JPH07112399A - Punching method for tape-form member - Google Patents

Abstract

PURPOSE:To provide a punching method for a tape-form member through which a hole in a stable shape is punched. CONSTITUTION:In a punching method for a taper-form member formed by punching holes in a carrier tape 1 as the taper-form member, a preliminary hole 3 is punched in a hole punching spot before a punching process. This method punches a desired hole in the tape-form member without generating roundness and burrs.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for punching holes in a tape-shaped member, and more particularly to a method for punching holes in a tape-shaped member such as a carrier tape for electronic parts at predetermined intervals.

[0002]

2. Description of the Related Art A conventional example of a hole punching method for a carrier tape constructed so that an electronic component such as a chip-shaped component is housed in a hole and conveyed will be described with reference to FIGS.

Conventionally, a hole punching device 50 as shown in FIG. 11 is used to form circular feed holes 52 and square holes 53 at predetermined intervals in a carrier tape 51 as shown in FIG. ing.

This hole punching device 50 is provided with the feed hole 5
3 circular tooth portions 54 for punching 2 and the square hole 5
An upper die 56 provided with four square tooth portions 55 for punching 3 on the lower surface, and circular recesses and square recess portions 58 corresponding to the circular tooth portions 54 and the square tooth portions 55 are provided on the upper surface. The lower die 57 and the upper die 5 are opposed to each other in a vertical arrangement.
The carrier tape 51 is conveyed in the direction of the arrow a between the upper die 5 and the lower die 57 by a conveying means (not shown).
By the vertical movement operation of 6, the circular feed hole 52 and the square hole 53 are punched out from the carrier tape 51 at predetermined intervals.

Details of the punching process of the square hole 53 using the punching device 50 will be described with reference to FIGS. 13 to 16.

As shown in FIG. 13, from the state where the square tooth portion 55 of the upper die 56 is arranged above the carrier tape 51, as shown in FIG. 14, the upper die 56 is lowered to form the square tooth. When the portion 55 is made to bite into the carrier tape 51, a fiber winding stress 59 shown by an arrow in FIG.
As shown in FIG. 5, the upper die 56 is lowered to move the square tooth portion 55.
As a result, when the carrier tape 51 is penetrated, punching burrs 60 shown in FIG. 15 are generated on the carrier tape 51. After that, the upper die 56 is raised as shown in FIG. 16, and one punching process is completed.

As a result of the punching process of the square hole 53, the square hole 53 of the carrier tape 51 is formed as shown in FIGS.
As shown in FIG. 6, a push-cut surface 62 with a smooth shearing surface 61 and a punching burr 60 appears. Further, the portion of the sheared surface 61 is rounded by the square tooth portion 55.

[0008]

As described above, when the conventional punching process of the square hole 53 is performed, the sheared surface 61 with the roundness and the push-cut surface 62 with the punching burr 60 are generated, and as a result, As shown in FIG. 17, the square hole 53 of the carrier tape 51 is 1.0 ×, for example.
When a small 0.5 × 0.5 mm chip component 65 is to be stored and transported, there is a problem that the posture of the chip component 65 is collapsed or pressed, causing a problem in the suction operation by a mounter (not shown). . In FIG. 17, 51a is a bottom tape.

Therefore, the present invention provides a hole punching method for a tape-like member suitable for application to a carrier tape for electronic parts, in which a desired hole can be bored without causing roundness or punching burr. .

[0010]

The invention according to claim 1 is
A method for punching a hole in a tape-shaped member, comprising punching a hole in a tape-shaped member, wherein a preliminary hole is punched at a punching position of the hole before the punching step of the hole.

The blanking size of the preliminary hole is smaller than or substantially equal to the hole.

The tape-shaped member is a carrier tape for electronic parts.

[0013]

According to the hole punching method described above, the preliminary hole is punched at the punching portion of the hole before the step of punching the hole in the tape-shaped member, so that the preliminary hole is formed before punching the hole. As a result, the push-off force and the shearing force in the punching step of the hole become small, whereby a hole having a desired shape can be formed without causing roundness or punching burr.

By making the punching dimension of the preliminary hole smaller or substantially equal to the dimension of the hole, it is possible to smoothly punch a hole having a desired shape.

By using the tape-shaped member as a carrier tape for electronic parts, it is possible to obtain a carrier tape in which electronic parts such as chip parts can be properly stored in a hole without roundness or punching burr.

[0016]

EXAMPLES Examples of the present invention will be described in detail below.

