CN209699273U - Full-automatic punching press braid all-in-one machine - Google Patents
Full-automatic punching press braid all-in-one machine Download PDFInfo
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- CN209699273U CN209699273U CN201920145780.7U CN201920145780U CN209699273U CN 209699273 U CN209699273 U CN 209699273U CN 201920145780 U CN201920145780 U CN 201920145780U CN 209699273 U CN209699273 U CN 209699273U
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- 238000004080 punching Methods 0.000 title claims abstract description 139
- 230000007246 mechanism Effects 0.000 claims abstract description 170
- 238000005520 cutting process Methods 0.000 claims abstract description 106
- 239000000463 material Substances 0.000 claims abstract description 66
- 238000000465 moulding Methods 0.000 claims abstract description 39
- 238000004806 packaging method and process Methods 0.000 claims abstract description 26
- 239000002994 raw material Substances 0.000 claims abstract description 24
- 238000005452 bending Methods 0.000 claims description 76
- 238000000034 method Methods 0.000 claims description 16
- 238000009434 installation Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 14
- 238000007493 shaping process Methods 0.000 claims description 10
- 238000004146 energy storage Methods 0.000 claims description 9
- 238000007731 hot pressing Methods 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 7
- 238000007667 floating Methods 0.000 claims description 6
- 230000000630 rising effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 33
- 239000002699 waste material Substances 0.000 abstract description 18
- 230000005540 biological transmission Effects 0.000 abstract description 11
- 230000035611 feeding Effects 0.000 description 41
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- 238000007599 discharging Methods 0.000 description 9
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
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- 238000012856 packing Methods 0.000 description 5
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- 238000005516 engineering process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
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- 239000003795 chemical substances by application Substances 0.000 description 2
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- 229910052759 nickel Inorganic materials 0.000 description 2
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Abstract
The utility model discloses a kind of full-automatic punching press braid all-in-one machines, by innovating layout feeding mechanism in stamping die, it is punched profile mechanism, cutting mechanism and waste cutting machine structure etc., and the carrier band slot that setting transmission carries in stamping die, achieve the purpose that organically combine the punch forming of SMD component and carrier band braid, in this way, SMD component need to only carry out automation feeding in the form of raw material, it can complete the automatic press molding of SMD component, it cuts and packs, be completed at the same time waste material cut and blanking, greatly improve the efficiency of the production of SMD component and packaging, meet the needs of SMT production line high-speed automated production.Relative to the elder generation's punch forming of SMD component at the form of material strip, production efficiency is further improved.
Description
Technical field
The utility model relates to the punch forming of SMD component and packing technique field more particularly to a kind of full-automatic punching presses
Braid all-in-one machine.
Background technique
SMT is the abbreviation of surface mount technology, means surface mounting technology, and the appearance of SMT makes electronics
Product produces huge change.Currently, overwhelming majority PCB more or less uses this low cost, high efficiency, reduces PCB
The production technology of plate bulk.SMD is the abbreviation of Surface Mounted Devices, means surface mount device, and SMT's is wide
General use promotes the development of SMD, and original jack type component is replaced by SMD component becomes inevitable, while people couple
The small size of the electronic products such as mobile phone, computer, multi-functional requirement more promote SMD component to highly integrated, miniaturization hair
Exhibition.
Currently, in order to adapt to the needs that the automation of SMT production line high-speed is used, SMD component is usually to carry braid
Packaging and transport agent, the load to meet the development need of SMT production line high-speed, as SMD component packaging and transport agent
Band braid is usually made of the lid band for being formed with the carrier band of several type chambers for accommodating SMD component and being open near closed hollow ring,
The type chamber is generally formed in the middle part of carrier band width direction, along the equal spacing in length direction arrangement of carrier band.SMD component carrier band is compiled
Speed with packaging determines that traditional operation mode is by the intracavitary speed of the type that SMD component is packed into carrier band: firstly, will
Carrier band is sent on the workbench of braider by devices for taking-up to be positioned；Then, by the loose mail one by one of well cutting
SMD component is intracavitary by the type that manually or mechanically hand is packed into carrier band, finally, keeping lid band and carrier band fitting close by hot-press arrangement
Envelope, to complete the packaging to SMD component；Above-mentioned operation mode needs to put into a large amount of people one is Manual feeding is used
Power, and operation packaging efficiency is lower, it is at high cost, and artificial manual operations is it is difficult to ensure that product quality.Another kind passes through manipulator
Automatic material taking, the type that the discrete piece SMD component of well cutting is encased in carrier band are intracavitary；This operation mode, since manipulator exists
Certain time is needed in motion process, causes the efficiency of SMD component carrier band tape package still lower, it is raw not to be able to satisfy SMT
The demand of the high-speed automated production of producing line.When particularly, for the punching piece of some similar elastic slices or nickel sheet class, due to elastic slice or
Nickel sheet class product is relatively light, thickness is than relatively thin, and some only has 0.1mm, and product has plane, also there is L-type or abnormal shape, and product
There is the direction of front and back sides, when this kind of using this operation mode packaging, there are vibrating disc feedings to get stuck, efficiency when direction discernment
Low, finger feed grabs the big problem of difficulty.The product even having is unable to satisfy the packing instructions of automation braider at all,
It can only be by the way of manpower handwork.For this purpose, patent document CN203332436U proposes a kind of SMD component carrier band volume
Band is packed for automatic charging cutting means, and SMD component is carried out automation feeding in the form of material strip, fixed by self-feeding
Position device and cutting means realize the automatic positioning of SMD component, cut and pack with feeding, substantially increase SMD component load
Efficiency with braid meets the needs of SMT production line high-speed automated production to a certain extent.But SMD component will be rushed first
The molded form at material strip, it still needs further improvement for production efficiency.
Summary of the invention
In order to solve the above-mentioned technical problem, the utility model proposes a kind of full-automatic punching press braid all-in-one machines, by SMD member
The punch forming of device and carrier band tape package are organically combined, and SMD component need to only be carried out automatically in the form of raw material
Change feeding, so that it may complete SMD component automatic press molding, cut and pack, greatly improve SMD component production and
The efficiency of packaging meets the needs of SMT production line high-speed automated production.
The technical solution of the utility model is achieved in that
A kind of full-automatic punching press braid all-in-one machine, including rack, the stamping die that is installed in the middle deck of the rack
Have, be installed on the upper frame of the rack and provide the ram driving mechanism of punching press motive force for the stamping die, be installed on
On the Vertical board support of the rack and it is located at the devices for taking-up of the stamping die side, is installed on the Vertical board support of the rack simultaneously
Hot-press arrangement between the devices for taking-up and the stamping die, the product volume being installed in the side frame body of the rack
Tep reel is installed on the lower frame of the rack for rolling up the carrier band reel of storage carrier band, being installed on the side frame body of the rack
For rolling up the lid belt reel and control system of storage lid band, under the control of the control system, for forming the original of SMD component
Material strip is fed from the side of the length direction of stamping die, from the carrier band reel for loading the carrier band of SMD component
It is fed from the side of the width direction of stamping die, the stamping die brings the raw material entered in it into punching course
Row punching press molds SMD component on raw band, and molding SMD component is cut from raw band, is automatically fed into
Corresponding type is intracavitary on the carrier band；Under the driving of the devices for taking-up, lid band from the lid belt reel with from described
The carrier band for being mounted with SMD component while the entrance hot-press arrangement of the other side output of the width direction of stamping die carry out
Fitting, the finished product take-up reel can wind up the carrier band after fitting lid band.
Further, the stamping die includes upper die and lower die and the molding that is installed in the upper mold and the lower die
Package mechanism, the shaping packaging mechanism include the feeding mechanism set gradually along the die length direction, cut out material side and punching
Holes mechanism, punching profile mechanism and cutting mechanism are positioned, the carrier band slot along the setting of die width direction is formed in the lower die,
Carrier band for loading SMD component is arranged in the carrier band slot, and equidistant interval along its length is formed on the carrier band
Several described type chambers of arrangement, the sanction material side and punching positioning holes mechanism include the punching edge of a knife group being installed in the lower die
With the punching formed punch group being installed in the upper mold；The punching profile mechanism includes the shape edge of a knife being installed in the lower die
Group and the shape formed punch group being installed in the upper mold；The cutting mechanism include be installed in the lower die cut the edge of a knife and
The formed punch that cuts for cutting cushion block and being installed in the upper mold, the cushion block that cuts are embedded in the lower die, the carrier band slot
Cushion block is cut through described, the cutting knife mask covers on the carrier band slot cut on cushion block, and described cuts in the edge of a knife
Portion has the material-dropping hole for penetrating through the carrier band slot；For forming the raw band of SMD component from the one of stamping die length direction
Side charging, and advance under the push of the feeding mechanism and set the distance of station, the carrier band for loading SMD component exists
Empty type chamber is moved to below the material-dropping hole under the driving of the devices for taking-up, the raw band expects side and punching in the sanction
Cutting material side is carried out by the punching edge of a knife group and the punching formed punch group at positioning holes mechanism and rushes location hole, cutting material side
With rush the raw band after location hole at the punching profile mechanism by the shape edge of a knife group and the shape formed punch group into
Row punching shape, raw band after being punched shape at the cutting mechanism by it is described cut the edge of a knife and it is described cut formed punch into
Row is cut, and molding SMD component is cut from raw band, the SMD component is made just can to cut the edge of a knife through described
On material-dropping hole drop into it is described carrier band slot in carrier band type chamber among.
Further, the lower die includes the lower template set gradually from top to bottom, lower bolster and lower die holder, the carrier band
Slot, the punching edge of a knife group, the shape edge of a knife group, it is described cut the edge of a knife and it is described cut cushion block be embedded in be installed on it is described under
On the top surface of template, the upper mold includes the stripper plate set gradually from bottom to top, de- backboard, cope plate, upper padding plate and upper mold
Seat, the punching formed punch group, the shape formed punch group and the formed punch that cuts are mounted on the cope plate, and can be successively
Across the de- backboard and the stripper plate.
Further, the feeding mechanism includes shovel base, sliding block, jacking cylinder, jacking part, reset spring and several buoyance lifts
It is formed with mutually matched oblique surface on part, the shovel base and the sliding block, forms sliding slot, the sliding block edge in the lower template
Stamping die length direction sliding is set in the sliding slot, and the shovel base top is clamped and located at the stripper plate and described
Between de- backboard, and the shovel base terminal is pierced by from the stripper plate, and the reset spring location and installation is in the sliding block and institute
It states between sliding slot；Have in the middle part of the sliding block along the through slot of stamping die length direction and along the top of stamping die thickness direction
Slot is risen, the jacking slot position is below the through slot and is connected to the through slot, and the raw band is worn out of described through slot
Out, the jacking cylinder is installed on the slider bottom, and the bottom end of the jacking part is installed on the jacking axis of the jacking cylinder
On, the top of the jacking part passes through the jacking slot and extend into the through slot；In clamping process, the jacking cylinder
It is failure to actuate, the shovel base drives the sliding block to retreat the distance of a station by the oblique surface, makes the reset spring pressure
Contracting energy storage；During die sinking, the raw band is raised setting height, the top from the lower template by several buoyance lift parts
Rising cylinder drives the jacking part to be pressed on the raw band on the roof of the through slot, and the shovel base follows upper mold gradually
It is detached from the sliding block, under reset spring reply, the sliding block, which advances, sets the distance of station, and drives the raw band
Advance and sets the distance of station.
Further, the stamping die includes upper die and lower die and the molding that is installed in the upper mold and the lower die
Package mechanism, the shaping packaging mechanism include the punching profile mechanism set gradually along the stamping die length direction, folding
Bender structure, cutting mechanism are punched discrete piece mechanism and feeding mechanism, are formed in the lower die and are arranged along stamping die width direction
Carrier band slot, the carrier band for loading SMD component is arranged in the carrier band slot, and side along its length is formed on the carrier band
To several the described type chambers equidistantly arranged, the punching profile mechanism includes the shape edge of a knife group being installed in the lower die
With the shape formed punch group being installed in the upper mold；The bending mechanism includes that the bending lower die being installed in the lower die enters block
Enter block with the bending upper die being installed in the upper mold；The cutting mechanism include be installed in the lower die cut the edge of a knife and
The formed punch that cuts for cutting cushion block and being installed in the upper mold, the cushion block that cuts are embedded in the lower die, the carrier band slot
Cushion block is cut through described, the cutting knife mask covers on the carrier band slot cut on cushion block, and described cuts in the edge of a knife
Portion has the material-dropping hole for penetrating through the carrier band slot；The punching discrete piece mechanism includes the punching discrete piece knife being installed in the lower die
Mouth and the punching discrete piece formed punch being installed in the upper mold；For forming the raw band of SMD component from the length of stamping die
The side in direction is fed, and empty type chamber is moved to by the carrier band for loading SMD component under the driving of the devices for taking-up
Below the material-dropping hole；The feeding mechanism can pull the distance of the raw material tape travel setting station, and the raw band exists
Shape is punched out by the shape edge of a knife group and the shape formed punch group at the punching profile mechanism, after being punched shape
Raw band enters block by the bending lower die at the bending mechanism and the bending upper die enters block and carries out bending set angle,
Raw band after bending cuts the edge of a knife described at the cutting mechanism and the formed punch that cuts is cut, will be molding
SMD component with bending cuts from raw band, cut the SMD component just can through described on the edge of a knife
Material-dropping hole drops among the type chamber of the carrier band in the carrier band slot；The punching discrete piece mechanism is set to the feeding mechanism and institute
It states between cutting mechanism, before raw band is not connected to the feeding mechanism, the cutting mechanism does not work, and passes through the punching
Cut discrete piece mechanism punching discrete piece formed punch and punching the discrete piece edge of a knife by the molding SMD component with bending from raw band
It cuts.
Further, the lower die includes the lower template set gradually from top to bottom, lower bolster and lower die holder, the carrier band
Slot, the shape edge of a knife group, the bending lower die enter block, described cut the edge of a knife, described cut cushion block, the punching discrete piece edge of a knife
Insertion is installed on the top surface of the lower template, the upper mold include the stripper plate set gradually from bottom to top, de- backboard, on
Template, upper padding plate and upper die holder, the shape formed punch group, it is described cut formed punch, the punching discrete piece formed punch be mounted on it is described
On cope plate, and the de- backboard and stripper plate are sequentially passed through, the bending upper die enters block top and is clamped and located at the de- material
Between plate and the de- backboard, and the bending upper die enters block bottom end and is pierced by from the stripper plate.
Further, the structure for the distance that the feeding mechanism can pull the raw material tape travel to set station is: institute
Stating feeding mechanism includes shovel base, sliding block, reset spring, buoyance lift hanging block corresponding with the raw band, buoyance lift retreat stop block and several
It is formed with mutually matched oblique surface on buoyance lift part, the shovel base and the sliding block, has at the top of the buoyance lift hanging block for single
There is the retaining for preventing the raw band from retreating to the driving salient point for driving the raw band, at the top of the buoyance lift retreat stop block
Salient point forms sliding slot in the lower template, and the sliding block is set in the sliding slot along die length direction sliding, the shovel
Base top is clamped and located between the stripper plate and the de- backboard, and the shovel base terminal is pierced by from the stripper plate, institute
Reset spring location and installation is stated between the sliding block and the sliding slot；The buoyance lift hanging block, which floats up and down, is installed on the sliding block
On, the buoyance lift retreat stop block, which floats up and down, to be installed in the lower template, and several buoyance lift parts are floated downward in raw band trend
It is dynamic to be installed in the lower template；Die opening state, the raw band is raised by several buoyance lift parts from the lower template to be set
Determine highly, in clamping process, the shovel base drives the sliding block along the advance setting of raw band feedstock direction by the oblique surface
The distance of station makes the reset spring compressed energy-storage, and drives the buoyance lift hanging block to advance and set the distance of station, described floating
Rise hanging block by the mounting of the driving salient point and the location hole of rise drive raw material tape travel setting station away from
From the buoyance lift retreat stop block tangles the positioning by the retaining salient point after the distance of raw material tape travel setting station
Hole carries out retaining, and during die sinking, the raw band is raised setting height from the lower template again by several buoyance lift parts
Degree, the shovel base follow upper mold to progressively disengage the sliding block, and the reset spring drives the sliding block and the driving salient point multiple
Position.
Further, the rack is equipped with pilot land, and guiding is formed on the pilot land and limits the carrier band
Guide channel, the guide channel is mutually linked with the carrier band slot, and the hot-press arrangement includes the upper hot pressing being oppositely arranged up and down
The hot pressing motor of block, lower hot wafering and the driving upper hot wafering and the lower hot wafering folding, the lower hot wafering are embedded at
On the pilot land, the upper hot wafering, which slides up and down, to be installed on the Vertical board support, the lid band conveyed in the guide channel
And carrier band needs the position being bonded to pass through between the lower hot wafering and the upper hot wafering.
Further, the devices for taking-up includes dividing gear, indexing pinch roller, pinch roller connecting rod and reel-motor, and described point
Spending on gear has the first indexing tooth, has the second indexing tooth on the indexing pinch roller, and the reel-motor is installed on described vertical
The back side of grillage, the dividing gear rotational installation pass through institute in the front of the stand plate, the rotary shaft of the reel-motor
Stating Vertical board support drives the dividing gear to turn an angle, and the pinch roller connecting rod, which floats up and down, is being installed on the Vertical board support just
Face, the indexing pinch roller rotational installation are led described in the first indexing tooth transmission on the dividing gear on the pinch roller connecting rod
The second indexing tooth engagement on chain hole and the indexing pinch roller on approaching channel and the carrier band.
It further, further include lid band guide mechanism, the lid includes being installed on the Vertical board support with guide mechanism
Two material rollers, a tightening roller and a limit shaft, two material rollers are mounted on same level position and are spaced set distance, institute
The lower section that tightening roller is installed on the middle position of line between two material rollers is stated, the limit shaft is located at a material roller
Lower section and be arranged close to the pilot land, have between the limit shaft and the guide channel for limiting the lid up and down
The gap of band and the carrier band, the lid band drawn from the lid belt reel successively bypass the material roller, the tightening roller,
Enter the hot-press arrangement after another material roller and the limit shaft, two are equipped at intervals on the limit shaft and is used for a left side
Two axle bumpers of lid band described in right limit, and the distance between two described axle bumpers are adjustable.
The beneficial effects of the utility model are: the utility model provides a kind of full-automatic punching press braid all-in-one machine, by
Innovation layout feeding mechanism, punching profile mechanism, cutting mechanism and waste cutting machine structure etc. in stamping die, and in stamping die
The carrier band slot of upper setting transmission carrier band has reached the mesh for organically combining the punch forming of SMD component and carrier band braid
, in this way, SMD component need to only carry out automation feeding in the form of raw material, so that it may complete the automatic punching of SMD component
It is molded, cut and pack, be completed at the same time waste material cut and blanking, greatly improve SMD component production and packaging
Efficiency meets the needs of SMT production line high-speed automated production.Relative to the elder generation's punch forming of SMD component at the form of material strip,
Production efficiency is further improved.
Detailed description of the invention
Fig. 1 is the perspective view of the full-automatic punching press braid all-in-one machine of the utility model；
Fig. 2 is enlarged structure schematic diagram at A in Fig. 1；
The front view of the full-automatic punching press braid all-in-one machine of Fig. 3 the utility model；
Fig. 4 is enlarged structure schematic diagram at B in Fig. 3；
The side view of the full-automatic punching press braid all-in-one machine of Fig. 5 the utility model；
Fig. 6 is the structural schematic diagram at 1 one visual angle of the utility model stamping die embodiment；
Fig. 7 is that Fig. 6 removes the structural schematic diagram after raw band and carrier band；
Fig. 8 is the structural schematic diagram that another visual angle of the utility model stamping die embodiment 1 molds state；
Fig. 9 is enlarged structure schematic diagram at A in Fig. 8；
Figure 10 is the structural schematic diagram of another visual angle die opening state of the utility model stamping die embodiment 1；
Figure 11 is the schematic diagram of jacking cylinder and sliding block cooperation in the utility model stamping die embodiment 1；
Figure 12 is the structural schematic diagram of the utility model stamping die embodiment 2；
Figure 13 is the side view of the utility model stamping die embodiment 2；
Figure 14 is the top view of the utility model stamping die embodiment 2；
Figure 15 be in Figure 14 A-A to cross section view；
Figure 16 is enlarged structure schematic diagram at A in Figure 15；
Figure 17 is B-B direction cross section view in Figure 14；
Figure 18 be in Figure 14 C-C to cross section view；
Figure 19 is the solid that the utility model stamping die embodiment 2 removes upper mold major part component only remaining portions formed punch
Figure.
Specific embodiment
In order to be more clearly understood that the technology contents of the utility model, spy lifts following embodiment and is described in detail, mesh
Be only that the content for being best understood from the utility model rather than limit the protection scope of the utility model.
As shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4 and Fig. 5, a kind of full-automatic punching press braid all-in-one machine, including rack 1, be installed on
Stamping die 2 in the middle deck 11 of rack is installed on the upper frame 12 of rack and provides punching press motive force for stamping die
Ram driving mechanism 3, be installed on the Vertical board support 13 of rack and be located at stamping die side devices for taking-up 4, be installed on machine
Hot-press arrangement 5 on the Vertical board support of frame and between devices for taking-up and stamping die, be installed in the side frame body of rack at
Product take-up reel 6 is installed on the lower frame 14 of rack for rolling up the carrier band reel 7 of storage carrier band 100, being installed on the side frame body of rack
The upper lid belt reel 8 and control system for being used to roll up storage lid band 200, under control of the control system, for forming SMD component
400 raw band 300 is fed from the side of the length direction of stamping die, from carrier band reel for loading SMD component
Carrier band fed from the side of the width direction of stamping die, stamping die is in punching course, to the raw band entered in it
Punching press is carried out, SMD component is molded on raw band, molding SMD component is cut from raw band, is sent automatically
Enter to carry upper corresponding type intracavitary；Under the driving of devices for taking-up, lid band from lid belt reel with from the width of stamping die
The carrier band for being mounted with SMD component of the other side output in direction while entering hot-press arrangement and be bonded, finished product take-up reel energy
Carrier band after enough lid bands by fitting is wound up.
In above structure, ram driving mechanism drives for driving stamping die to carry out punching press, such as by driving motor
Lead-screw drive mechanism may be implemented moving up and down for the upper mold of driving stamping die, provide drive for the molding and die sinking of stamping die
Power.For another example, can by driving motor drive eccentric cam, also may be implemented driving stamping die upper mold on move down
It is dynamic, driving force is provided for the molding and die sinking of stamping die.Devices for taking-up carries intermittent advance setting station for drawing, than
Such as cooperate stamping die, after the station that advances, the type that molding SMD component is sent into carrier band by stamping die is intracavitary, so
After readvance a station, repeatedly, realize the function of completing to load SMD component in stamping die.Hot-press arrangement is used
In carrying out hot pressing with the carrier band for being mounted with SMD component to lid band, it is bonded lid band with carrier band, SMD component is sealed in
The type of carrier band is intracavitary.Stamping die makes SMD for realizing the combination of punch forming and the carrier band braid of SMD component
The punch forming and carrier band braid of component synchronously complete, and the transhipment of SMD component and feeding are eliminated, in this way, SMD component
Automation feeding need to be only carried out in the form of raw material, so that it may complete the automatic press molding of SMD component, cut and wrap
Dress greatly improves the efficiency of the production of SMD component and packaging, meets the needs of SMT production line high-speed automated production.Phase
For the elder generation's punch forming of SMD component at the form of material strip, production efficiency is further improved.
Preferably, referring to fig. 2, rack is equipped with pilot land 15, and leading for guiding limit carrier band is formed on pilot land
Approaching channel 151, guide channel are mutually linked with carrier band slot, and hot-press arrangement includes the upper hot wafering 51 being oppositely arranged up and down, lower hot wafering
52 and the hot pressing motor of upper hot wafering and the folding of lower hot wafering is driven, lower hot wafering is embedded on pilot land, on upper hot wafering
Lower slider is installed on Vertical board support, and the position that the lid band and carrier band conveyed in guide channel needs to be bonded is from lower hot wafering and upper hot pressing
It is passed through between block.In this way, hot-press arrangement can be led to through guide channel by being mounted with the carrier band of SMD component and lid band, by Pyroelectric Media
Machine drives upper hot wafering and lower hot wafering to open and close, and realizes hot pressing joint function, in this way, can make lid band and carrier band by hot-press arrangement
Gluing, sealing, so that the braid completed to SMD component carries braid.
Preferably, include dividing gear 41, indexing pinch roller 42, pinch roller connecting rod 43 and roll up with Fig. 4, devices for taking-up referring to fig. 2
Motor (not shown) is taken, there is the first indexing tooth on dividing gear, indexing on pinch roller has the second indexing tooth, reel-motor installation
In the back side of Vertical board support, dividing gear rotational installation is driven in the front of stand plate, the rotary shaft of reel-motor across Vertical board support
Dividing gear turns an angle, and pinch roller connecting rod, which floats up and down, is installed on the front of Vertical board support, and indexing pinch roller rotational installation is in pressure
It takes turns on connecting rod, the first indexing tooth on dividing gear is through the second indexing on the chain hole and indexing pinch roller on guide channel and carrier band
Tooth engagement.In this way, by the cooperation of indexing pinch roller and dividing gear, by the first indexing tooth and the indexing pinch roller of dividing gear
The engagement of second indexing tooth is, it can be achieved that driving clamps the function of carrier band between them, in this way, the reel-motor of devices for taking-up
When driving dividing gear turns an angle, the carrier band movement set distance for being fitted with lid band can be driven, reel-motor is by PLC
The program of control system setting is controlled, it can be achieved that the function that automatic driving carrier band is transmitted and positioned.
It preferably, further include lid band guide mechanism 9, lid band guide mechanism includes being installed on vertical plate referring to 1, Fig. 2 and Fig. 4
Two material rollers, 91, tightening rollers 92 and a limit shaft 93 on frame, two material rollers are mounted on same level position and are spaced and set
Set a distance, tightening roller are installed on the lower section in the middle position of line between two material rollers, and limit shaft is located at the lower section of a material roller
And be arranged close to pilot land, there is the gap for upper and lower limited cover band and carrier band, from lid band between limit shaft and guide channel
The lid band drawn on reel enters hot-press arrangement after successively bypassing a material roller, tightening roller, another material roller and limit shaft, limits
Two two axle bumpers 931 for left and right limited cover band are equipped at intervals on the axis of position, and the distance between two axle bumpers are adjustable.Its
In two material rollers for being oriented to lid band, pilot cap band enters hot-press arrangement from the position of setting, and expansion tightening wheel is used for tensioner
Lid band, to prevent lid belt sag or tension, limit shaft enables lid band to be incorporated on carrier band and provides for being aligned lid band with carrier band
Position on.Referring to Fig. 1, lid band guide mechanism 9 further includes two cleat assemblies 94, and two cleat assemblies are set to hot-press arrangement
Two sides, two cleat assemblies are locked in together by fastener, and have the slit passed through for carrying and covering band, for entrance
Or send out carrier band and the lid band progress bound position of hot-press arrangement.
Stamping die makes SMD component for realizing the combination of punch forming and the carrier band braid of SMD component
Punch forming and carrier band braid synchronously complete, two kinds of embodiments of stamping die described in detail below.
Stamping die embodiment 1
As shown in Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10 and Figure 11, a kind of stamping die, for rushing for plane SMD component
Molded and packaging, including upper mold 211, lower die 212 and the shaping packaging mechanism being installed in upper mold and lower die, shaping packager
Outside structure includes the feeding mechanism 213 set gradually along stamping die length direction, sanction material side and punching positioning holes mechanism 214, is punched
Shape mechanism 215 and cutting mechanism 216 are formed with the carrier band slot 217 along the setting of stamping die width direction in lower die, for loading
The carrier band 100 of SMD component 400 is arranged in carrier band slot, and the several of equidistant interval arrangement along its length are formed on carrier band
A type chamber 1001, cuts out material side and punching positioning holes mechanism includes the punching edge of a knife group 2141 being installed in lower die and is installed in upper mold
Punching formed punch group 2142；Punching profile mechanism includes the shape edge of a knife group 2151 being installed in lower die and is installed in upper mold
Shape formed punch group 2152；Cutting mechanism includes being installed on cutting the edge of a knife 2161 and cutting in lower die cushion block 2162 and to be installed on
Formed punch 2163 is cut in upper mold, cushion block is cut and is embedded in lower die, through cushion block is cut, cutting knife mask covers to be cut out carrier band slot
It cuts on the carrier band slot on cushion block, and cuts the material-dropping hole 21611 in the middle part of the edge of a knife with perforation carrier band slot；For forming SMD member device
The raw band 300 of part is fed from the side of stamping die, and is advanced under the push of feeding mechanism and set the distance of station, such as
Advance a station, and empty type chamber is moved to material-dropping hole under the driving of devices for taking-up by the carrier band for loading SMD component
Lower section, raw band cut out material while and punching positioning holes mechanism at by punching edge of a knife group and punching formed punch group carry out cutting material while and punching
Location hole, cutting material side and rushes the raw band after location hole at punching profile mechanism by shape edge of a knife group and shape formed punch group
It is punched out shape, the raw band after being punched shape is cut at cutting mechanism by cutting the edge of a knife and cutting formed punch, will
Molding SMD component cuts from raw band, make SMD component just can the material-dropping hole on the cut edge of a knife drop into
Among the type chamber for carrying the carrier band in slot.
In above structure, by innovating layout feeding mechanism in stamping die, cutting out material side and punching positioning holes mechanism, punching
Profile mechanism and cutting mechanism, and the carrier band slot that setting transmission carries in stamping die, have reached rushing SMD component
The purpose that molded and carrier band braid is organically combined, in this way, SMD component need to only be automated in the form of raw material
Feeding, so that it may complete SMD component automatic press molding, cut and pack, be completed at the same time waste material cut and blanking, pole
The big efficiency for improving the production of SMD component and packaging, meets the needs of SMT production line high-speed automated production.Relative to
At the form of material strip, production efficiency is further improved the elder generation's punch forming of SMD component.The full-automatic punching press of the utility model
The working principle of braid all-in-one machine are as follows: under the control of PLC control system, devices for taking-up and stamping die are by driving mechanisms control
Automatically working is carried out, in die sinking, for forming the raw band of SMD component from one endfeed of stamping die, and in feeding
Advance under the promotion of mechanism and set the distance of station, the carrier band for loading SMD component will be empty under the driving of devices for taking-up
Type chamber be moved to below material-dropping hole, when molding, raw band first passes through cutting out at material side and punching positioning holes mechanism (punching station)
Punching edge of a knife group and punching formed punch group carry out cutting out material side and rush location hole, location hole be used for the pilot pin in upper mold and lower die into
Row cooperation, realizes the function of positioning raw band, prevents raw band from position occurring during being punched or cutting mobile.At this point, SMD
The monnolithic case of component forms out not yet, and then, raw band (punching shape station) at punching profile mechanism passes through
Shape edge of a knife group and shape formed punch group are punched out shape, at this point, the monnolithic case of SMD component has formed out, as
Embodiment can mold four SMD components simultaneously, and four SMD components are connected to back-to-back two-by-two on two sub- material strips,
It is subsequently cut at cutting mechanism by cutting the edge of a knife and cutting formed punch, by molding SMD component from raw band
Cut, make SMD component just can the material-dropping hole on the cut edge of a knife drop among the type chamber of the carrier band in carrier band slot；By
In in the carrier band slot that carrier band is located at lower die, raw band can be by carrying on slot, the SMD component arrival after molding on raw band
When carrying above the type chamber of the carrier band in slot, by the connection of cutting mechanism severing SMD component and raw band, SMD can be made first
The type that device can just fall into carrier band is intracavitary, reaches and the SMD component on raw band is quickly packed into the upper corresponding tape carrier type of carrier band
Intracavitary purpose, wherein the utility model forms cutting mechanism by cutting the edge of a knife, cutting cushion block and cutting formed punch, cuts pad
Block is embedded in lower die, and carrier band slot is through cushion block is cut, and cutting knife mask covers on cutting the carrier band slot on cushion block, and cutting knife
Mouth middle part has the material-dropping hole of perforation carrier band slot, and realization does not influence to cut out while meeting raw band transmission and carrier band transmission
The function of cutting.
Preferably, referring to Fig. 8 and Figure 10, lower die includes the lower template 2121 set gradually from top to bottom, lower bolster 2122
With lower die holder 2123, slot, punching edge of a knife group, shape edge of a knife group are carried, the edge of a knife is cut and cuts cushion block and be embedded in and be installed on lower die
On the top surface of plate, upper mold includes the stripper plate 2111 set gradually from bottom to top, de- backboard 2112, cope plate 2113, upper padding plate
2114 and upper die holder 2115, it is punched formed punch group, shape formed punch group and cuts formed punch and be mounted on cope plate, and can successively wear
Cross de- backboard and stripper plate.Wherein, upper die holder is mainly used for placing outer bush, limited post and discharging spring, upper die holder thickness
Size and the length of discharging spring have direct relation.Upper padding plate is mainly used for bearing formed punch or the mold insert stress in punching course
It returns and allows, upper die holder is avoided to send depressed deformation.Cope plate is also referred to as upper clamp plate, is mainly used for fixing each formed punch, mold insert, guarantees zero
Part active position and precision.De- backboard is mainly used for fixed discharging mold insert, and it is generated in process of production to bear molding mold insert
Concentrated stress.Stripper plate is mainly used for placing discharging mold insert, and after the completion of formed punch punching, the power provided by discharging spring will be rushed
Head is separated with stamping material.Lower template is mainly used for placing stock guide, die insert, interior guide sleeve and buoyant block, for example, carrier band
Slot punching edge of a knife group, shape edge of a knife group, cuts the edge of a knife, cuts cushion block and the punching discrete piece edge of a knife etc., and guaranteeing location accuracy,
And for bearing side power when punching.Lower bolster is mainly used for fixing each workpiece of its installation jointly with lower template, holds simultaneously
Generated power when by insert punching press prevents lower die holder to be recessed or deform.Lower die holder be mainly used for place outer bush, limited post,
Spring and buoyant pin assemblies.
Preferably, referring to Fig. 8, Figure 10 and Figure 11, feeding mechanism include shovel base 2131, sliding block 2132, jacking cylinder 2133,
Part 2134, reset spring and several buoyance lift parts 2135 are jacked, is formed with mutually matched oblique surface 2136 on shovel base and sliding block, under
Sliding slot is formed in template, sliding block is set in sliding slot along the sliding of stamping die length direction, and shovel base top is clamped and located at stripper plate
It between de- backboard, and shovels base terminal and is pierced by from stripper plate, reset spring location and installation is between sliding block and sliding slot；In the middle part of sliding block
With the through slot 21321 along stamping die length direction and the jacking slot 21322 along stamping die thickness direction, slot is jacked
Below through slot and it is connected to through slot, raw band is pierced by out of through slot, and jacking cylinder is installed on slider bottom, jacks part
Bottom end be installed on the jacking axis of jacking cylinder, the top for jacking part passes through jacking and slot and extend into through slot；It molded
Cheng Zhong, jacking cylinder are failure to actuate, and shovel base drives sliding block to retreat the distance of a station by oblique surface, make reset spring compression storage
Energy；During die sinking, raw band is raised setting height from lower template by several buoyance lift parts, and jacking cylinder driving jacking part will be former
Material strip is pressed on the roof of through slot, and shovel base follows upper mold to progressively disengage sliding block, and under reset spring reply, sliding block advance is set
Determine the distance of station, and drives the distance of raw material tape travel setting station.In this way, by the oblique surface and sliding block on shovel base
Under the mutual cooperation of oblique surface, in clamping process, when shoveling base vertical downward movement, sliding block can be driven along stamping die simultaneously
Length direction retreats the distance of a station, makes reset spring compressed energy-storage, at this point, jacking cylinder is failure to actuate, i.e., raw band does not have
It is pressed on sliding block, does not follow sliding block to move together, during completing the die sinking after a punching press, jacking cylinder is dynamic
Make, jacking part is driven by jacking cylinder, raw band can be pressed on the roof of through slot, at this point, shovel base follows upper mold gradually
It is detached from sliding block, under the driving of reset spring energy storage release force, sliding block, which can advance, sets the distance of station, and before driving raw band
Into the distance of setting station, the function of self-feeding is realized, it here, can in order to increase the contact area of jacking part and raw band
T-type is designed to so that part will be jacked, and the lateral part of T-type is set in through slot, and vertical section passes through jacking slot and jacking cylinder
Jacking axis be fixedly connected.Several buoyance lift parts are used to raw band being raised setting height from lower template, in order to by raw band
It is raised and is moved from lower template, for example buoyance lift part includes several floating pins or rocker piece etc.；Reset spring is for closing
Energy storage is retreated when mould, and driving sliding block carries out feeding in die sinking, repeatedly, it can be achieved that the continuous feed function of raw band.
Preferably, referring to Fig. 7, being punched formed punch group includes the location hole that location hole is formed for punching upper in the middle part of raw band
Formed punch 21421, the first cutting edge formed punch 21422 being punched out for a side to raw band and for the another of raw band
The second cutting edge formed punch 21423 that side is punched out, be punched edge of a knife group on be formed with corresponding gage punch the location hole edge of a knife,
The second cutting edge edge of a knife of the first cutting edge edge of a knife of corresponding first cutting edge formed punch and corresponding second cutting edge formed punch.Wherein, location hole is used
Cooperated in the pilot pin in upper mold and lower die, realize positioning raw band function, prevent raw band punching, bending or
It is mobile that position occurs during cutting.The width of raw band is typically larger than SMD component width after molding, cuts out by first
Side formed punch and the second cutting edge formed punch can cut away unwanted material sideline judge.
Preferably, referring to Fig. 7, shape formed punch group includes being punched out to form one first for a side to raw band
First side formed punch 21521 of the shape of SMD component is punched out to form one second for another side to raw band
Second side formed punch 21522 of the shape of SMD component and for form two the 3rd SMD member to being punched out in the middle part of raw band
The centre punch 21523 of the shape of device, be formed in shape edge of a knife group corresponding first in the first of formed punch the edge of a knife, corresponding the
Two in the second of formed punch the shape edge of a knife of the edge of a knife and corresponding second side formed punch, after punching, raw band is divided into two sub- material strips,
One the 3rd SMD component and a first SMD component is back-to-back is connected on a sub- material strip, another the 3rd SMD member
Device and a 2nd SMD component is back-to-back is connected on another sub- material strip.In this way, the shape of SMD component can root
According to the formation shape for needing to be punched into needs, here, first in formed punch and second formed punch be used to be punched into the product shapes of needs
And sub- material-strap structure.As one embodiment, the present embodiment can mold four SMD components, four SMD member devices simultaneously
Part is connected to back-to-back two-by-two on two sub- material strips, but not limited to this, it also can according to need while molding two SMD member devices
Part or a SMD component.
Preferably, referring to Fig. 7, cutting formed punch includes cutting from sub- material strip by molding first SMD component
First formed punch 21631 cut, molding 2nd SMD component is cut into second to get off from sub- material strip cut formed punch 21632
Formed punch 21633 is cut with two molding 3rd SMD components are cut two first to get off from sub- material strip, cuts the edge of a knife
Including and first cut formed punch corresponding first cut the edge of a knife, cut formed punch corresponding second with second and cut the edge of a knife and with two
Third cuts one-to-one two thirds of formed punch and cuts the edge of a knife, and material-dropping hole includes corresponding with the first SMD component first falling
Expect hole, the second material-dropping hole corresponding with the 2nd SMD component and is fallen with one-to-one two thirds of two the 3rd SMD components
Expect hole.In this way, by first cut formed punch, second cut formed punch, third cuts formed punch and its corresponding cooperation for cutting the edge of a knife,
Can simultaneously a first SMD component, a 2nd SMD component and two the 3rd SMD components whiles cut, and fill
It is intracavitary to enter to carry upper corresponding type, substantially increases packaging efficiency.
Preferably, it referring to Fig. 7, carries the position on slot in addition to cutting mechanism and is equipped with limit cover board 2124, limited cover
Plate is fixed in lower template and covers on carrier band slot, by carrier band limit in carrier band slot.In this way, being carried by limiting cover board the cover
On trough of belt, limit up and down can be carried out to carrier band, prevents carrier band from beating；And structure and shape phase due to carrying slot and carrier band
Together, left and right limit can be carried out to carrier band, prevents carrier band double swerve.
Preferably, referring to Fig. 7, along raw band feedstock direction, the left and right sides progress to raw band is installed in lower template
The first baffle 2125 and second baffle 2126 of limit, the side of first baffle top surface towards raw band is formed with the first stop edge
Side, the side of second baffle top surface towards raw band are formed with the second backstop rim.In this way, by installing first in lower template
Baffle and second baffle form the track groove for raw band and the transmission of sub- material strip between first baffle and second baffle, can
To limiting at left and right sides of material ribbon material strip, prevent raw band from wandering off, and by the top of first baffle and second baffle
Face forms the first backstop rim and the second backstop rim, and limit up and down can be carried out to raw band, prevents raw band from moving up and down.
Here, first baffle and second baffle can according to need the form for being arranged to multiple groups as combination, for example not rush in raw band
One group of setting before cutting respectively is arranged one group being punched cutting edge and cutting section, to meet the limit needs of raw band different in width.
It preferably, referring to figs. 7 and 8, further include the waste cutting machine structure 218 for being set to cutting mechanism side, waste material is cut
Mechanism includes the waste material edge of a knife group 2181 being installed in lower die and the waste material formed punch group 2182 being installed in upper mold；Waste material formed punch group
It is cut including two sub- material strips after cutting by the first SMD component, the 2nd SMD component and the 3rd SMD component disconnected
Two waste material formed punches, waste material edge of a knife group includes and the one-to-one two waste material edges of a knife of two waste material formed punches.In this way, by useless
Material cutting mechanism can complete cutting for waste material in stamping die, and waste material breaks it cutting by waste material formed punch and the waste material edge of a knife
Blanking is carried out automatically by the blanking port in stamping die.
It preferably, further include the channel for being connected to external vacuum evacuation device, channel includes setting along stamping die width direction
The first stomata for being placed in lower bolster and the second stomata cut in cushion block, the first stomata are set to along stamping die short transverse
It is connected to the second stomata and carrier band slot, the bottom of the type chamber of carrier band, which is formed with, vacuumizes hole.It is vacuumized in this way, channel is connected to outside
Device, when in the type chamber that SMD component drops into carrier band, by the first stomata, the second stomata and vacuumize hole take out it is true
SMD component can firmly be located in type chamber, prevent in motion process by sky, and SMD component flies out.
Stamping die embodiment 2
As shown in Figure 12, Figure 13, Figure 14, Figure 15, Figure 16, Figure 17, Figure 18 and Figure 19, a kind of stamping die is used for bending
The punch forming and packaging of SMD component, including upper mold 221, lower die 222 and the shaping packager being installed in upper mold and lower die
Structure, shaping packaging mechanism include the punching profile mechanism 223 set gradually along die length direction, bending mechanism 224, guillotine
Structure 225 is punched discrete piece mechanism 226 and feeding mechanism 227, and the carrier band slot 228 along the setting of die width direction is formed in lower die,
Carrier band 100 for packing SMD component is arranged in carrier band slot, and equidistant arrangement along its length is formed on carrier band
Several type chambers 1001, punching profile mechanism includes the shape edge of a knife group 2231 being installed in lower die and being installed in upper mold
Shape formed punch group 2232；Bending mechanism includes the folding that the bending lower die being installed in lower die enters block 2241 He is installed in upper mold
Curved upper mold enters block 2242；Cutting mechanism includes being installed on cutting the edge of a knife 2251 and cutting in lower die cushion block 2252 and to be installed on
Formed punch 2253 is cut on mould, cushion block is cut and is embedded in lower die, through cushion block is cut, cutting knife mask covers to be cut carrier band slot
On carrier band slot on cushion block, and cut the material-dropping hole 22511 in the middle part of the edge of a knife with perforation carrier band slot；Being punched discrete piece mechanism includes
The punching discrete piece edge of a knife 2261 being installed in lower die and the punching discrete piece formed punch 2262 being installed in upper mold；For forming SMD member
The raw band 300 of device, will be empty under the driving of devices for taking-up for packing the carrier band of SMD component from one endfeed of mold
Type chamber is moved to below material-dropping hole；Feeding mechanism can pull the distance of raw material tape travel setting station, such as station
Distance, raw band is punched out shape by shape edge of a knife group and shape formed punch group at punching profile mechanism, after being punched shape
Raw band block is entered by bending lower die at bending mechanism and bending upper die enters block and carries out bending set angle, the original after bending
Material strip at cutting mechanism by cutting the edge of a knife and cutting formed punch and cut, by the molding SMD component with bending from
Cut on raw band, make SMD component just can the material-dropping hole on the cut edge of a knife drop into the type of the carrier band in carrier band slot
Among chamber；It is punched discrete piece mechanism to be set between feeding mechanism and cutting mechanism, before raw band is not connected to feeding mechanism, cut out
It cuts mechanism not work, bending by molding is had by the punching discrete piece formed punch and the punching discrete piece edge of a knife that are punched discrete piece mechanism
SMD component cuts from raw band.
In above structure, by mold innovate layout punching profile mechanism, bending mechanism, cutting mechanism, punching dissipate
Piece mechanism and feeding mechanism, and on mold setting transmission carrier band carrier band slot, reached the punch forming of SMD component and
The purpose that carrier band braid is organically combined, in this way, SMD component need to only carry out automation feeding in the form of raw material, just
Can disposably complete SMD component automatic press molding, cut and pack, greatly improve SMD component production and
The efficiency of packaging meets the needs of SMT production line high-speed automated production.
