CN109606780B - Automatic forming and packaging die for bent SMD components - Google Patents
Automatic forming and packaging die for bent SMD components Download PDFInfo
- Publication number
- CN109606780B CN109606780B CN201910082196.6A CN201910082196A CN109606780B CN 109606780 B CN109606780 B CN 109606780B CN 201910082196 A CN201910082196 A CN 201910082196A CN 109606780 B CN109606780 B CN 109606780B
- Authority
- CN
- China
- Prior art keywords
- die
- raw material
- bending
- cutting
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 71
- 230000007246 mechanism Effects 0.000 claims abstract description 117
- 239000002994 raw material Substances 0.000 claims abstract description 107
- 238000005452 bending Methods 0.000 claims abstract description 98
- 238000005520 cutting process Methods 0.000 claims abstract description 94
- 238000004080 punching Methods 0.000 claims description 45
- 238000007667 floating Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 30
- 239000000463 material Substances 0.000 abstract description 8
- 238000009740 moulding (composite fabrication) Methods 0.000 description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 238000009954 braiding Methods 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
- B65B31/04—Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
- B65B61/04—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages
- B65B61/06—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting
- B65B61/065—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting by punching out
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses an automatic forming and packaging die for a bent SMD component, which is characterized in that a die-cutting appearance mechanism, a bending mechanism, a cutting mechanism, a die-cutting piece-dispersing mechanism and a feeding mechanism are innovatively arranged on the die, and a carrying groove for conveying a carrying belt is arranged on the die, so that the purpose of organically combining the forming and manufacturing of the SMD component with the carrying belt packaging is achieved, and the automatic forming, cutting and packaging of the SMD component can be finished at one time only by carrying out automatic feeding in a raw material mode, thereby greatly improving the production and packaging efficiency of the SMD component and meeting the requirement of high-speed automatic production of an SMT production line. Compared with the mode that SMD components are firstly molded to be made into a material belt, the production efficiency is further improved.
Description
Technical Field
The invention relates to SMD component forming and packaging equipment, in particular to an automatic forming and packaging die for a bent SMD component.
Background
SMT is an abbreviation of surface mount technology, meaning surface mount technology, and the advent of SMT has revolutionized electronics. Currently, most PCBs more or less adopt the production technology with low cost, high efficiency and reduced PCB board volume. The SMD is an abbreviation of Surface Mounted Devices, which means surface mount devices, and the wide application of SMT promotes the development of SMD, the original via components are replaced by SMD components, and meanwhile, people have the requirements of small volume and multiple functions for electronic products such as mobile phones, computers and the like, and further promote the development of SMD components to high integration and miniaturization.
At present, in order to meet the requirement of high-speed automatic application of an SMT production line, SMD components generally take a carrier tape as a packaging and transporting carrier to meet the requirement of high-speed development of the SMT production line, and the carrier tape as the SMD component packaging and transporting carrier is generally composed of a carrier tape formed with a plurality of cavities for accommodating the SMD components and a cover tape for closing the openings of the cavities, wherein the cavities are generally formed in the middle of the carrier tape in the direction of the carrier tape and are arranged at equal intervals along the length direction of the carrier tape. The speed of the SMD component carrier tape package is determined by the speed of loading the SMD component into the carrier tape cavity, and the traditional operation mode is as follows: firstly, conveying a carrier tape to a working platform of a braiding machine for positioning by a winding and conveying device; then, loading the cut piece-by-piece SMD components into a cavity of a carrier tape by a manual or mechanical arm, and finally, enabling the cover tape and the carrier tape to be attached and sealed by a hot pressing device, thereby completing the packaging of the SMD components; the manual feeding is adopted, a large amount of manpower is required to be input, the operation packaging efficiency is low, the cost is high, and the quality of products is difficult to ensure by manual operation. The other type is that the material is automatically taken by a mechanical arm, and cut scattered SMD components are put into a cavity of a carrier tape; in the operation mode, as the manipulator needs a certain time in the movement process, the SMD component carrier tape packaging efficiency is still low, and the high-speed automatic production requirement of the SMT production line cannot be met. In particular, for some punching sheets like elastic sheets or nickel sheets, because the elastic sheets or nickel sheets are lighter and thinner, the thickness of the product is only 0.1mm, the product is planar and L-shaped or abnormal, and the product has front and back directions, when the product is packaged in the operation mode, the problems of material clamping of a vibration disc, low efficiency in direction identification and high feeding and grabbing difficulty of a manipulator exist. Even some products can not meet the packaging requirement of an automatic braiding machine at all, and only manual operation modes can be adopted. Therefore, patent document CN203332436U proposes an automatic feeding and cutting device for packaging SMD component carrier tape, which automatically feeds SMD components in a material tape form, and realizes automatic positioning, cutting and feeding packaging of the SMD components through an automatic feeding positioning device and a cutting device, thereby greatly improving the packaging efficiency of the SMD component carrier tape and meeting the requirement of high-speed automatic production of an SMT production line to a certain extent. However, the SMD component is first molded into a tape form, and the production efficiency is still further improved.
Disclosure of Invention
In order to solve the technical problems, the invention provides the automatic forming and packaging die for the bent SMD components, which organically combines the forming and manufacturing of the SMD components with the carrying packaging, and can finish the automatic forming, manufacturing, cutting and packaging of the SMD components at one time only by automatically feeding the SMD components in a raw material mode, thereby greatly improving the production and packaging efficiency of the SMD components and meeting the requirement of high-speed automatic production of an SMT production line.
