JP3907240B2 - Carrier tape - Google Patents

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Publication number
JP3907240B2
JP3907240B2 JP19565596A JP19565596A JP3907240B2 JP 3907240 B2 JP3907240 B2 JP 3907240B2 JP 19565596 A JP19565596 A JP 19565596A JP 19565596 A JP19565596 A JP 19565596A JP 3907240 B2 JP3907240 B2 JP 3907240B2
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carrier tape
pocket
rib
lead
partition
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JPH1017073A (en
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知康 加藤
康幸 ▲高▼尾
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Shin Etsu Polymer Co Ltd
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Shin Etsu Polymer Co Ltd
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Description

【0001】
【発明の属する技術分野】
この発明は、電子部品の装着装置への供給や輸送等に用いるキャリアテープ、特に、モールド部とリードからなるQFP (Quad Flat Package) 等の半導体パッケージに適したキャリアテープに関する。
【0002】
【従来の技術】
従来のキャリアテープとしては、例えば、特公平4−42260号公報等に記載されたものが知られる。この特公平4−42260号公報には、図7および図8に示すように、平面視矩形凹状の複数のポケット2が形成された帯状長尺のキャリアテープであって、ポケット2の底面にポケット2周面から離間して平面視矩形状の台座3を形成し、台座3とポケット2周面との間にリード収容溝4を形成し、台座3の上面周縁に仕切りリブ5を突隆させたものが記載される。
【0003】
このようなキャリアテープにあっては、ポケット2内にそれぞれ半導体パッケージPがリードPbをリード収容溝4内に位置させてモールド部Paを台座3上面の仕切りリブ5の内側に載せて収容される。そして、このキャリアテープは、ポケット2内に半導体パッケージPを収容した後に、ポケット2の開口面側にカバーテープ(図示せず)が貼合される。
【0004】
【発明が解決しようとする課題】
しかしながら、上述した特公平4−42260号公報に記載のキャリアテープにあっては、作業者による取扱時等において曲げモーメントが作用すると、ポケット2と台座3との間にリード収容溝4の変形を伴う歪みが発生し、ポケット2の周面がリードPbに当接してリードPbが曲げ等を生じるおそれがあるという問題があった。
【0005】
すなわち、図8aに示すようにキャリアテープにポケット2の開口側(表面)とポケット2の底部側(裏面)とが長手方向に相対的な変位を生じるような曲げモーメントが作用した場合、また、図8bに示すように、キャリアテープに表面側を凸とする曲げを生じるような曲げモーメントが作用した場合、さらに、図8cに示すようにキャリアテープに裏面側を凸とする曲げを生じるような曲げモーメントが作用した場合、半導体パッケージPのリードPbがポケット2の周面と当接して押圧され、曲げを生じることがあった。
【0006】
また、このようなキャリアテープは金型等を用いて圧空成形、真空成形あるいはプレス成形等により成形され、金型に微細な突条を形成して該突条により仕切りリブを成形するが、仕切りリブの角部で突条に樹脂成形部分が抱き付くように密着し、離型性が阻害されて成形したキャリアテープに変形等の不都合が生じるという問題もあった。
この発明は、上記問題に鑑みなされたもので、キャリアテープに外力が作用した場合でもポケット内に収納した電子部品のリードに曲げ等の不都合が生じることがなく、また、成形に際しての離型性も改善することができるキャリアテープを提供することを目的とする。
【0007】
【課題を解決するための手段】
上記目的を達成するため、この発明は、長手方向に所定の間隔で形成されたポケットの底面に周面から離間して四角形状の台座を膨出成形して該台座と前記ポケット周面との間にリード収容溝を形成するとともに、該台座の座面周縁に仕切りリブを前記ポケット内方向に突設形成したキャリアテープにおいて、
前記座面角部の仕切りリブと連続し前記座面の対角線方向外側に向かって前記ポケット側壁に延びる補助リブが前記リード収容溝に形成され、かつ該補助リブの前記座面からの高さが全長に渡って仕切りリブの前記座面からの高さと同じであるか、または該補助リブの対角線内方側の端部が仕切りリブの前記座面からの高さと同じであり、該補助リブの高さを対角線外方に向かうにつれて漸減したことを特徴とするキャリアテープである。
【0008】
そして、この発明にかかるキャリアテープは、前記補助リブ幅bが前記仕切りリブの幅aに対して以下の関係式で定まる範囲とする態様(請求項2)とする。関係式は、a≦b≦2×a×cos45°(式)である。さらに、前記補助リブが前記対角線方向外側部分、すなわち、ポケット周面またはリード収容溝底面と連続する部分を拡幅させた態様(請求項)に構成することができる。
【0009】
電子部品は、モールド部(電子部品本体)等からリードが延出するものであり、前述したQFP等の半導体パッケージに代表される。
キャリアテープは、多数のポケットが一定の間隔を隔て形成され、また、必要に応じて一側あるいは両側に一定間隔で多数の送り孔が形成される。このキャリアテープは、ポリスチレン、ポリ塩化ビニル系樹脂、ポリエチレンテレフタレートあるいはポリプロピレン等の熱可塑性樹脂シートを圧空、プレスあるいは真空成形等で成形して製造される。
ポケットは、電子部品と対応した平面視四角形状の凹部等、例えば、一面(表面)に開口した直方体あるいは立方体形状の凹部からなる。
【0010】
台座は上面が電子部品のモールド部と対応(例えば、相似)した四角形状、例えば、正方形等の形状を有する。