A hole punching device 20 shown in FIG. 1 has two circular tooth portions 4 and a preliminary square hole 3 for punching a circular feed hole 2 in a carrier tape 1 for electronic parts as a tape-shaped member. A first upper mold 6 having one square tooth portion 5 for punching on the lower surface, and a circular concave portion and a square concave portion 8 corresponding to the circular tooth portion 4 and the square tooth portion 5 are provided on the upper surface. While facing the first lower mold 7 and the first lower mold 7,
Two circular tooth portions 4 for punching out circular feed holes 2 for the carrier tape 1 on the sides of the first upper mold 6 and the first lower mold 7, and a square hole 13 of a desired size. A second upper mold 10 having a lower surface provided with one square tooth portion 11 for punching, and a circular concave portion and a square concave portion 14 corresponding to the circular tooth portion 4 and the square tooth portion 11 on the upper surface. The provided second lower mold 12 is opposed to the upper and lower parts.

Further, the carrier tape 1 is provided between the first upper mold 6 and the first lower mold 7 and between the second upper mold 10 and the second lower mold 12 by a conveying means (not shown). Are conveyed in the direction of arrow a, and the carrier tape 1 is punched with circular feed holes 2 and preliminary square holes 3 and 13 at predetermined intervals.

The size of the square tooth portion 5 (the size of the punched surface) is set to be smaller than or substantially equal to the size of the square tooth portion 11.

Details of the punching process of the square hole 13 using the hole punching device 20 will be described with reference to FIGS.

First, the step of punching out the preliminary square hole 3 in the carrier tape 1 will be described with reference to FIGS.

As shown in FIG. 2, the first upper mold 6 is formed.
As shown in FIG. 3, the first upper mold 6 is lowered from the state in which the square tooth portions 5 are arranged above the carrier tape 1 so that the square tooth portions 5 penetrate into the carrier tape 1 while penetrating the same. Let At this time, the winding stress 14 shown by the arrow in FIG. 3 is generated in the carrier tape 1, and in the state shown in FIG. 4 in which the first upper mold 6 is elevated above the carrier tape 1, the carrier tape 1 A punching burr 15 shown in the figure appears in the punched spare square hole 3. Further, a roundness 16 due to the biting of the square tooth portion 5 appears in the upper portion of the preliminary square hole 5.

Next, the process of punching the square hole 13 of a desired size in the carrier tape 1 will be described with reference to FIGS.

As shown in FIG. 5, the second upper mold 1 is formed.
After the carrier tape 1 is conveyed in the direction of arrow a and stopped so that the square tooth portion 0 of 0 reaches above the preliminary square hole 5 formed in the carrier tape 1, as shown in FIG.
Then, the upper mold 10 is lowered so that the square-shaped tooth portion 11 bites into the peripheral portion of the preliminary square hole 5 in the carrier tape 1.

At this time, a winding stress 17 shown by an arrow in FIG. 6 still occurs around the preliminary square hole 5 in the carrier tape 1, but since the preliminary square hole 5 is already formed, the winding stress 17 is generated. Is smaller than the entrainment stress 59 of the conventional example.

Further, as shown in FIG. 7, the second upper mold 10 is lowered and punched out in the peripheral portion of the preliminary square hole 5 in the carrier tape 1 by the square tooth portion 11. Thereafter, as shown in FIG. 8, the second upper mold 10 is lifted above the carrier tape 1 to complete a series of punching steps.

According to the hole punching method of the present embodiment, the preliminary square hole 3 is punched at the punching portion of the square hole 13 before the punching process of the square hole 13 on the carrier tape 1. Since the preliminary square hole 3 is formed before the square hole 13 is punched out, the push-off force and the shearing force in the punching process of the square hole 13 become small,
As a result, the desired square hole 13 can be formed without causing roundness or punching burr, or even if it occurs, in a very small amount.

Further, by making the blanking size of the spare square hole 3 smaller or substantially equal to the size of the square hole 13, the blanking process of the square hole 13 can be carried out very smoothly.

Further, according to the carrier tape 1 in which the square holes 13 are punched out by the hole punching method of this embodiment, electronic parts such as chip parts are rounded and punched without burrs.
3 can be stored in a correct posture, and the suction operation by the mounter can be performed without any trouble.

FIG. 9 shows a carrier tape 1A in which the square holes 13 are punched out by the hole punching method of the present embodiment. The pitch p of the square holes 13 is 2 mm, and the distance d between the square holes 13 is 0.4 to 0.4. 0.6 mm, the lateral dimension x of the square hole 13 is 1.
3 to 1.6 mm, and the vertical dimension y of the square hole 13 is 2.2 to 2.4 mm.

