CN103862524B - The manufacture method of carrier band die for manufacturing and carrier band - Google Patents
The manufacture method of carrier band die for manufacturing and carrier band Download PDFInfo
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- CN103862524B CN103862524B CN201310683416.3A CN201310683416A CN103862524B CN 103862524 B CN103862524 B CN 103862524B CN 201310683416 A CN201310683416 A CN 201310683416A CN 103862524 B CN103862524 B CN 103862524B
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Abstract
The present invention provides a kind of mould, this mould for utilize the band of ground paper to produce to be provided with for electronic devices and components are housed therein and carry out in the longitudinal direction arranging and multiple holes through in a thickness direction, carrier band, even if the spacing between hole is comparatively narrow, also ensure that constitute electronic devices and components with time be pasted with between the hole of lower closure the flatness of lower surface of compartment.The end face (67) in the recess partition portion (66) between the multiple hole formation recesses receiving hole formation protuberance respectively in die (62) is formed concave shape by this mould.And, the face towards end face (67) of compartment (34) is curved along concave shape because of the compressive load brought when hole formation protuberance is embedded in hole formation recess or bends, but next, when hole formation protuberance is extracted and is discharged stress, the compartment (34) between hole, the face that is pasted with lower closure return to more smooth state.
Description
Technical field
The present invention relates to a kind of carrier band die for manufacturing and the manufacture method of the carrier band using this mould to implement, being provided with the carrier band for electronic devices and components are housed in internal multiple holes for utilizing the band of ground paper to produce, the plurality of hole arranges and through in a thickness direction in the longitudinal direction.
Background technology
As the technology that the present invention pays close attention to, for instance, Japanese Patent Laid-Open 2003-334795 publication (patent documentation 1) describes a kind of carrier band and manufactures the mould that carrier band uses.First, with reference to Fig. 8, the carrier band described in patent documentation 1 is illustrated.
Carrier band 1 is formed with the multiple holes 2 arranged at equal intervals along its length direction.Hole 2 is for housing the electronic devices and components of such as shaped like chips (in Fig. 8 not shown) therein singly, and is configured with the state at the through carrier band 1 of thickness direction.
Carrier band 1 also includes the multiple sprocket holes 3 being arranged in parallel with the orientation in above-mentioned multiple holes 2.The ratio in multiple holes 2 is equally spaced arranged by sprocket hole 3 with a sprocket hole 3.
With reference to Fig. 9～Figure 11, the carrier band die for manufacturing 4 being used for manufacturing above-mentioned carrier band 1 is illustrated.Carrier band die for manufacturing 4 includes being arranged to can close to each other, the punch 5 that separates and die 6.Punch 5 is shown in fig. 11, and die 6 is not only shown in fig. 11, is also individually shown in Fig. 9 and Figure 10.First, referring especially to Fig. 9 and Figure 10, die 6 is illustrated.
As it is shown in figure 9, die 6 has multiple hole formation recess 7 and multiple sprocket hole formation recess 8.Hole formation recess 7 and sprocket hole formation die 8 are for respectively forming above-mentioned hole 2 and sprocket hole 3, arrange with the distribution corresponding with the position in the hole 2 to be formed and sprocket hole 3.
As shown in Figure 10, die 6 has the structure of one dividing into three, is made up of three components 9～11.Above-mentioned hole formation recess 7 is formed by being combined by these three component 9～11.
First component 9 has the first side 12, and this first side 12 constitutes the first wall that hole formation recess 7 is specified.Additionally, be formed with sprocket hole formation recess 8 on the first component 9.The cross section of second component 10 is L-shaped, and constitutes the wall portion between adjacent hole formation recess 7, i.e. recess partition portion 13.3rd component 11 has the second side 14, and this second side 14 is constituted with by above-mentioned first side 12 and that hole is formed the first wall specified with recess 7 is relative.
By these first to the 3rd components 9～11 are combined as illustrated in fig. 9, thus constituting die 6.In die 6, carry out regulation hole formation recess 7 by the side 12 of the first component, the recess partition portion 13 of second component 10 and the side 14 of the 3rd component 11.Reason for this is that of combination of the first to the 3rd component 9～11 is so applied in order to form hole formation recess 7, the shape of cross section making hole formation recess 7 becomes rectangle exactly, so that the shape of cross section in the hole 2 being consequently formed becomes rectangle accurately.
If the shape of cross section in hole 2 is rectangle accurately, then can not only stably house the electronic devices and components of shaped like chips, even if the gap being housed between the outer peripheral face of the electronic devices and components of shaped like chips therein and the inner peripheral surface in hole 2 is less big, also can successfully draw electronic devices and components.