仕切りリブは、少なくとも台座上面の4角部に形成される。この仕切りリブは、連続であると間欠的であるとを問わないが、連続的に四角枠状に形成することが望ましい。
リード収容溝は、台座の周囲に全周にわたって台座の起立壁とポケットの側壁とにより区画形成されて電子部品のリードを収容し、その深さおよび幅が電子部品のリードに応じて定められる。
【0011】
補助リブは、一端(内側端)が台座上の角部の仕切りリブと連続して台座の対角線外方
向に延在し、他端がリード収容溝の底面あるいはポケットの側面あるいは上部(テープ表面)と連続する。この補助リブは、高さが全長にわたって仕切りリブと同一の高さ、あるいは、対角線外方に向かって漸減する。望ましい形態としては、この補助リブは、幅寸法法(付け根部分の幅寸法)bが仕切りリブの幅寸法aを基準として上述した式で規定される範囲に、また、対角線外方の部分が拡幅してリード収容溝の底面やポケットの側面等に大きな面積で連続する。
【0012】
【作用】
この発明にかかるキャリアテープは、台座上面周縁の仕切りリブから台座の対角線外方に向かってポケットの側面やリード収容溝の底面等まで補助リブが延出し、リード収容溝の剛性が向上する。このため、前述した図8a,b,cに示すような曲げモーメントが作用しても、リード収容溝の変形を抑制でき、ポケットに収容した電子部品にリードの曲げ等が生じることを防止できる。そして、補助リブは仕切りリブの角部に連続するため、成形に際しての離型性も改善され、成形品の変形等の発生も防止することができる。
【0013】
特に、請求項2の発明にかかるキャリアテープは、補助リブの高さを仕切りリブの高さと略同一とするため、より高い剛性が得られリード収容溝の変形をより確実に防止できる。
同様に、請求項4の発明にかかるキャリアテープは、補助リブの台座対角線外方側の端部を拡幅して大きな面積でポケットの側壁等と連続させるため、より高い剛性が得られる。
【0014】
また、請求項3の発明にかかるキャリアテープは、補助リブの幅寸法bを仕切りリブの幅寸法a以上で、2a・cos π/4以下とするため、十分な剛性を確保でき、また、ポケットに収容した電子部品のリードが補助リブに干渉することを防止できる。すなわち、補助リブの幅bが値aに満たなければリード収容溝の形状保持性を十分に確保できず、逆に、値(2a・cos π/4)より大きければリード収納領域にはみ出してリード干渉するが、上記範囲の幅寸法とすることで十分な形状保持が図れ、また、リードとの干渉が防止される。
【0015】
【発明の実施の形態】
以下、この発明の実施の形態を図面を参照して説明する。
図1はこの発明の一の実施の形態にかかるキャリアテープを示し、図1aが平面図、図1bが図1aのA−O−A矢視断面図である。
【0016】
図中、1はキャリアテープを示し、キャリアテープ1には一面(表面)に多数のキャビティ10が長手方向に一定間隔で形成され、また、幅方向両側に多数の送り孔20が長手方向に一定間隔で形成される。なお、図示と詳細な説明は省略するが、このキャリアテープ1はポケット10内にQFP等の半導体パッケージ(電子部品)Pを収納した状態で表面に周知のカバーテープが貼合され、ポケット10の開口が閉塞される。
【0017】
ポケット10は、テープ1の表面に正方形状に開口する凹部からなり、底部に周囲の側面と所定の間隔を隔て突出する平面視正方形状の台座11が膨出成形される。このポケット10内には、台座11の回りに台座11の起立壁とポケット10の側壁とによりリード収容溝12が形成される。リード収容溝12は、平面視略正方形枠状をなし、モールド部Paが台座11上に載置された半導体パッケージPのリードPbを収容する。
【0018】
台座11は、側壁(起立壁)が上部に向かって互いに接近する方向に傾斜した断面台形状であって、上面がモールド部Paと略同一の平面視形状(本実施の形態では正方形)を有する。この台座11は、上面周縁に全周にわたって連続する仕切りリブ13が一体に突設され、上面中央に電子部品検知用の検知孔19が貫通形成される。仕切りリブ13は、台座11の上面周縁を膨出させてなり、台座11の上面周縁に沿って正方形の辺状に延在する。
【0019】
また、ポケット10内には、台座11上面に仕切りリブ13の4角部からそれぞれ台座11の対角線外方に向かって補助リブ17が膨出成形される。補助リブ17は、台座11の対角線内方側の端部(内端部)が仕切りリブ13と台座11の座面からの高さが同一であり、仕切りリブ13と連続し、対角線外方に向かうにつれて座面からの高さが漸減し、外端部がリード収容溝12の底面にポケット10の側壁近傍で連続する。この補助リブ17は、付け根の幅寸法bが仕切りリブ13の幅寸法aに対して下記の式で定まる範囲の値に形成される。a≦b≦2×a×cos45°(式)
【0020】
この実施の形態にかかるキャリアテープ1にあっては、各ポケット10内にそれぞれ半導体パッケージPを収容し、表面に各ポケット10の開口を閉止するカバーテープが貼合される。ここで、ポケット10内に収容された半導体パッケージPは、モールド部Paを台座11上に載置させ、また、リードPbをリード収容溝12内に位置させる。
【0021】
そして、ポケット10内には、仕切りリブ13の4角部にそれぞれ補助リブ17が連続し、これら補助リブ17が台座11の上面対角線方向外方に延出してリード収容溝12の底面にポケット10の側壁近傍で連続する。このため、リード収容溝12は形状保持性、すなわち、剛性が高く、前述した図6a,b,cに示すような曲げモーメント作用してもリード収容溝12の変形が小さい。したがって、曲げモーメントが作用しても半導体パッケージPのリードPbとポケット10の側壁とが当接することがなく、この当接等に起因したリードPbの曲げ等が防止される。
【0022】
また、このキャリアテープ1は、補助リブ17の幅寸法が仕切りリブ13の幅寸法に対して下式を充足する値を有する。
a≦b≦2・a・cos45 ° (式)
このため、剛性を十分に向上でき、また、補助リブ17が仕切りリブ13の内側面に沿った線の間の領域、すなわち、リードフレーム収容領域にはみ出すことがなく、半導体パッケージPのリードPbが補助リブ17と干渉することも防止できる。
【0023】
さらに、このキャリアテープ1は金型を用いて圧空成形等により成形され、金型に成形された微細な突条等により仕切りリブ13が成形される。そして、前述したように、成形に際しては仕切りリブ13が正方形枠状であるため仕切りリブ13が角部で金型に密着し、仕切りリブ13と金型の離型性が阻害される。しかしながら、仕切りリブ13の4角部にはそれぞれ補助リブ17が連続し、この補助リブ17を仕切りリブ13と同時に成形するため、離型性が改善され、離型を円滑に行える。