The technical scheme of the invention is realized as follows:
the utility model provides a bending SMD components and parts automatic molding packaging mould, includes upper mould, lower mould and install in last mould reaches shaping packagine machine constructs on the lower mould, shaping packagine machine constructs including along die-cut appearance mechanism, bending mechanism, cutting mechanism, die-cut scattered piece mechanism and the feeding mechanism that die-cut length direction set gradually, be formed with the carrier band groove that sets up along the die width direction on the lower mould for the carrier band of packing SMD components and parts wears to locate in the carrier band groove, be formed with a plurality of die cavity of equidistant arrangement along its length direction on the carrier band, die-cut appearance mechanism includes install in appearance edge group on the lower mould and install in appearance drift group on the upper mould; the bending mechanism comprises a bending lower die inlet block arranged on the lower die and a bending upper die inlet block arranged on the upper die; the cutting mechanism comprises a cutting edge, a cutting cushion block and a cutting punch head, wherein the cutting edge and the cutting cushion block are arranged on the lower die, the cutting punch head is arranged on the upper die, the cutting cushion block is embedded on the lower die, the carrier belt groove penetrates through the cutting cushion block, the cutting knife mask covers the carrier belt groove on the cutting cushion block, and the middle part of the cutting knife opening is provided with a blanking hole penetrating through the carrier belt groove; the die-cutting and piece-dispersing mechanism comprises a die-cutting and piece-dispersing knife edge arranged on the lower die and a die-cutting and piece-dispersing punch arranged on the upper die; the raw material belt for forming the SMD components is fed from one end of the die, and the carrier belt for packaging the SMD components moves the empty cavity to the position below the blanking hole under the driving of the external coiling device; the feeding mechanism can pull the raw material belt to advance one station distance, the raw material belt is subjected to punching appearance through the appearance knife edge group and the appearance punch group at the punching appearance mechanism, the raw material belt subjected to punching appearance is subjected to bending setting angles through the bending lower die inlet block and the bending upper die inlet block at the bending mechanism, the bent raw material belt is subjected to cutting through the cutting knife edge and the cutting punch at the cutting mechanism, and the formed SMD component with bending is cut from the raw material belt, so that the SMD component just can fall into a cavity of the carrier belt in the carrier belt groove through a blanking hole on the cutting knife edge; the die-cut piece-dispersing mechanism is arranged between the feeding mechanism and the cutting mechanism, the cutting mechanism does not work before the raw material belt is not connected to the feeding mechanism, and the formed SMD component with bending is cut off from the raw material belt through the die-cut piece-dispersing punch and the die-cut piece-dispersing knife edge of the die-cut piece-dispersing mechanism.
Further, two sets of forming and packaging mechanisms are arranged, the two sets of forming and packaging mechanisms are arranged at intervals along the width direction of the die, each set of forming and packaging mechanism corresponds to one raw material belt, and the two sets of forming and packaging mechanisms simultaneously perform forming and packaging operations on the two raw material belts which enter the die at the same time.
Further, the lower mould includes lower bolster, lower bolster and die holder that top-down set gradually, the carrier groove the appearance edge of a knife group the lower mould income piece of bending the edge of a knife cut the cushion cuts the cushion the die-cut loose piece edge of a knife all imbeds and installs in on the top surface of lower bolster, the upper mould includes take off flitch, take off backplate, cope match-plate pattern, upper bolster and the upper die base that sets gradually from bottom to top, the appearance punch group cut the punch the die-cut loose piece punch all install in on the cope match-plate pattern, and pass in proper order take off backplate and take off the flitch, the upper mould income piece top centre gripping of bending is located take off the flitch with take off between the backplate, just the upper mould income piece bottom of bending is followed take off the flitch and wear out.
Further, the profile punch set includes a positioning hole punch for punching a positioning hole in the middle of the raw material belt, a first edge punch for punching one side edge of the raw material belt, and a second edge punch for punching the other side edge of the raw material belt to form the profile of the SMD component, and the profile punch set is formed with a positioning Kong Daokou corresponding to the positioning hole punch, a first edge corresponding to the first edge punch, and a second edge corresponding to the second edge punch.
Further, the structure of the feeding mechanism capable of pulling the raw material belt to advance one station is as follows: the feeding mechanism comprises a shovel base, a sliding block, a reset spring, two buoyancy lifting hanging blocks, two buoyancy lifting stopping blocks and a plurality of buoyancy lifting pieces, wherein the two buoyancy lifting hanging blocks, the two buoyancy lifting stopping blocks and the plurality of buoyancy lifting pieces are in one-to-one correspondence with the two raw material belts, the shovel base and the sliding block are formed with mutually matched inclined guide surfaces, the top of the buoyancy lifting hanging block is provided with a driving convex point for driving the raw material belts in a unidirectional manner, the top of the buoyancy lifting stopping block is provided with a stopping convex point for preventing the raw material belts from retreating, the lower die plate is provided with a sliding groove, the sliding block is slidably arranged in the sliding groove along the length direction of the die, the top end of the shovel base is clamped and positioned between the stripping plate and the stripping plate, the bottom end of the shovel base penetrates out from the stripping plate, and the reset spring is positioned and installed between the sliding block and the sliding groove; the two buoyancy lifting hanging blocks are arranged on the sliding block in a vertically floating mode, the two buoyancy lifting stopping blocks are arranged on the lower die plate in a vertically floating mode, and the plurality of buoyancy lifting pieces are arranged on the lower die plate in a vertically floating mode along the raw material carrying away direction; in the die opening state, a plurality of floating pieces lift the raw material belt from the lower die plate to set the height, in the die closing process, the shovel base drives the sliding block to advance by one station distance along the feeding direction of the raw material belt through the inclined guide surface, so that the reset spring compresses and stores energy and drives the floating hanging block to advance by one station distance, the floating hanging block drives the raw material belt to advance by one station distance through the hanging connection of the driving protruding point and the lifting positioning hole, the floating stop block stops the positioning hole through the stopping protruding point after the raw material belt advances by one station distance, and in the die opening process, the plurality of floating pieces lift the raw material belt again from the lower die plate to set the height, the shovel base is gradually separated from the sliding block along with the upper die, and the reset spring drives the sliding block and the driving protruding point to reset.