It addition, when not using the combination of the first to the 3rd component 9～11 to form hole formation recess 7, for the problem in processing, it is impossible to avoid the part at the angle of the rectangle at hole formation recess 7 to be more or less formed with circular arc.On the other hand, sprocket hole is formed with the cross section of recess 8 is circle so that can easily be processed, therefore, as long as being formed on the first component 9.
As shown in figure 11, punch 5 has the multiple hole formation protuberances 15 carrying out arranging.The above-mentioned hole formation recess 7 being arranged on die 6 houses hole formation protuberance 15.It addition, in fig. 11 although not shown, but on punch 5, it is arranged with prominent multiple sprocket hole formation pins accordingly with the multiple sprocket holes 3 to be formed.Sprocket hole formation pin is contained in the sprocket hole formation recess 8 of above-mentioned die 6.
In order to manufacture carrier band 1, as shown in Figure 11 (1), prepare the band 16 of ground paper, and band 16 is arranged between punch 5 and die 6.Above-mentioned recess partition portion 13 has the end face 18 on the opening 17 that is in hole formation recess 7 position side by side.Now, the end face 18 in recess partition portion 13 becomes the state contacted with band 16, till this state is maintained to the operation shown in Figure 11 described later (3).In addition, it is necessary in advance it is noted that in fig. 11, illustrate the thickness direction size of band 16 turgidly.To representing that with cross section other accompanying drawing of band is shown too turgidly.
It follows that as shown in Figure 11 (2), make punch 5 and die 6 close to each other.Thus, a part for band 16 is carried out punching press and is embedded in hole formation recess 7 by hole formation protuberance 15, thus forming hole 2 on band 16.In Figure 11 (2), the formation result that hole 2 is represented by dashed line and the punching sheet 19 stamped out from band 16.
Additionally, although not shown in Figure 11 (2), but as it has been described above, punch 5 and die 6 clip band 16 close to each other time, a part for band 16 is carried out punching press and embeds in sprocket hole formation recess 8 by sprocket hole formation pin, thus forming sprocket hole 3 on band 16 further.
It follows that as shown in Figure 11 (3), return the state that punch 5 is separated from one another with die 6.On the band 16 being arranged on die 6, multiple holes 2 and not shown multiple sprocket holes 3 are formed.
It follows that band 16 is carried predetermined distance in the longitudinal direction by sprocket hole 3.Then, the operation that band 16 is carried in the longitudinal direction predetermined distance is clipped to repeat each operation shown in Figure 11 (1)～(3), thus producing the carrier band 1 shown in Fig. 8.
The sectional view utilizing amplification in fig. 12 represents the electronic devices and components band (Japanese: sub-component) 20 using the carrier band 1 produced as above to constitute.In fig. 12, the reference numeral that the key element mark suitable with the key element shown in Fig. 8 is same, and the repetitive description thereof will be omitted.
In electronic devices and components band 20, the electronic devices and components 21 of shaped like chips are housed in the hole 2 being formed at carrier band 1 singly.Such as application heat sealing method pastes cover tape 22 and lower closure 23 respectively at upper surface and the lower surface of carrier band 1, to prevent coming off of the electronic devices and components 21 being housed in hole 2.Cover tape 22 and lower closure 23 do not cover sprocket hole 3.
In the assembly process of electronic devices and components 21, the electronic devices and components band 20 including carrier band 1 is carried off and on by sprocket hole 3, and on the absorption position of regulation, cover tape 22 is peeled off from carrier band 1, such as use vacuum attraction that the electronic devices and components 21 in hole 2 are drawn, and the rigging position of regulation is provided to.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open 2003-334795 publication
Summary of the invention
Invent technical problem to be solved
In recent years, along with the miniaturization of electronic devices and components constantly advances, form hole on carrier band also miniaturization therewith, and the collecting number of the electronic devices and components on per unit length also correspondingly increases, therefore, the arrangement pitches in hole also continuous stricturization.
Figure 13 illustrates the carrier band 31 corresponding with the miniaturization of above-mentioned electronic devices and components.On carrier band 31, being arranged with multiple hole 32 along its length direction, the orientation with multiple holes 32 has been arranged in parallel multiple sprocket hole 33.The ratio in four holes 32 is such as equally spaced arranged by sprocket hole 33 with a sprocket hole 3.
Carrier band 31 is such as about 0.5mm and is constituted through the band of ground paper of resin dipping by thickness, if enumerating an example of size, then hole 32 above measures, in orientation (length direction of carrier band 31), the size L1 obtained and is about 0.6mm, measuring the size L2 obtained on the direction orthogonal with orientation and be about 1.1mm, the arrangement pitches P in hole 2 is about 1.0mm.Therefore, the size W measuring compartment 34 that obtain, between hole 32 in the orientation in hole 32 is about 0.4mm.
