JP2014117759A - Mold for producing carrier tape, and producing method of carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mold for producing a cardboard carrier tape made of a tape material, in which tape a plurality of storing holes for storing electronic components in its inner section are aligned in a longitudinal direction and arranged in a state where they penetrate the tape in a thickness direction and ensuring flatness of the bottom surface at a gap part between the storing holes on which a bottom tape is allied upon construction of the electronic components, even if a pitch between storing holes is narrow.SOLUTION: Recessed configurations are provided on an end surface 67 of a recessed part gap wall part 66 between a plurality of storing hole forming recessed parts for respectively receiving a storing hole forming projecting part on a female mole 62. A surface facing an end surface 67 of an interval part 34 curved or folded along with the recessed configuration with compressive load provided when the storing hole forming projecting part is inserted into the storing hole forming recessed part, and then the storing hole forming recessed part is drawn out and a surface at the gap part between the storing holes on which the bottom tape is applied return to be flatter when the storing hole forming projecting part is drawn out.

Description

  This invention is used for manufacturing a carrier tape provided in a state of penetrating in the thickness direction while being arranged in the longitudinal direction with a plurality of accommodation holes for accommodating electronic components therein from a cardboard tape material, The present invention relates to a carrier tape manufacturing mold and a carrier tape manufacturing method implemented using the mold.

  As an interesting technique for this invention, a carrier tape and a mold used for manufacturing the carrier tape are described in, for example, Japanese Patent Application Laid-Open No. 2003-33495 (Patent Document 1). First, the carrier tape described in Patent Document 1 will be described with reference to FIG.

  The carrier tape 1 has a plurality of receiving holes 2 arranged at equal intervals along the longitudinal direction. The accommodation hole 2 is for accommodating, for example, chip-like electronic components (not shown in FIG. 8) one by one in the inside thereof, and is provided in a state of penetrating the carrier tape 1 in the thickness direction.

  The carrier tape 1 also includes a plurality of feed holes 3 arranged in parallel with the arrangement direction of the plurality of receiving holes 2 described above. The feed holes 3 are arranged at equal intervals at a rate of one for several receiving holes 2.

  The carrier tape manufacturing die 4 for manufacturing the carrier tape 1 described above will be described with reference to FIGS. The carrier tape manufacturing mold 4 includes a male mold 5 and a female mold 6 provided so as to be close to each other and separated from each other. The male mold 5 is illustrated in FIG. 11, and the female mold 6 is illustrated not only in FIG. 11 but also in FIGS. 9 and 10 alone. First, the female die 6 will be described mainly with reference to FIGS. 9 and 10.

  As shown in FIG. 9, the female die 6 has a plurality of receiving hole forming recesses 7 and a plurality of feed hole forming recesses 8. The housing hole forming recess 7 and the feed hole forming recess 8 are for forming the housing hole 2 and the feed hole 3 described above, respectively, at the positions of the housing hole 2 and the feed hole 3 to be formed. Arranged in the corresponding distribution state.

  As shown in FIG. 10, the female die 6 has a three-part structure and is composed of three members 9 to 11. The accommodation hole forming recess 7 described above is formed by combining these three members 9 to 11.

  The first member 9 has a first side surface 12 that provides a first wall surface that defines the recess 7 for forming the accommodation hole. Further, the first member 9 is formed with a feed hole forming recess 8. The second member 10 has an L-shaped cross section and provides a wall portion between adjacent housing hole forming recesses 7, that is, a wall portion 13 between the recesses. The third member 11 has a second side surface 14 that provides a second wall surface that opposes the first wall surface that defines the accommodation hole forming recess 7 provided by the first side surface 12 described above.

  These first to third members 9 to 11 are combined as shown in FIG. In the female mold 6, the housing hole forming recess 7 is defined by the side surface 12 of the first member, the inter-recess wall 13 of the second member 10, and the side surface 14 of the third member 11. The combination of the first to third members 9 to 11 is applied to form the receiving hole forming recess 7 in this manner, so that the cross sectional shape of the receiving hole forming recess 7 is accurately rectangular. This is to make the cross-sectional shape of the accommodation hole 2 formed by the accurate rectangular shape.

  If the cross-sectional shape of the accommodation hole 2 is an accurate rectangle, not only the chip-shaped electronic component can be stably accommodated, but also the outer peripheral surface of the chip-shaped electronic component accommodated therein and the accommodation hole 2 The electronic component can be picked up smoothly without enlarging the gap between the inner peripheral surface and the inner peripheral surface.

  If the combination of the first to third members 9 to 11 is not applied in order to form the accommodation hole forming recess 7, a rectangular corner portion of the accommodation hole forming recess 7 is caused due to processing problems. It is inevitable that R is formed to be larger or smaller. On the other hand, since the feed hole forming recess 8 has a circular cross section, it can be easily processed. Therefore, the feed hole forming recess 8 is simply formed on the first member 9.

  As shown in FIG. 11, the male mold 5 has a plurality of accommodating hole forming convex portions 15 arranged. The aforementioned receiving hole forming recess 7 provided in the female mold 6 receives the receiving hole forming convex part 15. Although not shown in FIG. 11, the male mold 5 has a plurality of protruding feed hole forming pins arranged corresponding to the plurality of feed holes 3 to be formed. The feed hole forming pin is received in the feed hole forming recess 8 of the female die 6 described above.

  In order to manufacture the carrier tape 1, as shown in FIG. 11 (1), a cardboard tape material 16 is prepared, and the tape material 16 is disposed between the male mold 5 and the female mold 6. The inter-recess wall 13 described above has an end face 18 that is positioned alongside the opening 17 of the housing hole forming recess 7. At this time, the end surface 18 of the inter-recess wall portion 13 is in contact with the tape material 16, and this state is maintained until the step shown in FIG. In FIG. 11, it is pointed out that the tape material 16 is illustrated with its dimension in the thickness direction exaggerated. The same exaggeration is performed in other drawings showing the tape material in cross section.

  Next, as shown in FIG. 11 (2), the male mold 5 and the female mold 6 are brought close to each other. Thus, the housing hole forming convex portion 15 is fitted into the housing hole forming concave portion 7 while punching a part of the tape material 16, whereby the housing hole 2 is formed in the tape material 16. In FIG. 11 (2), a punched piece 19 punched from the tape material 16 as a result of forming the accommodation hole 2 is indicated by a broken line.

  Although not shown in FIG. 11 (2), as described above, when the male mold 5 and the female mold 6 are close to each other with the tape material 16 in between, the feed hole forming pin is a part of the tape material 16. The tape hole 16 is further formed with a feed hole 3 by being inserted into the feed hole forming recess 8 while punching out.

  Next, as shown in FIG. 11 (3), the male mold 5 and the female mold 6 are returned to the separated state. A plurality of receiving holes 2 and a plurality of feed holes 3 (not shown) are formed in the tape material 16 arranged on the female mold 6.

  Next, the tape material 16 is conveyed by a predetermined distance in the longitudinal direction through the feed hole 3. And each process shown to FIG. 11 (1)-(3) is repeated on both sides of the process which conveys the tape material 16 for every predetermined distance to a longitudinal direction, and carrier tape 1 as shown in FIG. 8 is obtained. Manufactured.

  FIG. 12 is an enlarged cross-sectional view of an electronic component series 20 configured using the carrier tape 1 manufactured as described above. 12, elements corresponding to those shown in FIG. 8 are denoted by the same reference numerals, and redundant description is omitted.

  In the electronic component series 20, chip-shaped electronic components 21 are accommodated one by one in the accommodation holes 2 formed in the carrier tape 1. A top tape 22 and a bottom tape 23 are attached to the upper surface and the lower surface of the carrier tape 1 by applying, for example, a heat seal method to prevent the electronic component 21 housed in the housing hole 2 from falling off. The top tape 22 and the bottom tape 23 do not cover the feed hole 3.

  In the mounting process of the electronic component 21, the top tape 22 is peeled off from the carrier tape 1 at a predetermined pickup position while the electronic component series 20 including the carrier tape 1 is intermittently conveyed through the feed hole 3, and the accommodation hole The electronic component 21 in 2 is picked up using, for example, vacuum suction and supplied to a predetermined mounting position.

JP 2003-334895 A

  In recent years, as electronic components are further reduced in size, the receiving holes formed in the carrier tape are also reduced in size, and accordingly, the receiving holes are increased in order to increase the number of electronic components accommodated per unit length. The arrangement pitch of is also becoming narrower.

  FIG. 13 shows a carrier tape 31 corresponding to the downsizing of electronic parts as described above. In the carrier tape 31, a plurality of receiving holes 32 are arranged along the length direction, and a plurality of feed holes 33 are arranged in parallel to the arrangement direction of the plurality of receiving holes 32. The feed holes 33 are arranged at equal intervals, for example, at a rate of one for the four accommodation holes 32.

  The carrier tape 31 is made of a resin-impregnated cardboard tape material having a thickness of, for example, about 0.5 mm. For example, the receiving holes 32 are measured in the arrangement direction (longitudinal direction of the carrier tape 31). The dimension L1 is about 0.6 mm, the dimension L2 measured in the direction orthogonal to the arrangement direction is about 1.1 mm, and the arrangement pitch P of the receiving holes 32 is about 1.0 mm. Therefore, the dimension W of the space portion 34 between the accommodation holes 32 measured in the arrangement direction of the accommodation holes 32 is about 0.4 mm.

  FIG. 14 is a view showing a method of manufacturing the carrier tape 31 shown in FIG. 13, and shows a step corresponding to the step shown in FIG. ing. As shown in FIG. 14, when a male die 37 and a female die 38 constituting the carrier tape manufacturing die 36 are brought close to each other, the accommodating hole forming convex portion 39 provided in the male die 37 becomes the tape material 35. The hole 32 is formed in the tape material 35 by being inserted into the recess 40 for forming the receiving hole provided in the female die 38 while punching a part of the tape.

  As in the case of the female die 6 shown in FIG. 11, the female die 38 is formed with an inter-recess wall 41 between the adjacent recesses 40 for forming the receiving holes. It has an end face 43 positioned alongside the 40 openings 42. The end surface 43 of the inter-recess wall 41 is in contact with the tape material 35.

  Although not shown in FIG. 14, as described above, when the male die 37 and the female die 38 are close to each other with the tape material 35 interposed therebetween, the feed hole forming pin punches a part of the tape material 35. By inserting into the recess for forming the feed hole, a feed hole 33 is further formed in the tape material 35.

  Here, as described above, the dimension L1 of the receiving holes 32 measured in the arrangement direction is about 0.6 mm, and the arrangement pitch P of the receiving holes 32 is about 1.0 mm. It should be noted that the dimension W of the portion 34 is about 0.4 mm. That is, the dimension W of the spacing portion 34 between the accommodation holes 32 is shorter than the dimension L1 of the accommodation holes 32 measured in the arrangement direction.

  Under such circumstances, it was found that the following problems are likely to occur.

  FIG. 15 is an enlarged cross-sectional view of an electronic component series 44 configured using the carrier tape 31 described above. In FIG. 15, elements corresponding to the elements shown in FIG. 13 are denoted by the same reference numerals, and redundant description is omitted.

  In FIG. 15, for convenience of explanation, illustration of electronic components accommodated in the accommodation holes 32 is omitted. A top tape 45 and a bottom tape 46 are attached to the upper surface and the lower surface of the carrier tape 31, respectively. Normally, only the side edges extending in the longitudinal direction of the top tape 45 are affixed to the carrier tape 31, while the bottom tape 46 is affixed to the carrier tape 31 except for the accommodation hole 32. However, in the electronic component series 44 shown in FIG. 15, the spacing portion 34 is illustrated beyond the accommodation hole 32, that is, a gap 47 between the spacing portion 34 between the adjacent accommodation holes 32 and the bottom tape 46. Is formed. Although the presence of such a gap 47 causes inconvenience as described later, first, the cause of the formation of the gap 47 is estimated.

  FIG. 16 is a cross-sectional view taken along line AA of FIG. That is, FIG. 16 is a cross-sectional view seen in the arrangement direction of the recesses 40 for forming the accommodation holes. FIG. 16 shows a part of each of the first to third members 48, 49, and 50 constituting the female mold 38 corresponding to the first to third members 9, 10 and 11 described above. In particular, in the second member 49, the inter-recess wall 41 is illustrated.

  As shown in FIG. 14, the accommodating hole forming convex portion 39 provided in the male die 37 is fitted into the accommodating hole forming concave portion 40 provided in the female die 38 while punching a part of the tape material 35. At this time, the tape material 35 tends to be drawn into the recess 39 for forming the accommodation hole. At this time, a relatively large compressive load is exerted in the thickness direction on the portion of the tape material 35 located on the end surface 43 of the inter-recess wall 41, that is, the interval portion 34 between the accommodation holes 32.

  In particular, the carrier tape to be obtained has a dimension W of the interval portion 34 between the accommodation holes 32 as compared to the dimension L1 of the accommodation holes 32 measured in the arrangement direction, like the carrier tape 31 shown in FIG. The shorter is, that is, the thickness T2 of the inter-recess wall 41 located between the adjacent housing hole forming recesses 40 is thinner than the thickness T1 of the housing hole forming protrusions 39 appearing in FIG. The compression load mentioned above becomes large so that.

  When the compressive load as described above is applied in the thickness direction of the tape material 35, the lower surface 51 of the interval portion 34 between the accommodation holes 32 in the tape material 35 is in contact with the end surface 43 of the inter-recess wall 41. Therefore, the plane state is maintained.