Furthermore, the coiling device is provided with an indexing gear, the free end of the carrier tape is arranged on the indexing gear, and the coiling device drives the indexing gear to rotate for a certain angle, so that the indexing gear drives the carrier tape to move for a set distance.
Further, the lower bending module comprises a lower bending module A for bending 45 degrees and a lower bending module B for bending 90 degrees, and the upper bending module comprises an upper bending module A for bending 45 degrees in cooperation with the lower bending module A and an upper bending module B for bending 90 degrees in cooperation with the lower bending module B.
Further, a limit cover plate is arranged on the carrier belt groove except the cutting mechanism, and is fixedly connected to the lower die plate and covers the carrier belt groove to limit the carrier belt in the carrier belt groove.
Further, along the raw material belt advancing direction, install on the lower bolster right and left sides of raw material belt carries out spacing first baffle and second baffle, first baffle top surface orientation raw material belt's one side is formed with first backstop rim, second baffle top surface orientation raw material belt's one side is formed with the second backstop rim.
Further, the die comprises a channel connected to an external vacuumizing device, the channel comprises a first air hole arranged in the lower base plate along the width direction of the die and a second air hole arranged in the cutting cushion block along the height direction of the die, the first air hole is communicated with the second air hole and the carrier belt groove, and a vacuumizing hole is formed in the bottom of the cavity of the carrier belt.
The beneficial effects of the invention are as follows: the invention provides an automatic forming and packaging die for a bent SMD component, which is characterized in that a die-cutting appearance mechanism, a bending mechanism, a cutting mechanism, a die-cutting piece-dispersing mechanism and a feeding mechanism are innovatively arranged on the die, and a carrying groove for conveying a carrying belt is arranged on the die, so that the purpose of organically combining the forming and manufacturing of the SMD component with the carrying belt packaging is achieved, and the automatic forming, cutting and packaging of the SMD component can be finished at one time only by carrying out automatic feeding in a raw material mode, thereby greatly improving the production and packaging efficiency of the SMD component and meeting the requirement of high-speed automatic production of an SMT production line. Compared with the mode that SMD components are firstly molded to be made into a material belt, the production efficiency is further improved.
Drawings
Fig. 1 is a schematic structural diagram of an automatic forming and packaging mold for bending SMD components of the present invention;
FIG. 2 is a side view of an automatic molding packaging mold for bending SMD components of the present invention;
FIG. 3 is a top view of an automatic forming and packaging mold for a bent SMD component of the present invention;
FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;
FIG. 5 is an enlarged schematic view of the structure of FIG. 4A;
FIG. 6 is a cross-sectional view taken along line B-B in FIG. 3;
FIG. 7 is a cross-sectional view taken along line C-C of FIG. 3;
fig. 8 is a perspective view of the automatic forming and packaging die for the bent SMD component after removing most of the parts of the upper die and leaving only the punches.
Detailed Description
In order that the technical content of the present invention may be more clearly understood, the following detailed description of the embodiments is given only for better understanding of the content of the present invention and is not intended to limit the scope of the present invention.
As shown in fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7 and fig. 8, an automatic forming and packaging die for a bent SMD component comprises an upper die 1, a lower die 2 and forming and packaging mechanisms mounted on the upper die and the lower die, wherein the forming and packaging mechanisms comprise a punching appearance mechanism 3, a bending mechanism 4, a cutting mechanism 5, a punching and scattering mechanism 6 and a feeding mechanism 7 which are sequentially arranged along the length direction of the die, a carrier belt groove 8 arranged along the width direction of the die is formed on the lower die, a carrier belt 10 for packaging the SMD component is arranged in the carrier belt groove in a penetrating manner, a plurality of cavities 101 are formed on the carrier belt and are distributed at equal intervals along the length direction of the carrier belt, and the punching appearance mechanism comprises an appearance knife edge group 31 mounted on the lower die and an appearance punch head group 32 mounted on the upper die; the bending mechanism comprises a lower bending die inlet block 41 arranged on the lower die and an upper bending die inlet block 42 arranged on the upper die; the cutting mechanism comprises a cutting knife opening 51, a cutting cushion block 52 and a cutting punch 53, wherein the cutting knife opening 51 is arranged on the lower die, the cutting cushion block is arranged on the upper die in an embedded mode, the carrier groove penetrates through the cutting cushion block, the cutting knife mask covers the carrier groove on the cutting cushion block, and the middle part of the cutting knife opening is provided with a blanking hole 511 penetrating through the carrier groove; the punching and scattering sheet mechanism comprises a punching and scattering sheet knife edge 61 arranged on the lower die and a punching and scattering sheet punch 62 arranged on the upper die; a raw material belt 9 for forming SMD components is fed from one end of the die, and a carrier belt for packaging the SMD components moves an empty cavity to the position below the blanking hole under the drive of an external coiling device; the feeding mechanism can pull the raw material belt to advance one station distance, the raw material belt is subjected to punching appearance through the appearance knife edge group and the appearance punch group at the punching appearance mechanism, the raw material belt subjected to punching appearance is subjected to bending setting angles through the bending lower die inlet block and the bending upper die inlet block at the bending mechanism, the bent raw material belt is subjected to cutting through the cutting knife edge and the cutting punch at the cutting mechanism, and the formed SMD component with bending is cut from the raw material belt, so that the SMD component just can fall into a cavity of the carrier belt in the carrier belt groove through a blanking hole on the cutting knife edge; the die-cut piece-dispersing mechanism is arranged between the feeding mechanism and the cutting mechanism, the cutting mechanism does not work before the raw material belt is not connected to the feeding mechanism, and the formed SMD component with bending is cut off from the raw material belt through the die-cut piece-dispersing punch and the die-cut piece-dispersing knife edge of the die-cut piece-dispersing mechanism.