Figure 14 indicates that the figure of the manufacture method of the carrier band 31 shown in Figure 13, it is shown that forms the operation in hole 32 on band 35, be namely equivalent to the operation of operation shown in Figure 11 (2).As shown in figure 14, if making the punch 37 of composition carrier band die for manufacturing 36 and die 38 close to each other, a part for band 35 is punched out and is embedded in the hole formation recess 40 being arranged at die 38 by the hole formation protuberance 39 being then arranged on punch 37, thus forming hole 32 on band 35.
On die 38, identical with the situation of the die 6 shown in Figure 11, between adjacent hole formation recess 40, it is formed with recess partition portion 41, recess partition portion 41 has end face 43, and this end face 43 is positioned on the position side by side of the opening 42 with hole formation recess 40.The end face 43 in recess partition portion 41 contacts with band 35.
Additionally, although not shown in fig. 14, but as it has been described above, punch 37 and die 38 clip band 35 close to each other time, a part for band 35 is punched out by sprocket hole formation pin and embeds in sprocket hole formation recess, thus forming sprocket hole 33 on band 35 further.
Herein, as it has been described above, to be concerned with, hole 32 measures the size L1 obtained in orientation and is about 0.6mm, and the arrangement pitches P in hole 32 is about 1.0mm, and therefore, the size W of the compartment 34 between hole 32 is about 0.4mm.That is, compared with measuring, with hole 32, the size L1 obtained in orientation, the size W of the compartment 34 between hole 32 is shorter.
In this case, it has been found that easily produce problem below.
The sectional view utilizing amplification in fig .15 represents the electronic devices and components band 44 using above-mentioned carrier band 31 to constitute.In fig .15, the reference numeral that the key element mark suitable with the key element shown in Figure 13 is same, and the repetitive description thereof will be omitted.
In fig .15, for the ease of illustrating, the diagram of the electronic devices and components being housed in hole 32 is eliminated.Upper surface and lower surface at carrier band 31 are pasted with cover tape 45 and lower closure 46 respectively.Generally, cover tape 45 only its both sides of the edge extended along long side direction are pasted onto on carrier band 31, and lower closure 46 is except the part in hole 32, and its whole is all pasted onto on carrier band 31.But, in the electronic devices and components band 44 shown in Figure 15, the opposite side in hole 32 illustrates compartment 34, is formed with gap 47 between the namely adjacent compartment 34 between hole 32 and lower closure 46.The existence in such gap 47 can bring problem described later, but first speculates the reason forming gap 47.
Figure 16 is the sectional view of line A-A that the part to die 38 is amplified representing, along Figure 14.That is, Figure 16 is the sectional view when the orientation of hole formation recess 40 is observed.In figure 16, it is illustrated that be equivalent to above-mentioned first each part to the 3rd component 9,10 and 11, composition die 38 the first to the 3rd component 48,49 and 50, particularly in second component 49 illustrates recess partition portion 41.
As shown in figure 14, when a part for band 35 is punched out and is embedded in the hole formation recess 40 being arranged on die 38 by the hole formation protuberance 39 being arranged on punch 37, band 35 will be introduced in hole formation recess 39.Now, in a thickness direction to the part on the end face 43 in recess partition portion 41 of band 35, namely between hole 32 compartment 34 effect have bigger compressive load.
Especially, the carrier band obtained carrier band 31 as shown in fig. 13 that is such, compared with measuring, in orientation, the size L1 that obtains with hole 32, the size W of the compartment 34 between hole 32 is more short, namely, compared with the hole formation thickness T1 of protuberance 39 represented in Figure 14, the thickness T2 in the recess partition portion 41 being formed between recess 40 in adjacent hole is more thin, and above-mentioned compressive load is more big.
When on the thickness direction of carrier band 35, effect has above-mentioned compressive load, the lower surface 51 of the compartment 34 between the hole 32 of band 35 is in the state that the end face 43 with recess partition portion 41 contacts, accordingly, it is capable to maintain flat state.
It follows that leave die 38 at punch 37, hole formation protuberance 39 is when extracting from hole formation recess 40, the stress that above-mentioned compressive load causes is released.As a result, it is possible to the lower surface 51 of the compartment 34 between speculating the hole 32 keeping flat state along the end face 43 in recess partition portion 41 produces bigger depression as shown in phantom in Figure 16.
On the other hand, upper surface 52 for the compartment 34 between hole 32, when hole formation protuberance 39 is embedded in hole formation recess 40, do not produce the effect of any its flat shape of maintenance, therefore, compressive load is not easily concentrated, thus as shown in phantom in Figure 16, hole formation protuberance 39 from hole formation recess 40 extract time the deflection of upper surface 52 fewer than the deflection of lower surface 51.
