CN109606781B - Automatic forming and packaging die for planar SMD components - Google Patents
Automatic forming and packaging die for planar SMD components Download PDFInfo
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- CN109606781B CN109606781B CN201910082210.2A CN201910082210A CN109606781B CN 109606781 B CN109606781 B CN 109606781B CN 201910082210 A CN201910082210 A CN 201910082210A CN 109606781 B CN109606781 B CN 109606781B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 54
- 238000005520 cutting process Methods 0.000 claims abstract description 160
- 238000004080 punching Methods 0.000 claims abstract description 92
- 239000002994 raw material Substances 0.000 claims abstract description 89
- 230000007246 mechanism Effects 0.000 claims abstract description 75
- 239000000463 material Substances 0.000 claims abstract description 37
- 239000002699 waste material Substances 0.000 claims abstract description 22
- 238000009966 trimming Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000011084 recovery Methods 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 abstract description 28
- 238000009740 moulding (composite fabrication) Methods 0.000 description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007667 floating Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000009954 braiding Methods 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
- B65B31/04—Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
- B65B61/04—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages
- B65B61/06—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting
- B65B61/065—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting by punching out
Abstract
The invention discloses an automatic forming and packaging die for planar SMD components, which is characterized in that a feeding mechanism, a material cutting edge and positioning hole punching mechanism, a shape punching mechanism, a cutting mechanism and a waste cutting mechanism are innovated on the die, and a carrying groove for conveying a carrying belt is arranged on the die, so that the purpose of organically combining the forming and manufacturing of the planar SMD components with the packaging of the carrying belt is achieved, the planar SMD components can be automatically formed, manufactured, cut and packaged only in a raw material mode, and meanwhile, the cutting and blanking of waste are finished, the production and packaging efficiency of the SMD components is greatly improved, and the high-speed automatic production requirement of an SMT production line is met. Compared with the mode that SMD components are firstly molded to be made into a material belt, the production efficiency is further improved.
Description
Technical Field
The invention relates to SMD component forming and packaging equipment, in particular to an automatic forming and packaging die for planar SMD components.
Background
SMT is an abbreviation of surface mount technology, meaning surface mount technology, and the advent of SMT has revolutionized electronics. Currently, most PCBs more or less adopt the production technology with low cost, high efficiency and reduced PCB board volume. The SMD is an abbreviation of Surface Mounted Devices, which means surface mount devices, and the wide application of SMT promotes the development of SMD, the original via components are replaced by SMD components, and meanwhile, people have the requirements of small volume and multiple functions for electronic products such as mobile phones, computers and the like, and further promote the development of SMD components to high integration and miniaturization.
At present, in order to meet the requirement of high-speed automatic application of an SMT production line, SMD components generally take a carrier tape as a packaging and transporting carrier to meet the requirement of high-speed development of the SMT production line, and the carrier tape as the SMD component packaging and transporting carrier is generally composed of a carrier tape formed with a plurality of cavities for accommodating the SMD components and a cover tape for closing the openings of the cavities, wherein the cavities are generally formed in the middle of the carrier tape in the direction of the carrier tape and are arranged at equal intervals along the length direction of the carrier tape. The speed of the SMD component carrier tape package is determined by the speed of loading the SMD component into the cavity of the carrier tape, and the traditional operation mode is as follows: firstly, conveying a carrier tape to a working platform of a braiding machine for positioning by a winding and conveying device; then, loading the cut piece-by-piece SMD components into a cavity of a carrier tape by a manual or mechanical arm, and finally, enabling the cover tape and the carrier tape to be attached and sealed by a hot pressing device, thereby completing the packaging of the SMD components; the manual feeding is adopted, a large amount of manpower is required to be input, the operation packaging efficiency is low, the cost is high, and the quality of products is difficult to ensure by manual operation. The other type is that the material is automatically taken by a mechanical arm, and cut scattered SMD components are put into a cavity of a carrier tape; in the operation mode, as the manipulator needs a certain time in the movement process, the SMD component carrier tape packaging efficiency is still low, and the high-speed automatic production requirement of the SMT production line cannot be met. In particular, for some punching sheets like elastic sheets or nickel sheets, because the elastic sheets or nickel sheets are lighter and thinner, the thickness of the product is only 0.1mm, the product is planar and L-shaped or abnormal, and the product has front and back directions, when the product is packaged in the operation mode, the problems of material clamping of a vibration disc, low efficiency in direction identification and high feeding and grabbing difficulty of a manipulator exist. Even some products can not meet the packaging requirement of an automatic braiding machine at all, and only manual operation modes can be adopted. Therefore, patent document CN203332436U proposes an automatic feeding and cutting device for packaging SMD component carrier tape, which automatically feeds SMD components in a material tape form, and realizes automatic positioning, cutting and feeding packaging of the SMD components through an automatic feeding positioning device and a cutting device, thereby greatly improving the packaging efficiency of the SMD component carrier tape and meeting the requirement of high-speed automatic production of an SMT production line to a certain extent. However, the SMD component is first molded into a tape form, and the production efficiency is still further improved.
Disclosure of Invention
In order to solve the technical problems, the invention provides the automatic forming and packaging die for the planar SMD components, which organically combines the forming and manufacturing of the SMD components with the carrying packaging, and can finish the automatic forming, manufacturing, cutting and packaging of the SMD components only by automatically feeding the SMD components in the form of raw materials, thereby greatly improving the production and packaging efficiency of the SMD components and meeting the requirement of high-speed automatic production of an SMT production line.
The technical scheme of the invention is realized as follows:
the automatic forming and packaging die for the planar SMD components comprises an upper die, a lower die and a forming and packaging mechanism arranged on the upper die and the lower die, wherein the forming and packaging mechanism comprises a feeding mechanism, a cutting edge, a punching locating hole mechanism, a punching appearance mechanism and a cutting mechanism which are sequentially arranged along the length direction of the die, a carrier belt groove arranged along the width direction of the die is formed on the lower die, a carrier belt for packaging the SMD components is arranged in the carrier belt groove in a penetrating manner, a plurality of cavities which are arranged at equal intervals along the length direction are formed on the carrier belt, and the cutting edge and the punching locating hole mechanism comprise a punching edge group arranged on the lower die and a punching punch group arranged on the upper die; the shape punching mechanism comprises a shape knife edge group arranged on the lower die and a shape punch group arranged on the upper die; the cutting mechanism comprises a cutting edge, a cutting cushion block and a cutting punch head, wherein the cutting edge and the cutting cushion block are arranged on the lower die, the cutting punch head is arranged on the upper die, the cutting cushion block is embedded on the lower die, the carrier belt groove penetrates through the cutting cushion block, the cutting knife mask covers the carrier belt groove on the cutting cushion block, and the middle part of the cutting knife opening is provided with a blanking hole penetrating through the carrier belt groove; the raw material belt for forming the SMD component is fed from one end of the die and advances one station distance under the pushing of the feeding mechanism, the carrier belt for packaging the SMD component is driven by the external coiling device to move the empty cavity to the lower part of the blanking hole, the raw material belt is subjected to cutting edges and punching locating holes at the cutting edges and punching locating hole mechanism through the punching edge group and the punching punch group, the raw material belt after cutting edges and punching locating holes is subjected to punching appearance at the punching appearance mechanism through the appearance edge group and the appearance punch group, the raw material belt after punching appearance is subjected to cutting at the cutting mechanism through the cutting edge and the cutting punch, and the formed SMD component is cut from the raw material belt, so that the SMD component can fall into the cavity of the carrier belt in the carrier belt through the blanking hole on the cutting edge.
Further, the lower mould includes lower bolster, lower bolster and the die holder that top-down set gradually, the carrier groove the die-cut edge group, the appearance edge group, cut the edge with cut the cushion all imbeds and install in on the top surface of lower bolster, the upper mould includes take off flitch, take off backplate, cope match-plate pattern, upper bolster and the upper die holder that bottom-up set gradually, die-cut drift group the appearance drift group with cut the drift all install in on the cope match-plate pattern, and can pass in proper order take off backplate and take off the flitch.
Further, the feeding mechanism comprises a shovel base, a sliding block, a jacking cylinder, a jacking piece, a reset spring and a plurality of floating pieces, wherein an inclined guide surface matched with each other is formed on the shovel base and the sliding block, a sliding groove is formed on the lower die plate, the sliding block is arranged in the sliding groove in a sliding manner along the length direction of the die, the top end of the shovel base is clamped and positioned between the stripper plate and the stripper plate, the bottom end of the shovel base penetrates out of the stripper plate, and the reset spring is positioned and installed between the sliding block and the sliding groove; the middle part of the sliding block is provided with a through groove along the length direction of the die and a jacking groove along the thickness direction of the die, the jacking groove is positioned below the through groove and communicated with the through groove, the raw material belt penetrates out of the through groove, the jacking cylinder is arranged at the bottom of the sliding block, the bottom end of the jacking piece is arranged on a jacking shaft of the jacking cylinder, and the top end of the jacking piece penetrates through the jacking groove and stretches into the through groove; in the die assembly process, the jacking cylinder does not act, and the shovel base drives the sliding block to retreat by one station distance through the inclined guide surface, so that the reset spring compresses and stores energy; in the die sinking process, a plurality of the lifting pieces lift the raw material belt from the lower die plate to set height, the lifting air cylinder drives the lifting pieces to compress the raw material belt on the top wall of the through groove, the shovel base is gradually separated from the sliding block along with the upper die, and the sliding block advances by one station distance under the recovery of the reset spring and drives the raw material belt to advance by one station distance.
Further, the punching punch set includes a positioning hole punch for punching a positioning hole in the middle of the raw material belt, a first trimming punch for punching one side of the raw material belt, and a second trimming punch for punching the other side of the raw material belt, and the punching knife edge set is formed with a positioning Kong Daokou corresponding to the positioning hole punch, a first trimming knife edge corresponding to the first trimming punch, and a second trimming knife edge corresponding to the second trimming punch.