In the structure, through the die-cut appearance mechanism of innovation overall arrangement on the mould, the mechanism of bending, cut mechanism, die-cut scattered piece mechanism and feeding mechanism, and set up the carrier groove of conveying carrier tape on the mould, reached the shaping preparation and the carrier tape packing with the SMD components and parts carry out the purpose of organic combination, like this, the SMD components and parts only need carry out automatic feeding with the form of raw and other materials, just can once only accomplish the automatic molding preparation of SMD components and parts, cut and pack, very big improvement the efficiency of SMD components and parts production and packing, satisfy SMT production line high-speed automated production's needs. The invention relates to an automatic forming and packaging die for a bent SMD component, which comprises the following working principles: under the control of a PLC control system, a coiling device and a die are controlled by a driving mechanism to automatically work, before automatic working, a raw material belt is required to be connected to the feeding mechanism, and the feeding mechanism is arranged at the tail end of the die, therefore, before the raw material belt is not connected to the feeding mechanism, the cutting mechanism does not work, namely, a formed SMD component is not cut into a cavity of the carrier belt, the formed SMD component is cut out from the raw material belt by manually operating a punching scattered piece punch and a punching scattered piece knife edge of the punching scattered piece mechanism, then the free end of the raw material belt is connected to the feeding mechanism, after the formal working is started, the punching scattered piece mechanism does not work any more, at this time, the raw material belt for forming the SMD component is fed from one end of the die, and is driven by the feeding mechanism to move an empty cavity to the position below the punch, at the position of the position, the position of the die is cut out by the blanking mechanism, the blanking position (the shape) is firstly cut out position of the shape mechanism, the shape of the die is cut out position is set, the SMD component is bent, the bending position is not bent, the bending position is required to be formed by the SMD component is bent, and the bending position is not bent, the bending position is required to be formed by the SMD component is cut into the position of the bending position, and the bending position is required to be bent by the bending position, cutting the formed SMD component with the bending from a raw material belt, so that the SMD component can just fall into a cavity of a carrier belt in the carrier belt groove through a blanking hole on the cutting edge; the carrier belt is positioned in the carrier belt groove of the lower die, the raw material belt passes through the carrier belt groove, when the SMD components formed on the raw material belt reach the position above the cavity of the carrier belt in the carrier belt groove, the SMD components are connected with the raw material belt by the cutting mechanism, so that the SMD components can just fall into the cavity of the carrier belt, and the purpose of rapidly loading the SMD components on the raw material belt into the corresponding carrier belt cavity on the carrier belt is achieved.
Preferably, referring to fig. 8, two sets of forming and packaging mechanisms are provided, the two sets of forming and packaging mechanisms are arranged at intervals along the width direction of the die, each set of forming and packaging mechanism corresponds to one raw material belt, and the two sets of forming and packaging mechanisms simultaneously perform forming and packaging operations on the two raw material belts which enter the die at the same time. Therefore, the automatic forming and packaging die for the bent SMD components can integrate two sets of forming and packaging mechanisms at the same time, and the two sets of forming and packaging mechanisms can simultaneously form and package two raw material strips entering the die, so that the production and packaging efficiency of the SMD components is further improved, and the high-speed automatic production requirement of an SMT production line is better met.
Preferably, referring to fig. 2 and 8, the lower die includes a lower die plate 21, a lower backing plate 22 and a lower die holder 23 sequentially arranged from top to bottom, the carrier slot, the profile knife edge group, the bent lower die insert block, the cutting knife edge, the cutting cushion block and the die-cut scattered piece knife edge are all embedded and installed on the top surface of the lower die plate, the upper die includes a stripper plate 11, a stripper plate 12, an upper die plate 13, an upper backing plate 14 and an upper die holder 15 sequentially arranged from bottom to top, the profile punch group, the cutting punch and the die-cut scattered piece punch are all installed on the upper die plate and sequentially penetrate through the stripper plate and the stripper plate, the top end of the bent upper die insert block is clamped and positioned between the stripper plate and the stripper plate, and the bottom end of the bent upper die insert block is penetrated out from the stripper plate. The upper die holder is mainly used for placing the outer guide sleeve, the limiting column, the unloading spring and the upper die holder, and the thickness of the upper die holder is directly related to the length of the unloading spring. The upper base plate is mainly used for bearing the stress return of the punch or the insert in the punching process, and the upper die base is prevented from transmitting concave deformation. The upper die plate is also called as an upper clamping plate and is mainly used for fixing each punch and each insert and guaranteeing the action position and the precision of the parts. The back-off plate is mainly used for fixing a discharging insert such as a bending upper die inlet block, a shovel base of a feeding mechanism and a guide post, and is used for bearing concentrated stress generated in the production process of the forming insert. The stripper plate is mainly used for placing the unloading insert, and when the punching shearing of the punch is completed, the punch is separated from the punching material by the aid of the force provided by the unloading spring. The lower template is mainly used for placing a guide plate, a die insert, an inner guide sleeve and a floating block, such as a carrier groove, an outline knife edge group, a lower bending die insert, a cutting knife edge, a cutting cushion block, a cutting scattered blade edge and the like, ensuring the position accuracy and being used for bearing the side force during punching and shearing. The lower backing plate is mainly used for fixing all the workpieces mounted with the lower die plate together, and simultaneously bears the force generated during the insert stamping to prevent the lower die holder from sinking or deforming. The lower die holder is mainly used for placing the outer guide sleeve, the limiting column, the spring and the floating pin component.