Gap 47 shown in above-mentioned Figure 15 comes from the depressed deformation of the lower surface 51 of above-mentioned band 35.In electronic devices and components band 44, if being formed with gap 47, then can cause problems with.
Using electronic devices and components with, in the assembly process of the electronic devices and components of 44, generally, using suction nozzle to draw electronic devices and components based on vacuum attraction.In the case, in order to improve the efficiency utilizing this suction nozzle to draw electronic devices and components, sometimes adopt following methods: namely, suction nozzle is not carried out the start/stop control of attraction action, and make it be in attraction state all the time, and by making suction nozzle near drawing electronic devices and components.
Should in aforementioned manners time, owing to gap 47 becomes the passage of air, therefore, compared with the situation of very close to each other 47, the captivation of suction nozzle can be strengthened, and, captivation is also possible to can produce deviation because of the difference of gap 47 size.Thus, if captivation strengthens or produces deviation, then can cause problems with: even if suction nozzle is in distance electronic devices and components remote position, also electronic devices and components can be lifted from hole 32, or make absorption failure, or draw with inappropriate posture, also or namely enable and draw rightly, also can damage electronic devices and components.
Therefore, it is an object of the invention to provide a kind of carrier band die for manufacturing being not likely to produce the problems referred to above and the manufacture method of the carrier band using this mould to implement.
Solve the technical scheme that technical problem adopts
The present invention relates to a kind of carrier band die for manufacturing, this carrier band die for manufacturing for utilize the band of ground paper to manufacture to be provided with for electronic devices and components are housed therein and carry out in the longitudinal direction arranging and multiple holes through in a thickness direction, carrier band.Carrier band die for manufacturing includes being arranged to punch close to each other, that separate and die, on punch, multiple hole formation protuberance it is arranged with accordingly with the multiple holes to be formed, on die, it is arranged with the multiple hole formation recesses housing hole formation protuberance respectively, and, between adjacent hole formation recess, it is formed with recess partition portion, recess partition portion has end face, and this end face is on the position side by side of the opening with hole formation recess.Punch and die clip band close to each other time, when the end face in recess partition portion contacts with band, a part for band is punched out and is embedded in hole formation recess by hole formation protuberance, thus on band formed hole.
Carrier band die for manufacturing involved in the present invention is characterised by, in order to solve above-mentioned technical problem, when observing the end face in recess partition portion from the orientation of hole formation recess, the end face in recess partition portion has concave shape.
According to the present invention, owing to the end face in recess partition portion has concave shape, therefore, when hole formation protuberance is embedded in hole formation recess, compartment effect between the hole of band is had compressive load, but the face towards end face of compartment (hereinafter referred to as " lower surface ") is curved along concave shape due to this compressive load or bends.It follows that when formation protuberance in hole is pulled out from hole formation recess, the stress that above-mentioned compressive load causes is released, but the release of this stress acts on towards the direction eliminating above-mentioned bending or bending.Therefore, the lower surface of the compartment between hole, the face that is namely pasted with lower closure can become more smooth.
It is shorter than the size in hole that the carrier band of the application present invention is preferably size that the orientation mensuration in hole obtains, compartment between hole.Such carrier band easily produces above-mentioned problem, and therefore, mould involved in the present invention is more effectively.
In the present invention, the concave shape end face in recess partition portion formed can have various form.Being preferably, when concave shape is observed in the orientation of hole formation recess, concave shape is the shape producing depression with the two ends of end face for starting point.According to this structure, following problem can be eliminated at whole compartment: that namely, by above-mentioned compressive load cause, produce bending or bending along the concave shape of lower surface of compartment；And the stress caused by this compressive load is released and causes that the concave shape of the lower surface along compartment produces bending or bending.
Furthermore it is preferred that be that concave shape is symmetrical shape when concave shape is observed in the orientation of hole formation recess.According to this structure, producing to eliminate the maximum efficiency of following problem at the central part of compartment, this problem is: that caused by above-mentioned compressive load, produce bending or bending along the concave shape of lower surface of compartment；And the stress caused by this compressive load is released and causes that the concave shape of the lower surface along compartment produces bending or bending, it is thus possible to obtain significantly more effect.
Being preferably when concave shape is observed in the orientation of hole formation recess, concave shape is V-shaped shape.Have and be used in the processing obtaining die and become easy such advantage.
Furthermore it is preferred that the cup depth for concave shape is deeper than the degree of depth in the depression using the face contacted with recess partition portion of the compartment having a recess partition portion and when this recess partition portion has the carrier band die for manufacturing of the end face not possessing concave shape to manufacture carrier band, between hole can be generated by.Thus, when constituting electronic devices and components band, can more reliably prevent formation gap between compartment and the lower closure between adjacent hole.