Further, the profile punch set comprises a first side punch for punching one side of the raw material belt to form the profile of a first SMD component, a second side punch for punching the other side of the raw material belt to form the profile of a second SMD component, and a central punch for punching the middle of the raw material belt to form the profiles of two third SMD components, wherein the profile punch set is provided with a first side punch edge, a second side punch edge and a profile punch edge, the first side punch edge corresponds to the second side punch edge, the second side punch edge corresponds to the central punch edge, after punching, the raw material belt is divided into two sub-material belts, one third SMD component and one first SMD component are connected back to back on one sub-material belt, and the other third SMD component and one second SMD component are connected back to back on another sub-material belt.
Further, the cutting punch comprises a first cutting punch for cutting the formed first SMD component from the sub-material belt, a second cutting punch for cutting the formed second SMD component from the sub-material belt and two third cutting punches for cutting the two formed third SMD components from the sub-material belt, and the cutting knife opening comprises a first cutting knife edge corresponding to the first cutting punch, a second cutting knife edge corresponding to the second cutting punch and two third cutting knife edges corresponding to the two third cutting punches one to one, and the blanking holes comprise a first blanking hole corresponding to the first component, a second blanking hole corresponding to the second SMD component and two third blanking holes corresponding to the two third SMD components one to one.
Further, a limit cover plate is arranged on the carrier belt groove except the cutting mechanism, and is fixedly connected to the lower die plate and covers the carrier belt groove to limit the carrier belt in the carrier belt groove.
Further, along the raw material belt feeding direction, install on the lower bolster right and left sides of raw material belt go on spacing first baffle and second baffle, first baffle top surface orientation raw material belt's one side is formed with first backstop rim, second baffle top surface orientation raw material belt's one side is formed with the second backstop rim.
Further, the device also comprises a waste cutting mechanism arranged at one side of the cutting mechanism, wherein the waste cutting mechanism comprises a waste knife edge group arranged on the lower die and a waste punch head group arranged on the upper die; the scrap punch set comprises two scrap punches which cut off the sub-material strips after the first SMD component, the second SMD component and the third SMD component are cut off, and the scrap knife edge set comprises two scrap knife edges which are in one-to-one correspondence with the two scrap punches.
Further, the die comprises a channel connected to an external vacuumizing device, the channel comprises a first air hole arranged in the lower base plate along the width direction of the die and a second air hole arranged in the cutting cushion block along the height direction of the die, the first air hole is communicated with the second air hole and the carrier belt groove, and a vacuumizing hole is formed in the bottom of the cavity of the carrier belt.
The beneficial effects of the invention are as follows: the invention provides an automatic forming and packaging die for planar SMD components, which is characterized in that a feeding mechanism, a material cutting edge and positioning hole punching mechanism, a shape punching mechanism, a cutting mechanism and a waste cutting mechanism are innovated on the die, and a carrier groove for conveying a carrier belt is arranged on the die, so that the purpose of organically combining the forming and manufacturing of the planar SMD components with the packaging of the carrier belt is achieved, the planar SMD components can be automatically formed, manufactured, cut and packaged only in a raw material mode, and meanwhile, the cutting and blanking of waste materials are completed, the production and packaging efficiency of the SMD components is greatly improved, and the high-speed automatic production requirement of an SMT production line is met. Compared with the mode that SMD components are firstly molded to be made into a material belt, the production efficiency is further improved.
Drawings
FIG. 1 is a schematic view of a view angle of an automatic forming and packaging mold for planar SMD components of the present invention;
FIG. 2 is a schematic view of the structure of FIG. 1 with the material and carrier tapes removed;
FIG. 3 is a schematic structural view of a planar SMD component automatic molding packaging mold in another view angle mold closing state;
FIG. 4 is an enlarged schematic view of the structure of FIG. 3A;
fig. 5 is a schematic structural view of another view angle mold opening state of the planar SMD component automatic molding packaging mold of the present invention;
fig. 6 is a schematic diagram of the cooperation of the jacking cylinder and the sliding block in the invention.
Detailed Description
In order that the technical content of the present invention may be more clearly understood, the following detailed description of the embodiments is given only for better understanding of the content of the present invention and is not intended to limit the scope of the present invention.
As shown in fig. 1, fig. 2, fig. 3, fig. 4, fig. 5 and fig. 6, an automatic forming and packaging die for planar SMD components comprises an upper die 1, a lower die 2, and forming and packaging mechanisms mounted on the upper die and the lower die, wherein the forming and packaging mechanisms comprise a feeding mechanism 3, a cutting edge and punching positioning hole mechanism 4, a punching appearance mechanism 5 and a cutting mechanism 6 which are sequentially arranged along the length direction of the die, a carrier belt groove 7 arranged along the width direction of the die is formed on the lower die, a carrier belt 8 for packaging the SMD components 100 is arranged in the carrier belt groove in a penetrating manner, a plurality of cavities 81 are formed on the carrier belt at equal intervals along the length direction, and the cutting edge and punching positioning hole mechanism comprises a punching edge group 41 mounted on the lower die and a punching punch head group 42 mounted on the upper die; the shape punching mechanism comprises a shape knife edge group 51 arranged on the lower die and a shape punch group 52 arranged on the upper die; the cutting mechanism comprises a cutting edge 61 and a cutting cushion block 62 which are arranged on the lower die and a cutting punch 63 which is arranged on the upper die, the cutting cushion block is embedded on the lower die, the carrier groove penetrates through the cutting cushion block, the cutting knife mask covers the carrier groove on the cutting cushion block, and the middle part of the cutting knife opening is provided with a blanking hole 611 which penetrates through the carrier groove; the raw material belt 9 for forming the SMD component is fed from one end of the die and advances one station distance under the pushing of the feeding mechanism, the carrier belt for packaging the SMD component is driven by the external coiling device to move the empty cavity to the lower part of the blanking hole, the raw material belt is subjected to cutting edges and punching positioning holes through the punching edge group and the punching punch group at the cutting edge and positioning hole mechanism, the raw material belt subjected to cutting edges and punching positioning holes is subjected to punching appearance through the appearance edge group and the appearance punch group at the punching appearance mechanism, the raw material belt subjected to punching appearance is subjected to cutting through the cutting edge and the cutting punch at the cutting mechanism, and the formed SMD component is cut from the raw material belt, so that the SMD component can fall into the cavity of the carrier belt in the carrier belt groove through the blanking hole on the cutting edge.
In the structure, through innovation overall arrangement feeding mechanism, cut out the material limit and punch out locating hole mechanism, die-cut appearance mechanism and cut out the mechanism on the mould to set up the carrier groove of conveyer belt on the mould, reached the shaping preparation and the carrier belt packing of plane SMD components and parts carry out the purpose of organic combination, like this, plane SMD components and parts only need carry out automatic material loading with the form of raw and other materials, just can accomplish the automatic molding preparation of SMD components and parts, cut out and pack, accomplish the cutting and the unloading of waste material simultaneously, very big improvement SMD components and parts production and packing efficiency, satisfy SMT production line high-speed automated production's needs. Compared with the mode that SMD components are firstly molded to be made into a material belt, the production efficiency is further improved. The working principle of the automatic forming and packaging die for the planar SMD components of the invention is as follows: under the control of a PLC control system, a coiling device and a die are controlled by a driving mechanism to automatically work, when the die is opened, a raw material belt for forming SMD components is fed from one end of the die and is pushed by a feeding mechanism to move forward by a distance of one station, a carrier belt for packaging the SMD components is driven by an external coiling device to move an empty cavity below a blanking hole, when the die is closed, the raw material belt firstly cuts a material edge and punches a locating hole at a cutting edge and punching locating hole mechanism (punching station) through a punching knife edge group and a punching punch head group, and the locating hole is used for matching with locating pins on an upper die and a lower die to realize the function of locating the raw material belt and prevent the raw material belt from moving in the punching or cutting process. At this time, the whole appearance of the SMD component is not formed yet, then the raw material belt is punched by an appearance cutting edge group and an appearance punch group at a punching appearance mechanism (punching appearance station), at this time, the whole appearance of the SMD component is formed, as a preferred embodiment, four SMD components can be formed at the same time, the four SMD components are connected back to back on two sub-material belts, then the cutting mechanism cuts the SMD component by the cutting edge and the cutting punch, and the formed SMD component is cut from the raw material belt, so that the SMD component just can fall into the cavity of the carrier belt in the carrier belt groove through the blanking hole on the cutting edge; the carrier belt is positioned in the carrier belt groove of the lower die, the raw material belt passes through the carrier belt groove, when the SMD components formed on the raw material belt reach the position above the cavity of the carrier belt in the carrier belt groove, the SMD components are connected with the raw material belt by the cutting mechanism, so that the SMD components can just fall into the cavity of the carrier belt, and the purpose of rapidly loading the SMD components on the raw material belt into the corresponding carrier belt cavity on the carrier belt is achieved.
Preferably, referring to fig. 3 and 5, the lower die includes a lower die plate 21, a lower backing plate 22 and a lower die holder 23 sequentially arranged from top to bottom, the carrier slot, the punching blade group, the profile blade group, the cutting blade and the cutting cushion block are all embedded and mounted on the top surface of the lower die plate, the upper die includes a stripper plate 11, a stripper plate 12, an upper die plate 13, an upper backing plate 14 and an upper die holder 15 sequentially arranged from bottom to top, and the punching punch group, the profile punch group and the cutting punch are all mounted on the upper die plate and can sequentially pass through the stripper plate and the stripper plate. The upper die holder is mainly used for placing the outer guide sleeve, the limiting column and the unloading spring, and the thickness of the upper die holder is directly related to the length of the unloading spring. The upper base plate is mainly used for bearing the stress return of the punch or the insert in the punching process, and the upper die base is prevented from transmitting concave deformation. The upper die plate is also called as an upper clamping plate and is mainly used for fixing each punch and each insert and guaranteeing the action position and the precision of the parts. The stripper plate is mainly used for fixing the unloading insert and bearing the concentrated stress generated in the production process of the molding insert. The stripper plate is mainly used for placing the unloading insert, and when the punching shearing of the punch is completed, the punch is separated from the punching material by the aid of the force provided by the unloading spring. The lower template is mainly used for placing a guide plate, a die insert, an inner guide sleeve and a floating block, such as a carrier groove, a punching blade group, an outline blade group, a cutting blade, a cutting cushion block, a punching scattered blade and the like, ensuring the position accuracy and being used for bearing the side force during punching and shearing. The lower backing plate is mainly used for fixing all the workpieces mounted with the lower die plate together, and simultaneously bears the force generated during the insert stamping to prevent the lower die holder from sinking or deforming. The lower die holder is mainly used for placing the outer guide sleeve, the limiting column, the spring and the floating pin component.
Preferably, referring to fig. 3, 5 and 6, the feeding mechanism includes a shovel base 31, a slide block 32, a lifting cylinder 33, a lifting member 34, a return spring and a plurality of lifting members 35, wherein the shovel base and the slide block are formed with mutually matched inclined guide surfaces 36, a chute is formed on the lower die plate, the slide block is slidingly arranged in the chute along the length direction of the die, the top end of the shovel base is clamped and positioned between the stripper plate and the stripper plate, the bottom end of the shovel base penetrates out of the stripper plate, and the return spring is positioned and installed between the slide block and the chute; the middle part of the sliding block is provided with a through groove 321 along the length direction of the die and a jacking groove 322 along the thickness direction of the die, the jacking groove is positioned below the through groove and communicated with the through groove, the raw material belt penetrates out of the through groove, the jacking cylinder is arranged at the bottom of the sliding block, the bottom end of the jacking piece is arranged on a jacking shaft of the jacking cylinder, and the top end of the jacking piece penetrates through the jacking groove and stretches into the through groove; in the die assembly process, the jacking cylinder does not act, and the shovel base drives the sliding block to retreat by one station distance through the inclined guide surface, so that the reset spring compresses and stores energy; in the die sinking process, a plurality of the lifting pieces lift the raw material belt from the lower die plate to set height, the lifting air cylinder drives the lifting pieces to compress the raw material belt on the top wall of the through groove, the shovel base is gradually separated from the sliding block along with the upper die, and the sliding block advances by one station distance under the recovery of the reset spring and drives the raw material belt to advance by one station distance. Therefore, under the mutual matching of the inclined guide surface on the shovel base and the inclined guide surface on the sliding block, in the die assembly process, the shovel base can drive the sliding block to retreat by one station along the length direction of the die at the same time, so that the reset spring compresses and stores energy, at the moment, the jacking air cylinder does not act, namely the raw material belt is not pressed on the sliding block and does not move along with the sliding block, in the die opening process after one stamping is completed, the jacking air cylinder acts, the jacking piece is driven by the jacking air cylinder, the raw material belt can be pressed on the top wall of the through groove, at the moment, the shovel base is gradually separated from the sliding block along the upper die, the sliding block can advance by one station distance and drive the raw material belt to advance by one station distance under the drive of the reset spring energy storage release force, and the automatic feeding function is realized. A plurality of buoyancy elements are used for lifting the raw material belt from the lower die plate to a set height so as to lift and move the raw material belt from the lower die plate, for example, the buoyancy elements comprise a plurality of buoyancy pins or floating blocks and the like; the reset spring is used for retreating and storing energy during die assembly, and driving the sliding block to feed during die opening, and the continuous feeding function of the raw material belt can be realized through repetition.
Preferably, referring to fig. 2, the punching punch set includes a positioning hole punch 421 for punching a positioning hole 91 in the middle of the raw material belt, a first trimming punch 422 for punching one side edge of the raw material belt, and a second trimming punch 423 for punching the other side edge of the raw material belt, and the punching knife set is formed with a positioning Kong Daokou corresponding to the positioning hole punch, a first trimming knife corresponding to the first trimming punch, and a second trimming knife corresponding to the second trimming punch. Wherein, the locating hole is used for cooperating with the locating pin on last mould and the lower mould, realizes the function of locating the raw materials area, prevents that the raw materials area from taking place the position movement in die-cut, bending or cutting process. The width of the raw material belt is generally larger than the width of the SMD components after molding, and unnecessary material edges can be cut off through the first edge cutting punch and the second edge cutting punch.
Preferably, referring to fig. 2, the profile punch set includes a first edge punch 521 for punching one side edge of the raw material strip to form a profile of a first SMD component, a second edge punch 522 for punching the other side edge of the raw material strip to form a profile of a second SMD component, and a center punch 523 for punching the middle part of the raw material strip to form profiles of two third SMD components, the profile punch set is formed with a first edge corresponding to the first edge punch, a second edge corresponding to the second edge punch, and a profile edge corresponding to the center punch, after punching, the raw material strip is divided into two sub-strips, one of the third SMD components is connected back to back with one of the first SMD components to back with one of the second SMD components, and the other of the third SMD components is connected back to back with one of the second SMD components to back with the sub-strips. Thus, the external shape of the SMD component can be punched into a required shape according to the requirement, and the first side punch and the second side punch are used for punching the required product external shape and the sub-material belt structure. As a preferred embodiment, the present embodiment can simultaneously mold four SMD components, where the four SMD components are connected back to two sub-bands, but not limited thereto, and two SMD components or one SMD component may be simultaneously molded as required.
Preferably, referring to fig. 2, the cutting punch includes a first cutting punch 631 cutting the molded first SMD component from the sub-material tape, a second cutting punch 632 cutting the molded second SMD component from the sub-material tape, and two third cutting punches 633 cutting the two molded third SMD components from the sub-material tape, and the cutting knife includes a first cutting knife edge corresponding to the first cutting punch, a second cutting knife edge corresponding to the second cutting punch, and two third cutting knife edges corresponding to the two third cutting punches one to one, and the blanking holes include a first blanking hole corresponding to the first SMD component, a second blanking hole corresponding to the second SMD component, and two third blanking holes corresponding to the two third SMD components one to one. Therefore, the first, second and third cutting punches and the corresponding cutting edges thereof can be matched to cut one first SMD component, one second SMD component and two third SMD components at the same time and are arranged in the corresponding cavities on the carrier tape, so that the packaging efficiency is greatly improved.
Preferably, referring to fig. 2, a limiting cover plate 24 is disposed on the carrier belt slot except for the cutting mechanism, and is fixedly connected to the lower die plate and covers the carrier belt slot to limit the carrier belt in the carrier belt slot. Therefore, the carrier belt can be limited up and down by covering the carrier belt groove through the limiting cover plate, and the carrier belt is prevented from jumping; and because the structure and the shape of the carrier belt groove and the carrier belt are the same, the carrier belt can be limited left and right, and the carrier belt is prevented from shaking left and right.
Preferably, referring to fig. 2, along the feeding direction of the raw material belt, a first baffle 25 and a second baffle 26 for limiting the left and right sides of the raw material belt are mounted on the lower die plate, a first stop edge is formed on one side of the top surface of the first baffle facing the raw material belt, and a second stop edge is formed on one side of the top surface of the second baffle facing the raw material belt. Like this, through installing first baffle and second baffle on the lower bolster, formed the track groove that supplies raw materials area and sub-material area transmission between first baffle and the second baffle, can carry out spacingly to raw materials area sub-material area left and right sides, prevent that the raw materials from taking away partially, and through forming first backstop rim and second backstop rim at the top surface of first baffle and second baffle, can carry out spacing from top to bottom to the raw materials area, prevent that the raw materials from jumping from top to bottom. Here, the first baffle and the second baffle can be arranged in a plurality of groups as required, for example, a group is arranged before the raw material belt is not punched, and a group is arranged at the punching cutting edge and the cutting section respectively, so as to meet the limit requirements of different widths of the raw material belt.
Preferably, referring to fig. 2 and 3, the waste cutting mechanism 10 is further included on one side of the cutting mechanism, and the waste cutting mechanism includes a waste knife edge group 101 mounted on the lower die and a waste punch group 102 mounted on the upper die; the scrap punch set comprises two scrap punches which cut off the sub-material strips after the first SMD component, the second SMD component and the third SMD component are cut off, and the scrap knife edge set comprises two scrap knife edges which are in one-to-one correspondence with the two scrap punches. Therefore, the waste cutting mechanism can cut waste on the die, and the waste is automatically discharged through the blanking port on the die after being cut by the waste punch and the waste knife edge.
Preferably, the die comprises a die, a lower base plate and a cutting cushion block, and is characterized by further comprising a channel connected to an external vacuumizing device, wherein the channel comprises a first air hole arranged in the lower base plate along the width direction of the die and a second air hole arranged in the cutting cushion block along the height direction of the die, the first air hole is communicated with the second air hole and the carrier groove, and a vacuumizing hole is formed in the bottom of a cavity of the carrier belt. Like this, the passageway communicates to outside evacuating device, when SMD components and parts fall into the die cavity of carrier band, carries out the evacuation through first gas pocket, second gas pocket and evacuating hole, can firmly fix SMD components and parts in the die cavity, prevents to bend SMD components and parts departure in the motion process.
The above embodiments are described in detail with reference to the accompanying drawings. Modifications and variations in the above-described embodiments may be made by those skilled in the art without departing from the spirit of the invention, which fall within the scope of the invention.
Claims (10)
1. The utility model provides a plane SMD components and parts automatic molding packaging mould which characterized in that: the forming and packaging mechanism comprises an upper die (1), a lower die (2) and a forming and packaging mechanism arranged on the upper die and the lower die, wherein the forming and packaging mechanism comprises a feeding mechanism (3), a cutting edge and punching locating hole mechanism (4), a punching appearance mechanism (5) and a cutting mechanism (6) which are sequentially arranged along the length direction of the die, a carrier belt groove (7) arranged along the width direction of the die is formed on the lower die, a carrier belt (8) for packaging SMD components (100) is arranged in the carrier belt groove in a penetrating way, a plurality of cavities (81) which are arranged at equal intervals along the length direction are formed on the carrier belt, and the cutting edge and punching locating hole mechanism comprises a punching edge group (41) arranged on the lower die and a punching punch head group (42) arranged on the upper die; the shape punching mechanism comprises a shape knife edge group (51) arranged on the lower die and a shape punch group (52) arranged on the upper die; the cutting mechanism comprises a cutting knife opening (61) and a cutting cushion block (62) which are arranged on the lower die and a cutting punch (63) which is arranged on the upper die, the cutting cushion block is embedded on the lower die, the carrier groove penetrates through the cutting cushion block, the cutting knife mask covers the carrier groove on the cutting cushion block, and the middle part of the cutting knife opening is provided with a blanking hole (611) penetrating through the carrier groove; the raw material belt (9) for forming the SMD component is fed from one end of the die and advances one station distance under the pushing of the feeding mechanism, the carrier belt for packaging the SMD component is driven by the external coiling device to move the empty cavity to the lower part of the blanking hole, the raw material belt is subjected to cutting edges and punching positioning holes through the punching edge group and the punching punch group at the positions of the cutting edges and the punching positioning holes, the raw material belt after cutting edges and punching the positioning holes is subjected to punching appearance through the appearance edge group and the appearance punch group at the positions of the punching appearance mechanism, the raw material belt after punching appearance is subjected to cutting through the cutting edges and the cutting punch at the positions of the cutting mechanism, and the formed SMD component is cut from the raw material belt, so that the SMD component can just fall into the cavity of the carrier belt in the carrier belt through the blanking holes on the cutting edges.
2. The planar SMD component auto forming packaging mold of claim 1, wherein: the lower die comprises a lower die plate (21), a lower base plate (22) and a lower die holder (23) which are sequentially arranged from top to bottom, the carrier groove, the punching blade group, the profile blade group, the cutting blade and the cutting cushion block are all embedded and mounted on the top surface of the lower die plate, the upper die comprises a stripper plate (11), a stripper plate (12), an upper die plate (13), an upper base plate (14) and an upper die holder (15) which are sequentially arranged from bottom to top, and the punching punch group, the profile punch group and the cutting punch are all mounted on the upper die plate and can sequentially penetrate through the stripper plate and the stripper plate.
3. The planar SMD component auto forming packaging mold of claim 2, wherein: the feeding mechanism comprises a shovel base (31), a sliding block (32), a jacking air cylinder (33), a jacking piece (34), a reset spring and a plurality of jacking pieces (35), wherein inclined guide surfaces (36) which are matched with each other are formed on the shovel base and the sliding block, a sliding groove is formed on the lower die plate, the sliding block is slidingly arranged in the sliding groove along the length direction of the die, the top end of the shovel base is clamped and positioned between the stripping plate and the stripping plate, the bottom end of the shovel base penetrates out of the stripping plate, and the reset spring is positioned and installed between the sliding block and the sliding groove; the middle part of the sliding block is provided with a through groove (321) along the length direction of the die and a jacking groove (322) along the thickness direction of the die, the jacking groove is positioned below the through groove and communicated with the through groove, the raw material belt penetrates out of the through groove, the jacking cylinder is arranged at the bottom of the sliding block, the bottom end of the jacking piece is arranged on a jacking shaft of the jacking cylinder, and the top end of the jacking piece penetrates through the jacking groove and stretches into the through groove; in the die assembly process, the jacking cylinder does not act, and the shovel base drives the sliding block to retreat by one station distance through the inclined guide surface, so that the reset spring compresses and stores energy; in the die sinking process, a plurality of the lifting pieces lift the raw material belt from the lower die plate to set height, the lifting air cylinder drives the lifting pieces to compress the raw material belt on the top wall of the through groove, the shovel base is gradually separated from the sliding block along with the upper die, and the sliding block advances by one station distance under the recovery of the reset spring and drives the raw material belt to advance by one station distance.
4. The planar SMD component auto forming packaging mold of claim 1, wherein: the punching punch set comprises a positioning hole punch (421) for punching a positioning hole (91) in the middle of the raw material belt, a first trimming punch (422) for punching one side edge of the raw material belt and a second trimming punch (423) for punching the other side edge of the raw material belt, and the punching punch set is provided with a positioning Kong Daokou corresponding to the positioning hole punch, a first trimming punch corresponding to the first trimming punch and a second trimming punch corresponding to the second trimming punch.
5. The planar SMD component auto forming packaging mold of claim 2, wherein: the profile punch set comprises a first side punch (521) for punching one side edge of the raw material belt to form the profile of a first SMD component, a second side punch (522) for punching the other side edge of the raw material belt to form the profile of a second SMD component, and a center punch (523) for punching the middle part of the raw material belt to form the profile of two third SMD components, wherein the profile punch set is provided with a first side punch edge, a second side punch edge and a profile punch edge, the first side punch edge corresponds to the second side punch edge and the second side punch edge corresponds to the center punch edge, after punching, the raw material belt is divided into two sub-material belts, one third SMD component and one first SMD component are connected on the sub-material belt back to back, and the other third SMD component and one second SMD component are connected on the other sub-material belt back to back.
6. The planar SMD component auto forming packaging mold of claim 5, wherein: the cutting punch comprises a first cutting punch (631) for cutting the formed first SMD component from the sub-material belt, a second cutting punch (632) for cutting the formed second SMD component from the sub-material belt and two third cutting punches (633) for cutting the two formed third SMD components from the sub-material belt, and the cutting knife opening comprises a first cutting knife edge corresponding to the first cutting punch, a second cutting knife edge corresponding to the second cutting punch and two third cutting knife edges corresponding to the two third cutting punches one to one, and the blanking holes comprise a first blanking hole corresponding to the first SMD component, a second blanking hole corresponding to the second SMD component and two third blanking holes corresponding to the two third SMD components one to one.
7. The planar SMD component auto forming packaging mold of claim 2, wherein: and a limiting cover plate (24) is arranged on the carrier belt groove except the cutting mechanism, is fixedly connected to the lower die plate and covers the carrier belt groove, and limits the carrier belt in the carrier belt groove.
8. The planar SMD component auto forming packaging mold of claim 2, wherein: along the raw material strip feeding direction, install on the lower bolster and to carry out spacing first baffle (25) and second baffle (26) of left and right sides of raw material strip, first baffle top surface orientation raw material strip's one side is formed with first backstop rim, second baffle top surface orientation raw material strip's one side is formed with the second backstop rim.
9. The planar SMD component auto forming packaging mold of claim 6, wherein: the cutting machine also comprises a waste cutting mechanism (10) arranged on one side of the cutting mechanism, wherein the waste cutting mechanism comprises a waste knife edge group (101) arranged on the lower die and a waste punch head group (102) arranged on the upper die; the scrap punch set comprises two scrap punches which cut off the sub-material strips after the first SMD component, the second SMD component and the third SMD component are cut off, and the scrap knife edge set comprises two scrap knife edges which are in one-to-one correspondence with the two scrap punches.
10. The planar SMD component auto forming packaging mold of claim 6, wherein: the die comprises a die, a lower backing plate, a cutting cushion block, a first air hole, a second air hole, a carrier belt groove and a vacuum pumping hole, wherein the outer vacuum pumping device is connected with the die, the channel comprises a first air hole arranged in the lower backing plate along the width direction of the die and a second air hole arranged in the cutting cushion block along the height direction of the die, the first air hole is communicated with the second air hole and the carrier belt groove, and the vacuum pumping hole is formed in the bottom of a cavity of the carrier belt.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910082210.2A CN109606781B (en) | 2019-01-28 | 2019-01-28 | Automatic forming and packaging die for planar SMD components |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910082210.2A CN109606781B (en) | 2019-01-28 | 2019-01-28 | Automatic forming and packaging die for planar SMD components |
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| CN109606781B true CN109606781B (en) | 2024-04-05 |
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| JP2004051212A (en) * | 2002-05-28 | 2004-02-19 | Toobi Tookyoo Kk | Blanking apparatus and method for blanking lid part using it |
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| TW201904376A (en) * | 2017-05-31 | 2019-01-16 | 深圳市寶爾威精密機械有限公司 | SMD carrier tape universal feeder |
| CN209701028U (en) * | 2019-01-28 | 2019-11-29 | 昆山琨明电子科技有限公司 | Plane SMD component automatic moulding packaged die |
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- 2019-01-28 CN CN201910082210.2A patent/CN109606781B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004051212A (en) * | 2002-05-28 | 2004-02-19 | Toobi Tookyoo Kk | Blanking apparatus and method for blanking lid part using it |
| KR20040059217A (en) * | 2002-12-28 | 2004-07-05 | 유선종 | A drill for pack carrier tape of electronic chip |
| JP2012096477A (en) * | 2010-11-04 | 2012-05-24 | Okuda Corp | Apparatus for manufacturing carrier tape |
| CN104709497A (en) * | 2015-03-15 | 2015-06-17 | 韩立艳 | Fully automatic heat-sealing tape and reel packaging machine |
| TW201904376A (en) * | 2017-05-31 | 2019-01-16 | 深圳市寶爾威精密機械有限公司 | SMD carrier tape universal feeder |
| CN209701028U (en) * | 2019-01-28 | 2019-11-29 | 昆山琨明电子科技有限公司 | Plane SMD component automatic moulding packaged die |
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