Preferably, referring to fig. 8, the profile punch set includes a positioning hole punch 321 for punching a positioning hole 91 in the middle of the raw material tape, a first edge punch 322 for punching one side edge of the raw material tape, and a second edge punch 323 for punching the other side edge of the raw material tape to form the profile of the SMD component, and the profile punch set is formed with a positioning Kong Daokou 311 corresponding to the positioning hole punch, a first edge 312 corresponding to the first edge punch, and a second edge 313 corresponding to the second edge punch. Wherein, the locating hole is used for cooperating with the locating needle 210 and the pinhole 220 on the upper die and the lower die, realizing the function of locating the raw material belt, preventing the raw material belt from position movement in the punching, bending or cutting process. And the positioning hole is also used for being connected with the feeding mechanism, and the feeding mechanism pulls the positioning hole to feed. The external shape of the SMD component can be punched into a required shape according to the requirement. The first side punch and the second side punch are used for punching out the needed product appearance and the material belt structure. In other embodiments, referring to fig. 8, a pre-punched punching mechanism 230 may be further disposed at a station before the outline punch set, and two pre-punched holes may be punched at corresponding positions of the formed SMD component, so as to finally form the outline of the SMD component.
Preferably, referring to fig. 7 and 8, the structure of the feeding mechanism capable of pulling the raw material belt to advance one station is as follows: the feeding mechanism comprises a shovel base 71, a sliding block 72, a reset spring 73, two buoyancy lifting hanging blocks 74, two buoyancy lifting stopping blocks 75 and a plurality of buoyancy lifting pieces 76, wherein the two buoyancy lifting hanging blocks 74, the two buoyancy lifting stopping blocks 75 and the plurality of buoyancy lifting pieces 76 are in one-to-one correspondence with each other, inclined guide surfaces 77 which are matched with each other are formed on the shovel base and the sliding block, a driving convex point 741 for unidirectionally driving the raw material belt is formed at the top of each buoyancy lifting hanging block, a stopping convex point 751 for preventing the raw material belt from retreating is formed at the top of each buoyancy lifting stopping block, a sliding groove 211 is formed on the lower die plate, the sliding block is slidably arranged in the sliding groove along the length direction of the die, the top end of the shovel base is clamped and positioned between the stripping plate and the stripping plate, the bottom end of the shovel base penetrates out of the stripping plate, and the reset spring is positioned and installed between the sliding block and the sliding groove; the two buoyancy lifting hanging blocks are arranged on the sliding block in a vertically floating mode, the two buoyancy lifting stopping blocks are arranged on the lower die plate in a vertically floating mode, and the plurality of buoyancy lifting pieces are arranged on the lower die plate in a vertically floating mode along the raw material carrying away direction; in the die opening state, a plurality of floating pieces lift the raw material belt from the lower die plate to set the height, in the die closing process, the shovel base drives the sliding block to advance by one station distance along the feeding direction of the raw material belt through the inclined guide surface, so that the reset spring compresses and stores energy and drives the floating hanging block to advance by one station distance, the floating hanging block drives the raw material belt to advance by one station distance through the hanging connection of the driving protruding point and the lifting positioning hole, the floating stop block stops the positioning hole through the stopping protruding point after the raw material belt advances by one station distance, and in the die opening process, the plurality of floating pieces lift the raw material belt again from the lower die plate to set the height, the shovel base is gradually separated from the sliding block along with the upper die, and the reset spring drives the sliding block and the driving protruding point to reset. Therefore, under the mutual matching of the inclined guide surface on the shovel base and the inclined guide surface on the sliding block, when the shovel base moves vertically downwards in the die assembly process, the sliding block can be driven to move forwards by one station along the length direction of the die, namely the feeding direction of the raw material belt, so that the reset spring compresses and stores energy and drives the floating hanging block to move forwards by one station. Here, a plurality of buoyancy members are used for lifting the raw material belt from the lower die plate to a set height so as to lift and move the raw material belt from the lower die plate, for example, the buoyancy members comprise a plurality of buoyancy pins, floating blocks and the like; the reset spring is used for driving the sliding block and the driving convex points to reset, and the continuous feeding function of the raw material belt is realized by repeating the steps.
Preferably, the coiling device is provided with an indexing gear, the free end of the carrier tape is arranged on the indexing gear, and the coiling device drives the indexing gear to rotate for a certain angle, so that the indexing gear drives the carrier tape to move for a set distance. In this way, the coiling device drives the indexing gear, and the function of automatically driving the carrier tape to convey a set distance and position according to a program set by the PLC controller can be realized.
Preferably, referring to fig. 8, the lower bending die comprises a lower bending die a411 for bending 45 degrees and a lower bending die B412 for bending 90 degrees, and the upper bending die comprises an upper bending die a421 for bending 45 degrees in cooperation with the lower bending die a and an upper bending die B422 for bending 90 degrees in cooperation with the lower bending die B. Therefore, the bending mechanism is divided into two steps of pre-bending 45 degrees and bending 90 degrees, and the rebound of a product during bending at a large angle is avoided, so that the bending quality is ensured.
Preferably, referring to fig. 8, a limiting cover plate 24 is disposed on the carrier belt slot except for the cutting mechanism, and is fixedly connected to the lower die plate and covers the carrier belt slot to limit the carrier belt in the carrier belt slot. Therefore, the carrier belt can be limited up and down by covering the carrier belt groove through the limiting cover plate, and the carrier belt is prevented from jumping; and because the structure and the shape of the carrier belt groove and the carrier belt are the same, the carrier belt can be limited left and right, and the carrier belt is prevented from shaking left and right.