In carrier band die for manufacturing involved in the present invention, it is preferably die by the first component, second component and the 3rd component being combined to composition, wherein, described first component has the first side, this first side constitutes the first wall that hole formation recess is specified, described second component constitutes the recess partition portion between adjacent hole formation protuberance, 3rd component has the second side constituting the second wall, and it is relative that what this second wall was constituted with by the first side forms the first wall specified with recess to hole.By this structure, can not only easily make the shape of cross section of hole formation recess become rectangle exactly, and can also easily carry out the processing for the end face in recess partition portion being constituted concave shape.
Present disclosure additionally applies for the manufacture method of the carrier band using above-mentioned carrier band die for manufacturing to implement.The manufacture method of carrier band involved in the present invention is characterised by, including: prepare the operation of band；Prepare the operation of above-mentioned carrier band die for manufacturing；Band is arranged in the operation between punch and die；And make punch and die close to each other, thus forming the operation in hole on band.
The effect of invention
According to the present invention, as mentioned above, the face being pasted with lower closure that can make the compartment between hole becomes more smooth, thus when using obtained bringing to constitute electronic devices and components band, can make not to be easily formed between the compartment between adjacent hole and lower closure gap.
Therefore, even if application makes suction nozzle be in attraction state all the time and by making suction nozzle near the method drawing electronic devices and components in advance, it is not easy to occur accidentally make because of gap captivation strengthen or produce the such problem of deviation, thus, it is not easily caused problems with: even if suction nozzle is in leaves electronic devices and components remote position, also electronic devices and components can be lifted from hole, or make absorption failure, or draw with inappropriate posture, also or namely enable and draw rightly, also can damage electronic devices and components.
Accompanying drawing explanation
Fig. 1, for illustrating to use the carrier band die for manufacturing 61 method to manufacture carrier band of embodiments of the present invention 1, indicates that and forms the operation in hole 32 on band 35, is namely equivalent to the sectional view of the operation of the operation shown in Figure 11 (2) or the operation shown in Figure 14.
Fig. 2 is the amplification view of the line A-A along Fig. 1, indicates that the figure corresponding with Figure 16 of a part for the die 62 included by carrier band die for manufacturing 61 shown in Fig. 1.
Fig. 3 indicate that use the carrier band 31 manufactured by carrier band die for manufacturing 61 including the die 62 shown in Fig. 2 and the electronic devices and components that use this carrier band 31 to constitute with 44 sectional view.
Fig. 4 is the sectional view that the recess partition portion 66 to the die included by the carrier band die for manufacturing of embodiments of the present invention 2 is amplified representing.
Fig. 5 is the sectional view that the recess partition portion 66 to the die included by the carrier band die for manufacturing of embodiments of the present invention 3 is amplified representing.
Fig. 6 is the sectional view that the recess partition portion 66 to the die included by the carrier band die for manufacturing of embodiments of the present invention 4 is amplified representing.
Fig. 7 is the sectional view that the recess partition portion 66 to the die included by the carrier band die for manufacturing of embodiments of the present invention 5 is amplified representing.
Fig. 8 indicates that the axonometric chart of the existing carrier band 1 that the present invention pays close attention to.
Fig. 9 indicates that the axonometric chart of the die 6 included by existing carrier band die for manufacturing that the present invention pays close attention to.
Figure 10 is by the axonometric chart that is indicated separated from one another for the first to the 3rd component 9～11 constituting punch 6 shown in Fig. 9.
Figure 11 indicates that the sectional view of the punch 5 included by the die 6 shown in Fig. 9, carrier band die for manufacturing 4 and band 16, (1) represent that punch 5 and die 6 clip the state that band 16 is separated from one another, (2) represent realize after the state shown in (1) state, namely hole formation protuberance 15 included by punch 5 band 16 is punched out after state, (3) represent the state realized after the state shown in (2), namely formed after hole 2 on band 16, state that punch 5 separates from die 6.
Figure 12 is with 20 sectional views being amplified expression to the electronic devices and components using the carrier band 1 shown in Fig. 8 to constitute.
Figure 13 indicates that compared with the situation of the carrier band 1 shown in Fig. 8, can tackle the top view of the carrier band 31 of the further miniaturization of electronic devices and components.
Figure 14 indicates that the figure of the manufacture method of the carrier band 31 shown in Figure 13, indicates that the operation forming hole 32 on band 35, is namely equivalent to the sectional view of the operation of the operation shown in Figure 11 (2).
Figure 15 is used for the problem to be solved in the present invention is described, is with 44 sectional views being amplified expression to the electronic devices and components using the carrier band 31 shown in Figure 13 to constitute.
Figure 16 is the amplification view of the line A-A along Figure 14, it is shown that the recess partition portion 41 of die 38.