In this carrier tape 1A, since the distance d between the square holes 13 is as narrow as 0.4 to 0.6 mm,
The strength of the carrier tape 1A itself becomes unstable depending on the location when punched by the conventional method. However, when the hole punching method of this embodiment is used, the strength of the carrier tape 1A itself becomes stable around all punching points. I was able to confirm that

FIG. 10 shows another hole punching device 30 used in the hole punching method of this embodiment.

This hole punching device 30 includes an upper die 31.
2 circular tooth portions 32 on the lower surface and a preliminary square tooth portion 33 for punching the preliminary square hole 3 on the lower side, and a square die for punching the desired square hole 13 on the upper portion of the preliminary square tooth portion 33. The feature is that two punch portions 35 having tooth portions 34 are provided. Figure 1
In 0, 36 is a lower mold.

The size of the preliminary square tooth portion 33 is set to be smaller than or substantially equal to the size of the square tooth portion 34.

In the case of the hole punching device 30, the preliminary square tooth portion 33 is formed by the first lowering operation of the upper die 31 having a single structure.
The carrier tape 1 is provided with a preliminary square hole 3 by means of a second lowering operation of the upper die 31, and the square tooth portion 34 makes a desired corner around the preliminary square hole 3 with respect to the carrier tape 1. By forming the holes 13, electronic components such as chip parts can be correctly stored in the square holes 13 having no rounding or punching burr, and the carrier tape 1 that can perform the suction operation by the mounter without any trouble, as in the case described above. Can be obtained.

The present invention is not limited to the above-mentioned embodiments, but various modifications can be made within the scope of the invention.

For example, the present invention can be applied to the above-mentioned carrier tape 1 as well as a tape-shaped member whose material itself is soft and difficult to press, and a punched surface of which requires smoothness.

[0038]

According to the present invention described in detail above, a preliminary hole is formed before punching a hole, and the push-cutting force and the shearing force in the punching process of the hole become small, which results in roundness. It is possible to provide a hole punching method for a tape-shaped member that can punch a hole having a desired shape without causing a punch burr.

Further, according to the present invention, it is possible to provide a hole punching method for a tape-shaped member which can smoothly punch a hole having a desired shape.

Further, according to the present invention, it is possible to provide a hole punching method for a tape-shaped member, which can obtain a carrier tape which can store electronic parts such as chip parts in a hole without rounding or punching burr in a correct posture. .

[Brief description of drawings]

FIG. 1 is a perspective view of a hole punching device used in an embodiment method of the present invention.

FIG. 2 is a cross-sectional view showing a blanking step of a preliminary square hole in a method according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a blanking step of a preliminary square hole in a method according to an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a blanking step of a preliminary square hole in a method according to an embodiment of the present invention.

FIG. 5 is a sectional view showing a punching process of a square hole in the method according to the embodiment of the present invention.

FIG. 6 is a sectional view showing a punching process of a square hole in the method according to the embodiment of the present invention.

FIG. 7 is a sectional view showing a punching process of a square hole in the method according to the embodiment of the present invention.

FIG. 8 is a sectional view showing a punching process of a square hole in the method according to the embodiment of the present invention.

FIG. 9 is a plan view showing a carrier tape punched out by a method according to an embodiment of the present invention.

FIG. 10 is a perspective view showing another example of the hole punching device used in the method of the embodiment of the present invention.

FIG. 11 is a perspective view showing a conventional hole punching device.

FIG. 12 is a plan view showing a carrier tape punched out by a conventional method.

FIG. 13 is a sectional view showing a punching step of a conventional hole punching method.

FIG. 14 is a sectional view showing a punching step of a conventional hole punching method.

FIG. 15 is a sectional view showing a punching process of a conventional hole punching method.

FIG. 16 is a sectional view showing a punching step of a conventional hole punching method.

FIG. 17 is a cross-sectional view showing a mounting state of electronic components in holes of a carrier tape punched out by a conventional method.

[Explanation of symbols]

 1 Carrier Tape 2 Feed Hole 3 Preliminary Square Hole 5 First Square Tooth 6 First Upper Mold 10 Second Upper Mold 11 Second Square Tooth 13 Square Hole

Claims (3)

[Claims] 1. A method of punching a tape-shaped member for punching a hole in a tape-shaped member, wherein a preliminary hole is punched at a punching position of the hole before the punching step of the hole. Hole punching method for tape-shaped member. 2. The method of punching a tape-shaped member according to claim 1, wherein the punching dimension of the preliminary hole is smaller than or substantially equal to the dimension of the hole. 3. The method for punching a hole in a tape-shaped member according to claim 1, wherein the tape-shaped member is a carrier tape for electronic components.