Preferably, referring to fig. 8, along the advancing direction of the raw material belt, a first baffle 25 and a second baffle 26 for limiting the left and right sides of the raw material belt are mounted on the lower die plate, a first stop edge is formed on one side of the top surface of the first baffle facing the raw material belt, and a second stop edge is formed on one side of the top surface of the second baffle facing the raw material belt. Like this, through installing first baffle and second baffle on the lower bolster, formed the track groove that supplies the raw materials area to transmit between first baffle and the second baffle, can carry out spacingly to raw materials area left and right sides, prevent that the raw materials from taking away partially, and through forming first backstop rim and second backstop rim at the top surface of first baffle and second baffle, can carry out spacing from top to bottom to the raw materials area, prevent that the raw materials from taking from jumping from top to bottom. Here, the first baffle and the second baffle can be set into a plurality of groups as a combination according to the requirement, for example, a group is set before the raw material belt is not punched, a second group is set after punching, bending and cutting Duan Shezhi, and a third group is set after cutting, so that the limit requirement of different widths of the raw material belt can be met.
Preferably, referring to fig. 4 and 5, the vacuum pump further comprises a channel 27 connected to an external vacuum device, the channel comprises a first air hole 271 arranged in the lower pad plate along the width direction of the die and a second air hole 272 arranged in the cutting pad block along the height direction of the die, the first air hole is communicated with the second air hole and the carrier belt groove, and a vacuum hole 102 is formed at the bottom of the cavity of the carrier belt. Like this, the passageway communicates to outside evacuating device, when bending SMD components and parts fall into the die cavity of carrier band, carries out the evacuation through first gas pocket, second gas pocket and evacuating hole, can firmly fix a position bending SMD components and parts in the die cavity, prevents to bend SMD components and parts departure in the motion process.
The above embodiments are described in detail with reference to the accompanying drawings. Modifications and variations in the above-described embodiments may be made by those skilled in the art without departing from the spirit of the invention, which fall within the scope of the invention.
Claims (10)
1. An automatic shaping packaging mould of SMD components and parts of bending, its characterized in that: the forming and packaging mechanism comprises an upper die (1), a lower die (2) and a forming and packaging mechanism arranged on the upper die and the lower die, wherein the forming and packaging mechanism comprises a punching outline mechanism (3), a bending mechanism (4), a cutting mechanism (5), a punching scattered piece mechanism (6) and a feeding mechanism (7) which are sequentially arranged along the length direction of the die, a carrier belt groove (8) arranged along the width direction of the die is formed on the lower die, a carrier belt (10) for packaging SMD components is arranged in the carrier belt groove in a penetrating manner, a plurality of cavities (101) which are arranged at equal intervals along the length direction of the carrier belt are formed on the carrier belt, and the punching outline mechanism comprises an outline knife edge group (31) arranged on the lower die and an outline punch group (32) arranged on the upper die; the bending mechanism comprises a lower bending die inlet block (41) arranged on the lower die and an upper bending die inlet block (42) arranged on the upper die; the cutting mechanism comprises a cutting knife opening (51), a cutting cushion block (52) and a cutting punch head (53), wherein the cutting knife opening is arranged on the lower die, the cutting cushion block is arranged on the upper die in an embedded mode, the carrier groove penetrates through the cutting cushion block, the cutting knife mask covers the carrier groove on the cutting cushion block, and a blanking hole (511) penetrating through the carrier groove is formed in the middle of the cutting knife opening; the punching and scattering sheet mechanism comprises a punching and scattering sheet knife edge (61) arranged on the lower die and a punching and scattering sheet punch (62) arranged on the upper die; a raw material belt (9) for forming the SMD components is fed from one end of the die, and a carrier belt for packaging the SMD components moves an empty cavity to the position below the blanking hole under the driving of an external coiling device; the feeding mechanism can pull the raw material belt to advance one station distance, the raw material belt is subjected to punching appearance through the appearance knife edge group and the appearance punch group at the punching appearance mechanism, the raw material belt subjected to punching appearance is subjected to bending setting angles through the bending lower die inlet block and the bending upper die inlet block at the bending mechanism, the bent raw material belt is subjected to cutting through the cutting knife edge and the cutting punch at the cutting mechanism, and the formed SMD component with bending is cut from the raw material belt, so that the SMD component just can fall into a cavity of the carrier belt in the carrier belt groove through a blanking hole on the cutting knife edge; the die-cut piece-dispersing mechanism is arranged between the feeding mechanism and the cutting mechanism, the cutting mechanism does not work before the raw material belt is not connected to the feeding mechanism, and the formed SMD component with bending is cut off from the raw material belt through the die-cut piece-dispersing punch and the die-cut piece-dispersing knife edge of the die-cut piece-dispersing mechanism.
2. The folded SMD component auto forming packaging mold of claim 1, wherein: two sets of forming and packaging mechanisms are arranged, the two sets of forming and packaging mechanisms are arranged at intervals along the width direction of the die, each set of forming and packaging mechanism corresponds to one raw material belt, and the two sets of forming and packaging mechanisms simultaneously perform forming and packaging operations on the two raw material belts which enter the die simultaneously.