Detailed description of the invention
Embodiments described below is for manufacturing the carrier band 31 shown in Figure 13, and this carrier band 31 meets the following conditions: namely, and compared with measuring, with hole 32, the size L1 obtained in orientation, the size W of the compartment 34 between hole 32 is shorter.
Figure 1 illustrates the carrier band die for manufacturing 61 of embodiments of the present invention 1.It addition, the cross section that the cross section that figure 1 illustrates of carrier band die for manufacturing 61 and above-mentioned carrier band die for manufacturing 36 figure 14 illustrates is substantially identical.Therefore, at Fig. 1 and represent along in the Fig. 2 in the cross section of the line A-A of Fig. 1, the reference numeral that the key element mark suitable with the key element shown in Figure 16 of Figure 14 and the cross section representing the line A-A along Figure 14 is identical, and the repetitive description thereof will be omitted.
Feature structure in carrier band die for manufacturing 61 shown in Fig. 1 is to have die 62, and this point is well represented in fig. 2.
Referring especially to Fig. 2, die 62 is same as shown in Figure 16, has the structure of the one dividing into three being made up of the first to the 3rd component 63,64 and 65.Herein, if paying close attention to the recess partition portion 66 being arranged on second component 64, then when the direction shown in the sectional view of the line A-A along Fig. 1 and Fig. 2 is observed, namely, when hole formation is observed with the orientation of recess 40, the end face 67 being on the position side by side of the opening 42 with hole formation recess 40 has concave shape.
If as it has been described above, die 62 has the structure of one dividing into three, then can not only easily make the shape of cross section of hole formation recess 40 become rectangle exactly, and can also easily carry out the processing for the end face in recess partition portion 66 being formed concave shape.
In addition, as mentioned above, if the end face 67 in recess partition portion 66 has concave shape, then as shown in Figure 1, when hole formation protuberance 39 is embedded in hole formation recess 40, compartment 34 between the hole 32 of band 35 is acted on and has compressive load, and the lower surface 68 that compartment 34 is in the drawings bends along the concave shape of end face 67 or bending as illustrated in solid line in figure 2 due to this compressive load.It addition, the upper surface 69 that compartment 34 is in the drawings is not substantially affected by the impact of the concave shape of end face 67.
It follows that when hole formation protuberance 39 is extracted from hole formation recess 40, the stress that above-mentioned compressive load causes is released, but the release of this stress acts on towards the direction bending or bending eliminating above-mentioned lower surface 68.Accordingly, it is capable to make the lower surface 68 of the compartment 34 between hole 32 become more smooth as shown in phantom in Figure 2.
Especially, in the present embodiment, when hole formation is observed with the orientation of recess 40, concave shape is the symmetrical shape producing depression with the two ends of end face 67 for starting point, and is V-shaped shape.According to this structure, the bending or bending that produce as follows can be eliminated at whole compartment 34, bending that concave shape that the release of the stress caused by bending that namely, the concave shape of the lower surface 68 along compartment 34 that above-mentioned compressive load causes produces or bending and this compressive load causes, along lower surface 68 produces or bending, and, bending that the concave shape along lower surface 68 produces can also be made or bend and their central part at compartment 34 that eliminates produces maximum, it is thus possible to obtain significantly more effect.If additionally, concave shape is V-shaped shape, then producing following advantage, being namely used for obtaining die 62, the particularly processing of second component 64 and becoming easy.Furthermore it is possible to think if concave shape is symmetrical V-shaped shape, then can obtain the most significant effect.
In addition, as shown in figure 16, the degree of depth that the above-mentioned cup depth in concave shape is preferably the depression that the lower surface 51 of the compartment 34 having a recess partition portion 41 than use and when this recess partition portion 41 has the carrier band die for manufacturing 36 of the end face 43 not possessing concave shape to manufacture carrier band 31, between hole 32 can be generated by is deep.Especially, more than 1.2 times of the degree of depth of the above-mentioned depression that the lower surface 51 of the compartment 34 between hole 32 when the degree of depth of the depression in concave shape is preferably do not have concave shape can be generated by, but about the upper limit, it is preferred to less than 2 times, more preferably less than 1.5 times.If this is because, more than 2 times, though the stress then caused by compressive load be released after as a result, make bending or bending be eliminated, it is nonetheless possible to produce to become bending or the bending of smooth degree.
As in figure 2 it is shown, in the present embodiment, it is provided with the flank 70 for it is strengthened in the recess partition portion 66 of second component 64.Thus, by arranging flank 70, the situation even the arrangement pitches in multiple hole 32 narrows etc. so that the wall thickness in recess partition portion 66 is thinning, remain to make recess partition portion 66 when punching because occurring the problem of breakage to be more not susceptible to from punch 37 subjected to stress.