【0024】
図2はこの発明の他の実施の形態にかかるキャリアテープを示し、図2aが一部を拡大した平面図、図2bが図2aのB−O−B矢視断面図である。
なお、この実施の形態および後述する各実施の形態では前述したキャリアテープと同一の部分には同一の番号を付して説明を割愛する。
【0025】
この実施の形態にあっては、補助リブ17が仕切りリブ13の座面からの高さが同一で連続し、この高さを維持して、すなわち、均一な高さを維持してポケット10の角部に連続する。前述した実施の形態と同様に、補助リブ17は、幅寸法bが前述した式により規定される値を有する。
【0026】
この実施の形態においては、補助リブ17は全長にわたって仕切りリブ13と同一の高さを有し、内端部が仕切りリブ13に、外端部がポケット10の角部に連続する。このため、リード収容溝12の形状保持性がより優れ、リード収容溝12の変形がより抑制され、また、成形に際しての離型性が改善される。
【0027】
図3はこの発明の参考形態にかかるキャリアテープを示し、図2aのB−O−B矢視断面に相当する断面図である。この参考形態にあっては、補助リブ17は内端部が仕切りリブ13に同一高さで連続し、外端部がポケット10の角部の上部に連続し、その高さが対角線方向外方に向かって漸増する。
【0028】
この参考形態にあっても、リード収容溝12の形状保持性が優れ、ポケット10の壁面とリードPbの曲がり等が防止でき、また、成形に際しての離型性が改善される。
【0029】
図4はこの発明のさらに他の実施の形態にかかるキャリアテープを示し、図4aが一部を拡大した平面図、図4bが図4aのC−C矢視断面図である。
この実施の形態にかかるキャリアテープ1は、台座11の上面周縁に仕切りリブ13と隣接して溝18を形成する。溝18は、仕切りリブ13と相似な四角枠状に延在する。
【0030】
この実施の形態は、仕切りリブ13の内側の立ち上がり部が湾曲していた場合でも、この立ち上がり部に半導体パッケージPのモールド部Paの下側縁部が干渉する(乗り上げる)ことがなく、モールド部Paと仕切りリブ13の立ち上がり部との干渉に起因した半導体パッケージPの浮き上がりが防止される。
【0031】
図5はこの発明のまたさらに他の実施の形態にかかるキャリアテープを示し、図5aが一部を拡大した平面図、図5bが図5aのD−D矢視断面図である。
この実施の形態にかかるキャリアテープ1は、ポケット10の底面に4つの凸部16を台座11として対称的に突設する。これら凸部16は、上面(天面)が平坦な平面視四角形状を有し、前述した各実施の形態における台座11と同等の突出高さを有する。また、仕切りリブ13は、ポケット10の各辺中央位置で分断され、ポケット10の4隅部に略Y字状に形成される。
【0032】
この実施の形態にあっては、半導体パッケージPのモールド部Paが各凸部16上に載せられるため、仕切りリブ13の内側基端部(付け根部)が湾曲していてもモールド部Paと仕切りリブ13が干渉することがなく、半導体パッケージPの浮き上がりが防止され、また、半導体パッケージPを適正な姿勢、すなわち、モールド部Paがテープと平行な姿勢で収容できる。
【0033】
なお、上述した各実施の形態では、補強リブ17を一様な幅に成形するが、図6a,bに示すように外端部を拡幅することも可能である。すなわち、図6aに示す態様は、図2,3に示す補強リブ17のポケット10壁部と連続する外端部を直線的(一次関数的な特性)に拡幅、すなわち、C面取り形状に拡幅する。
また同様に、図6bに示す態様は、補強リブ17の外端部を二次関数的な特性、すなわち、外端部の側縁を曲面として拡幅する。これら図6a,bの態様にあっては、補強リブ17の外端部が拡幅して大きな面積でポケット10の壁と連続するため、リード収容溝12の形状保持性をより改善することができ、離型性もより改善される。
【0034】
さらに、上述した図4の実施の形態においては、台座11の上面周縁に溝18を形成するが、この溝18に代えて仕切りリブ13の基端に向かって下向きに傾斜する傾斜部を台座11の上面に形成することもできる。また、図5の実施の形態においては、凸部16の平面形状は任意に選択できる。
【0035】
【実施例】
次に、実施例を説明する。
この実施例では、下記の試験サンプル作成方法により図1の実施の形態に相当する試験サンプル1と、図2の実施の形態に相当する試験サンプル2を作成し、これら試験サンプル1と試験サンプル2について下記のテスト方法により落下テストと実装テストを行った。
【0036】
・試験サンプルの作成方法
サーモシートEC(電気化学工業(株)製、商品名)の厚さ0.3mmのものを圧空成形法で成形したキャリアテープに、電気部品として半導体パッケージ(LQFP100P)を収容し、外径330mm、内径100mmのPS製インジェクションリールに巻いたものを10リール用意し、これらを段ボール箱に収容して試験サンプルとした。
ただし、試験サンプル1にかかるキャリアテープはポケット10の深さが2.0mm、試験サンプル2にかかるキャリアテープはポケット10の深さが3.5mmであり、また、試験サンプル1および試験サンプル2ともに1リールの半導体パッケージ収納数は1000個である。
【0037】
・テスト方法
1) 落下テスト
JIS Z0202に準じ、75cmの高さからの落下を行った。
2) 実装テスト
落下テストを行ったサンプルを富士機械製造(株)製実装機CP−6を用い、タクトタイム0.2秒で実装を行った。
【0038】
上述した試験サンプル1および試験サンプル2について、落下テスト後の半導体パッケージPのリードPbの曲がりを目視により評価したが曲がりは発見できず、また、実装テストも実装不良を生じること無く行え、本発明のキャリアテープが優れていることが実証された。
【0039】
【発明の効果】
以上説明したように、この発明にかかるキャリアテープによれば、ポケット内に平面視四角形状の台座を膨出形成して台座の周りにリード収容溝を区画形成するとともに、この台座の上面周縁に仕切りリブを突出形成し、この仕切りリブの角部から対角線方向外側にポケット側壁に連続する補助リブを形成するため、剛性が向上してリード収容溝の形状保持性が改善され、ポケット側壁とリードの当接等に起因したリードの曲がりが防止でき、また、成形に際しての成形金型の離型性も改善される。
【0040】
さらに加えて、請求項2に記載の発明にかかるキャリアテープは、リード収容溝の形状保持性を十分に確保しつつ補助リブとリードの干渉を防止でき、
また、請求項3に記載の発明にかかるキャリアテープは、リード収容溝の形状保持性がより改善されるため、リードの曲がり等をより確実に防止できるし、成形金型との離型性をより改善できる。
【図面の簡単な説明】
【図1】 この発明の一の実施の形態にかかるキャリアテープを示し、aが一部を拡大した平面図、bがaのA−O−A矢視断面図である。
【図2】 この発明の他の実施の形態にかかるキャリアテープを示し、aが一部を拡大した平面図、bがaのB−O−B矢視断面図である。
【図3】 この発明の参考形態にかかるキャリアテープを示し、図2aのB−O−B矢視に相当する断面図である。
【図4】 この発明のさらに他の実施の形態にかかるキャリアテープを示し、aが一部を拡大した平面図、bがaのC−O−C矢視断面図である。
【図5】 この発明のまたさらに他の実施の形態にかかるキャリアテープを示し、aが一部を拡大した平面図、bがaのD−O−D矢視断面図である。
【図6】 a,bがそれぞれこの発明の他の態様にかかるキャリアテープの一部を拡大した平面図である。
【図7】 従来のキャリアテープを示し、aが一部を拡大した平面図、bがaのE−E矢視面図である。
【図8】 a,b,cがそれぞれ同従来のキャリアテープの問題を説明するための図7aのE−E矢視線に相当する断面図である。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a carrier tape used for supplying or transporting an electronic component to a mounting apparatus, and more particularly to a carrier tape suitable for a semiconductor package such as a QFP (Quad Flat Package) including a mold part and leads.
[0002]
[Prior art]
As a conventional carrier tape, for example, one described in Japanese Patent Publication No. 4-42260 is known. As shown in FIG. 7 and FIG. 8, this Japanese Patent Publication No. 4-42260 discloses a strip-like long carrier tape in which a plurality of pockets 2 having a rectangular concave shape in plan view are formed. A pedestal 3 having a rectangular shape in plan view is formed apart from the two peripheral surfaces, a lead receiving groove 4 is formed between the pedestal 3 and the peripheral surface of the pocket 2, and partition ribs 5 are projected on the upper surface periphery of the pedestal 3. Are listed.
[0003]
In such a carrier tape, the semiconductor package P is accommodated in the pocket 2 by placing the lead Pb in the lead accommodating groove 4 and placing the mold part Pa inside the partition rib 5 on the upper surface of the base 3. . Then, after this carrier tape accommodates the semiconductor package P in the pocket 2, a cover tape (not shown) is bonded to the opening surface side of the pocket 2.
[0004]
[Problems to be solved by the invention]
However, in the carrier tape described in Japanese Patent Publication No. 4-42260 described above, when a bending moment is applied during handling by an operator, the lead receiving groove 4 is deformed between the pocket 2 and the base 3. There is a problem in that the accompanying distortion occurs and the peripheral surface of the pocket 2 may come into contact with the lead Pb and the lead Pb may be bent.
[0005]
That is, as shown in FIG. 8a, when a bending moment that causes relative displacement in the longitudinal direction between the opening side (front surface) of the pocket 2 and the bottom side (back surface) of the pocket 2 acts on the carrier tape, As shown in FIG. 8b, when a bending moment that causes the carrier tape to be convex is applied to the carrier tape, as shown in FIG. 8c, the carrier tape is bent so that the back surface is convex. When a bending moment is applied, the lead Pb of the semiconductor package P may be pressed against the peripheral surface of the pocket 2 to cause bending.
[0006]
Also, such carrier tape is formed by pressure forming, vacuum forming, press forming or the like using a mold or the like, and a fine rib is formed on the mold and a partition rib is formed by the protrusion. There is also a problem in that the resin tape is closely attached to the protrusions at the corners of the ribs, the mold release property is hindered, and the molded carrier tape has problems such as deformation.
The present invention has been made in view of the above problems, and even when an external force is applied to the carrier tape, there is no inconvenience such as bending in the lead of the electronic component stored in the pocket, and the mold release property at the time of molding It is an object to provide a carrier tape that can be improved.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, a rectangular pedestal is bulged and formed on a bottom surface of a pocket formed at a predetermined interval in the longitudinal direction at a distance from the peripheral surface to form a pedestal and the pocket peripheral surface. In the carrier tape in which a lead receiving groove is formed between and a partition rib projectingly formed in the pocket inward direction on the periphery of the seat surface of the base,
An auxiliary rib that is continuous with the partition rib at the corner of the seating surface and extends to the pocket side wall toward the diagonally outer side of the seating surface is formed in the lead receiving groove, and the height of the auxiliary rib from the seating surface is The height of the partition rib is the same as the height from the seat surface over the entire length, or the diagonally inner end of the auxiliary rib is the same as the height from the seat surface of the partition rib, a carrier tape, characterized in that the hand was gradually Hesi as towards the height diagonally outward.
[0008]
The carrier tape according to the present invention, prior Symbol auxiliary rib width b is the aspect (Claim 2) in the range defined by the following equation with respect to the width a of the partition ribs. The relational expression is a ≦ b ≦ 2 × a × cos 45 ° (formula) . Furthermore, the auxiliary rib can be configured to have an aspect in which the diagonally outer portion, that is, the portion continuous with the pocket peripheral surface or the lead receiving groove bottom surface is widened (Claim 3 ).
[0009]
An electronic component has a lead extending from a mold part (electronic component main body) or the like, and is typified by a semiconductor package such as the above-described QFP.
In the carrier tape, a large number of pockets are formed at regular intervals, and a plurality of feed holes are formed at regular intervals on one side or both sides as necessary. This carrier tape is manufactured by molding a thermoplastic resin sheet such as polystyrene, polyvinyl chloride resin, polyethylene terephthalate, or polypropylene by compressed air, pressing, or vacuum forming.
The pocket is composed of, for example, a rectangular recess in a plan view corresponding to the electronic component, for example, a rectangular parallelepiped or a cubic recess opening on one surface (surface).
[0010]
The pedestal has a quadrangular shape whose upper surface corresponds to (for example, similar to) the mold part of the electronic component, for example, a square shape.
The partition ribs are formed at least at the four corners of the upper surface of the base. The partition ribs may be continuous or intermittent, but are preferably formed continuously in a rectangular frame shape.
The lead receiving groove is defined by the standing wall of the pedestal and the side wall of the pocket around the entire periphery of the pedestal to receive the lead of the electronic component, and the depth and width thereof are determined according to the lead of the electronic component.
[0011]
The auxiliary rib has one end (inner end) continuous to the corner partition ribs on the base and extending diagonally outward from the base, and the other end is the bottom surface of the lead receiving groove or the side or top of the pocket (tape surface) Is continuous. The auxiliary rib, the height is equal to the partition ribs over the entire length height, or that lessen gradually toward diagonally outward. As a desirable form, this auxiliary rib has a width dimension method (width dimension of the base portion) b within the range defined by the above-mentioned formula with reference to the width dimension a of the partition rib, and the portion outside the diagonal line is widened. Then, it continues with a large area on the bottom surface of the lead receiving groove and the side surface of the pocket.
[0012]
[Action]
In the carrier tape according to the present invention, the auxiliary rib extends from the partition rib on the periphery of the upper surface of the pedestal to the diagonal side of the pedestal to the side surface of the pocket, the bottom surface of the lead receiving groove, etc., and the rigidity of the lead receiving groove is improved. For this reason, even if a bending moment as shown in FIGS. 8a, 8b, and 8c described above is applied, deformation of the lead receiving groove can be suppressed, and bending of the lead or the like can be prevented from occurring in the electronic component housed in the pocket. And since an auxiliary rib continues to the corner | angular part of a partition rib, the mold release property in the case of shaping | molding is improved, and generation | occurrence | production of a deformation | transformation etc. of a molded product can also be prevented.
[0013]
In particular, the carrier tape according to the second aspect of the present invention has the height of the auxiliary rib substantially the same as the height of the partition rib, so that higher rigidity can be obtained and the deformation of the lead receiving groove can be prevented more reliably.
Similarly, since the carrier tape according to the fourth aspect of the present invention widens the end of the auxiliary rib on the outer side of the pedestal diagonal so as to be continuous with the side wall of the pocket in a large area, higher rigidity is obtained.
[0014]
Further, the carrier tape according to the invention of claim 3 can ensure sufficient rigidity because the width dimension b of the auxiliary rib is not less than the width dimension a of the partition rib and not more than 2a · cos π / 4. It is possible to prevent the lead of the electronic component housed in the interference with the auxiliary rib. That is, if the width b of the auxiliary rib is less than the value a, the shape retaining property of the lead receiving groove cannot be secured sufficiently, and conversely, if the width is larger than the value (2a · cos π / 4), the lead protrudes into the lead storing area. Although it interferes, a sufficient shape can be maintained by setting the width in the above range, and interference with the lead can be prevented.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
1A and 1B show a carrier tape according to an embodiment of the present invention, in which FIG. 1a is a plan view and FIG. 1b is a cross-sectional view taken along line A-O-A in FIG. 1a.