3. The bent SMD component auto forming packaging mold of claim 2, wherein: the lower die comprises a lower die plate (21), a lower base plate (22) and a lower die holder (23) which are sequentially arranged from top to bottom, the carrying groove, the profile edge group, the bending lower die entering block, the cutting edge, the cutting cushion block and the punching scattered piece edge are all embedded and installed on the top surface of the lower die plate, the upper die comprises a stripper plate (11), a stripper plate (12), an upper die plate (13), an upper base plate (14) and an upper die holder (15) which are sequentially arranged from bottom to top, the profile punch group, the cutting punch and the punching scattered piece punch are all installed on the upper die plate and sequentially penetrate through the stripper plate and the stripper plate, the top end of the bending upper die entering block is clamped and positioned between the stripper plate and the stripper plate, and the bottom end of the bending upper die entering block is penetrated out from the stripper plate.
4. The folded SMD component auto-forming packaging mold according to claim 3, wherein: the profile punch set comprises a positioning hole punch (321) for punching a positioning hole (91) in the middle of the raw material belt, a first edge punch (322) for punching one side edge of the raw material belt and a second edge punch (323) for punching the other side edge of the raw material belt to form the profile of the SMD component, and the profile punch set is provided with a positioning Kong Daokou (311) corresponding to the positioning hole punch, a first edge (312) corresponding to the first edge punch and a second edge (313) corresponding to the second edge punch.
5. The bent SMD component auto forming packaging mold of claim 4, wherein: the structure that feeding mechanism can stimulate the distance that the raw material belt advances one station is: the feeding mechanism comprises a shovel base (71), a sliding block (72), a reset spring (73), two buoyancy lifting hanging blocks (74), two buoyancy lifting stopping blocks (75) and a plurality of buoyancy lifting pieces (76), wherein the two buoyancy lifting hanging blocks are in one-to-one correspondence with two raw material belts, mutually matched inclined guide surfaces (77) are formed on the shovel base and the sliding block, a driving convex point (741) for unidirectionally driving the raw material belts is formed at the top of each buoyancy lifting hanging block, a stopping convex point (751) for preventing the raw material belts from retreating is formed at the top of each buoyancy lifting stopping block, a sliding groove (211) is formed in the lower die plate, the sliding block is slidably arranged in the sliding groove along the length direction of the die, the top end of the shovel base is clamped and positioned between the stripping plate and the stripping plate, the bottom end of the shovel base penetrates out of the stripping plate, and the reset spring is positioned and installed between the sliding block and the sliding groove; the two buoyancy lifting hanging blocks are arranged on the sliding block in a vertically floating mode, the two buoyancy lifting stopping blocks are arranged on the lower die plate in a vertically floating mode, and the plurality of buoyancy lifting pieces are arranged on the lower die plate in a vertically floating mode along the raw material carrying away direction; in the die opening state, a plurality of floating pieces lift the raw material belt from the lower die plate to set the height, in the die closing process, the shovel base drives the sliding block to advance by one station distance along the feeding direction of the raw material belt through the inclined guide surface, so that the reset spring compresses and stores energy and drives the floating hanging block to advance by one station distance, the floating hanging block drives the raw material belt to advance by one station distance through the hanging connection of the driving protruding point and the lifting positioning hole, the floating stop block stops the positioning hole through the stopping protruding point after the raw material belt advances by one station distance, and in the die opening process, the plurality of floating pieces lift the raw material belt again from the lower die plate to set the height, the shovel base is gradually separated from the sliding block along with the upper die, and the reset spring drives the sliding block and the driving protruding point to reset.
6. The folded SMD component auto forming packaging mold of claim 1, wherein: the coiling device is provided with an indexing gear, the free end of the carrier tape is arranged on the indexing gear, and the coiling device drives the indexing gear to rotate for a certain angle, so that the indexing gear drives the carrier tape to move for a set distance.
7. The folded SMD component auto forming packaging mold of claim 1, wherein: the lower bending die block comprises a lower bending die block A (411) for bending 45 degrees and a lower bending die block B (412) for bending 90 degrees, and the upper bending die block comprises an upper bending die block A (421) for bending 45 degrees in cooperation with the lower bending die block A and an upper bending die block B (422) for bending 90 degrees in cooperation with the lower bending die block B.
8. The folded SMD component auto-forming packaging mold according to claim 3, wherein: and a limiting cover plate (24) is arranged on the carrier belt groove except the cutting mechanism, is fixedly connected to the lower die plate and covers the carrier belt groove, and limits the carrier belt in the carrier belt groove.
9. The folded SMD component auto-forming packaging mold according to claim 3, wherein: along the raw material belt advancing direction, install on the lower bolster and carry out spacing first baffle (25) and second baffle (26) to the left and right sides of raw material belt, first baffle top surface orientation raw material belt's one side is formed with first backstop rim, second baffle top surface orientation raw material belt's one side is formed with the second backstop rim.