The working principle of the utility model stamping die are as follows: under the control of PLC control system, devices for taking-up and mold by
Driving mechanisms control carries out automatically working and before automatically working needs that first raw band is connected on feeding mechanism, and
The tail end of mold is arranged in feeding mechanism, and therefore, before raw band is not connected to feeding mechanism, cutting mechanism does not work, i.e.,
Molding SMD component is cut punching intracavitary into the type carried, but passing through manual operation punching discrete piece mechanism
Discrete piece formed punch and the punching discrete piece edge of a knife, the molding SMD component with bending is cut from raw band, then again will
The free end of raw band is connected on feeding mechanism, and after starting life's work, punching discrete piece mechanism will no longer work, this
When, for forming the raw band of SMD component from one endfeed of mold, and the station that advances under the pulling of feeding mechanism
Distance, empty type chamber is moved to below material-dropping hole by the carrier band for packing SMD component under the driving of devices for taking-up, each
At station, raw band first at punching profile mechanism (punching station) is punched out outer by shape edge of a knife group and shape formed punch group
Shape at this point, the monnolithic case of SMD component has formed out, but is not bent into the SMD component of needs, and not
SMD component and the raw band of bending link together, and then (bending station) by bending lower die enters block at bending mechanism
Enter block with bending upper die and carry out bending set angle, at this point, SMD component carries out bending in the position for needing bending, after bending
SMD component remain attached on raw band, subsequently by cutting the edge of a knife and cutting formed punch and cut out at cutting mechanism
It cuts, the molding SMD component with bending is cut from raw band, make SMD component just can be on the cut edge of a knife
Material-dropping hole drop into carrier band slot in carrier band type chamber among；It is located in the carrier band slot of lower die due to carrying, raw band can be through
It overloads on trough of belt, when above the type chamber that SMD component after molding on raw band reaches the carrier band in carrier band slot, by cutting
The connection of mechanism severing SMD component and raw band can make SMD component just and can fall into the type of carrier band intracavitary, reach it is quick will
SMD component on raw band, which is packed into, carries the intracavitary purpose of upper corresponding tape carrier type, wherein the utility model is by cutting mechanism
It is formed by cutting the edge of a knife, cutting cushion block and cutting formed punch, cuts cushion block and be embedded in lower die, carrier band slot is cut out through cushion block is cut
Cutter mask covers on cutting the carrier band slot on cushion block, and cuts the material-dropping hole in the middle part of the edge of a knife with perforation carrier band slot, realizes
While meeting raw band transmission and carrier band transmission, and do not influence the function of cutting.
Preferably, referring to Figure 19, two sleeve forming package mechanisms are equipped with, two sleeve forming package mechanisms are between die width direction
Every setting, the corresponding raw band of every sleeve forming package mechanism, two sleeve forming package mechanisms are to two originals for entering mold simultaneously
Material strip carries out molding and packaging operation simultaneously.In this way, the utility model bending SMD component automatic moulding packaged die can be simultaneously
Integrated two sleeve forming package mechanisms, two sleeve forming package mechanisms can simultaneously form two raw bands for entering mold simultaneously
And packaging operation, the efficiency of the production of SMD component and packaging is further improved, it is automatic to better meet SMT production line high-speed
The needs that metaplasia produces.
Preferably, referring to Figure 13 and Figure 19, lower die includes the lower template 2221 set gradually from top to bottom, lower bolster 2222
With lower die holder 2223, slot is carried, shape edge of a knife group, bending lower die enter block, cut the edge of a knife, cut cushion block, the punching discrete piece edge of a knife is equal
Insertion is installed on the top surface of lower template, and upper mold includes the stripper plate 2211 set gradually from bottom to top, de- backboard 2212, upper mold
Plate 2213, upper padding plate 2214 and upper die holder 2215, shape formed punch group, cut formed punch, punching discrete piece formed punch be mounted on cope plate
On, and de- backboard and stripper plate are sequentially passed through, bending upper die enters block top and is clamped and located between stripper plate and de- backboard, and rolls over
Curved upper mold enters block bottom end and is pierced by from stripper plate.Wherein, upper die holder be mainly used for placing outer bush, limited post and discharging spring,
The size of upper die holder thickness and the length of discharging spring have direct relation.Upper padding plate is mainly used for bearing formed punch or mold insert in punching press
Stress is returned and is allowed in the process, and upper die holder is avoided to send depressed deformation.Cope plate is also referred to as upper clamp plate, be mainly used for fixing each formed punch,
Mold insert guarantees part active position and precision.De- backboard is mainly used for fixed discharging mold insert such as bending upper die and enters block, feeder
The shovel base and guide post of structure bear molding mold insert generated concentrated stress in process of production.Stripper plate, which is mainly used for placing, to be unloaded
Expect mold insert, after the completion of formed punch punching, separates formed punch with stamping material by the power that discharging spring provides.Lower template is mainly used
In placing stock guide, die insert, interior guide sleeve and buoyant block, for example, carrier band slot, shape edge of a knife group, bending lower die enter block, cut
The edge of a knife cuts cushion block and the punching discrete piece edge of a knife etc., and guarantees location accuracy, and for bearing side power when punching.Underlay
Plate is mainly used for fixing each workpiece of its installation jointly with lower template, while bearing generated power when insert punching press, prevents down
Die holder recess or deformation.Lower die holder is mainly used for placing outer bush, limited post, spring and buoyant pin assemblies.
Preferably, referring to Figure 19, shape formed punch group includes that the positioning of location hole is formed for punching upper in the middle part of raw band
Hole formed punch 22321, the first side formed punch 22322 being punched out for a side to raw band and for the another of raw band
Side is punched out the second side formed punch 22323 of the shape to form SMD component, is formed with corresponding location hole in shape edge of a knife group
The location hole edge of a knife 22311 of formed punch, corresponding first in the first of formed punch the edge of a knife 22312 and corresponding second side formed punch second
The side edge of a knife 22313.Wherein, location hole be used for in upper mold and lower die pilot pin 22210 and pin hole 22220 cooperated, it is real
The function of now positioning raw band prevents raw band in punching, bending or that position occurs during cut is mobile.And location hole will also
For being attached with feeding mechanism, location hole is pulled to carry out feeding by feeding mechanism.The shape of SMD component can be according to need
It is punched into the formation shape of needs.First in formed punch and second formed punch be used to be punched into the product shape and material strip knot of needs
Structure.In other embodiments, referring to Figure 19, the punching mechanism of pre-punched hole can also be set at the station before shape formed punch group
22230, two pre-punched holes are punched into the corresponding position of molding SMD component, ultimately form the shape of SMD component.
Preferably, referring to Figure 18 and Figure 19, feeding mechanism can pull the structure of the distance of one station of raw material tape travel
Be: feeding mechanism includes shovel base 2271, sliding block 2272, reset spring 2273 and one-to-one two buoyance lifts of two raw bands
2274, two buoyance lift retreat stop blocks 2275 of hanging block and several buoyance lift parts 2276 are shoveled on base and sliding block to be formed with and mutually matched tiltedly be led
Face 2277, buoyance lift hanging block top have the driving salient point 22741 for unidirectional drive raw band, have use at the top of buoyance lift retreat stop block
In forming sliding slot 22211 on the retaining salient point 22751 for preventing raw band from retreating, lower template, sliding block is slided along die length direction
In sliding slot, shovel base top is clamped and located between stripper plate and de- backboard, and is shoveled base terminal and be pierced by from stripper plate, and bullet is resetted
Spring location and installation is between sliding block and sliding slot；Two buoyance lift hanging blocks float up and down and are installed on sliding block, on two buoyance lift retreat stop blocks
Lower floating is installed in lower template, and several buoyance lift parts float up and down along raw band trend and are installed in lower template；Die opening state, if
Raw band is raised setting height from lower template by dry buoyance lift part, and in clamping process, shovel base drives sliding block along original by oblique surface
The distance of material strip feedstock direction one station of advance, makes reset spring compressed energy-storage, and drives buoyance lift hanging block one station of advance
Distance, buoyance lift hanging block by driving salient point and the location hole of rise mounting drive one station of raw material tape travel at a distance from,
Buoyance lift retreat stop block tangles location hole by retaining salient point after the distance of one station of raw material tape travel and carries out retaining, is opened process
In, raw band is raised setting height from lower template again by several buoyance lift parts, and shovel base follows upper mold to progressively disengage sliding block, resets
Spring drives sliding block and driving salient point to reset.In this way, pass through on shovel base under the mutual cooperation of oblique surface and the oblique surface on sliding block,
In clamping process, when shoveling base vertical downward movement, sliding block can be driven along the die length direction i.e. charging of raw band simultaneously
The distance of one station of direction advance, makes reset spring compressed energy-storage, and drives the distance of buoyance lift hanging block one station of advance, by
It can be mounted between the location hole on driving salient point and raw band at the top of buoyance lift hanging block, therefore, raw band can be driven simultaneously
Advance the distance of a station, and can also be mounted between the retaining salient point on buoyance lift retreat stop block and the location hole on raw band,
Therefore, the function of preventing raw band from retreating can be played, in this way, under the collective effect of buoyance lift hanging block and buoyance lift retreat stop block, it can
With unidirectional drive raw material tape travel, allow to carry out Continuous maching operation at each station of raw band.Here, several buoyance lift parts are used for
Raw band is raised setting height from lower template, in order to which raw band to be raised and move from lower template, such as it is floating
Rising part includes several floating pins, rocker piece etc.；Reset spring is for driving sliding block and driving salient point to be resetted, repeatedly,
Realize the continuous feed function of raw band.