It addition, in fig. 2, the inclined plane of flank 70 is formed by the barrel surface with circular arc but it also may replace barrel surface by simple plane.
The manufacture method including the carrier band 31 shown in that the carrier band die for manufacturing 61 of the die 62 shown in Fig. 2 is implemented, Figure 13 is used to comprise the operation substantially identical with the manufacture method illustrated with reference to Figure 14.
As shown in Figure 1, if making the punch 37 of composition carrier band die for manufacturing 61 and die 62 close to each other, a part for band 35 is punched out and is embedded in the hole formation recess 40 being arranged on die 62 by the hole formation protuberance 39 being then arranged on punch 37, thus forming hole 32 on band 35.Herein, the end face 67 in the recess partition portion 66 of die 62 contacts with band 35.
In above-mentioned operation, the compartment 34 between the hole 32 of band 35 is acted on and has compressive load, and the lower surface 68 that compartment 34 is in the drawings bends along the concave shape of end face 67 or bending as illustrated in solid line in figure 2 due to this compressive load.
Although it is not shown in FIG, but as mentioned above, punch 37 and die 62 clip band 35 close to each other time, a part for band 35 is punched out and is embedded in sprocket hole formation recess by sprocket hole formation pin, thus forming sprocket hole 33 on band 35 further.
It follows that when hole formation protuberance 39 is extracted from hole formation recess 40, the stress that above-mentioned compressive load causes is released.The release of this stress acts on towards the direction of the bending or bending that eliminate above-mentioned lower surface 68.Accordingly, it is capable to make the lower surface 68 of the compartment 34 between hole 32 recover more smooth as shown in phantom in Figure 2.
The carrier band 31 so produced is used to carry out the electronic devices and components band 44 shown in pie graph 3.Fig. 3 is the figure corresponding with Figure 15.In figure 3, the reference numeral that the key element mark suitable with the key element shown in Figure 15 is same, and the repetitive description thereof will be omitted.
With reference to Fig. 3, shown in dotted line, the electronic devices and components 71 of shaped like chips are housed in the hole 32 being formed at carrier band 31 singly, and are formed without gap between compartment 34 and the lower closure 46 between adjacent hole 32.As it has been described above, this is owing to making the lower surface 68 of compartment 34 become smooth reason.
Hereinafter, other embodiment of the present invention is illustrated.
Fig. 4～Fig. 7 is embodiments of the present invention 2 to 5 respectively, it is shown that the variation in the recess partition portion 66 of die.Second component 64 in die 62 shown in Fig. 2 is only taken out and is indicated by Fig. 4～Fig. 7.In Fig. 4～Fig. 7, the reference numeral that the key element mark suitable with the key element shown in Fig. 2 is same, and the repetitive description thereof will be omitted.
When the orientation of hole formation recess is observed, the concave shape of the end face 67a in the recess partition portion 66 shown in Fig. 4 is left-right asymmetry V-shaped shape.The meaning of present embodiment is in that the concave shape having expressed end face can not be symmetrical.
When the orientation of hole formation recess is observed, the concave shape of the end face 67a in the recess partition portion 66 shown in Fig. 5 is W glyph shape, and symmetrical.The meaning of present embodiment is in that to have expressed the concave shape of end face and can not be concavity and obtain maximum.
When the orientation of hole formation recess is observed, the concave shape of the end face 67c in the recess partition portion 66 shown in Fig. 6 is stepped and symmetrical.
When the orientation of hole formation recess is observed, the concave shape of the end face 67d in the recess partition portion 66 shown in Fig. 7 is arc-shaped, and symmetrical.
Above, the present invention is illustrated explicitly with embodiment illustrated, but can have other various variation within the scope of the invention.
Such as, the die 62 shown in Fig. 2 is the structure of one dividing into three, but carrier band die for manufacturing involved in the present invention can also include the die of integrative-structure.
Additionally, the present invention is not limited to the manufacture of the carrier band 31 shown in Figure 13, it is of course also possible to be applied to the manufacture with the carrier band of other size relationship.
Label declaration
31 carrier bands
32 holes
33 sprocket holes
34 compartments
35 carrier bands
37 punch
39 hole formation protuberances
40 hole formation recesses
42 openings
44 electronic devices and components bands
45 cover tapes
46 lower closures
61 carrier band die for manufacturing
62 dies
63 first components
64 second components
65 the 3rd components
66 recess partition portions
67,67a, 67b, 67c, 67d end face
71 electronic devices and components
Claims (6)
1. a carrier band die for manufacturing, for utilize the band of ground paper to produce to be provided with for electronic devices and components are housed therein and carry out in the longitudinal direction arranging and multiple holes through in a thickness direction, carrier band, it is characterised in that
Described carrier band die for manufacturing includes being arranged to punch close to each other, that separate and die,
On described punch, multiple hole formation protuberance it is arranged with accordingly with the multiple described hole to be formed, on described die, it is arranged with the multiple hole formation recesses housing described hole formation protuberance respectively, and between adjacent described hole formation recess, it is formed with recess partition portion, described recess partition portion has the end face on the opening that is in described hole formation recess position side by side
Described punch and described die clip described band close to each other time, when the described end face in described recess partition portion contacts with described band, a part for described band is punched out and is embedded in described hole formation recess by described hole formation protuberance, thus forming described hole on described band
When the orientation of described hole formation recess is observed, the described end face in described recess partition portion has concave shape,
Described carrier band die for manufacturing is applicable to manufacture following carrier band, and the size that this carrier band measures compartment that obtain, between described hole in the orientation in described hole is shorter than the size in described hole,
Cup depth in described concave shape is deeper than the degree of depth of the depression that the face contacted with described recess partition portion on the compartment when use has recess partition portion and this recess partition portion has the carrier band die for manufacturing of the end face not possessing concave shape to manufacture carrier band, between hole can be generated by.
2. carrier band die for manufacturing as claimed in claim 1, it is characterised in that
When the orientation of described hole formation recess is observed, described concave shape is the shape producing depression with the two ends of described end face for starting point.
3. carrier band die for manufacturing as claimed in claim 1, it is characterised in that
When the orientation of described hole formation recess is observed, described concave shape is symmetrical shape.
4. carrier band die for manufacturing as claimed in claim 1, it is characterised in that
When the orientation of described hole formation recess is observed, described concave shape is V-shaped shape.
5. carrier band die for manufacturing as claimed in claim 1, it is characterised in that
Described die is by being combined the first component, second component and the 3rd component and constitute, wherein, described first component has the first side, this first side constitutes the first wall that described hole formation recess is specified, described second component constitutes the recess partition portion between adjacent described hole formation protuberance, 3rd component has the second side constituting the second wall, and it is relative that what this second wall was constituted with by described first side forms described first wall specified with recess to described hole.
6. the manufacture method of a carrier band, it is characterised in that including:
Prepare the operation of band；
The operation of preparation carrier band die for manufacturing according to any one of claim 1 to 5；
The operation of described band is configured between described punch and described die；And
Make described punch and described die close to each other, thus forming the operation in hole on described band.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012272917A JP5794219B2 (en) | 2012-12-14 | 2012-12-14 | Mold for manufacturing carrier tape and method for manufacturing carrier tape |
| JP2012-272917 | 2012-12-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103862524A CN103862524A (en) | 2014-06-18 |
| CN103862524B true CN103862524B (en) | 2016-07-20 |
Family
ID=50901841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310683416.3A Active CN103862524B (en) | 2012-12-14 | 2013-12-13 | The manufacture method of carrier band die for manufacturing and carrier band |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5794219B2 (en) |
| CN (1) | CN103862524B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109606780B (en) * | 2019-01-28 | 2024-03-19 | 昆山琨明电子科技有限公司 | Automatic forming and packaging die for bent SMD components |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07112399A (en) * | 1993-10-19 | 1995-05-02 | Tdk Corp | Punching method for tape-form member |
| CN2664885Y (en) * | 2003-12-24 | 2004-12-22 | 天津市双鹿电子元件包装材料有限责任公司 | Deep type cell carried belt forming mould |
| CN2806094Y (en) * | 2005-02-05 | 2006-08-16 | 方隽云 | Counter die of piercing die |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003334795A (en) * | 2002-05-17 | 2003-11-25 | Okuix:Kk | Metal mold for manufacturing carrier tape |
| JP5358510B2 (en) * | 2010-04-21 | 2013-12-04 | 信越ポリマー株式会社 | Embossed carrier tape, method for manufacturing the same, and packaged part wound body |
| JP5789399B2 (en) * | 2011-04-07 | 2015-10-07 | ローム株式会社 | Carrier tape manufacturing method and carrier tape manufacturing apparatus |
-
2012
- 2012-12-14 JP JP2012272917A patent/JP5794219B2/en active Active
-
2013
- 2013-12-13 CN CN201310683416.3A patent/CN103862524B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07112399A (en) * | 1993-10-19 | 1995-05-02 | Tdk Corp | Punching method for tape-form member |
| CN2664885Y (en) * | 2003-12-24 | 2004-12-22 | 天津市双鹿电子元件包装材料有限责任公司 | Deep type cell carried belt forming mould |
| CN2806094Y (en) * | 2005-02-05 | 2006-08-16 | 方隽云 | Counter die of piercing die |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5794219B2 (en) | 2015-10-14 |
| CN103862524A (en) | 2014-06-18 |
| JP2014117759A (en) | 2014-06-30 |
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