10. The folded SMD component auto-forming packaging mold according to claim 3, wherein: the die comprises a die, a lower base plate, a cutting cushion block, a channel (27) connected to the external vacuumizing device, and a vacuumizing hole (102) formed in the bottom of a cavity of the carrier band, wherein the channel comprises a first air hole (271) formed in the lower base plate along the width direction of the die and a second air hole (272) formed in the cutting cushion block along the height direction of the die, and the first air hole is communicated with the second air hole and the carrier band groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910082196.6A CN109606780B (en) | 2019-01-28 | 2019-01-28 | Automatic forming and packaging die for bent SMD components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910082196.6A CN109606780B (en) | 2019-01-28 | 2019-01-28 | Automatic forming and packaging die for bent SMD components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109606780A CN109606780A (en) | 2019-04-12 |
| CN109606780B true CN109606780B (en) | 2024-03-19 |
Family
ID=66020933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910082196.6A Active CN109606780B (en) | 2019-01-28 | 2019-01-28 | Automatic forming and packaging die for bent SMD components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109606780B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210010297A (en) * | 2019-07-19 | 2021-01-27 | 가부시키가이샤 휴브레인 | Shipping tape charging device |
| CN110523848A (en) * | 2019-09-18 | 2019-12-03 | 深圳嘉信源科技实业有限公司 | A kind of progressive die of earphone front shroud fixed steelring |
| CN115339712B (en) * | 2021-05-13 | 2023-12-12 | 苏州优斯登物联网科技有限公司 | Track induction system and automation equipment |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03119798A (en) * | 1989-09-30 | 1991-05-22 | Haimeka Koki:Kk | Automatic taping machine, forming means and taping method for electronic component |
| JPH0613199U (en) * | 1992-07-21 | 1994-02-18 | 株式会社コパル | Electronic component tape package and electronic component mounter |
| TW201203628A (en) * | 2010-10-13 | 2012-01-16 | Greenled Technology Co Ltd | LED SMD leadframe manufacturing method |
| CN102837334A (en) * | 2012-09-13 | 2012-12-26 | 昆山仁硕机械制造有限公司 | Multifunctional automatic cutting dishing machine |
| CN203316643U (en) * | 2013-06-25 | 2013-12-04 | 厦门旺朋电子元件有限公司 | Hinge type bending jig |
| CN203332436U (en) * | 2013-05-28 | 2013-12-11 | 昆山琨明电子科技有限公司 | Automatic feeding cutting device for SMD component carrier tape braided tape packaging |
| CN103862524A (en) * | 2012-12-14 | 2014-06-18 | 株式会社村田制作所 | Mold for manufacturing carrier tape and manufacturing method of carrier tape |
| JP2018089710A (en) * | 2016-11-30 | 2018-06-14 | 日昌株式会社 | Electronic component manufacturing apparatus and manufacturing method of the same |
| CN207773559U (en) * | 2017-12-31 | 2018-08-28 | 上海维衡精密电子股份有限公司 | A kind of automatic installing fixture for outer casing member |
| CN209701027U (en) * | 2019-01-28 | 2019-11-29 | 昆山琨明电子科技有限公司 | Bending SMD component automatic moulding packaged die |
-
2019
- 2019-01-28 CN CN201910082196.6A patent/CN109606780B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03119798A (en) * | 1989-09-30 | 1991-05-22 | Haimeka Koki:Kk | Automatic taping machine, forming means and taping method for electronic component |
| JPH0613199U (en) * | 1992-07-21 | 1994-02-18 | 株式会社コパル | Electronic component tape package and electronic component mounter |
| TW201203628A (en) * | 2010-10-13 | 2012-01-16 | Greenled Technology Co Ltd | LED SMD leadframe manufacturing method |
| CN102837334A (en) * | 2012-09-13 | 2012-12-26 | 昆山仁硕机械制造有限公司 | Multifunctional automatic cutting dishing machine |
| CN103862524A (en) * | 2012-12-14 | 2014-06-18 | 株式会社村田制作所 | Mold for manufacturing carrier tape and manufacturing method of carrier tape |
| CN203332436U (en) * | 2013-05-28 | 2013-12-11 | 昆山琨明电子科技有限公司 | Automatic feeding cutting device for SMD component carrier tape braided tape packaging |
| CN203316643U (en) * | 2013-06-25 | 2013-12-04 | 厦门旺朋电子元件有限公司 | Hinge type bending jig |
| JP2018089710A (en) * | 2016-11-30 | 2018-06-14 | 日昌株式会社 | Electronic component manufacturing apparatus and manufacturing method of the same |
| CN207773559U (en) * | 2017-12-31 | 2018-08-28 | 上海维衡精密电子股份有限公司 | A kind of automatic installing fixture for outer casing member |
| CN209701027U (en) * | 2019-01-28 | 2019-11-29 | 昆山琨明电子科技有限公司 | Bending SMD component automatic moulding packaged die |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109606780A (en) | 2019-04-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109664368B (en) | Full-automatic punching press braid all-in-one | |
| CN109606780B (en) | Automatic forming and packaging die for bent SMD components | |
| CN209953641U (en) | Hardware stamping die for producing precise communication component shell | |
| CN111360131A (en) | Aluminum sheet rubberizing unloading automation equipment | |
| CN209701027U (en) | Bending SMD component automatic moulding packaged die | |
| CN210648107U (en) | Continuous machining die for clutch transmission piece | |
| CN109606781B (en) | Automatic forming and packaging die for planar SMD components | |
| CN209393825U (en) | A kind of bimetallic material prejudges the two-in-one mold of riveted | |
| KR101606324B1 (en) | compound mold | |
| CN209701028U (en) | Plane SMD component automatic moulding packaged die | |
| CN114889064B (en) | Cutting machine for cutting off water gap and glue inlet of mobile phone protective sleeve | |
| CN111250598A (en) | Paper shredding blade stamping die | |
| CN212121345U (en) | Aluminum sheet rubberizing unloading automation equipment | |
| CN102488362B (en) | Automatic assembling device and assembling method for button shank of metal button | |
| CN111545691B (en) | Semi-open type metal elastic part forming equipment and forming method thereof | |
| CN114850293A (en) | Thin cutter blade punching forming device | |
| CN211539215U (en) | Hinge shaping lower die structure | |
| CN210847981U (en) | Composite die for cutting, bending and one-step forming | |
| CN114367574A (en) | Battery pole piece die cutting device and die cutting method thereof | |
| CN209699273U (en) | Full-automatic punching press braid all-in-one machine | |
| CN110978135A (en) | Composite die for punching and cutting plastic suction products | |
| CN217252068U (en) | Punching and riveting integrated device | |
| CN214866734U (en) | Cross feeding punching riveting device | |
| CN215618584U (en) | Upper punch type cutting mechanism of elastic sheet packaging machine | |
| CN209737754U (en) | Pay-off cuts and equipment apron device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |