JP2001348009A - Method and apparatus for manufacturing band material for packaging small component and band material for packaging small component - Google Patents
Method and apparatus for manufacturing band material for packaging small component and band material for packaging small componentInfo
- Publication number
- JP2001348009A JP2001348009A JP2000169562A JP2000169562A JP2001348009A JP 2001348009 A JP2001348009 A JP 2001348009A JP 2000169562 A JP2000169562 A JP 2000169562A JP 2000169562 A JP2000169562 A JP 2000169562A JP 2001348009 A JP2001348009 A JP 2001348009A
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- JP
- Japan
- Prior art keywords
- strip
- correction
- recess
- shape
- band material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、小部品包装用帯材
の製造方法、装置および小部品包装用帯材に関し、詳し
くは、チップ抵抗などの微小電子部品その他の小部品を
輸送保管等のために搬送するのに利用され、多数の小部
品をまとめて包装しておくための包装用帯材を製造する
方法と、この製造方法に用いる製造装置、そのような製
造方法および装置で製造される小部品包装用帯材とを対
象にしている。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for producing a band for packaging small parts, and a band for packaging small parts. More specifically, the present invention relates to a method for transporting and storing microelectronic parts such as chip resistors and other small parts. A method of manufacturing a packaging strip for packing a large number of small parts together and a manufacturing apparatus used for the manufacturing method, manufactured by such a manufacturing method and apparatus. For small parts packaging strips.
【０００２】[0002]
【従来の技術】電子部品、特に、数mm程度の大きさしか
ないチップ抵抗などの微小な電子部品を搬送する技術と
して、キャリアテープがある。キャリアテープとして、
焼却や埋立などの廃棄処分が容易な紙材料を用いたもの
がある。ある程度の厚みがある紙からなる帯材に、長手
方向に沿って電子部品の収納孔を多数貫通形成し、帯材
の裏面には紙や合成樹脂からなる薄いフィルムを貼り付
けて、収納孔の底を形成する。フィルムで底が形成され
た収納孔に電子部品を収納してから、帯材の表面にカバ
ーテープを貼着する。2. Description of the Related Art There is a carrier tape as a technique for transporting electronic components, particularly minute electronic components such as chip resistors having a size of only several mm. As a carrier tape,
Some use paper materials that can be easily disposed of, such as by incineration or landfill. A large number of electronic component storage holes are formed in the paper strip with a certain thickness along the longitudinal direction, and a thin film made of paper or synthetic resin is attached to the back of the strip. Form the bottom. After the electronic component is stored in the storage hole with the bottom formed by the film, a cover tape is attached to the surface of the strip.
【０００３】上記技術でも、紙製帯材の裏面に合成樹脂
の底フィルムが貼着されているので、焼却などの廃棄処
分が面倒になる。そこで、底フィルムのない紙製キャリ
アテープも提案されている。具体的には、実開平４−３
８９７５号公報や特開平１０−３３８２０８号公報に開
示された技術がある。これらの技術では、プレス成形機
を用いて、厚手の紙からなる帯材に電子部品を収納する
凹部を圧縮成形している。[0003] Even in the above technique, since the bottom film of the synthetic resin is adhered to the back surface of the paper strip, disposal such as incineration is troublesome. Therefore, a paper carrier tape without a bottom film has been proposed. Specifically, 4-3
There are techniques disclosed in JP-A-8975 and JP-A-10-338208. In these techniques, a recess for accommodating an electronic component is compression-molded in a band made of thick paper using a press molding machine.
【０００４】[0004]
【発明が解決しようとする課題】上記した底フィルムの
ないプレス成形の紙製キャリアテープは、キャリアテー
プを連続的に走行させて各種作業を行う際に、テープが
浮き上がったり上下に振動を生じ易いという問題があ
る。この原因は、プレス成形で凸型を紙テープの表面に
押し込んで収納凹部を成形したときに、テープの裏面側
で凸型あるいは収納凹部の形状に対応する領域に膨出が
生じることにある。図４に示すように、収納凹部２が成
形されたテープ１には、収納凹部２のプレス成形で加わ
った力の作用で、テープ１が裏面側に膨出Δｘを生じて
しまう。平坦であるべきテープの裏面にわずかでも凸形
状があると、テープの搬送装置の走行支持面に、走行し
ているテープ裏面の凸形状が断続的に当たり、その反動
で、走行支持面からテープが浮き上がったり上下に振動
を発生したりすることになる。The above-described press-formed paper carrier tape without a bottom film is liable to be lifted or vibrated up and down when the carrier tape is continuously run to perform various operations. There is a problem. The reason for this is that, when the convex portion is pressed into the surface of the paper tape by press molding to form the storage concave portion, a bulge occurs in a region corresponding to the shape of the convex shape or the concave portion on the back side of the tape. As shown in FIG. 4, in the tape 1 in which the storage recess 2 is formed, the tape 1 bulges to the rear surface side due to the force applied by the press molding of the storage recess 2. If there is even a slight convex shape on the back surface of the tape that should be flat, the convex shape of the running tape back surface intermittently hits the running support surface of the tape transport device, and the tape recedes from the running support surface. It will float up and vibrate up and down.
【０００５】前記した先行技術では、プレス成形型のう
ち、紙テープの裏面に当接する下型の表面を平坦にして
おくことで、テープの裏面が平坦に仕上がるようにして
いる。この方法では、プレス成形時には、下型の平坦な
表面にしたがってテープの裏面は平坦になるが、成形後
に素材の有する復元力が徐々に作用することで、テープ
の裏面にわずかな凸形の膨出が生じてしまう。前記図４
における膨出量Δｘは、１mm未満のわずかな量である
が、キャリアテープを高速で走行させた場合には、この
程度のわずかな膨出であっても、テープの走行に支障を
生じる場合がある。また、電子部品が、数mm以下の微小
部品の場合、テープがわずかに上下動しただけでも、収
納凹部から電子部品が飛び出したり、電子部品を掴んで
取り出すのが困難になる。近年、電子部品の実装作業の
効率化のために、キャリアテープの走行速度は益々速く
なる傾向があり、将来における高速化に対応するために
も改善が求められている。In the prior art described above, the lower surface of the press mold, which is in contact with the lower surface of the paper tape, is made flat so that the lower surface of the tape is finished flat. In this method, during press molding, the back surface of the tape becomes flat according to the flat surface of the lower mold, but the restoring force of the material gradually acts after molding, so that a slightly convex bulge is formed on the back surface of the tape. Out. FIG. 4
Is a small amount of less than 1 mm, but when the carrier tape is run at a high speed, even such a small swelling may hinder the running of the tape. is there. In addition, when the electronic component is a minute component of several mm or less, even if the tape slightly moves up and down, it becomes difficult for the electronic component to jump out of the storage recess or to grasp and take out the electronic component. In recent years, the traveling speed of a carrier tape has tended to increase more and more in order to increase the efficiency of mounting work of electronic components, and improvement is required in order to cope with a higher speed in the future.