Preferably, referring to Figure 19, it includes entering block A22411 and use for 45 degree of bending of bending lower die that bending lower die, which enters block,
Enter block B22412 in 90 degree of bending lower die of bending, it includes being rolled over for entering block A cooperation with bending lower die that bending upper die, which enters block,
Curved 45 degree of bending upper die enters block A22421 and the bending upper die for entering 90 degree of bending of progress of block B cooperation with bending lower die enters block
B22422.In this way, bending mechanism to be divided into pre-bend 45 and 90 degree of two steps of bending, product when wide-angle bending is avoided to return
Bullet, to guarantee bending quality.
Preferably, it referring to Figure 19, carries the position on slot in addition to cutting mechanism and is equipped with limit cover board 2224, limited cover
Plate is fixed in lower template and covers on carrier band slot, by carrier band limit in carrier band slot.In this way, being carried by limiting cover board the cover
On trough of belt, limit up and down can be carried out to carrier band, prevents carrier band from beating；And structure and shape phase due to carrying slot and carrier band
Together, left and right limit can be carried out to carrier band, prevents carrier band double swerve.
Preferably, referring to Figure 19, along raw band direction of travel, the left and right sides progress to raw band is installed in lower template
Limit first baffle 2225 and second baffle 2226, the side of first baffle top surface towards raw band are formed with the first stop edge
Side, the side of second baffle top surface towards raw band are formed with the second backstop rim.In this way, by installing first in lower template
Baffle and second baffle form the track groove for raw band transmission between first baffle and second baffle, can be to a raw band left side
Right two sides are limited, and prevent raw band from wandering off, and by forming the first stop edge in the top surface of first baffle and second baffle
Side and the second backstop rim can carry out limit up and down to raw band, prevent raw band from moving up and down.Here, first baffle and
Second baffle can according to need the form for being arranged to multiple groups as combination, for example one group is arranged before raw band is not punched,
Section is cut in punching bending and is arranged second group, and third group is set after cutting, can satisfy raw band different in width in this way
Limit needs.
It preferably, further include the channel 2227 for being connected to external vacuum evacuation device referring to Figure 15 and Figure 16, channel includes edge
The first stomata 22271 and cut in cushion block is set to along mold height direction that die width direction is set in lower bolster
Two stomatas 22272, the first stomata are connected to the second stomata and carrier band slot, and the bottom of the type chamber of carrier band, which is formed with, vacuumizes hole 1002.
In this way, channel is connected to external vacuum evacuation device, when bending SMD component drops into the type chamber of carrier band, pass through the first gas
It hole, the second stomata and vacuumizes hole and is vacuumized, bending SMD component can be firmly located in type chamber, prevent from moving
In the process, bending SMD component flies out.
Above embodiments are that the embodiments of the present invention are described in detail referring to attached drawing.Those skilled in the art
Member is by carrying out modification or change on various forms, but the situation of the essence without departing substantially from the utility model to above-described embodiment
Under, all fall within the scope of the present invention.
Claims (10)
1. a kind of full-automatic punching press braid all-in-one machine, it is characterised in that: flat including rack (1), the middle part for being installed on the rack
Stamping die (2) on platform (11) is installed on the upper frame (12) of the rack and provides punching press for the stamping die and push
The ram driving mechanism (3) of power is installed on the Vertical board support (13) of the rack and is located at batching for the stamping die side
Device (4), the hot pressing being installed on the Vertical board support of the rack and between the devices for taking-up and the stamping die fill
(5) are set, the finished product take-up reel (6) that is installed in the side frame body of the rack, is installed on the lower frame (14) of the rack and uses
In the lid belt reel (8) and the control that are used to roll up storage lid band in the carrier band reel (7) that volume storage carries, the side frame body for being installed on the rack
System processed, under the control of the control system, for forming the raw band of SMD component from the length direction of stamping die
Side charging, the side of width direction of the carrier band from stamping die for loading SMD component from the carrier band reel
Charging, the stamping die carry out punching press in punching course, to the raw band entered in it, SMD are molded on raw band
Molding SMD component is cut by component from raw band, and it is intracavitary to be automatically fed into corresponding type on the carrier band；In
Under the driving of the devices for taking-up, lid band and the other side of the width direction from the stamping die from the lid belt reel
The carrier band for being mounted with SMD component while the entrance hot-press arrangement of output are bonded, and the finished product take-up reel can incite somebody to action
Carrier band after fitting lid band is wound up.
2. full-automatic punching press braid all-in-one machine according to claim 1, it is characterised in that: the stamping die includes upper mold
(211), lower die (212) and the shaping packaging mechanism being installed in the upper mold and the lower die, shaping packaging mechanism packet
Outside including the feeding mechanism (213) set gradually along the die length direction, sanction material side and punching positioning holes mechanism (214), being punched
Shape mechanism (215) and cutting mechanism (216) are formed with the carrier band slot (217) along the setting of die width direction in the lower die, use
It is arranged in the carrier band slot in the carrier band (100) for loading SMD component (400), is formed with along its length on the carrier band
Several described type chambers (1001) of equidistant interval arrangement, the sanction material side and punching positioning holes mechanism include being installed on the lower die
On punching edge of a knife group (2141) and the punching formed punch group (2142) that is installed in the upper mold；The punching profile mechanism includes
The shape edge of a knife group (2151) being installed in the lower die and the shape formed punch group (2152) being installed in the upper mold；The sanction
Cutting mechanism includes being installed on cutting the edge of a knife (2161) and cut cushion block (2162) and be installed in the upper mold in the lower die
Cut formed punch (2163), the cushion block that cuts is embedded in the lower die, and the carrier band slot cuts cushion block through described, described
Cutting knife mask covers on the carrier band slot cut on cushion block, and described cut has the perforation carrier band slot in the middle part of the edge of a knife
Material-dropping hole (21611)；Raw band (300) for forming SMD component is fed from the side of stamping die length direction, and
Advance under the push of the feeding mechanism and set the distance of station, for loading the carrier band of SMD component in the devices for taking-up
Driving under empty type chamber is moved to below the material-dropping hole, the raw band expects that side and punching position at holes mechanism in sanctions
Cutting material side is carried out by the punching edge of a knife group and the punching formed punch group and rushes location hole 3001, cutting material side and punching positioning
Raw band behind hole is punched out at the punching profile mechanism by the shape edge of a knife group and the shape formed punch group outer
Shape, the raw band after being punched shape cuts the edge of a knife described at the cutting mechanism and the formed punch that cuts is cut,
Molding SMD component is cut from raw band, makes the SMD component just can be through the blanking cut on the edge of a knife
Hole drops among the type chamber of the carrier band in the carrier band slot.
3. full-automatic punching press braid all-in-one machine according to claim 2, it is characterised in that: the lower die includes from top to bottom
Lower template (2121), lower bolster (2122) and the lower die holder (2123) set gradually, the carrier band slot, the punching edge of a knife group,
The shape edge of a knife group, it is described cut the edge of a knife and the cushion block that cuts is embedded on the top surface for being installed on the lower template, it is described
Upper mold includes the stripper plate (2111) set gradually from bottom to top, de- backboard (2112), cope plate (2113), upper padding plate (2114)
With upper die holder (2115), the punching formed punch group, the shape formed punch group and the formed punch that cuts are mounted on the cope plate
On, and the de- backboard and the stripper plate can be sequentially passed through.
4. full-automatic punching press braid all-in-one machine according to claim 3, it is characterised in that: the feeding mechanism includes shovel base
(2131), sliding block (2132), jacking cylinder (2133), jacking part (2134), reset spring and several buoyance lift parts (2135), it is described
It is formed with mutually matched oblique surface (2136) on shovel base and the sliding block, forms sliding slot, the sliding block edge in the lower template
Stamping die length direction sliding is set in the sliding slot, and the shovel base top is clamped and located at the stripper plate and described
Between de- backboard, and the shovel base terminal is pierced by from the stripper plate, and the reset spring location and installation is in the sliding block and institute
It states between sliding slot；Have in the middle part of the sliding block along the through slot (21321) of stamping die length direction and along stamping die thickness
The jacking slot (21322) in direction, the jacking slot position is below the through slot and is connected to the through slot, the raw band from
It is pierced by the through slot, the jacking cylinder is installed on the slider bottom, and the bottom end of the jacking part is installed on the top
On the jacking axis for rising cylinder, the top of the jacking part passes through the jacking slot and extend into the through slot；Clamping process
In, the jacking cylinder is failure to actuate, and the shovel base drives the sliding block to retreat the distance of a station by the oblique surface, is made
The reset spring compressed energy-storage；During die sinking, the raw band is raised by several buoyance lift parts from the lower template
Setting height, the jacking cylinder drives the jacking part to be pressed on the raw band on the roof of the through slot, described
Shovel base follows upper mold to progressively disengage the sliding block, and under reset spring reply, the sliding block, which advances, sets the distance of station,
And drive the distance of the raw material tape travel setting station.
