JPH0523919B2 - - Google Patents

Description

[Detailed Description of the Invention] (Technical Field) The present invention relates to thermal heads, optical sensors, IC
The present invention relates to a cutting method for punching out a tape carrier for mounting a circuit element in a card or the like from a tape carrier to which the circuit element is bonded.

(Prior art) As a method for mounting circuit elements such as a drive circuit on a thermal head, etc., there is a tape carrier method in which the circuit elements are bonded to a tape carrier, and the tape carrier is bonded to the thermal head, etc. . Recently, as devices such as thermal heads have become smaller, tape carriers themselves have also become smaller.

In the tape carrier type bonding method, for example, a tape carrier as shown in FIG. 2 is used. For example, an inner lead hole 4 for inner bonding a circuit element to a base 2 made of polyimide, etc., and an outer lead hole 4 for allowing the lead to protrude when cut and to be outer bonded to a device such as a thermal head. 6 and 8 are left open, and leads 10 and 12 are patterned and formed. A circuit element is positioned in the inner lead hole 4 of this tape carrier, and the circuit element is bonded to the portion (inner lead) of the leads 10, 12 that protrudes into the hole 4. 14 and 16 are signal check pads for testing bonded circuit elements;
18 is a sprocket hole for feeding the tape.

The tape carrier with the circuit elements bonded in this way is wound up into a roll, then punched out one by one and transported onto a device such as a thermal head.
Bonding is performed between the parts of the leads 10 and 12 that protrude from the ends (outer leads) and a device such as a thermal head.

By the way, in this case, the tape carrier is punched out by cutting as shown in the dashed line in FIG. is the lead.

However, since portions a to d of the base 2 are long, a large force is required for punching with a punching press, as shown in FIG. Therefore, the impact during punching is applied to the entire tape carrier 1, and when it is cut, the punched tape carrier 20 may shift as shown in FIG. 4, or sometimes the tape carrier 20 may fly out of the upper die. A problem arises in which positioning becomes difficult during outer bonding later. This problem becomes more pronounced as the punched tape carrier 20 becomes smaller. In FIGS. 3 and 4, 22 is a lower die of the punching press, 24 is an upper die, and 26 is a circuit element such as an IC bonded to the tape carrier 1.

In order to solve these problems, various improvements have been made to presses or outer bonding devices as described below.

(1) It is okay for the removed tape to shift, so align it with the bonding part after transporting it. This requires a fine adjustment mechanism for X, Y, Z, and θ to be provided in the vacuum chuck, which complicates the structure of the device. Generally, the size of the tape carrier 20 after punching is about 3.8 mm x 20 mm, and it must be aligned to the bonding part while viewing it with a microscope. , Y, Z, θ movable chuck is difficult to make.

(2) As shown in FIGS. 5 and 6, raise the lower mold 22 while holding it down with the vacuum chuck 28.
This method avoids damage to the tape carrier 20 by the vacuum chuck 28, the description of the dimension e to avoid the thickness e' of the upper mold 24, the spring mechanism to prevent damage, and the like. Since an f dimension is required to attach the lens, a very complicated structure is required to suppress the e and f dimensions within the focus of the microscope.

(3) As shown in Fig. 7, a suction port is provided on the lower mold 32,
Cut while adsorbing with the lower die 32, and then cut with the lower die 3.
Turn off the suction in step 2 and transport using a vacuum chuck. Although this method is very effective, when the size of the tape carrier is about 3.8 mm x 20 mm, the diameter of the suction port can only be about 1 mm or 2 mm at most, and many deviations still occur.

(4) Also, if both the lower die and the upper die are new, the blades are sharp, so even if you do not do the steps in (1), (2), and (3) above, the tape carrier will not shift, so it will last for several weeks. The molds are polished periodically after each use, but this has the drawbacks that removing the molds is difficult, production efficiency is not improved, and polishing costs are high.

(Purpose) The present invention shortens the length of the part where the base of the tape carrier is cut, and also devises the lower die and upper die of the punching press so that the tape carrier base can be cut with a small force. It is an object of the present invention to provide a cutting method that reduces the impact force when cutting a tape carrier so that the punched tape carrier is difficult to shift.

(Structure) In the present invention, holes are pre-drilled in the tape carrier at the position where the circuit element is bonded, the position where the leads protrude when cut, and a part of the part to be cut. or a cutting method in which the tape carrier is punched out using a punching press in which at least a portion of the edges of both the lower die and the upper die are sloped.

Hereinafter, the present invention will be explained in detail with reference to Examples.

Note that in all the figures, the same or equivalent parts are denoted by the same symbols and detailed explanations are omitted.