【０００６】そこで、本発明の課題は、前記した従来の
キャリアテープが有する問題点を解消し、テープの走行
時に浮き上がりや振動などの問題を生じ難いキャリアテ
ープを提供することである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a carrier tape which solves the above-mentioned problems of the conventional carrier tape and hardly causes problems such as floating and vibration during running of the tape.
【０００７】[0007]
【課題を解決するための手段】本発明にかかる小部品包
装用帯材の製造方法は、長手方向に沿って配置された多
数の収納凹部に小部品を収納し、収納凹部の表面を被覆
テープで覆って小部品を包装する小部品包装用帯材を製
造する方法であって、圧縮成形性を有する可撓性材料か
らなる帯材に対して、片面には、前記収納凹部に対応す
る形状の成形凸型を押圧して収納凹部を成形すると同時
に、反対面には、前記収納凹部の外形よりも広い補正凸
型を押圧する。 〔小部品〕従来キャリアテープ方式で包装されていた各
種部品が適用できる。According to the present invention, there is provided a method of manufacturing a band for packaging small parts, wherein small parts are stored in a plurality of storage recesses arranged along a longitudinal direction, and a surface of the storage recess is covered with a covering tape. A method for producing a small component packaging strip for packaging a small component by covering the same with a strip made of a flexible material having compression moldability, wherein one side has a shape corresponding to the storage recess. Is pressed at the same time as the concave shape is formed, and at the same time, a correction convex shape wider than the outer shape of the concave portion is pressed on the opposite surface. [Small parts] Various parts conventionally packaged by a carrier tape method can be applied.
【０００８】大量の部品を十分な保護状態で搬送する必
要がある電子部品その他の精密部品に好適に利用され
る。電子部品としては、チップ抵抗やチップコンデン
サ、各種センサチップなどが挙げられる。小部品の形状
としては、特に限定されず、直方体状その他の多角立方
体状、円柱や半球状などの曲面部分を有する立体形状、
外周にピンその他の突起部を有するものなどに適用でき
る。 〔帯材〕帯材の材料は、搬送時にリール状に巻き取るな
どの取り扱いが可能な程度の可撓性を有していること
と、プレス成形で収納凹部が形成できる程度の圧縮成形
性を有している材料であれば、基本的には既知のキャリ
アテープに用いられているテープ材料と同様の材料を用
いることができる。７０〜９５％の圧縮成形が可能な材
料が好ましい。具体的には、合成樹脂、発泡樹脂、セラ
ミック、紙、繊維などからなるフィルム材またはシート
材を単層あるいは複層にして用いることができる。天然
繊維と合成繊維とが組み合わせられた紙材も用いられ
る。焼却等の廃棄処理が行い易い材料を用いるのが好ま
しい。[0008] The present invention is suitably used for electronic components and other precision components that require a large number of components to be conveyed in a sufficiently protected state. Examples of the electronic component include a chip resistor, a chip capacitor, and various sensor chips. The shape of the small part is not particularly limited, and a three-dimensional shape having a curved surface portion such as a rectangular parallelepiped or other polygonal cube, a column or a hemisphere,
The present invention can be applied to a device having a pin or other protrusions on the outer periphery. [Band material] The material of the band material must be flexible enough to be handled such as being wound into a reel when transported, and compression-moldable enough to form a storage recess by press molding. As long as it has a material, basically the same material as the tape material used for the known carrier tape can be used. A material that can be compression molded by 70 to 95% is preferable. Specifically, a film material or a sheet material made of a synthetic resin, a foamed resin, ceramic, paper, fiber, or the like can be used as a single layer or multiple layers. Paper materials in which natural fibers and synthetic fibers are combined are also used. It is preferable to use a material that can be easily disposed of by incineration or the like.
【０００９】帯材として、導電性材料を用いたり、表面
に導電処理や帯電防止処理を施しておけば、電子部品な
どの包装に好ましい。帯材を構成する合成樹脂や紙に、
カーボンブラックなどの導電性材料を配合しておくこと
もできる。帯材の表面に貼着する被覆テープの貼着性お
よび剥離性の良い材料が好ましい。帯材の幅および厚み
は、収納する小部品の寸法に合わせて設定される。特
に、帯材の厚みは、少なくとも小部品の高さ寸法よりも
少し分厚い程度に設定しておく必要がある。具体的に
は、例えば電子部品の包装に用いる場合、ＪＩＳ等で規
格化されたキャリアテープの幅および厚みの寸法値の何
れかを採用することができる。具体的には、帯材の厚み
は、０．３５〜０．９５mmが好ましい。帯材の幅は、４
〜８mmが好ましい。帯材の長さは、１０００〜５０００
ｍが好ましい。帯材として、坪量３３５〜７３０g/m2の
紙材料を用いるのが好ましい。If a conductive material is used as the band material, or if the surface is subjected to a conductive treatment or an antistatic treatment, it is preferable for packaging electronic parts and the like. For synthetic resin and paper that make up the band,
A conductive material such as carbon black may be added. A material with good adhesiveness and releasability of the covering tape to be adhered to the surface of the band material is preferable. The width and thickness of the strip are set according to the dimensions of the small parts to be stored. In particular, it is necessary to set the thickness of the strip to be at least slightly thicker than the height of the small part. Specifically, for example, when used for packaging electronic components, any of the width and thickness dimension values of the carrier tape standardized by JIS or the like can be adopted. Specifically, the thickness of the strip is preferably 0.35 to 0.95 mm. The width of the strip is 4
８8 mm is preferred. The length of the strip is 1000-5000
m is preferred. It is preferable to use a paper material having a basis weight of 335 to 730 g / m 2 as the band material.
【００１０】帯材には、機械的に走行させる際に利用す
る送り孔等の送り手段を設けておくことができる。送り
手段は、孔あるいはスリット、切り欠き、突起など、通
常の帯状材料を走行させる機構構造が採用される。送り
手段は、通常、電子部品の保持の邪魔になり難い帯材の
両側端に設けられるが、片側端でもよいし、小部品の収
納の邪魔にならなければ中央に設けてもよい。帯材とし
て、予め送り手段が形成されたものを用いてもよいし、
送り手段を有しない帯材を用いて、この発明にかかる製
造方法で収納凹部などをプレス成形する際に送り手段の
加工工程を同時に行うこともできる。[0010] The strip may be provided with feed means such as feed holes used for mechanical traveling. As the feeding means, a mechanism structure such as a hole or a slit, a notch, or a projection for moving a normal band-shaped material is adopted. The feeding means is usually provided at both side ends of the strip which is hard to hinder the holding of the electronic component, but may be provided at one side end, or may be provided at the center if it does not hinder the storage of the small components. As the band material, a material in which a feeding means is formed in advance may be used,
Using a strip having no feeding means, the working step of the feeding means can be performed simultaneously when press-forming the storage recess and the like by the manufacturing method according to the present invention.