[0016]
In the figure, reference numeral 1 denotes a carrier tape. A large number of cavities 10 are formed on one surface (surface) of the carrier tape 1 at regular intervals in the longitudinal direction, and a large number of feed holes 20 are constant in the longitudinal direction on both sides in the width direction. Formed at intervals. Although not shown and detailed description is omitted, the carrier tape 1 has a known cover tape bonded to the surface of the pocket 10 with a semiconductor package (electronic component) P such as QFP accommodated in the pocket 10. The opening is closed.
[0017]
The pocket 10 is formed of a concave portion that opens in a square shape on the surface of the tape 1, and a pedestal 11 having a square shape in plan view that protrudes at a predetermined interval from a peripheral side surface is bulged and formed on the bottom portion. In the pocket 10, a lead receiving groove 12 is formed around the pedestal 11 by the standing wall of the pedestal 11 and the side wall of the pocket 10. The lead accommodating groove 12 has a substantially square frame shape in plan view, and accommodates the lead Pb of the semiconductor package P in which the mold part Pa is placed on the pedestal 11.
[0018]
The pedestal 11 has a trapezoidal cross-sectional shape in which the side walls (standing walls) are inclined toward each other toward the upper part, and the upper surface has a plan view shape (square in the present embodiment) that is substantially the same as the mold part Pa. . In this pedestal 11, partition ribs 13 that are continuous over the entire periphery of the upper surface are integrally projected, and a detection hole 19 for detecting an electronic component is formed through the center of the upper surface. The partition rib 13 bulges the upper surface periphery of the base 11 and extends in a square side shape along the upper surface periphery of the base 11.
[0019]
Further, in the pocket 10, auxiliary ribs 17 are bulged and formed on the upper surface of the pedestal 11 from the four corners of the partition rib 13 toward the diagonally outward direction of the pedestal 11. The auxiliary ribs 17 have diagonally inward end portions (inner end portions) of the pedestal 11 that have the same height from the seating surfaces of the partition ribs 13 and the pedestal 11, are continuous with the partition ribs 13, and are diagonally outward. gradually decreases in height from the seat surface as it unsuitable, the outer end portion is continuous in the vicinity of the side walls of the pocket 10 to the bottom surface of the lead receiving groove 12. The auxiliary rib 17 is formed to have a value in a range where the root width dimension b is determined by the following formula with respect to the width dimension a of the partition rib 13. a ≦ b ≦ 2 × a × cos 45 ° (formula)
[0020]
In the carrier tape 1 according to this embodiment, the semiconductor package P is accommodated in each pocket 10, and a cover tape that closes the opening of each pocket 10 is bonded to the surface. Here, in the semiconductor package P accommodated in the pocket 10, the mold part Pa is placed on the pedestal 11, and the lead Pb is positioned in the lead accommodating groove 12.
[0021]
In the pocket 10, auxiliary ribs 17 are continuous with the four corners of the partition rib 13, and these auxiliary ribs 17 extend outward in the diagonal direction on the top surface of the pedestal 11 so that the pocket 10 is formed on the bottom surface of the lead receiving groove 12. It continues in the vicinity of the side wall. For this reason, the lead accommodating groove 12 has high shape retention, that is, high rigidity, and deformation of the lead accommodating groove 12 is small even when the bending moment acts as shown in FIGS. Therefore, even if a bending moment acts, the lead Pb of the semiconductor package P and the side wall of the pocket 10 do not come into contact with each other, and bending of the lead Pb due to this contact or the like is prevented.
[0022]
Further, in the carrier tape 1, the width dimension of the auxiliary rib 17 has a value satisfying the following expression with respect to the width dimension of the partition rib 13.
a ≤ b ≤ 2 · a · cos 45 ° (Formula)
For this reason, the rigidity can be sufficiently improved, and the auxiliary rib 17 does not protrude into the region between the lines along the inner surface of the partition rib 13, that is, the lead frame accommodating region, and the lead Pb of the semiconductor package P Interference with the auxiliary rib 17 can also be prevented.
[0023]
Further, the carrier tape 1 is formed by pressure forming or the like using a mold, and partition ribs 13 are formed by fine protrusions or the like formed on the mold. As described above, since the partition ribs 13 have a square frame shape during molding, the partition ribs 13 are in close contact with the mold at the corners, and the releasability between the partition ribs 13 and the mold is hindered. However, the auxiliary ribs 17 are continuous with the four corners of the partition ribs 13 and the auxiliary ribs 17 are formed at the same time as the partition ribs 13. Therefore, the releasability is improved and the release can be performed smoothly.
[0024]
2A and 2B show a carrier tape according to another embodiment of the present invention, in which FIG. 2a is a partially enlarged plan view, and FIG. 2b is a cross-sectional view taken along line B-O-B in FIG. 2a.
In this embodiment and each embodiment described later, the same parts as those of the carrier tape described above are denoted by the same reference numerals and description thereof is omitted.
[0025]
In this embodiment, the auxiliary ribs 17 are continuous with the same height from the seating surface of the partition ribs 13 , and maintain this height, i.e., maintain a uniform height. Consecutive corners. Similar to the embodiment described above, the auxiliary rib 17 has a value in which the width dimension b is defined by the above-described formula.