5. full-automatic punching press braid all-in-one machine according to claim 1, it is characterised in that: the stamping die includes upper mold
(221), lower die (222) and the shaping packaging mechanism being installed in the upper mold and the lower die, shaping packaging mechanism packet
Include punching profile mechanism (223), the bending mechanism (224), cutting mechanism set gradually along the stamping die length direction
(225), it is punched discrete piece mechanism (226) and feeding mechanism (227), is formed in the lower die and is arranged along stamping die width direction
Carrier band slot (228), the carrier band (100) for loading SMD component is arranged in the carrier band slot, is formed on the carrier band
Several the described type chambers (1001) equidistantly arranged along its length, the punching profile mechanism include be installed on it is described under
Shape edge of a knife group (2231) on mould and the shape formed punch group (2232) being installed in the upper mold；The bending mechanism includes peace
The bending upper die for entering block (2241) loaded on the bending lower die in the lower die and being installed in the upper mold enters block (2242)；It is described
Cutting mechanism includes being installed on cutting the edge of a knife (2251) and cut cushion block (2252) and be installed on the upper mold in the lower die
On cut formed punch (2253), the cushion block that cuts is embedded in the lower die, and the carrier band slot cuts cushion block through described, institute
It states cutting knife mask to cover on the carrier band slot cut on cushion block, and described cut in the middle part of the edge of a knife has the perforation carrier band slot
Material-dropping hole (22511)；The punching discrete piece mechanism includes the punching discrete piece edge of a knife (2261) being installed in the lower die and peace
Loaded on the punching discrete piece formed punch (2262) in the upper mold；For forming the raw band (300) of SMD component from stamping die
The side of length direction is fed, and the carrier band for loading SMD component moves empty type chamber under the driving of the devices for taking-up
It moves to the material-dropping hole；The feeding mechanism can pull the distance of the raw material tape travel setting station, the raw material
Band is punched out shape by the shape edge of a knife group and the shape formed punch group at the punching profile mechanism, is punched shape
Raw band afterwards enters block by the bending lower die at the bending mechanism and the bending upper die enters block and carries out bending setting
Angle, the raw band after bending cuts the edge of a knife described at the cutting mechanism and the formed punch that cuts is cut, will
The molding SMD component with bending cuts from raw band, and the SMD component is made just can to cut the edge of a knife through described
On material-dropping hole drop into it is described carrier band slot in carrier band type chamber among；The punching discrete piece mechanism is set to the feeding mechanism
Between the cutting mechanism, before raw band is not connected to the feeding mechanism, the cutting mechanism does not work, and passes through institute
It states the punching discrete piece formed punch of punching discrete piece mechanism and is punched the discrete piece edge of a knife for the molding SMD component with bending from raw band
On cut.
6. full-automatic punching press braid all-in-one machine according to claim 5, it is characterised in that: the lower die includes from top to bottom
Lower template (2221), lower bolster (2222) and the lower die holder (2223) set gradually, the carrier band slot, the shape edge of a knife group,
The bending lower die enter block, it is described cut the edge of a knife, it is described cut cushion block, the punching discrete piece edge of a knife be embedded in be installed on it is described under
On the top surface of template, the upper mold includes the stripper plate (2211) set gradually from bottom to top, de- backboard (2212), cope plate
(2213), upper padding plate (2214) and upper die holder (2215), the shape formed punch group, it is described cut formed punch, the punching discrete piece punching
Head is mounted on the cope plate, and sequentially passes through the de- backboard and stripper plate, and the bending upper die enters the clamping of block top
It is positioned between the stripper plate and the de- backboard, and the bending upper die enters block bottom end and is pierced by from the stripper plate.
7. full-automatic punching press braid all-in-one machine according to claim 6, it is characterised in that: the feeding mechanism can pull
The structure of the distance of the raw material tape travel setting station is: the feeding mechanism includes shovel base (2271), sliding block (2272), answers
Position spring (2273), buoyance lift hanging block (2274) corresponding with the raw band, buoyance lift retreat stop block (2275) and several buoyance lift parts
(2276), it is formed with mutually matched oblique surface (2277) on the shovel base and the sliding block, has at the top of the buoyance lift hanging block
For the driving salient point (22741) of raw band described in unidirectional drive, have at the top of the buoyance lift retreat stop block for preventing the original
The retaining salient point (22751) that material strip retreats forms sliding slot (22211) in the lower template, and the sliding block is along the die length
Direction sliding is set in the sliding slot, and the shovel base top is clamped and located between the stripper plate and the de- backboard, and institute
It states shovel base terminal to be pierced by from the stripper plate, the reset spring location and installation is between the sliding block and the sliding slot；It is described
Buoyance lift hanging block, which floats up and down, to be installed on the sliding block, and the buoyance lift retreat stop block, which floats up and down, to be installed in the lower template, if
It does the buoyance lift part and moves towards to float up and down to be installed in the lower template along raw band；Die opening state, several buoyance lift parts will
The raw band is raised setting height from the lower template, and in clamping process, the shovel base drives institute by the oblique surface
Sliding block is stated along the distance of raw band feedstock direction advance setting station, makes the reset spring compressed energy-storage, and is driven described floating
The distance of hanging block advance setting station is risen, the buoyance lift hanging block passes through the mounting of the location hole of the driving salient point and rise
Drive the distance of the raw material tape travel setting station, distance of the buoyance lift retreat stop block in raw material tape travel setting station
The location hole is tangled by the retaining salient point afterwards and carries out retaining, during die sinking, several buoyance lift parts are by the raw material
Band is raised setting height from the lower template again, and the shovel base follows upper mold to progressively disengage the sliding block, the reset bullet
Spring drives the sliding block and the driving salient point to reset.
8. full-automatic punching press braid all-in-one machine according to claim 1, it is characterised in that: it is flat that the rack is equipped with guiding
Platform (15) is formed with the guide channel (151) that guiding limits the carrier band, the guide channel and the carrier band on the pilot land
Slot is mutually linked, and the hot-press arrangement includes described in the upper hot wafering (51) being oppositely arranged up and down, lower hot wafering (52) and driving
The hot pressing motor of upper hot wafering and lower hot wafering folding, the lower hot wafering are embedded on the pilot land, it is described on
Hot wafering, which slides up and down, to be installed on the Vertical board support, the position that the lid band and carrier band conveyed in the guide channel needs to be bonded from
It is passed through between the lower hot wafering and the upper hot wafering.
9. full-automatic punching press braid all-in-one machine according to claim 8, it is characterised in that: the devices for taking-up includes indexing
Gear (41) indexes pinch roller (42), pinch roller connecting rod (43) and reel-motor, has the first indexing tooth, institute on the dividing gear
Stating has the second indexing tooth on indexing pinch roller, the reel-motor is installed on the back side of the Vertical board support, and the dividing gear turns
The dynamic front for being installed on stand plate, the rotary shaft of the reel-motor pass through the Vertical board support and drive the dividing gear rotation one
Determine angle, the pinch roller connecting rod, which floats up and down, is installed on the front of the Vertical board support, and the indexing pinch roller rotational installation is in described
On pinch roller connecting rod, the first indexing tooth on the dividing gear penetrates chain hole and described point on the guide channel and the carrier band
Spend the second indexing tooth engagement on pinch roller.
10. full-automatic punching press braid all-in-one machine according to claim 9, it is characterised in that: further include lid band guide mechanism
(9), the lid includes two material rollers (91) being installed on the Vertical board support, a tightening roller (92) and one with guide mechanism
Limit shaft (93), two material rollers are mounted on same level position and are spaced set distance, and the tightening roller is installed on two institutes
The lower section in the middle position of line between material roller is stated, the limit shaft is located at the lower section of a material roller and close to the guiding
Platform setting has the gap for limiting the lid band and the carrier band up and down between the limit shaft and the guide channel,
The lid band drawn from the lid belt reel successively bypasses the material roller, the tightening roller, another described material roller and institute
State and enter the hot-press arrangement after limit shaft, be equipped at intervals on the limit shaft two for left and right the limit lid band two
A axle bumper (931), and the distance between two described axle bumpers are adjustable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920145780.7U CN209699273U (en) | 2019-01-28 | 2019-01-28 | Full-automatic punching press braid all-in-one machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920145780.7U CN209699273U (en) | 2019-01-28 | 2019-01-28 | Full-automatic punching press braid all-in-one machine |
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| Publication Number | Publication Date |
|---|---|
| CN209699273U true CN209699273U (en) | 2019-11-29 |
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ID=68640651
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920145780.7U Withdrawn - After Issue CN209699273U (en) | 2019-01-28 | 2019-01-28 | Full-automatic punching press braid all-in-one machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109664368A (en) * | 2019-01-28 | 2019-04-23 | 昆山琨明电子科技有限公司 | Full-automatic punching press braid all-in-one machine |
-
2019
- 2019-01-28 CN CN201920145780.7U patent/CN209699273U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109664368A (en) * | 2019-01-28 | 2019-04-23 | 昆山琨明电子科技有限公司 | Full-automatic punching press braid all-in-one machine |
| CN109664368B (en) * | 2019-01-28 | 2024-03-19 | 昆山琨明电子科技有限公司 | Full-automatic punching press braid all-in-one |
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