  Next, when the male mold 37 is separated from the female mold 38 and the housing hole forming convex portion 39 is pulled out from the housing hole forming concave portion 40, the stress due to the compression load is released. As a result, the lower surface 51 of the spacing portion 34 between the receiving holes 32 that has been maintained in a planar state along the end surface 43 of the inter-recess wall 41 has a relatively large recess as shown by a broken line in FIG. Guessed.

  On the other hand, on the upper surface 52 of the interval portion 34 between the receiving holes 32, when the receiving hole forming convex portion 39 is fitted into the receiving hole forming concave portion 40, something that maintains its planar shape acts. The compressive load is less likely to concentrate, so the deformation amount of the upper surface 52 when the accommodating hole forming convex portion 39 is pulled out from the accommodating hole forming concave portion 40 is as shown by the broken line in FIG. Compared to the amount of deformation of the lower surface 51, it is small.

  The gap 47 shown in FIG. 15 is caused by the dent deformation on the lower surface 51 of the tape material 35 described above. If the gap 47 is formed in the electronic component series 44, the following problems are caused.

  In the mounting process of the electronic component using the electronic component series 44, a suction nozzle is usually used to pick up the electronic component based on vacuum suction. In this case, in order to increase the efficiency of picking up the electronic component by the suction nozzle, the electronic component is picked up by bringing the suction nozzle close while always keeping the suction state without performing the on / off control of the suction operation in the suction nozzle. The method may be applied.

  When the above-described method is applied, the gap 47 becomes a passage for air, so that the suction force by the suction nozzle is increased as compared with the case where the gap 47 is not provided. There is a risk of causing variations in the suction force. As described above, when the suction force becomes strong or varies, the electronic component is lifted from the housing hole 32 or the pickup fails even though the suction nozzle is located at a position relatively away from the electronic component. In some cases, the pickup may be in an inappropriate posture, or even if the pickup is properly performed, the electronic component may be damaged.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a carrier tape manufacturing mold that can make the above-mentioned disadvantages less likely to occur, and a carrier tape manufacturing method that is performed using this mold.

  This invention is used for manufacturing a carrier tape provided in a state of penetrating in the thickness direction while being arranged in the longitudinal direction with a plurality of accommodation holes for accommodating electronic components therein from a cardboard tape material, Directed to carrier tape manufacturing mold. The carrier tape manufacturing mold includes a male mold and a female mold provided so as to be close to each other and can be separated from each other. The male mold has a plurality of housing hole forming projections corresponding to the plurality of housing holes to be formed. The female mold is provided with a plurality of receiving hole forming recesses for receiving the receiving hole forming convex portions, and a recess-to-recess wall portion is formed between adjacent receiving hole forming recesses. The inter-wall portion has an end surface located side by side with the opening of the recess for forming the accommodation hole. When the male mold and female mold are close to each other with the tape material in between, the receiving hole forming convex portion punches a part of the tape material while the end face of the wall between the recesses is in contact with the tape material. By inserting into the recess, the tape material is configured to form an accommodation hole.

  In order to solve the above-described technical problem, the carrier tape manufacturing die according to the present invention has a concave shape when the end surface of the wall portion between the recesses is viewed in the arrangement direction of the recesses for forming the receiving holes. It is said.

  According to this invention, since the end surface of the wall portion between the recesses has a recessed shape, when the receiving hole forming convex portion is fitted into the receiving hole forming recess, the gap portion between the receiving holes of the tape material is formed. A compressive load is applied, but due to this compressive load, the surface of the gap portion facing the end surface (hereinafter referred to as “lower surface”) is curved or bent along the concave shape. Next, when the housing hole forming convex portion is pulled out from the housing hole forming concave portion, the stress due to the compressive load is released, and the release of the stress works in a direction to cancel the above-described bending or bending. Therefore, the lower surface of the space | interval part between accommodation holes, ie, the surface where a bottom tape is affixed, can be made flatter.

  The carrier tape to which the present invention is applied is preferably such that the dimension of the space between the accommodation holes is shorter than the dimension of the accommodation holes as measured in the arrangement direction of the accommodation holes. Since such a carrier tape tends to cause the above-mentioned disadvantage, the mold according to the present invention becomes more effective.

  In the present invention, there can be various modes for the concave shape provided on the end surface of the inter-recess wall. Preferably, the recessed shape is a shape recessed from both ends of the end face as starting points when viewed in the arrangement direction of the recesses for forming the receiving holes. According to this configuration, the bending or bending along the concave shape of the lower surface of the interval portion due to the above-described compressive load, and the bending or bending along the concave shape of the lower surface of the interval portion resulting from the release of stress by this compressive load. It is possible to eliminate the bending in the entire interval portion.

  Moreover, it is preferable that a dent shape is a symmetrical shape when it sees in the sequence direction of the recessed part for accommodation hole formation. According to this configuration, the bending or bending along the concave shape of the lower surface of the interval portion due to the above-described compressive load, and the bending or bending along the concave shape of the lower surface of the interval portion resulting from the release of stress by this compressive load. The bending can be caused to be greatest at the central portion of the interval portion, and a more remarkable effect can be obtained.

  Preferably, the concave shape is a V shape when viewed in the arrangement direction of the concave portions for forming the receiving holes. There is an advantage that processing for obtaining a female mold is easy.

  In addition, the depth of the dent in the dent shape is defined as the dent in the space between the receiving holes when the carrier tape is manufactured using a carrier tape manufacturing mold having an inter-recess wall having an end surface that does not have a dent shape. It is preferable that the depth be deeper than the depth of the dent that may occur on the surface in contact with the intermediate wall. Thereby, when an electronic component series is comprised, it can prevent more reliably that a clearance gap is formed between the space | interval part between adjacent accommodation holes, and a bottom tape.

  In the carrier tape manufacturing mold according to the present invention, the female mold includes a first member having a first side surface that provides a first wall surface that defines the recess for forming the accommodation hole, and an adjacent projection for forming the accommodation hole. A second member for providing a wall portion between the recesses located between the second member and a second side surface for providing a second wall surface facing the first wall surface defining the recess for forming the accommodation hole provided by the first side surface; It is preferable to be composed of a combination with the third member. According to this configuration, not only is it easy to make the cross-sectional shape of the recess for forming the accommodation hole exactly rectangular, but also processing for imparting the recess shape to the end surface of the wall portion between the recesses is facilitated.

  The present invention is also directed to a method for manufacturing a carrier tape, which is carried out using the carrier tape manufacturing mold described above. The carrier tape manufacturing method according to the present invention includes a step of preparing a tape material, a step of preparing the above-described carrier tape manufacturing mold, a step of arranging the tape material between the male mold and the female mold, Forming a receiving hole in the tape material by bringing the male mold and the female mold close to each other.

  According to the present invention, as described above, since the surface to which the bottom tape is attached can be made flatter in the interval portion between the accommodation holes, when the electronic component series is configured using the obtained carrier tape Further, it is possible to make it difficult to form a gap between the interval portion between the adjacent accommodation holes and the bottom tape.

  Therefore, even when a method of picking up an electronic component by bringing the suction nozzle closer while keeping the suction nozzle in a suction state is applied, it is difficult to cause inconvenience that the suction force is inadvertently increased or varies due to the gap. Therefore, even though the suction nozzle is relatively far from the electronic component, the electronic component is lifted from the accommodation hole, the pickup fails, or the pickup is in an inappropriate posture, Even if it can be picked up properly, it is possible to make it difficult to cause inconveniences such as damage to electronic components.

FIG. 11 (2) is a diagram for explaining a method of manufacturing a carrier tape using the carrier tape manufacturing mold 61 according to the first embodiment of the present invention. FIG. 15 is a cross-sectional view illustrating a process corresponding to the process illustrated in FIG. FIG. 17 is an enlarged cross-sectional view taken along line AA of FIG. 1 and shows a part of a female die 62 included in the carrier tape manufacturing die 61 shown in FIG. 1 and corresponds to FIG. 16. 3 is a cross-sectional view showing a carrier tape 31 manufactured using a carrier tape manufacturing mold 61 including the female mold 62 shown in FIG. 2 and an electronic component series 44 configured using the carrier tape 31. FIG. . It is sectional drawing which expands and shows the wall part 66 between recessed parts of the female type | mold provided with the metal mold | die for carrier tape manufacture by 2nd Embodiment of this invention. It is sectional drawing which expands and shows the wall part 66 between recessed parts of the female type | mold provided with the metal mold | die for carrier tape manufacture by 3rd Embodiment of this invention. It is sectional drawing which expands and shows the wall part 66 between recessed parts of the female type | mold provided with the metal mold | die for carrier tape manufacture by 4th Embodiment of this invention. It is sectional drawing which expands and shows the wall part 66 between recessed parts of the female type | mold provided with the metal mold | die for carrier tape manufacture by 5th Embodiment of this invention. It is a perspective view which shows the conventional carrier tape 1 interesting for this invention. It is a perspective view which shows the female type | mold 6 with which the conventional metal mold | die for carrier tape manufacture interesting for this invention is equipped. It is a perspective view which isolate | separates and shows the 1st thru | or 3rd members 9-11 which comprise the male type | mold 6 shown in FIG. It is sectional drawing which shows the male type | mold 5 and tape material 16 with which the carrier mold | die 4 for carrier tape manufacture is equipped with the female type | mold 6 shown in FIG. 9, (1) is the male type | mold 5 and the female type | mold 6 and the tape material 16 is shown. 2 shows a state separated from each other, and (2) is a state realized after the state shown in (1), and the housing hole forming convex portion 15 provided in the male mold 5 punches the tape material 16. (3) is a state realized after the state shown in (2), in which the male mold 5 is separated from the female mold 6 after the housing hole 2 is formed in the tape material 16. Indicates. It is sectional drawing which expands and shows the electronic component series 20 comprised using the carrier tape 1 shown in FIG. It is a top view which shows the carrier tape 31 corresponding to size reduction of an electronic component compared with the case of the carrier tape 1 shown in FIG. It is a figure which shows the manufacturing method of the carrier tape 31 shown in FIG. 13, Comprising: It is sectional drawing which shows the process corresponding to the process which formed the accommodation hole 32 in the tape material 35, ie, the process shown in FIG. . FIG. 14 is an enlarged cross-sectional view showing an electronic component series 44 configured using the carrier tape 31 shown in FIG. 13 for explaining the problem to be solved by the present invention. FIG. 15 is an enlarged cross-sectional view taken along line AA in FIG. 14 and shows a wall 41 between the recesses of the female mold 38.

  The embodiment described below is shown in FIG. 13, which satisfies the condition that the dimension W of the spacing portion 34 between the accommodation holes 32 is shorter than the dimension L1 of the accommodation holes 32 measured in the arrangement direction. The carrier tape 31 is to be manufactured.

  FIG. 1 shows a carrier tape manufacturing die 61 according to the first embodiment of the present invention. The carrier tape manufacturing die 61 is substantially the same in cross section as shown in FIG. 14 of the carrier tape manufacturing die 36 described above. Therefore, in FIG. 2 showing a cross section taken along line AA in FIGS. 1 and 1, elements corresponding to those shown in FIG. 16 showing a cross section taken along line AA in FIGS. Reference numerals are assigned, and duplicate descriptions are omitted.

  The characteristic feature of the carrier tape manufacturing mold 61 shown in FIG. 1 is that the female mold 62 has, and this often appears in FIG.

  Referring mainly to FIG. 2, female mold 62 has a three-part structure composed of first to third members 63, 64 and 65, as shown in FIG. 16. Here, when attention is paid to the inter-recess wall portion 66 provided in the second member 64, the end face 67 positioned alongside the opening 42 of the housing hole forming recess 40 is a cross-sectional view taken along the line AA in FIG. When viewed in the direction shown in FIG. 2, that is, when viewed in the arrangement direction of the recesses 40 for forming the receiving holes, it has a concave shape.

  As described above, when the female mold 62 has the three-part structure, not only is it easy to make the cross-sectional shape of the recess 40 for forming the receiving hole accurately rectangular, Processing for imparting a concave shape to the end surface is facilitated.

  Further, as described above, when the end surface 67 of the inter-recess wall portion 66 has a concave shape, the housing hole forming convex portion 39 is fitted into the housing hole forming concave portion 40 as shown in FIG. When this occurs, a compressive load is applied to the gap portion 34 between the receiving holes 32 of the tape material 35. Due to this compressive load, the lower surface 68 of the gap portion 34 shown in the figure is shown by a solid line in FIG. Curve or bend along the concave shape. It should be noted that the upper surface 69 shown in the drawing of the spacing portion 34 is hardly affected by the concave shape of the end surface 67.

  Next, when the accommodating hole forming convex portion 39 is pulled out from the accommodating hole forming concave portion 40, the stress due to the compressive load is released, but the release of the stress eliminates the bending or bending of the lower surface 68 described above. Work in the direction you want. Therefore, the lower surface 68 of the space portion 34 between the receiving holes 32 can be made flatter as indicated by a broken line in FIG.

  In particular, in this embodiment, the concave shape is a bilaterally symmetric shape that is recessed from both ends of the end face 67 when viewed in the arrangement direction of the accommodating hole forming concave portions 40, and is V-shaped. According to this configuration, the bending or bending along the concave shape of the lower surface 68 of the spacing portion 34 due to the compression load described above, and the bending or bending along the concave shape of the lower surface 68 resulting from the release of stress due to this compression load. The elimination of the bending can be caused to occur in the entire interval portion 34, and the bending or bending along the concave shape of the lower surface 68 and the elimination thereof can be caused to occur most in the central portion of the interval portion 34. And a more remarkable effect can be obtained. Further, if the concave shape is V-shaped, there is an advantage that the processing for obtaining the female mold 62, particularly the second member 64, is easy. In addition, it is thought that the most remarkable effect will be acquired if a dent shape is a symmetrical V character shape.

  Further, as shown in FIG. 16, the depth of the recess in the above-described recess shape is determined by using the carrier tape manufacturing mold 36 having the inter-recess wall 41 having the end face 43 not having the recess shape. When manufactured, the depth is preferably deeper than the depth of the dent that may occur in the lower surface 51 of the space 34 between the receiving holes 32. In particular, the depth of the dent in the dent shape is preferably 1.2 times or more the depth of the dent that may occur on the lower surface 51 of the space portion 34 between the receiving holes 32 when the dent shape is not provided. The upper limit is preferably 2 times or less, and more preferably 1.5 times or less. If it is twice or more, as a result of releasing stress due to the compressive load, even if the bending or bending is eliminated, there is a possibility that bending or bending to such an extent that it cannot become flat may occur.

  As shown in FIG. 2, in this embodiment, a rib 70 is provided on the inter-recess wall 66 of the second member 64 to reinforce it. Thus, by providing the rib 70, even if the thickness of the wall portion 66 between the recesses becomes thin because the arrangement pitch of the plurality of receiving holes 32 becomes narrow, the recesses are caused by the stress received from the male die 37 at the time of punching. The inconvenience that the inter-wall portion 66 is damaged can be made less likely to occur.

  In FIG. 2, the rib 70 is formed by a cylindrical surface having a rounded inclined surface, but may be a simple plane instead of the cylindrical surface.

  The carrier tape 31 manufacturing method shown in FIG. 13 performed using the carrier tape manufacturing die 61 including the female mold 62 shown in FIG. 2 is substantially the same as the manufacturing method described with reference to FIG. Includes the same steps.

  As shown in FIG. 1, when the male die 37 and the female die 62 constituting the carrier tape manufacturing die 61 are brought close to each other, the accommodating hole forming convex portion 39 provided in the male die 37 becomes the tape material 35. By inserting into a recess 40 for forming a receiving hole provided in the female mold 62 while punching a part of the receiving hole 32, the receiving hole 32 is formed in the tape material 35. Here, the end surface 67 of the inter-recess wall 66 of the female die 62 is in contact with the tape material 35.

  In the above-described process, a compressive load is applied to the interval portion 34 between the receiving holes 32 of the tape material 35. Due to this compressive load, the lower surface 68 of the interval portion 34 shown in FIG. Curves or bends along the 67 concave shape.

  Although not shown in FIG. 1, as described above, when the male die 37 and the female die 62 are close to each other across the tape material 35, the feed hole forming pin punches a part of the tape material 35 to form the feed hole. The feed hole 33 is further formed in the tape material 35 by being inserted into the concave portion for use.

  Next, when the accommodating hole forming convex portion 39 is pulled out from the accommodating hole forming concave portion 40, the stress due to the compressive load is released. This release of stress acts in a direction to eliminate the bending or bending of the lower surface 68 described above. Therefore, the lower surface 68 of the interval portion 34 between the accommodation holes 32 returns to become flatter as indicated by the broken line in FIG.

  Using the carrier tape 31 thus manufactured, an electronic component series 44 as shown in FIG. 3 is configured. FIG. 3 corresponds to FIG. In FIG. 3, elements corresponding to those shown in FIG. 15 are denoted by the same reference numerals, and redundant description is omitted.

  Referring to FIG. 3, the receiving holes 32 formed in the carrier tape 31 accommodate one chip-like electronic component 70 at a time, as indicated by a broken line. No gap is formed between 34 and the bottom tape 46. This is because, as described above, the lower surface 68 of the spacing portion 34 is flat.

  Hereinafter, other embodiments of the present invention will be described.

  4 to 7 show modifications of the female inter-recess wall 66, which are to be the second to fifth embodiments of the present invention. 4 to 7 show only the second member 64 extracted from the female mold 62 shown in FIG. 4 to 7, elements corresponding to those shown in FIG. 2 are denoted by the same reference numerals, and redundant description is omitted.

  The concave shape of the end surface 67a of the inter-recess wall portion 66 shown in FIG. 4 is an asymmetrical V-shape when viewed in the arrangement direction of the housing hole forming concave portions. This embodiment is meaningful to clearly show that the concave shape of the end surface does not have to be symmetrical.