[0026]
In this embodiment, the auxiliary rib 17 has the same height as the partition rib 13 over the entire length, and the inner end portion is continuous with the partition rib 13 and the outer end portion is continuous with the corner portion of the pocket 10. For this reason, the shape retaining property of the lead receiving groove 12 is more excellent, the deformation of the lead receiving groove 12 is further suppressed, and the releasability at the time of molding is improved.
[0027]
FIG. 3 shows a carrier tape according to a reference embodiment of the present invention, and is a cross-sectional view corresponding to a cross section taken along the line B-O-B in FIG. 2a. In this reference form, the auxiliary rib 17 has an inner end continuous to the partition rib 13 at the same height, an outer end continuous to the upper portion of the corner of the pocket 10, and the height is diagonally outward. It gradually increases to.
[0028]
Also in this reference embodiment, the shape retention of rie de accommodating groove 12 is excellent, it can prevent such bending of the wall and lead Pb pocket 10, also releasing property is improved during molding.
[0029]
FIG. 4 shows a carrier tape according to still another embodiment of the present invention. FIG. 4a is a partially enlarged plan view, and FIG. 4b is a cross-sectional view taken along the line CC in FIG. 4a.
The carrier tape 1 according to this embodiment forms a groove 18 adjacent to the partition rib 13 on the periphery of the upper surface of the base 11. The groove 18 extends in a square frame shape similar to the partition rib 13.
[0030]
In this embodiment, even when the rising part inside the partition rib 13 is curved, the lower edge part of the mold part Pa of the semiconductor package P does not interfere with (climb on) the rising part. The lift of the semiconductor package P due to the interference between Pa and the rising portion of the partition rib 13 is prevented.
[0031]
FIG. 5 shows a carrier tape according to still another embodiment of the present invention, in which FIG. 5a is a partially enlarged plan view, and FIG. 5b is a sectional view taken along the line DD in FIG. 5a.
The carrier tape 1 according to this embodiment projects symmetrically with four convex portions 16 as pedestals 11 on the bottom surface of the pocket 10. These convex portions 16 have a rectangular shape in plan view with a flat upper surface (top surface), and have a protruding height equivalent to the pedestal 11 in each of the above-described embodiments. Further, the partition rib 13 is divided at the center position of each side of the pocket 10 and is formed in a substantially Y shape at the four corners of the pocket 10.
[0032]
In this embodiment, since the mold part Pa of the semiconductor package P is placed on each convex part 16, even if the inner base end part (base part) of the partition rib 13 is curved, the mold part Pa is separated from the mold part Pa. The ribs 13 do not interfere with each other, so that the semiconductor package P is prevented from being lifted, and the semiconductor package P can be accommodated in an appropriate posture, that is, in a posture in which the mold portion Pa is parallel to the tape.
[0033]
In each of the above-described embodiments, the reinforcing rib 17 is formed to have a uniform width, but the outer end portion can be widened as shown in FIGS. 6a and 6b. That is, in the embodiment shown in FIG. 6a, the outer end portion continuous with the wall portion of the pocket 10 of the reinforcing rib 17 shown in FIGS. 2 and 3 is linearly (linear function) widened, that is, widened in a C chamfered shape. .
Similarly, in the embodiment shown in FIG. 6b, the outer end portion of the reinforcing rib 17 has a quadratic function characteristic, that is, the side edge of the outer end portion is widened as a curved surface. 6a and 6b, since the outer end portion of the reinforcing rib 17 is widened and continues to the wall of the pocket 10 with a large area, the shape retaining property of the lead receiving groove 12 can be further improved. In addition, the releasability is further improved.
[0034]
Further, in the embodiment of FIG. 4 described above, the groove 18 is formed on the peripheral edge of the upper surface of the pedestal 11, but instead of this groove 18, an inclined portion inclined downward toward the base end of the partition rib 13 is provided. It can also be formed on the upper surface. In the embodiment of FIG. 5, the planar shape of the convex portion 16 can be arbitrarily selected.
[0035]
【Example】
Next, examples will be described.
In this example, a test sample 1 corresponding to the embodiment of FIG. 1 and a test sample 2 corresponding to the embodiment of FIG. 2 are prepared by the following test sample preparation method. A drop test and a mounting test were conducted by the following test methods.
[0036]
・ Test sample preparation method Thermo-sheet EC (trade name, manufactured by Denki Kagaku Kogyo Co., Ltd.) with a thickness of 0.3 mm is molded into the carrier tape by the compressed air molding method, and the semiconductor package (LQFP100P) is housed as an electrical component. Then, 10 reels wound around a PS injection reel having an outer diameter of 330 mm and an inner diameter of 100 mm were prepared, and these were housed in a cardboard box to prepare test samples.
However, the carrier tape according to the test sample 1 has a depth of the pocket 10 of 2.0 mm, the carrier tape according to the test sample 2 has a depth of the pocket 10 of 3.5 mm, and both the test sample 1 and the test sample 2 The number of semiconductor packages stored on one reel is 1000.
[0037]
Test method 1) Drop test According to JIS Z0202, a drop from a height of 75 cm was performed.
2) Mounting test The sample subjected to the drop test was mounted with a tact time of 0.2 seconds using a mounting machine CP-6 manufactured by Fuji Machine Manufacturing Co., Ltd.
[0038]
Regarding the test sample 1 and the test sample 2 described above, the bending of the lead Pb of the semiconductor package P after the drop test was visually evaluated, but the bending could not be found, and the mounting test could be performed without causing a mounting failure. The carrier tape was proven to be excellent.