【００１１】帯材として、多数の収納凹部を並べて配置
できる広幅の帯材を用いることができる。この場合、帯
材の幅方向に多数の収納凹部を並べてプレス成形したあ
とで、帯材を収納凹部の中間で幅方向に裁断すれば、１
列あるいは任意の列数の収納凹部が配置された帯材を得
ることができる。 〔収納凹部〕小部品を収納して保護しておけるだけの面
積と深さが必要である。収納凹部の深さが、収納凹部に
収納される小部品の高さよりも深いことが好ましい。収
納凹部の形状は、小部品の形状に合わせるとともにプレ
ス成形が可能な形状を採用する。具体的には、平面形が
多角形や円形、楕円形その他の形状で深さ方向につづく
筒状を有するものが好ましい。小部品の凹凸形状に対応
する凹凸形状を収納凹部の内面に形成しておくこともで
きる。収納凹部の内側壁のうち、少なくとも一方の側壁
が、表面側よりも奥側にかけて狭くなるテーパ状の凹部
であってもよい。As the band, a wide band in which a large number of storage recesses can be arranged side by side can be used. In this case, after a large number of storage recesses are arranged in the width direction of the strip and press-formed, and then the strip is cut in the width direction in the middle of the storage recess, 1
It is possible to obtain a strip in which rows or an arbitrary number of rows of storage recesses are arranged. [Accommodation recess] An area and a depth enough to accommodate and protect small parts are required. It is preferable that the depth of the storage recess is deeper than the height of the small parts stored in the storage recess. The shape of the storage recess is adapted to the shape of the small part and can be press-formed. Specifically, it is preferable that the planar shape be a polygon, a circle, an ellipse, or any other shape having a cylindrical shape that continues in the depth direction. An uneven shape corresponding to the uneven shape of the small component can be formed on the inner surface of the storage recess. At least one side wall among the inner side walls of the storage recess may be a tapered recess narrowing toward the back side from the front side.
【００１２】なお、収納凹部の深さは、帯材の厚みより
も少し浅く設定される。収納凹部の深さが帯材の厚みの
１／２以上を有するものが好ましい。収納凹部の深さが
０．３５〜０．９０mmであることが好ましい。収納凹部
の深さの許容誤差が、±１．５％以内であることが好ま
しい。好ましい許容誤差の具体値は、収納凹部の深さに
よって異なり、最大が深さ０．８５mmの場合で許容誤差
±０．１mm、最小が深さ０．３０mmの場合で許容誤差±
０．０３mmである。帯材の厚みと収納凹部の深さとの差
が、収納凹部の底部分の厚みになる。小部品の保護を十
分にするには、収納凹部の底の厚みを分厚くするのが好
ましい。The depth of the storage recess is set slightly smaller than the thickness of the strip. It is preferable that the depth of the storage recess has at least half the thickness of the strip. Preferably, the depth of the storage recess is 0.35 to 0.90 mm. The tolerance of the depth of the storage recess is preferably within ± 1.5%. The preferred specific value of the tolerance varies depending on the depth of the storage recess. The tolerance is ± 0.1 mm when the maximum is 0.85 mm and the tolerance is ± 0.1 when the minimum is 0.30 mm.
0.03 mm. The difference between the thickness of the strip and the depth of the storage recess is the thickness of the bottom of the storage recess. In order to sufficiently protect small parts, it is preferable to increase the thickness of the bottom of the storage recess.
【００１３】〔被覆テープ〕通常のキャリアテープにお
けるカバーテープあるいはフィルムと同様の材料および
構造が採用できる。被覆テープの材料は、合成樹脂、紙
などが用いられる。透明なテープであれば、収納凹部に
収納された小部品の状態を包装状態でも観察することが
できる。被覆テープを、熱接着によって帯材に接合する
場合には、熱接着性の材料を用いる。 〔プレス成形〕基本的には、通常の合成樹脂材料や紙材
料に対するプレス成形技術が適用できる。[Coating Tape] The same material and structure as those of a cover tape or a film in an ordinary carrier tape can be adopted. As a material of the covering tape, a synthetic resin, paper, or the like is used. If it is a transparent tape, the state of the small parts stored in the storage recess can be observed even in the packaging state. When the covering tape is joined to the strip by thermal bonding, a thermal adhesive material is used. [Press molding] Basically, a press molding technique for an ordinary synthetic resin material or paper material can be applied.
【００１４】プレス成形装置は通常、一対のプレス成形
型の間に被加工材である帯材を挟み込み、プレス成形型
の型面形状に対応するプレス加工を帯材に施す。プレス
成形型の型面は固定構造であってもよいし、成形型本体
の平坦な表面に対して部分的に出入り自在な型面構造を
備えておき、加工時のみ平坦な表面から出入り自在な型
面部分が突出して凸状の型面を構成するものであっても
よい。一対のプレス成形型の対向する型面には、一方の
型面には収納凹部に対応する形状の成形凸型を設け、他
方の型面には補正凸型を設けておく。成形凸型は、帯材
の厚みよりも低い高さに設定される。In a press forming apparatus, usually, a band material to be processed is sandwiched between a pair of press forming dies, and the band material is subjected to press working corresponding to the shape of the surface of the press forming die. The mold surface of the press mold may have a fixed structure, or a mold surface structure that is partially movable in and out of the flat surface of the mold main body is provided. The mold surface portion may protrude to form a convex mold surface. On the opposing mold surfaces of the pair of press-molding dies, a mold convex shape having a shape corresponding to the storage recess is provided on one mold surface, and a correction convex mold is provided on the other mold surface. The height of the molded convex is set lower than the thickness of the strip.
【００１５】表裏面が平坦な帯材は、表面側に押圧され
る成形凸型で収納凹部が成形され、裏面側に押圧される
補正凸型で補正凹部が成形される。但し、プレス成形後
に帯材の素材が有する復元作用で、成形された形状が少
し変形することがある。その結果、補正凹部が実質的に
無くなることがある。本発明では、帯材の裏面側に膨出
が生じなければ、上記のように実質的に補正凹部が無く
なってしまっても構わない。プレス成形の成形条件につ
いては、通常のプレス成形と同様の条件が採用できる。
プレス成形と同時に加熱したり、温度や湿度を管理した
りすることができる。２度打ちプレスや、プレス後のシ
ェービング加工、レーザ光によるケバや微粉の焼却除去
加工などを採用することもできる。In the belt material having a flat front and back surface, a storage concave portion is formed by a molding convex pressed to the front surface side, and a correction concave portion is formed by a correction convex die pressed to the rear surface side. However, the formed shape may be slightly deformed due to the restoring action of the material of the strip after press forming. As a result, the correction concave portion may be substantially eliminated. In the present invention, as long as no bulging occurs on the back surface side of the strip, the correction concave portion may substantially disappear as described above. As for the molding conditions of the press molding, the same conditions as in the ordinary press molding can be adopted.
Heating can be performed simultaneously with press molding, and temperature and humidity can be controlled. It is also possible to employ a double-punching press, a shaving process after the press, a process of incineration and removal of fluff and fine powder by a laser beam, and the like.
【００１６】プレス成形装置として、ナックル機構プレ
スを使用すると、プレス型の作動位置を正確に制御でき
る。プレス成形では、帯材から切断粉や切削粉が出るこ
とはない。プレス成形された収納凹部の底部分は、帯材
の厚み分の材料が薄く圧縮されることになるため、強度
的に優れたものとなる。 〔補正凸型〕補正凸型は、成形凸型を有するプレス成形
型と対向する反対側のプレス成形型に配置される。補正
凸型の高さは、少なくとも、収納凹部の成形によって生
じる帯材の裏面側への膨出を抑制できるだけの高さに設
定すればよい。補正凸型の高さが高いほど、帯材の裏面
側への膨出は起こり難くなるが、補正凸型が高すぎる
と、収納凹部の深さあるいは底面の厚みが少なくなって
しまう。具体的には、補正凸型の高さは、０．０２〜
０．１mmに設定され、好ましくは０．０２〜０．０５mm
に設定される。When a knuckle mechanism press is used as the press molding device, the operating position of the press die can be accurately controlled. In press molding, no cutting powder or cutting powder is emitted from the strip. The bottom portion of the press-formed storage recess is excellent in strength because the material corresponding to the thickness of the band material is thinly compressed. [Correction convex mold] The correction convex mold is arranged on the press mold opposite to the press mold having the molding convex. The height of the correction convex may be set to at least a height that can suppress the swelling of the strip material to the back side caused by the formation of the storage recess. As the height of the correction convex is higher, the belt material is less likely to bulge to the back side, but if the correction convex is too high, the depth of the storage recess or the thickness of the bottom surface is reduced. Specifically, the height of the correction convex is 0.02 to
0.1 mm, preferably 0.02-0.05 mm
Is set to
【００１７】補正凸型の平面形状は、収納凹部の平面形
状に合わせて設定される。通常は、収納凹部の平面形状
に対して、ほぼ相似形状で少し広い形状にする。ほぼ相
似形状とは、完全な相似形状であってもよいし、部分的
に形状が異なる部分があってもよいし、収納凹部の平面
形状をおおまかに囲む概略形状であってもよいことを意
味する。例えば、矩形状の収納凹部あるいは成形凸型に
対して、矩形状、長円形状、楕円形状などの補正凸型を
組み合わせることができる。収納凹部に対する補正凸型
の寸法比を、外形状の代表的な位置における差し渡し径
で対比して、収納凹部の外形寸法Ｂに対する補正凸型の
外形寸法Ａの百分率をＡ／Ｂ×１００＝１１０〜３００
％の範囲に設定しておくことができる。好ましくは１５
０〜２２０％に設定しておく。The planar shape of the correction convex shape is set according to the planar shape of the storage recess. Normally, the shape is substantially similar to the planar shape of the storage recess and slightly wider. The substantially similar shape means that the shape may be a completely similar shape, may have a partially different shape, or may be a general shape roughly surrounding the planar shape of the storage recess. I do. For example, a rectangle, an oval shape, an elliptical shape, or another correction convex shape can be combined with a rectangular storage concave portion or molded convex shape. The ratio of the dimension of the correction convex to the storage concave is compared with the diameter of the outer shape at the representative position of the outer shape, and the percentage of the external dimension A of the correction convex to the external dimension B of the storage concave is A / B × 100 = 110. ~ 300
% Can be set in the range. Preferably 15
It is set to 0 to 220%.
【００１８】外形寸法Ａ、Ｂは、例えば、補正凸型が矩
形状の場合には長辺の長さで代表させることができ、補
正凸型が楕円形の場合には長径で代表させることができ
る。補正凸型の全方向について外形寸法が前記条件を満
足するのが最も好ましいが、局部的に前記条件を満足し
ない個所が存在しても構わない。補正凸型の上面は、平
坦であってもよいし、中央が高く周辺に向かって低くな
ったテーパー面や湾曲面であってもよい。 〔パンチ加工〕プレス成形装置には、プレス成形を行う
構造部分に加えて、パンチ加工を行う構造部分を設けて
おくことができる。これによって、プレス成形とパンチ
加工による送り孔加工を同時に行うことが可能になる。The external dimensions A and B can be represented by, for example, the length of the long side when the correction convex shape is rectangular, and can be represented by the long diameter when the correction convex shape is elliptical. it can. It is most preferable that the external dimensions satisfy the above conditions in all directions of the correction convex shape. However, there may be locations where the above conditions are not locally satisfied. The upper surface of the correction convex shape may be flat, or may be a tapered surface or a curved surface whose center is higher and becomes lower toward the periphery. [Punching] The press forming apparatus can be provided with a structural part for performing punching in addition to a structural part for performing press forming. Thereby, it is possible to simultaneously perform the press hole forming and the feed hole forming by punching.
【００１９】〔小部品包装用帯材〕前記したプレス成形
および必要に応じて行われるパンチ加工によって、帯材
の表面には、表面から所定の深さまで厚み方向に圧縮し
て成形された収納凹部が形成される。帯材の裏面には、
収納凹部の外形よりも広い領域に補正凹部が形成され
る。パンチ加工によって送り孔が加工される場合もあ
る。前記したように、補正凹部の形状は補正凸型の形状
にほぼ対応する形状になる。補正凹部の深さは、０〜
０．１mmになる。ここで、深さ０mmとは、プレス成形後
の復元によって、補正凸型による成形形状が無くなって
しまった場合を意味する。この場合、補正凹部は実質的
に存在しないことになる。明確な補正凹部がなくても、
裏面への膨出がなければ本発明の目的は達成できる。明
確な補正凹部を形成する場合には、補正凹部の深さを
０．０２〜０．０５mmに設定する。[Strip for Packaging Small Parts] By the above-described press forming and, if necessary, punching, a storage recess formed on the surface of the strip by being compressed from the surface to a predetermined depth in the thickness direction. Is formed. On the back of the strip,
The correction recess is formed in a region wider than the outer shape of the storage recess. The feed hole may be formed by punching. As described above, the shape of the correction concave portion substantially corresponds to the shape of the correction convex shape. The depth of the correction recess is 0 to
0.1 mm. Here, the depth of 0 mm means a case where the shape formed by the correction convex has disappeared due to restoration after press molding. In this case, the correction concave portion does not substantially exist. Even without a clear correction recess,
The object of the present invention can be achieved if there is no swelling on the back surface. When forming a clear correction recess, the depth of the correction recess is set to 0.02 to 0.05 mm.
【００２０】[0020]
【発明の実施の形態】〔小部品包装用帯材〕図１に示す
実施形態は、チップ抵抗などの電子部品を包装するため
の小部品包装用帯材を表している。帯材１０は、圧縮成
形性のある厚紙からなり、長さ方向に連続する長尺の帯
状をなしている。帯材１０はある程度の可撓性を有して
おり、長尺の帯材１０をリール状に巻回して輸送保管に
供することができる。帯材１０の表面には、長さ方向に
沿って等間隔で多数の直方体状をなす収納凹部１４が設
けられている。収納凹部１４は、帯材１０の幅方向で中
央よりも少し片側に寄った位置に設けられており、幅方
向の反対側には多数の円形状の送り孔１２が等間隔をあ
けて貫通形成されている。送り孔１２の配置間隔と収納
凹部１４の配置間隔は違っている。DESCRIPTION OF THE PREFERRED EMBODIMENTS [Strip for Packaging Small Parts] The embodiment shown in FIG. 1 shows a strip for packaging small parts for packaging electronic components such as chip resistors. The band material 10 is made of cardboard having compression moldability, and has a long band shape that is continuous in the length direction. The band material 10 has a certain degree of flexibility, and the long band material 10 can be wound around a reel and provided for transportation and storage. A large number of rectangular parallelepiped storage recesses 14 are provided on the surface of the strip 10 at regular intervals along the length direction. The storage recess 14 is provided at a position slightly closer to one side than the center in the width direction of the strip 10, and a large number of circular feed holes 12 are formed at equal intervals on the opposite side in the width direction. Have been. The arrangement interval of the feed holes 12 and the arrangement interval of the storage recesses 14 are different.
【００２１】図１(b) に詳しく示すように、収納凹部１
４には、収納凹部１４よりも一回り小さな直方体状をな
す電子部品２０が収容される。電子部品２０が収容され
た収納凹部１４の開口面には、合成樹脂からなるカバー
テープ２２が貼着されて、電子部品２０の脱落を防ぐ。
図１(b) (c) に示すように、帯材１０の裏面には補正凹
部１６が形成されている。補正凹部１６は、表面側の収
納凹部１４の平面形状よりも一回り大きな概略矩形状を
なしている。但し、矩形の隅角部にはアールが付けられ
ている。補正凹部１６の断面形状は、中央が高く周辺に
向かって低くなるゆるやかな湾曲形状をなしている。As shown in detail in FIG.
The electronic component 20 having a rectangular parallelepiped shape slightly smaller than the storage recess 14 is stored in the storage portion 4. A cover tape 22 made of a synthetic resin is adhered to the opening surface of the storage recess 14 in which the electronic component 20 is stored to prevent the electronic component 20 from falling off.
As shown in FIGS. 1B and 1C, a correction recess 16 is formed on the back surface of the band material 10. The correction recess 16 has a substantially rectangular shape slightly larger than the planar shape of the storage recess 14 on the front side. However, the corners of the rectangle are rounded. The cross-sectional shape of the correction concave portion 16 has a gentle curved shape in which the center is high and becomes low toward the periphery.
【００２２】図１(b) において、帯材１０の全高Ｈは、
収納凹部１４の深さＤと、収納凹部１４の底の厚みｔ
と、補正凹部１６の深さｄとを合わせたものになる。ま
た、図１(c) で、補正凹部１６の平面寸法は縦ＡL ×横
ＡW 、収納凹部１４の平面寸法は縦ＢL ×横ＢW であ
る。上記のような構造の小部品包装用帯材１０は、裏面
側に膨出する部分がないので、小部品包装用帯材１０を
連続的に走行させて、電子部品２０の搭載やカバーテー
プ２２の貼着、実装時のカバーテープ２２剥離、電子部
品２０の取り出しなどの作業を行う際に、走行装置に小
部品包装用帯材１０の裏面が引っ掛かったり、走行面で
上下に跳ねたり振動したりすることがなく、スムーズな
走行が果たされる。In FIG. 1B, the total height H of the strip 10 is
The depth D of the storage recess 14 and the thickness t of the bottom of the storage recess 14
And the depth d of the correction concave portion 16. In FIG. 1C, the plane size of the correction recess 16 is vertical AL × horizontal AW, and the plane size of the storage recess 14 is vertical BL × horizontal BW. Since the small component packaging strip 10 having the above-described structure does not have a swelling portion on the back surface side, the small component packaging strip 10 is continuously run to mount the electronic component 20 or the cover tape 22. When performing operations such as attaching the cover tape 22, peeling the cover tape 22 during mounting, and taking out the electronic component 20, the back surface of the small component packaging band 10 is caught by the traveling device, and the traveling material is bounced up and down or vibrated. And smooth running is achieved.
【００２３】また、収納凹部１４の底が、補正凹部１６
の深さだけ、帯材１０の裏面よりも上部に浮いた状態で
支持されているので、収納凹部１４の電子部品２２に外
力の振動や衝撃が伝わり難く、緩衝性能も向上する。 〔小部品包装用帯材の製造〕図２に示す実施形態は、小
部品包装用帯材１０をプレス成形する製造装置と製造工
程を示している。図２(a) に示すように、帯材１０は、
表裏面が平坦な長尺帯の形態で供給される。帯材１０の
厚みをＨ0 で表す。Further, the bottom of the storage recess 14 is
Is supported above the back surface of the band material 10 by the depth of the belt member 10, so that vibrations and shocks of external force are hardly transmitted to the electronic components 22 of the storage recess 14, and the cushioning performance is improved. [Manufacturing of Small Component Packaging Band] The embodiment shown in FIG. 2 shows a manufacturing apparatus and a manufacturing process for press-forming the small component packaging band 10. As shown in FIG. 2 (a), the strip 10
It is supplied in the form of a long strip with flat front and back surfaces. It represents the thickness of the strip 10 at H 0.
【００２４】プレス成形装置は、基本的には一般的な紙
などに対するプレス成形装置と同様の構造を備えてい
る。上下に一対のプレス型３０、４０を備え、下型４０
に対して上型３０が昇降および押圧自在に設けられてい
る。なお、上型３０と下型４０の両方が昇降するもので
あっても構わない。上型３０は、表面すなわち下面がほ
ぼ平坦であるとともに、帯材１０に送り孔１２を加工す
る円柱状のパンチ型３２と、収納凹部１４をプレス成形
する断面矩形状の成形凸型３４とを備えている。パンチ
型３２および成形凸型３４は、上型３０の本体とは別個
に昇降する。The press forming apparatus basically has the same structure as a general press forming apparatus for paper and the like. A pair of press dies 30 and 40 are provided on the upper and lower sides,
The upper die 30 is provided so as to be able to move up and down and press freely. Note that both the upper mold 30 and the lower mold 40 may move up and down. The upper die 30 has a substantially flat upper surface, that is, a lower surface, and a cylindrical punch die 32 for processing the feed hole 12 in the strip 10 and a forming convex die 34 having a rectangular cross section for press-forming the storage recess 14. Have. The punch die 32 and the molding die 34 move up and down separately from the main body of the upper die 30.
【００２５】下型４０は、表面すなわち上面がほぼ平坦
であるとともに、上型３０のパンチ型３２に対応する位
置にパンチ型３２の外径よりも少し大きく、加工屑を排
出する排出孔４２を備える。成形凸型３４に対応する位
置には、下型４０の本体によりも上方に突出し、上面が
平坦な補正凸型４４が設けられている。補正凸型４４の
高さｈ2 は、０．１mm以下程度のわずかな量である。図
示を省略するが、補正凸部４４の平面外形は、上型３０
の成形凸型３４の平面外形とほぼ相似形で少し大きくな
っている。図２(b) に示すように、下型４０に対して上
型３０を下降させると、帯材１０は上型３０と下型４０
とで押圧される。このとき、帯材１０の厚みは、押圧前
の厚みＨ0 から少し圧縮されて、上型３０と下型４０と
の間隔に等しい厚みｈ0 になる。The lower die 40 has a substantially flat upper surface, that is, an upper surface, and has a discharge hole 42 at a position corresponding to the punch die 32 of the upper die 30, which is slightly larger than the outer diameter of the punch die 32, and discharges machining chips. Prepare. At a position corresponding to the molded convex mold 34, a correction convex mold 44 projecting upward from the main body of the lower mold 40 and having a flat upper surface is provided. The height h 2 of the correction convex 44 is a small amount on the order 0.1mm or less. Although illustration is omitted, the planar outer shape of the correction convex portion 44 is
The shape is substantially similar to the planar outer shape of the molding convex 34 of FIG. As shown in FIG. 2B, when the upper mold 30 is lowered with respect to the lower mold 40, the band material 10 is moved to the upper mold 30 and the lower mold 40.
And is pressed. At this time, the thickness of the band material 10 is slightly compressed from the thickness H 0 before pressing, and becomes a thickness h 0 equal to the distance between the upper mold 30 and the lower mold 40.
【００２６】上型３０のパンチ型３２がさらに下降し
て、帯材１０に送り孔１２を貫通形成する。送り孔１２
の加工で生じた加工屑１３は、下型４０の排出孔４２か
ら落下して回収される。上型３０の成形凸型３４が、上
型３０の表面から一定距離ｈ1 だけ下降して、帯材１０
の表面に収納凹部１４が形成される。このとき、帯材１
０の裏面には下型４０の補正凸型４４が押圧されるの
で、補正凸型４４の形状に対応して帯材１０の裏面が変
形する。その後、パンチ型３２や成形凸型３４が退出
し、上型３０と下型４０とが離れて、プレス加工が完了
すれば、前記した図１に示す構造の小部品包装用帯材１
０が得られる。The punch die 32 of the upper die 30 is further lowered to form the feed hole 12 through the strip 10. Feed hole 12
The processing waste 13 generated by the processing described in (1) falls from the discharge hole 42 of the lower mold 40 and is collected. Forming convex 34 of the upper mold 30, descends from the surface of the upper mold 30 by a predetermined distance h 1, the strip 10
Is formed on the surface of the substrate. At this time, strip 1
Since the correction convex 44 of the lower mold 40 is pressed against the back surface of the belt 0, the rear surface of the strip 10 is deformed according to the shape of the correction convex 44. Thereafter, the punch mold 32 and the molding convex mold 34 are withdrawn, the upper mold 30 and the lower mold 40 are separated from each other, and when the press working is completed, the small component packaging strip 1 having the structure shown in FIG.
0 is obtained.
【００２７】なお、帯材１０の材料特性によって、プレ
ス加工後にある程度の復元が生じる。そのため、図２
(b) に示す加工時における帯材１０の寸法形状と、図１
に示す加工後の帯材１０の寸法形状とは少し違ってい
る。例えば、加工後の厚みＨが、加工時の厚みｈ0 より
も大きくなっていたり、収納凹部１４の深さＤが加工時
の深さｈ1 よりも浅くなっていたりする。特に、補正凹
部１６の形状は、補正凸型４４の形状に比べてかなり変
形しており、補正凸型４４の上面が平坦面であるのに対
して、補正凹部１６の上面はゆるやかな湾曲面になる。
補正凸部４４の高さｈ2 に対して、補正凹部１６の深さ
ｄは少し小さくなる。Note that, depending on the material properties of the band material 10, some restoration occurs after the press working. Therefore, FIG.
FIG. 1B shows the dimensions and shape of the band material 10 during the processing shown in FIG.
Is slightly different from the dimension and shape of the band material 10 after processing. For example, the thickness H of the post-processing, or is greater than the thickness h 0 of the time of processing, the depth D of the housing recess 14 is or are shallower than the depth h 1 during processing. In particular, the shape of the correction concave portion 16 is considerably deformed as compared with the shape of the correction convex portion 44, and the upper surface of the correction concave portion 44 is a flat surface, whereas the upper surface of the correction concave portion 16 is a gentle curved surface. become.
The height h 2 of the correction convex portion 44, the depth d of the correction recess 16 is slightly smaller.
【００２８】〔補正凹部と寸法例〕前記実施形態の小部
品包装用帯材を、補正凹部の寸法設定を変えて製造し、
その性能を評価した。図１に示す形状の小部品包装用帯
材を製造した。帯材１０として、幅８．０mm、厚み０．
６mmの厚紙を用いた。収納凹部１４として、縦１．２mm
×横０．７mm ×深さ０．５２mmの直方体形状のものを
作製した。プレス成形型の成形凸部３４は、縦１．１７
mm×横０．６７mm×最大突出量０．５５mmであった。[Correction recess and example of dimensions] The small component packaging strip of the above embodiment is manufactured by changing the dimension setting of the compensation recess.
Its performance was evaluated. A small component packaging strip having the shape shown in FIG. 1 was manufactured. The band 10 has a width of 8.0 mm and a thickness of 0.
6 mm thick paper was used. 1.2 mm long as storage recess 14
A rectangular parallelepiped having a width of 0.7 mm and a depth of 0.52 mm was prepared. The forming protrusion 34 of the press forming die has a length of 1.17.
mm × 0.67 mm × 0.55 mm.
【００２９】補正凹部１６は、下表に示す縦横寸法の矩
形状をなし、深さ０．０３mmのものを作製した。プレス
成形型の補正凸部４４は、図２に示す概略形状で、高さ
０．０３mmのものであった。 ＜補正凹部の寸法＞ ─────────────────────────── 収納凹部 補正凹部 寸法比率 ％ ＢW ×ＢL ＡW ×ＡL ＡW ／ＢW ＡL ／ＢL ─────────────────────────── 0.7 ×1.2 1.3 ×1.6 １８６ １３３ 0.7 ×1.2 2.0 ×3.5 ２８６ ２９２ ─────────────────────────── 上記何れの場合も、小部品包装用帯材として良好に使用
でき、連続的に走行させて取り扱った場合でも、帯材の
浮き上がりや上下の振動などは発生しなかった。The correction concave portion 16 was formed in a rectangular shape having a vertical and horizontal dimension shown in the following table and having a depth of 0.03 mm. The correction projection 44 of the press mold had a schematic shape shown in FIG. 2 and a height of 0.03 mm. <Dimensions of compensating recess> ─────────────────────────── Storage recess Compensating recess Dimension ratio% BW x BL AW x AL AW / BW AL / BL ─────────────────────────── 0.7 × 1.2 1.3 × 1.6 186 133 0.7 × 1.2 2.0 × 3.5 286 292 ─────何 れ In any of the above cases, it can be used favorably as a strip for packaging small parts, and even when it is handled while running continuously. In addition, no lifting of the band material and no vertical vibration occurred.
【００３０】〔補正凸型の変更形状〕図３に示す実施形
態は、前記実施形態と補正凸型の形状を変えている。下
型３０の補正凸型４４は、中心が高く周辺に向かって低
くなるテーパー形状の上面を有している。このようなテ
ーパー構造を備えておくことで、プレス成形の際に、帯
材１０の加工変形がスムーズに行われ易い。このような
補正凸型４４で成形された帯材１０の補正凹部１６は、
中央が深く周辺に向かって浅くなるテーパー形状の内面
を有するものとなる。[Modified Shape of Correction Convex Shape] The embodiment shown in FIG. 3 is different from the above embodiment in the shape of the correction convex shape. The correction convex 44 of the lower mold 30 has a tapered upper surface whose center is higher and lowers toward the periphery. By providing such a tapered structure, the working deformation of the band material 10 is easily performed smoothly during press forming. The correction concave portion 16 of the strip 10 formed by such a correction convex mold 44 is
The tapered inner surface becomes deeper at the center and shallower toward the periphery.
【００３１】[0031]
【発明の効果】本発明にかかる小部品包装用帯材の製造
方法では、収納凹部をプレス成形する際に、帯材の表面
に収納凹部を成形する成形凸型に対向して、帯材の裏面
を補正凸型で押圧することによって、帯材の裏面に不要
な膨出が生じることが防げる。その結果、小部品の搭載
および取り出しなどの帯材の取扱い作業時に、帯材が浮
き上がったり上下に振動したりする問題が解消できる。
さらに、小部品包装用帯材として、帯材の裏面に補正凹
部を有していれば、収納凹部の底面が補正凹部の深さ分
だけ裏面から上方に浮いた状態で支持されるので、収納
凹部の底に配置された小部品に外力の衝撃や振動が加わ
り難くなり、小部品の緩衝保護効果も高まる。According to the method of manufacturing a small component packaging strip according to the present invention, when the storage recess is press-molded, the strip is opposed to a molding convex for forming the storage recess on the surface of the strip. By pressing the back surface with the correction convex, unnecessary swelling on the back surface of the strip can be prevented. As a result, it is possible to solve the problem that the band material floats or vibrates up and down during the handling operation of the band material such as loading and unloading of small parts.
Furthermore, if the band for the small component packaging has a correction recess on the back surface of the band, the bottom surface of the storage recess is supported in a state of floating upward from the back surface by the depth of the correction recess. The impact and vibration of external force are less likely to be applied to the small parts arranged at the bottom of the recess, and the effect of protecting the small parts from shock absorption is enhanced.
【図１】 本発明の実施形態を表す小部品包装用帯材の
平面図(a) 、拡大断面図(b) 、底面図(c)FIG. 1 is a plan view (a), an enlarged cross-sectional view (b), and a bottom view (c) of a small component packaging strip according to an embodiment of the present invention.
【図２】 プレス成形工程を段階的に示す断面図FIG. 2 is a cross-sectional view showing a step of the press forming process.
【図３】 別の実施形態を示す帯材および成形型の断面
図FIG. 3 is a cross-sectional view of a strip and a molding die showing another embodiment.
【図４】 従来技術を表し、帯材の裏面に膨出が生じた
状態を示す断面図FIG. 4 is a cross-sectional view showing a state in which a swelling has occurred on the back surface of a strip, showing a conventional technique.
１０ 帯材 １２ 送り孔 １４ 収納凹部 １６ 補正凹部 ２０ 電子部品 ２２ カバーテープ ３０、４０ プレス成形型 ３２ パンチ型 ３４ 成形凸型 ４４ 補正凸型 REFERENCE SIGNS LIST 10 strip 12 feed hole 14 storage recess 16 correction recess 20 electronic component 22 cover tape 30, 40 press molding die 32 punch die 34 molding convex die 44 correction convex die
───────────────────────────────────────────────────── フロントページの続き (72)発明者 浅尾 由紀彦 大阪市北区西天満４丁目８番17号 日昌キ ャリヤシステム株式会社内 Ｆターム(参考） 3E067 AA12 AB41 AC04 BA26A EE60 FA01 FC01 GD10 3E096 AA06 BA08 BB05 CA15 CB02 CC02 DA30 DB06 DC01 FA40 GA05 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Yukihiko Asao 4-7-17 Nishitenma, Kita-ku, Osaka-shi F-term in Nissho Carrier System Co., Ltd. (reference) 3E067 AA12 AB41 AC04 BA26A EE60 FA01 FC01 GD10 3E096 AA06 BA08 BB05 CA15 CB02 CC02 DA30 DB06 DC01 FA40 GA05
Claims (5)
部に小部品を収納し、収納凹部の表面を被覆テープで覆
って小部品を包装する小部品包装用帯材を製造する方法
であって、 圧縮成形性を有する可撓性材料からなる帯材に対して、 片面には、前記収納凹部に対応する形状の成形凸型を押
圧して収納凹部を成形すると同時に、 反対面には、前記収納凹部の外形よりも広い補正凸型を
押圧する小部品包装用帯材の製造方法。1. A method for manufacturing a small component packaging strip for storing small components in a plurality of storage recesses arranged along the longitudinal direction, and covering the surfaces of the storage recesses with a covering tape to package the small components. On the other hand, on a strip made of a flexible material having compression moldability, on one surface, a molding convex having a shape corresponding to the accommodation recess is pressed to form the accommodation recess, and on the other side, And a method of manufacturing a small component packaging strip for pressing a correction convex shape wider than the outer shape of the storage recess.
部に小部品を収納し、収納凹部の表面を被覆テープで覆
って小部品を包装する小部品包装用帯材を製造する装置
であって、 互いに接離自在な一対のプレス成形型を備え、 一方のプレス成形型には、前記小部品包装用帯材の材料
となる帯素材の片面に当接する平坦な表面と、表面から
突出自在に配置され、前記収納凹部に対応する形状で帯
素材の厚みよりも低い成形凸型とを有し、 他方のプレス成形型には、前記帯素材の反対面に当接す
る平坦な表面と、表面に突出して配置され、前記収納凹
部の外形よりも広い面積を有し、帯材の厚みから成形凸
型の厚みを差し引いた寸法よりも低い補正凸型とを有す
る小部品包装用帯材の製造装置。2. An apparatus for manufacturing a small component packaging strip for storing small components in a plurality of storage recesses arranged along the longitudinal direction, covering the surfaces of the storage recesses with a covering tape, and packaging the small components. There is a pair of press forming dies which can be separated from and separated from each other. One of the press forming dies has a flat surface which comes into contact with one surface of a band material which is a material of the small component packaging band material, and a projecting surface. Freely formed, having a molding convex shape having a shape corresponding to the storage recess and lower than the thickness of the band material, and the other press molding die having a flat surface abutting on the opposite surface of the band material, A small-part packaging strip having a larger area than the outer shape of the storage recess, and having a correction convex lower than the dimension obtained by subtracting the thickness of the molded convex from the thickness of the strip; manufacturing device.
mmであり、 前記収納凹部の外形寸法に対する補正凸型の外形寸法の
比率が、１１０〜３００％の範囲にある請求項２に記載
の小部品包装用帯材の製造装置。3. The height of the correction convex is 0.02 to 0.1.
3. The apparatus according to claim 2, wherein a ratio of an outer dimension of the correction convex to an outer dimension of the storage recess is in a range of 110 to 300%.
部に小部品を収納し、収納凹部の表面を被覆テープで覆
って小部品を包装する帯材であって、 圧縮成形性を有する可撓性材料からなり、 表面から所定の深さまで厚み方向に圧縮して成形された
収納凹部と、 前記収納凹部の外形よりも広い領域で裏面に成形された
補正凹部とを備える小部品包装用帯材。4. A strip material for storing small parts in a number of storage recesses arranged along the longitudinal direction, and covering the surfaces of the storage recesses with a covering tape to package the small parts, and has compression moldability. For small component packaging, comprising a storage recess made of a flexible material and formed by compressing in the thickness direction from the front surface to a predetermined depth, and a correction recess formed on the back surface in a region wider than the outer shape of the storage recess. Strips.
mmである請求項４に記載の小部品包装用帯材。5. The correction concave portion has a depth of 0.02 to 0.1.
The band for packaging small parts according to claim 4, which is mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000169562A JP2001348009A (en) | 2000-06-06 | 2000-06-06 | Method and apparatus for manufacturing band material for packaging small component and band material for packaging small component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000169562A JP2001348009A (en) | 2000-06-06 | 2000-06-06 | Method and apparatus for manufacturing band material for packaging small component and band material for packaging small component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001348009A true JP2001348009A (en) | 2001-12-18 |
| JP2001348009A5 JP2001348009A5 (en) | 2007-06-28 |
Family
ID=18672402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000169562A Pending JP2001348009A (en) | 2000-06-06 | 2000-06-06 | Method and apparatus for manufacturing band material for packaging small component and band material for packaging small component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001348009A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012035899A (en) * | 2010-08-11 | 2012-02-23 | Murata Mfg Co Ltd | Carrier tape, and apparatus and method for manufacturing the same |
| JP2012218761A (en) * | 2011-04-07 | 2012-11-12 | Rohm Co Ltd | Method of manufacturing carrier tape, and carrier tape manufacturing apparatus |
| KR20160087142A (en) * | 2015-01-13 | 2016-07-21 | 저장 지에메이 일렉트로닉 & 테크놀로지 컴퍼니 리미티드 | Manufacturing method of strips for carrying and continuous feeding of electronic component |
| WO2019216480A1 (en) * | 2018-05-08 | 2019-11-14 | Woo Hyun Gyu | Method for manufacturing paper carrier tape |
| WO2019216481A1 (en) * | 2018-05-08 | 2019-11-14 | Woo Hyun Gyu | Method for manufacturing paper carrier tape |
| WO2023286215A1 (en) * | 2021-07-14 | 2023-01-19 | 株式会社Fuji | Tape tip processing jig |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001171726A (en) * | 1999-12-17 | 2001-06-26 | Tokyo Ueruzu:Kk | Carrier tape and device for manufacturing it |
-
2000
- 2000-06-06 JP JP2000169562A patent/JP2001348009A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001171726A (en) * | 1999-12-17 | 2001-06-26 | Tokyo Ueruzu:Kk | Carrier tape and device for manufacturing it |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012035899A (en) * | 2010-08-11 | 2012-02-23 | Murata Mfg Co Ltd | Carrier tape, and apparatus and method for manufacturing the same |
| US9635791B2 (en) | 2010-08-11 | 2017-04-25 | Murata Manufacturing Co., Ltd. | Carrier tape, carrier tape manufacturing apparatus, and method of manufacturing carrier tape |
| JP2012218761A (en) * | 2011-04-07 | 2012-11-12 | Rohm Co Ltd | Method of manufacturing carrier tape, and carrier tape manufacturing apparatus |
| KR20160087142A (en) * | 2015-01-13 | 2016-07-21 | 저장 지에메이 일렉트로닉 & 테크놀로지 컴퍼니 리미티드 | Manufacturing method of strips for carrying and continuous feeding of electronic component |
| KR101701019B1 (en) * | 2015-01-13 | 2017-01-31 | 저장 지에메이 일렉트로닉 & 테크놀로지 컴퍼니 리미티드 | Manufacturing method of strips for carrying and continuous feeding of electronic component |
| WO2019216480A1 (en) * | 2018-05-08 | 2019-11-14 | Woo Hyun Gyu | Method for manufacturing paper carrier tape |
| WO2019216481A1 (en) * | 2018-05-08 | 2019-11-14 | Woo Hyun Gyu | Method for manufacturing paper carrier tape |
| WO2023286215A1 (en) * | 2021-07-14 | 2023-01-19 | 株式会社Fuji | Tape tip processing jig |
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