiconductor device assembling carrier according to a second embodiment of the present invention.

FIG. 12 is a diagram illustrating a process of mounting a bare chip on the tape after the process illustrated in FIG. 11;

FIG. 13 is a view showing a step of potting and sealing a bare chip on a tape after the step shown in FIG. 12;

FIG. 14 is a view illustrating a step of placing a solder ball on the tape after the step illustrated in FIG. 13;

15 is a diagram illustrating a step of separating the tape-type semiconductor device completed through the step illustrated in FIG. 14 from the tape.

FIG. 16 is a plan view showing a strip-shaped tape on which a plurality of bare chips are mounted, as a conventional tape-type semiconductor device assembling carrier.

FIG. 17 is a plan view showing a case where the outer periphery of the tape of FIG. 16 is simply attached to a metal frame.

FIG. 18 is a side view illustrating a step for bonding the frame and the tape illustrated in FIG. 17;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 strip-shaped tape 2 bare chip 10, 30 tape-type semiconductor device assembling carrier 11, 31 metal frame 12, 32 mounting portion 13 heater block 14 magazine 15 handler 16 syringe 17 resin 18 ball placer 19 solder ball 20 blade 21 tape type Semiconductor device 22 Tray 32a, 32b Tip 33 Sprocket hole

Claims (7)

(57) [Claims] 1. A carrier for assembling a tape-type semiconductor device in which a semiconductor chip is mounted on a TAB tape, the carrier comprising: a metal frame formed of a thin metal plate; and a strip-shaped member protruding inside the metal frame. A carrier for assembling a tape type semiconductor device, comprising: a plurality of attachment portions for attaching the TAB tape. 2. The thermal expansion coefficient of the carrier is equal to the TA.
2. The tape-type semiconductor device assembling carrier according to claim 1, wherein the carrier is smaller than a coefficient of thermal expansion of the B tape. 3. The tape-type semiconductor device assembling carrier according to claim 1, wherein said mounting portion is curved, and a tip portion of said mounting portion is formed flat for attaching said TAB tape. 4. The tape-type semiconductor device assembling carrier according to claim 1, wherein said mounting portion is curved, and a tip portion of said mounting portion is bent so as to be hooked on a sprocket hole of said TAB tape. 5. A method for manufacturing a tape-type semiconductor device using the carrier according to claim 2, wherein the carrier and the strip-shaped TAB tape are heated while the strip-shaped TAB tape is attached to the mounting portion of the carrier. A step of attaching an outer peripheral portion of the TAB tape, a step of mounting a semiconductor chip on the strip-shaped TAB tape attached to the carrier, and a step of sealing the mounted semiconductor chip with a liquid resin. Placing a plurality of solder balls at one time on the strip-shaped TAB tape as external terminals of the tape-type semiconductor device; and dicing the tape-type semiconductor device completed through the above steps from the tape by dicing. A method of manufacturing a tape-type semiconductor device having a cutting step. 6. A method of manufacturing a tape-type semiconductor device using the carrier according to claim 3, wherein the curved mounting portion of the carrier is temporarily extended inside the metal frame. A step of attaching an outer peripheral portion of the strip-shaped TAB tape to a mounting portion of a carrier; a step of mounting a semiconductor chip on the strip-shaped TAB tape attached to the carrier; A step of sealing with a liquid resin, a step of mounting a plurality of solder balls serving as external terminals of the tape-type semiconductor device on the strip-shaped TAB tape at a time, and a tape type completed through the above steps. Cutting the semiconductor device from the tape by dicing. 7. A method for manufacturing a tape-type semiconductor device using the carrier according to claim 4, wherein a curved mounting portion of the carrier is temporarily extended inside the metal frame to form the strip-shaped semiconductor device. A step of hooking a tip end of the mounting portion on a sprocket hole of the TAB tape and mounting an outer peripheral portion of the strip-shaped TAB tape on a mounting portion of the carrier; A step of mounting a semiconductor chip; a step of sealing the mounted semiconductor chip with a liquid resin; and forming a plurality of solder balls serving as external terminals of the tape-type semiconductor device on the strip-shaped TAB tape at a time. A tape-type semiconductor having a mounting step and a step of dicing the tape-type semiconductor device completed through the above steps from the tape by dicing Method of manufacturing location.