[0039]
【The invention's effect】
As described above, according to the carrier tape according to the present invention, a pedestal having a rectangular shape in plan view is formed in a pocket to form a lead receiving groove around the pedestal, and at the periphery of the upper surface of the pedestal. A partition rib is formed to protrude, and an auxiliary rib that is continuous with the pocket side wall is formed diagonally outward from the corner of the partition rib. Therefore, rigidity is improved and shape retention of the lead receiving groove is improved. The bending of the lead due to the contact of the metal and the like can be prevented, and the mold releasability of the mold during molding is improved.
[0040]
In addition , the carrier tape according to the invention of claim 2 can prevent interference between the auxiliary rib and the lead while sufficiently securing the shape retaining property of the lead receiving groove ,
In addition, the carrier tape according to the invention of claim 3 can more reliably prevent the bending of the lead, etc., because the shape retention property of the lead receiving groove is further improved, and the releasability from the molding die can be improved. It can be improved.
[Brief description of the drawings]
FIG. 1 shows a carrier tape according to an embodiment of the present invention, in which a is a partially enlarged plan view and b is a cross-sectional view taken along line A-O-A.
FIGS. 2A and 2B show a carrier tape according to another embodiment of the present invention, in which a is a partially enlarged plan view and b is a cross-sectional view taken along line B-OB in FIG.
FIG. 3 is a cross-sectional view showing a carrier tape according to a reference embodiment of the present invention and corresponding to a BOB arrow view of FIG. 2a.
FIG. 4 shows a carrier tape according to still another embodiment of the present invention, in which a is a partially enlarged plan view, and b is a cross-sectional view taken along the line CC in FIG.
FIG. 5 shows a carrier tape according to still another embodiment of the present invention, in which a is a partially enlarged plan view, and b is a cross-sectional view taken along line D-O-D of a.
FIGS. 6A and 6B are enlarged plan views of a part of a carrier tape according to another embodiment of the present invention.
7 shows a conventional carrier tape, in which a is a partially enlarged plan view, and b is a EE arrow view of a. FIG.
8 is a cross-sectional view corresponding to the EE arrow line of FIG. 7a for explaining the problems of the conventional carrier tape.

Claims (3)

長手方向に所定の間隔で形成されたポケットの底面に周面から離間して四角形状の台座を膨出成形して該台座と前記ポケット周面との間にリード収容溝を形成するとともに、該台座の座面周縁に仕切りリブを前記ポケット内方向に突設形成したキャリアテープにおいて、
前記座面角部の仕切りリブと連続し前記座面の対角線方向外側に向かって前記ポケット側壁に延びる補助リブが前記リード収容溝に形成され、かつ該補助リブの前記座面からの高さが全長に渡って仕切りリブの前記座面からの高さと同じであるか、または該補助リブの対角線内方側の端部が仕切りリブの前記座面からの高さと同じであり、該補助リブの高さを対角線外方に向かうにつれて漸減したことを特徴とするキャリアテープ。
A rectangular pedestal is swelled from the peripheral surface of the bottom surface of the pocket formed at a predetermined interval in the longitudinal direction to form a lead receiving groove between the pedestal and the pocket peripheral surface, and In the carrier tape which formed the partition rib in the pocket inward direction at the periphery of the seat surface of the base,
An auxiliary rib that is continuous with the partition rib at the corner of the seating surface and extends to the pocket side wall toward the diagonally outer side of the seating surface is formed in the lead receiving groove, and the height of the auxiliary rib from the seating surface is The height of the partition rib is the same as the height from the seat surface over the entire length, or the diagonally inner end of the auxiliary rib is the same as the height from the seat surface of the partition rib, carrier tape, characterized in that the hand was gradually Hesi as towards the height diagonally outward.
前記補助リブ幅bが前記仕切りリブの幅aに対し次の式で定まる値であることを特徴とする請求項1に記載のキャリアテープ。
(式)a≦b≦2×a×cos45°
The carrier tape according to claim 1, wherein the auxiliary rib width b is a value determined by the following formula with respect to the width a of the partition rib.
(Formula) a ≦ b ≦ 2 × a × cos 45 °
前記補助リブが前記ポケット周面またはリード収容溝底面と連続する部分を拡幅させたことを特徴とする請求項1または請求項2に記載のキャリアテープ。  3. The carrier tape according to claim 1, wherein the auxiliary rib widens a portion continuous with the pocket peripheral surface or the bottom surface of the lead receiving groove. 4.
JP19565596A 1996-07-05 1996-07-05 Carrier tape Expired - Lifetime JP3907240B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19565596A JP3907240B2 (en) 1996-07-05 1996-07-05 Carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19565596A JP3907240B2 (en) 1996-07-05 1996-07-05 Carrier tape

Publications (2)

Publication Number Publication Date
JPH1017073A JPH1017073A (en) 1998-01-20
JP3907240B2 true JP3907240B2 (en) 2007-04-18

Family

ID=16344794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19565596A Expired - Lifetime JP3907240B2 (en) 1996-07-05 1996-07-05 Carrier tape

Country Status (1)

Country Link
JP (1) JP3907240B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG94735A1 (en) * 2001-01-16 2003-03-18 Sumitomo Bakelite Co Container for electric device
JP2003081331A (en) * 2001-09-17 2003-03-19 Gold Kogyo Kk Embossing tape for electronic parts, its manufacturing method and pocket forming die

Also Published As

Publication number Publication date
JPH1017073A (en) 1998-01-20

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