FIG. 1 shows a tape carrier to be cut according to the present invention, with circuit elements shown in a state before bonding. Compared to the conventional one shown in Fig. 2, the base 2 is the same in that it has an inner lead hole 4 and outer lead holes 6 and 8, but it also has cutting holes 40, 42, 44 and 4
The difference is that 6 is open. These holes are provided so as to include a portion of the cutting location indicated by the dashed line.

In the punching process after circuit elements are mounted on this tape carrier, the tape carrier base 2 is cut at points g to n, which correspond to a to d in FIG.
Compared to
44 and 46, the impact force during punching with a press is also reduced, and the cut tape carrier is less likely to shift or pop out, making the subsequent outer bonding process more efficient. You will be able to perform well.

In this way, the punched tape carrier 20
has a shape as shown in FIG. 26 is
It is a circuit element such as an IC.

In the present invention, in order to perform the punching process more efficiently, the die of the punching press is also devised.

FIG. 9 shows a lower mold 50 of a punching press according to an embodiment of the present invention, and a pair of opposing edges 52 and 54 are inclined so as to be concave toward the center.

When this lower mold 50 is combined with the upper mold to punch out a tape carrier, the edges 52 and 54 of the lower mold 50 obliquely hit the tape carrier 56, as shown in FIGS. 10 and 11, and the tape carrier 56 is gradually cut. As the cutting process continues, the impact force at the time of cutting becomes weaker, and the cut tape carrier 20 is less likely to be misaligned.

Note that during punching, the edges 52, 5 of the lower mold 50
Although the tape carrier 20 is slightly deformed due to the inclination of the tape carrier 56, since the base 2 of the tape carrier 56 is made of a resin such as polyamide and has elasticity, plastic deformation as in the case of general metal plate punching does not occur, and the tape carrier 20 deforms slightly after the punching is completed. returns to its original flat state.

In the present invention, various shapes can be adopted for the edge portion of the lower die. For example, as shown in FIG. 12, there is a lower mold 59 in which the edges 58 are inclined so as to protrude at four corners, or as shown in FIG. 13, there is a lower mold 61 in which the edges 60 are inclined to one side. In short, it is sufficient if the edge is inclined so that the contact with the tape carrier occurs at a portion of the edge and the tape carrier is difficult to gradually cut.

FIG. 14 shows still another example of the lower press mold,
The tape carrier 56 is attached to the lower die 62 with the inclined edge.
An exhaust port 64 is provided for sucking in the air. If the tape carrier 56 is cut while being sucked by the lower mold 62, the cut tape carrier is less likely to shift.

FIG. 15 shows an embodiment using a press upper die 68 having an inclined edge 66, in which case the tape carrier 56 is also attached to the inclined upper die edge 68.
6, the impact force at the time of punching becomes weaker.

The punching press of the present invention may also be configured such that the edges of both the lower die and the upper die are inclined, and in this case, the impact force at the time of punching is further weakened.

(Effects) According to the present invention, since the impact force when punching out the tape carrier is weakened, the tape carrier after being punched out is less likely to shift from a predetermined position, and the tape carrier during the subsequent outer bonding process is This has the effect of making positioning easier.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing part of an embodiment of the tape carrier used in the present invention, FIG. 2 is a plan view showing part of the tape carrier used in the conventional method, and FIGS. Figure 4 is a sectional view illustrating the process of punching out a tape carrier using a conventional press, Figures 5 and 6 are also sectional views illustrating the process of punching a tape carrier using a conventional press, and Figure 7 is also a sectional view illustrating the process of punching a tape carrier using a conventional press. 8 is a perspective view showing a tape carrier punched out from the tape carrier shown in FIG. 1 according to the present invention; FIG. 9 is a perspective view showing an example of the lower press die according to the present invention; FIG. 11 is a cross-sectional view showing the punching process performed using the lower die shown in FIG. 9, FIGS. 12 and 13 are perspective views showing other embodiments of the press lower die in the present invention, and FIG. Furthermore, FIG. 15 is a cross-sectional view showing a punching process using another embodiment of a lower press mold, and FIG. 15 is a cross-sectional view showing a punching process using an example of an upper mold according to the present invention. 2...Tape carrier base, 4...Inner lead hole to which circuit elements are bonded, 6,
8... Outer lead hole from which the lead protrudes when cut, 10, 12... Lead, 26... Circuit element, 40, 42, 44, 46... Cutting hole,
50, 59, 61, 62... lower die, 68... upper die, 52, 54, 58, 60... slanted edge.

Claims (1)

[Claims] 1. Holes are drilled in advance in the tape carrier at the position where the circuit element is bonded, at the position where the leads protrude when cut, and at a part of the part to be cut, and A cutting method characterized in that the tape carrier is punched out using a die or a punching press in which at least a portion of the edges of both the lower die and the upper die are sloped.