  The concave shape of the end surface 67b of the inter-recess wall portion 66 shown in FIG. 5 is a W-shape and is bilaterally symmetric when viewed in the arrangement direction of the recesses for forming the receiving holes. In this embodiment, the concave shape of the end surface is meaningful to clearly indicate that the center may not be the most concave.

  The recess shape of the end surface 67c of the inter-recess wall portion 66 shown in FIG. 6 is stepped when viewed in the arrangement direction of the housing hole forming recesses, and is symmetrical.

  The concave shape of the end surface 67d of the inter-recess wall portion 66 shown in FIG. 7 is arcuate and symmetric when viewed in the arrangement direction of the recesses for forming the receiving holes.

  While the present invention has been described with reference to the illustrated embodiment, various other modifications are possible within the scope of the present invention.

  For example, although the female mold 62 shown in FIG. 2 has a three-part structure, the carrier tape manufacturing mold according to the present invention may include an integrated female mold.

  Further, the present invention is not limited to the manufacture of the carrier tape 31 shown in FIG. 13, but can be naturally applied to the manufacture of carrier tapes having other dimensional relationships.

31 Carrier Tape 32 Housing Hole 33 Feeding Hole 34 Spacing Portion 35 Tape Material 37 Male Mold 39 Housing Hole Forming Convex 40 Housing Hole Forming Concave 42 Opening 44 Electronic Component Series 45 Top Tape 46 Bottom Tape 61 Mold for Making Carrier Tape 62 Female mold 63 First member 64 Second member 65 Third member 66 Inter-recess wall portions 67, 67a, 67b, 67c, 67d End face 71 Electronic component

Claims (8)

For manufacturing carrier tapes, which are used to manufacture a carrier tape provided with a plurality of receiving holes for storing electronic components inside in the thickness direction while being arranged in the longitudinal direction from a cardboard tape material Mold,
A male mold and a female mold are provided so as to be close to and away from each other.
Corresponding to the plurality of receiving holes to be formed, the male mold has a plurality of receiving hole forming convex portions arranged therein, and the female mold has a plurality of receiving portions respectively receiving the receiving hole forming convex portions. The recesses for forming holes are arranged, and a wall portion between the recesses is formed between the adjacent recesses for forming the receiving hole, and the wall portion between the recesses has an end face positioned alongside the opening of the recess for forming the receiving hole. Have
When the male mold and the female mold are close to each other across the tape material, the accommodating hole forming convex portion is one of the tape materials in a state where the end surface of the wall portion between the recesses is in contact with the tape material. The housing hole is formed in the tape material by being inserted into the housing hole forming recess while punching out a part,
The end surface of the inter-recess wall portion has a concave shape when viewed in the arrangement direction of the recesses for forming the accommodation holes.
Mold for carrier tape manufacturing.   The method according to claim 1, which is applied to manufacture a carrier tape, which is measured in the arrangement direction of the receiving holes and has a shorter dimension between the receiving holes than a size of the receiving holes. The mold for manufacturing the carrier tape as described.   3. The carrier tape manufacturing mold according to claim 1, wherein the concave shape is a concave shape starting from both ends of the end face when viewed in the arrangement direction of the receiving hole forming recesses.   The carrier tape manufacturing die according to any one of claims 1 to 3, wherein the concave shape is a symmetrical shape when viewed in the arrangement direction of the receiving hole forming concave portions.   The carrier tape manufacturing die according to any one of claims 1 to 4, wherein the concave shape is a V-shape when viewed in the arrangement direction of the receiving hole forming concave portions.   When the carrier tape is manufactured using a carrier tape manufacturing mold having an inter-recess wall having an end surface that does not have a recess shape, the depth of the recess in the recess shape is the recess in the space between the receiving holes. The mold for manufacturing a carrier tape according to any one of claims 1 to 5, wherein the mold is deeper than a depth of a dent that may occur on a surface in contact with the intermediate wall portion.   The female mold includes a first member having a first side surface that provides a first wall surface that defines the recess for forming the accommodation hole, and a wall portion between the recesses located between the adjacent projections for forming the accommodation hole. A second member to be provided, and a third member having a second side surface for providing a second wall surface opposite to the first wall surface defining the recess for forming the accommodation hole provided by the first side surface The mold for manufacturing a carrier tape according to any one of claims 1 to 6, comprising a combination. A step of preparing a tape material;
Preparing a carrier tape manufacturing mold according to any one of claims 1 to 7,
Disposing the tape material between the male mold and the female mold;
Forming a receiving hole in the tape material by bringing the male mold and the female mold close to each other;
A method for manufacturing a carrier tape.

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